CN112118718B - Electronic equipment and heat dissipation method thereof - Google Patents
Electronic equipment and heat dissipation method thereof Download PDFInfo
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- CN112118718B CN112118718B CN202011200607.6A CN202011200607A CN112118718B CN 112118718 B CN112118718 B CN 112118718B CN 202011200607 A CN202011200607 A CN 202011200607A CN 112118718 B CN112118718 B CN 112118718B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application provides an electronic device and a heat dissipation method thereof. The electronic equipment comprises a plurality of electronic parts, a heat conduction part and a driving assembly. The heat conduction piece is used for radiating the electronic piece; the driving component is connected with the heat conducting piece and used for driving the heat conducting piece to move so as to adjust the electronic piece radiating by the heat conducting piece. The heat dissipation method of the electronic equipment comprises the steps of determining a target electronic part in a plurality of electronic parts, wherein the target electronic part is a main heating device in the plurality of electronic parts; and controlling the driving assembly to drive the heat absorption end of the heat conduction piece to move to the target electronic piece so as to radiate heat of the target electronic piece. The heat dissipation mechanism of the electronic equipment can be dynamically adjusted. According to the heat dissipation method of the electronic equipment, the main heating device inside the electronic equipment can be selectively subjected to heat dissipation, and the heat dissipation efficiency is improved by changing the heat dissipation mechanism.
Description
Technical Field
The application relates to the technical field of electronics, in particular to electronic equipment and a heat dissipation method thereof.
Background
Along with the continuous powerful functions of the electronic equipment, the 5G, high quality screen, double speakers, high performance processor and the like bring smoother experience, and simultaneously cause larger power consumption and higher temperature rise, so that great discomfort is brought to a user in using the electronic equipment. In the related art, electronic devices often have a situation that part of the heat of the electronic component is suddenly increased, resulting in heat concentration in the area where the electronic component is disposed. Therefore, how to reduce the heat concentration in the electronic device is a technology to be solved.
Disclosure of Invention
The application provides electronic equipment with an adjustable heat dissipation mechanism and a heat dissipation method thereof.
In one aspect, the present application provides an electronic device, including:
a plurality of electronic components;
the heat conduction piece is used for radiating the electronic piece; a kind of electronic device with high-pressure air-conditioning system
The driving assembly is connected with the heat conducting piece and used for driving the heat conducting piece to move so as to adjust the electronic piece radiating by the heat conducting piece.
On the other hand, the application also provides a heat dissipation method of the electronic equipment, wherein the electronic equipment comprises a plurality of electronic parts, a heat conduction part, a driving assembly and a controller;
the method comprises the following steps:
determining a target electronic part in a plurality of electronic parts, wherein the target electronic part is a main heating device in the plurality of electronic parts;
and controlling the driving assembly to drive the heat absorption end of the heat conduction piece to move to the target electronic piece so as to radiate heat of the target electronic piece.
The heat conduction piece and the driving assembly are arranged, so that the heat on the electronic piece is conducted and diffused by the heat conduction piece, and the heat dissipation of the electronic piece is realized; when the driving component drives the heat conducting piece to move to different positions, the heat conducting piece can radiate different electronic pieces, so that the radiating mechanism of the electronic equipment can be dynamically adjusted, and the situation of local heat concentration of the electronic equipment is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below.
Fig. 1 is a schematic diagram of an external structure of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the internal structure of the electronic device shown in FIG. 1;
FIG. 3 is a schematic view of the electronic device shown in FIG. 2 with a plurality of electronic components;
FIG. 4 is a schematic diagram of the electronic device shown in FIG. 3 with a controller;
FIG. 5 is a schematic diagram of the electronic device shown in FIG. 4 with a temperature detection module;
FIG. 6 is a schematic diagram of the electronic device of FIG. 5 with a detector;
FIG. 7 is a schematic view of the heat conductive member shown in FIG. 6 disposed between a motherboard and a display screen;
FIG. 8 is a schematic view of the drive assembly of FIG. 7 including a slider and a driver;
FIG. 9 is a schematic view of the slider and driver of FIG. 8 disposed between a battery and a display screen;
fig. 10 is a flowchart of a heat dissipation method of an electronic device according to an embodiment of the present application;
FIG. 11 is a partial flow diagram of another method of dissipating heat from an electronic device;
fig. 12 is a schematic flow chart of a portion of a heat dissipation method of another electronic device.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
Along with the continuous powerful functions of the mobile phone, the number of electronic devices capable of generating heat inside the mobile phone is increased, and the heat generated by each electronic device in different use scenes is different. In the related art, a heat dissipation structure is disposed inside a mobile phone to dissipate heat of electronic devices inside the mobile phone, for example: adopts a high heat conduction middle frame material, and is provided with a graphite sheet, a heat pipe and the like. However, the heat dissipation mechanism in the related art is fixed inside the mobile phone, and only can passively receive heat on the electronic device to dissipate the heat, but the heat dissipation mechanism cannot be adjusted according to the change of the use scene of the mobile phone, so as to achieve the effect of active heat dissipation. In addition, the heat dissipation mechanism in the related art only considers the heat dissipation of the motherboard which is easy to generate higher heat, but it is difficult to realize the heat dissipation of other electronic devices which are arranged far from the motherboard region.
Fig. 1 is a schematic structural diagram of an external portion of an electronic device 100 according to an embodiment of the present application. The heat dissipation mechanism of the electronic device 100 provided in the embodiment of the application can be dynamically adjusted to realize selective and targeted heat dissipation, so as to solve the problem of local heat concentration of the electronic device 100. The electronic device 100 may be a cell phone, tablet computer, desktop computer, laptop computer, electronic reader, handheld computer, electronic display screen, notebook computer, ultra-mobile personal computer (UMPC), netbook, and a device that generates heat from the internal electronics 10 when in use, such as a cell phone, personal digital assistant (personal digital assistant, PDA), augmented reality (augmented reality, AR) \virtual reality (VR) device, media player, wristwatch, necklace, glasses, etc. The present application describes a mobile phone as an example.
As shown in fig. 2, fig. 2 is a schematic diagram of an internal structure of the electronic device 100 shown in fig. 1. The electronic device 100 includes an electronic component 10, a heat conducting member 20, and a driving assembly 30.
The electronic component 10 may be a receiver, a camera, a vibrator, a sensor, a processor, a battery 90, etc. The number of electronic components 10 is plural. The plurality of electronic components 10 are distributed at different locations of the electronic device 100. In different usage scenarios, the electronic device 100 generates more heat from a single or part of the electronic components 10 among the plurality of electronic components 10. For example: when the user is in voice communication, the heat on the receiver increases, and at this time, the heat on the electronic component 10 such as the camera and the vibrator is relatively small, so that in this use scenario, it is necessary to radiate heat from the receiver to reduce the heat concentration around the receiver. Also for example: when a user reads novels with a mobile phone, the heat on the processor increases, and at this time, the heat on the electronic component 10 such as a receiver, a camera, etc. is relatively small, so that in this use scenario, it is necessary to radiate heat from the processor to reduce the heat concentration around the processor.
Referring to fig. 2 and 3, the following embodiments are described with two electronic components 10 without particular description, and determine that the heat generation amount of a single electronic component 10 in an application scenario is more. The two electronic components 10 are denoted as a first electronic component 101 and a second electronic component 102, respectively.
Referring to fig. 2 and 3, the heat conducting member 20 is used for dissipating heat from the electronic component 10. It will be appreciated that the heat conducting member 20 is capable of absorbing and conducting heat from the electronic component 10 and diffusing the heat to effect heat dissipation from the electronic component 10. Alternatively, the heat conductive member 20 may be a heat pipe, a heat sink, a heat conductive silicone, a metal plate, or the like. The embodiment of the present application describes a metal heat pipe in a long strip shape as the heat conductive member 20. The heat conductive member 20 includes a heat absorbing end 201 and a heat dissipating end 202. It will be appreciated that the heat absorbing end 201 is configured to absorb heat and the heat dissipating end 202 is configured to dissipate heat. The heat absorbing end 201 may be understood as the evaporation end of the heat pipe, and the heat dissipating end 202 may be understood as the condensation end of the heat pipe, in general, the evaporation end of the heat pipe is disposed near the heat generating object, when the evaporation end is heated, the liquid in the capillary tube is vaporized, the vapor flows to the other end under the power of thermal diffusion, and releases the heat at the condensation end, and the liquid flows back to the evaporation end along the porous material by capillary action, so that the liquid circulates until the temperatures at the two ends of the heat pipe are equal, so that the heat can be continuously conducted away.
Wherein the number of the heat conductive members 20 may be one or more. The embodiment of the present application will be described by taking one heat conductive member 20 as an example. Of course, in other embodiments, the number of the heat conducting members 20 may be plural, and the plurality of heat conducting members 20 may be driven by the driving assembly 30 respectively. In this embodiment, the plurality of heat conducting members 20 may be suitable for the situation that the plurality of electronic components 10 have high heat at the same time in the determined application scenario, and the driving assembly 30 may drive the plurality of heat conducting members 20 to approach or contact the corresponding electronic components 10, so that the plurality of heat conducting members 20 dissipate heat from the plurality of electronic components 10.
The driving assembly 30 is connected to the heat conductive member 20. The driving assembly 30 may be connected to the heat absorbing end 201 of the heat conducting member 20 or may be connected to the heat dissipating end 202 of the heat conducting member 20, and of course, the driving assembly 30 may also be connected between the heat absorbing end 201 and the heat dissipating end 202 of the heat conducting member 20. The driving assembly 30 is used for driving the heat conducting member 20 to move so as to adjust the electronic component 10 dissipating heat from the heat conducting member 20. The driving assembly 30 may drive the heat conducting member 20 to move, or may drive the heat conducting member 20 to rotate. It will be appreciated that when the driving assembly 30 drives the heat conducting member 20 to move close to or contact the first electronic component 101, the heat conducting member 20 is used for dissipating heat from the first electronic component 101. When the driving assembly 30 drives the heat conducting member 20 to move close to or contact the second electronic component 102, the heat conducting member 20 is used for dissipating heat from the second electronic component 102. In one embodiment, when the heat on the first electronic component 101 is high, the driving component 30 may drive the electronic component 10 to move close to or contact with the first electronic component 101. When the heat on the second electronic component 102 is high, the electronic component 10 can be driven by the driving component 30 to move close to or contact with the second electronic component 102. In this embodiment, the driving assembly 30 drives the heat conducting member 20 to move, so that the heat conducting member 20 dissipates heat of the electronic component 10 with a relatively high temperature, thereby improving heat dissipation efficiency. Of course, in other embodiments, the driving assembly 30 may also be used to drive the heat conducting member 20 to move according to the setting condition of the electronic device 10, the selection of the user, the touch position of the user, and so on, so as to selectively dissipate heat.
By arranging the heat conducting piece 20 and the driving component 30, the heat conducting piece 20 conducts and diffuses heat on the electronic component 10, so that heat dissipation of the electronic component 10 is realized; when the driving assembly 30 drives the heat conducting member 20 to move to different positions, the heat conducting member 20 can radiate heat from different electronic components 10, so that the heat radiating mechanism of the electronic device 100 can be dynamically adjusted, and the situation of local heat concentration of the electronic device 100 is reduced.
Further, as shown in fig. 4, the electronic device 100 further includes a controller 40. The controller 40 is electrically connected to the plurality of electronic components 10, and the controller 40 is used for determining the target electronic component 10 among the plurality of electronic components 10.
Alternatively, as shown in fig. 5, the plurality of electronic components 10 are respectively connected to the corresponding temperature detection modules 50. One end of each temperature detection module 50 is electrically connected to the corresponding target electronic component 10, and the other end of each temperature detection module 50 is electrically connected to the controller 40, so that each electronic component 10 is electrically connected to the controller 40 through the temperature detection module 50 to form a conductive loop. The temperature detection module 50 is configured to detect a temperature of the corresponding electronic component 10, and transmit the detected temperature signal to the controller 40, and the controller 40 determines the target electronic component 10 among the plurality of electronic components 10 according to the received temperature signal. In an embodiment, the first temperature detecting module 501 detects that the temperature on the first electronic component 101 is 50 ℃, the second temperature detecting module 502 detects that the temperature on the second electronic component 102 is 55 ℃, and the second electronic component 102 is determined to be the target electronic component 10 because the temperature on the second electronic component 102 is greater than the temperature on the first electronic component 101. In another embodiment, the first temperature detecting module 501 detects that the temperature of the first electronic component 101 is 55 ℃, and the second temperature detecting module 502 detects that the temperature of the second electronic component 102 is 55 ℃, and since the temperature of the second electronic component 102 is the same as the temperature of the first electronic component 101, either the first electronic component 101 or the second electronic component 102 is determined to be the target electronic component 10, or both the first electronic component 101 and the second electronic component 102 are determined to be the target electronic component 10. It is understood that the target electronic component 10 may be one or a portion of the plurality of electronic components 10. The target electronic component 10 is a main heat generating device of the plurality of electronic components 10, which can be understood that the heat of the target electronic component 10 is greater than the heat of other electronic components 10, or the heat of the target electronic component 10 is greater than or equal to a preset temperature, and the heat of other electronic components 10 is less than the preset temperature.
The controller 40 is electrically connected to the drive assembly 30. Another conductive loop is formed among the controller 40, the driving assembly 30 and the heat conducting member 20. In this conductive loop, the controller 40 is used for controlling the driving assembly 30 to drive the heat absorbing end 201 of the heat conducting member 20 to move to the target electronic component 10, so as to dissipate heat of the target electronic component 10. In other words, after the controller 40 determines the target electronic component 10, the driving assembly 30 is controlled to drive the heat conducting member 20 to a position close to or contacting the target electronic component 10, so that the heat absorbing end 201 of the heat conducting member 20 absorbs the heat on the target electronic component 10 and diffuses the heat through the heat dissipating end 202. It will be appreciated that the controller 40 controls the distance and direction in which the driving assembly 30 drives the heat conducting member 20 according to the position of the target electronic component 10, so that the heat absorbing end 201 of the heat conducting member 20 moves to a position close to or contacting the target electronic component 10. The driving assembly 30 is controlled by the controller 40, so that the heat conducting member 20 can move to the target electronic part 10 needing heat dissipation, and the controllability of heat dissipation inside the electronic device 100 is realized.
Further, as shown in fig. 6, the electronic device 100 further includes a detector 60. The detector 60 is electrically connected to the display screen 70 of the electronic device 100, and the detector 60 is used for detecting a touch area of the display screen 70. It can be appreciated that the touch area is a location on the display screen 70 that is touched by a user when using the electronic device 100. In this embodiment, the detector 60 is electrically connected to the display screen 70 of the electronic device 100, and the touch area can be determined directly by detecting the capacitance change on the display screen 70, without providing an additional touch detection element or the like inside the electronic device 100 for detecting the touch area. It will be appreciated that the detector 60 may be a signal transmission circuit or the like. Of course, in other embodiments, the detector 60 may be a touch sensor, a light sensing detecting element or a capacitance detecting element, and the detector 60 may be disposed in the display screen 70 or under the display screen 70 to implement touch detection, where the detector 60 and the display screen 70 may be independent of each other, in other words, no electrical connection is required between the detector 60 and the display screen 70.
The controller 40 is electrically connected to the detector 60. It will be appreciated that in this embodiment, the display 70, the detector 60, and the controller 40 form a further conductive loop. The controller 40 is configured to control the heat dissipation capacity of the heat conducting member 20 to the target electronic device 10 when the heat dissipation end 202 of the heat conducting member 20 overlaps the touch area. For example, when the front projection of the touch area partially or completely overlaps the heat dissipation end 202 of the heat conducting member 20, the controller 40 controls the heat conducting member 20 to reduce or stop dissipating heat to the target electronic device 10, so as to avoid more heat dissipation to the touch position of the user. In an embodiment, when part or all of the front projection of the touch area overlaps with the heat dissipation end 202 of the heat conducting member 20, the controller 40 controls the driving assembly 30 to drive the heat conducting member 20 to move, so that the heat dissipation end 201 of the heat conducting member 20 is separated from the target electronic member 10, thereby reducing the heat dissipation capacity of the heat conducting member 20 to the target electronic member 10. In this embodiment, the controller 40 controls the driving assembly 30 to drive the heat conducting member 20 to move again, so as to control the heat dissipation capacity of the target electronic member 10 by the heat conducting member 20, and parts inside the electronic device 100 are not added, so that the space inside the electronic device 100 can be saved, and the electronic device 100 is convenient to miniaturize and thin.
Of course, in other embodiments, when part or all of the front projection of the touch area overlaps with the heat dissipation end 202 of the heat conducting member 20, the controller 40 may control the driving assembly 30 to drive the heat dissipation end 202 of the heat conducting member 20 to move, so that the heat dissipation end 202 of the heat conducting member 20 moves to a position that does not overlap with the front projection of the touch area, and therefore, when the heat conducting member 20 dissipates heat of the target electronic member 10, the dissipated heat can be prevented from being diffused to the touch position of the user via the display screen 70, and the user experience is further improved.
Alternatively, as shown in fig. 7, the main board 80 of the electronic device 100 and the display screen 70 of the electronic device 100 are disposed in the thickness direction of the electronic device 100. The thickness direction may refer to a direction perpendicular to the XY plane in fig. 7. Some of the plurality of electronic components 10 are disposed on a side of the main board 80 facing the display screen 70, and another part of the electronic components 10 are disposed in the display screen 70 or another part of the electronic components 10 are disposed on a side of the display screen 70 facing the main board 80. In this embodiment, the first electronic component 101 is disposed in the display screen 70, and the second electronic component 102 is disposed on a side of the main board 80 facing the display screen 70. The heat conductive member 20 is disposed between the main board 80 and the display screen 70 in the thickness direction of the electronic device 100. In an embodiment, the heat conducting member 20 is disposed between the display screen 70 and the second electronic component 102 along the thickness direction of the electronic device 100, and opposite sides of the heat conducting member 20 may be close to the first electronic component 101 and the second electronic component 102, respectively, so as to conduct heat on the first electronic component 101 and the second electronic component 102. In this embodiment, the protection member may be disposed on the side of the display screen 70 facing the motherboard 80 and the side of the second electronic component 102 facing away from the motherboard 80, so as to prevent the heat conducting member 20 from scratching or damaging the electronic components or the display screen 70 on the motherboard 80 during movement. Of course, in other embodiments, the heat conducting member 20 may be flush with the second electronic component 102 on the main board 80 along the thickness direction of the electronic device 100, and at this time, a moving track of the heat conducting member 20 may be disposed on the main board 80, so that the heat conducting member 20 moves along the track during movement, thereby avoiding touching other electronic devices on the main board 80, and a gap may be reserved between the heat conducting member 20 and the display screen 70, so as to avoid the heat conducting member 20 damaging the display screen 70.
By arranging the heat conducting member 20 between the main board 80 and the display screen 70, the heat dissipation structure of the electronic device 100 provided in this embodiment can be used in combination with a heat dissipation manner through a middle frame or a rear cover of the electronic device 100, so that heat dissipation is performed on the electronic device 100 in multiple ways, and performance of the electronic device 100 is improved.
Alternatively, referring to fig. 7 and 8, the driving assembly 30 includes a driving member 301 and a sliding block 302 connected to each other. One end of the sliding block 302 away from the driving piece 301 is connected with the heat conducting piece 20, and the driving piece 301 drives the sliding block 302 to slide so as to drive the heat conducting piece 20 to slide. The driving member 301 may be a motor, an electromagnetic member, or the like. In this embodiment, the driving assembly 30 has a simple structure and fewer parts, and can be conveniently arranged inside the electronic device 100. In addition, the controller 40 in the above embodiment may be disposed close to the driving member 301 to reduce the current loss between the controller 40 and the driving assembly 30.
In one embodiment, as shown in fig. 9, the electronic device 100 further includes a battery 90, and the battery 90 is disposed substantially flush with the main board 80 along the thickness direction of the electronic device 100. The driver 301 and the slider 302 are provided between the battery 90 and the display screen 70 in the thickness direction of the electronic apparatus 100. The driving member 301, the sliding block 302, and the heat conductive member 20 are sequentially arranged along the length direction of the electronic device 100. The length direction of the electronic device 100 may refer to the X-axis direction in fig. 8. The slider 302 is connected to the heat dissipation end 202 of the heat conductive member 20. The present embodiment can avoid increasing the size of the electronic device 100 in the length direction and the width direction by disposing the driving assembly 30 and the heat conductive member 20 between the display screen 70 and the main board 80 in the thickness direction of the electronic device 100. The width direction of the electronic device 100 may refer to the Y-axis direction in fig. 8.
In addition, as shown in fig. 10, the application also provides a heat dissipation method of the electronic device. The electronic equipment comprises a plurality of electronic parts, a heat conducting part, a driving assembly and a controller.
The heat dissipation method of the electronic equipment at least comprises the following steps:
s101: and determining a target electronic part in the plurality of electronic parts, so that the target electronic part is a main heating device in the plurality of electronic parts.
In an embodiment, the determining the target electronic component in the plurality of electronic components may directly obtain temperature values on the plurality of electronic components, and determine the target electronic component according to the temperature value on each electronic component. For example, the highest temperature electronic component among the plurality of electronic components may be determined as the target electronic component.
In another embodiment, determining a target electronic component among the plurality of electronic components may be to acquire a target application program operated by the electronic device, and determine a main heating device when the target application program is operated as the target electronic component. In other words, the electronic device stores therein the programs of the main heating devices corresponding to the target application programs, and the target application programs operated by the electronic device are acquired, so that the stored programs are called to determine the corresponding target electronic devices. For example, when it is obtained that the target application program run by the electronic device includes a telephone, the target electronic component may be determined to be a receiver. When the target application program operated by the electronic device is acquired to comprise a camera, the target electronic component can be determined to be a camera. When the target application program operated by the electronic device is acquired to comprise a browser, the target electronic device can be determined to be a processor. When the target application program operated by the electronic device includes a plurality of target electronic components, the target electronic components can be determined according to a preset heating sequence. The preset heating sequence can be arranged according to the power of the electronic component.
S102: and controlling the driving assembly to drive the heat absorption end of the heat conduction piece to move to the target electronic piece so as to radiate heat of the target electronic piece.
The controller may control the driving assembly to drive the heat absorbing end of the heat conducting member to move to the target electronic member, or may control the driving assembly to drive the whole heat conducting member to move and drive the heat absorbing end of the heat conducting member to move to the target electronic member. It will be appreciated that the controller is used to control the distance, direction, etc. of movement of the thermally conductive member.
The heat conduction piece is controlled to radiate the main heating device, so that the local heat concentration of the electronic equipment can be reduced, and the electronic equipment has better performance.
Further, in another embodiment, as shown in fig. 11, the electronic device further includes a detector and a display screen. The heat dissipation method of the electronic equipment further comprises the following steps:
s103: and receiving the touch area of the display screen detected by the detector.
The detector may be a signal transmission circuit connected to the display screen, or may be a touch sensor, a light sensing element, a capacitance sensing element, or the like. The detector detects a touch area on the display screen, and transmits the position information of the detected touch area to the controller, and the controller receives the position information of the touch area transmitted by the detector.
S104: and when the radiating end of the heat conducting piece is overlapped with the touch control area, controlling the radiating amount of the heat conducting piece to the target electronic piece.
The controller obtains the position information of the heat dissipation end of the heat conduction piece, and compares the position information of the heat dissipation end of the heat conduction piece with the position information of the touch area transmitted by the receiving detector to judge whether the heat dissipation end of the heat conduction piece and the touch area are overlapped. And when the heat dissipation end of the heat conduction piece is overlapped with the touch area, the controller controls the heat dissipation capacity of the heat conduction piece to the target electronic piece. For example: when the heat dissipation end of the heat conduction piece is overlapped with the touch control area, the controller reduces or stops the heat dissipation amount of the heat conduction piece on the target electronic piece, so that the heat of the heat dissipation end of the heat conduction piece is prevented from being diffused to the touch control position of a user. In addition, when the heat dissipation end of the heat conduction piece and the touch control area are not overlapped, the controller can control the heat conduction piece to continue to dissipate heat of the target electronic piece in an original state.
In one embodiment, the method for controlling the heat dissipation capacity of the heat conducting member to the target electronic member by the controller includes: and controlling the driving assembly to drive the heat absorbing end of the heat conducting piece to move to be separated from the target electronic piece. It can be understood that when the heat absorbing end of the heat conducting element is separated from the target electronic element, the heat conducting element can absorb the heat on the target electronic element, the heat required to be emitted by the heat radiating end of the heat conducting element is reduced, and the heat which can be diffused to the touch position is reduced at the moment, so that the use experience of a user can be improved.
In another embodiment, as shown in fig. 12, the step 104 may be replaced by the step 105:
s105: when the heat dissipation end of the heat conduction piece is overlapped with the touch area, the driving component is controlled to drive the heat dissipation end of the heat conduction piece to move to be separated from the touch area.
Specifically, the controller obtains the position information of the heat dissipation end of the heat conduction member, and compares the position information of the heat dissipation end of the heat conduction member with the position information of the touch area transmitted by the receiving detector to judge whether the heat dissipation end of the heat conduction member and the touch area have overlapping. When the heat dissipation end of the heat conduction piece and the touch area are overlapped, the controller controls the driving assembly to drive the heat dissipation end of the heat conduction piece to move to be separated from the touch area, the controller can control the driving assembly to only drive the heat dissipation end of the heat conduction piece to move, and the controller can also control the driving assembly to drive the whole heat conduction piece to move. The heat dissipation end of the heat conduction piece is separated from the touch area, namely, the heat dissipation end of the heat conduction piece is not overlapped with the touch area, so that the heat dissipated to the fingers of a user by the heat conduction piece can be reduced, and the use experience of the user is improved.
Through detecting the touch area, when the heat dissipation end of the heat conduction piece overlaps with the touch area, the heat dissipation capacity of the heat conduction piece to the target electronic piece is reduced, or the heat dissipation end of the heat conduction piece is moved away to a position far away from the touch area, the heat dissipation of the electronic equipment on the heat conduction piece can be prevented from being dissipated to the touch position of a user in the use process, and then the use experience of the user can be improved while the adjustment heat dissipation mechanism is ensured to improve the heat dissipation efficiency.
The foregoing is a partial embodiment of the present application and it should be noted that, for a person skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Claims (6)
1. An electronic device, comprising:
a main board;
a display screen;
a plurality of electronic components;
the heat conduction piece is arranged between the main board and the display screen and is used for radiating the electronic piece;
the driving component is connected with the heat conducting piece and used for driving the heat conducting piece to move so as to adjust the electronic piece radiating heat by the heat conducting piece;
the detector is electrically connected with the display screen and is used for detecting a touch area of the display screen; a kind of electronic device with high-pressure air-conditioning system
The controller is electrically connected with the driving assembly and is electrically connected with the detector; the controller is used for controlling the driving component to drive the heat dissipation end of the heat conduction piece to move when the heat dissipation end of the heat conduction piece is overlapped with the touch area, so that the heat dissipation end of the heat conduction piece moves to a position which is not overlapped with the orthographic projection of the touch area.
2. The electronic device of claim 1, wherein the controller is electrically connected to a plurality of the electronic components, the controller is configured to determine a target electronic component among the plurality of electronic components, the target electronic component is a main heat generating component among the plurality of electronic components, and the controller is configured to control the driving assembly to drive the heat absorbing end of the heat conducting component to move to the target electronic component so as to dissipate heat from the target electronic component.
3. The electronic device according to claim 1, wherein a main board of the electronic device and a display screen of the electronic device are arranged along a thickness direction of the electronic device, a part of the electronic component is arranged on a side of the main board facing the display screen, another part of the electronic component is arranged in the display screen or another part of the electronic component is arranged on a side of the display screen facing the main board.
4. An electronic device according to any one of claims 1 to 3, wherein the driving assembly comprises a driving member and a sliding block which are connected, one end of the sliding block away from the driving member is connected with the heat conducting member, and the driving member drives the sliding block to slide so as to drive the heat conducting member to slide.
5. The heat dissipation method of the electronic equipment is characterized in that the electronic equipment comprises a main board, a display screen, a plurality of electronic parts, a heat conduction part, a driving assembly, a controller and a detector;
the method comprises the following steps:
determining a target electronic part in a plurality of electronic parts, wherein the target electronic part is a main heating device in the plurality of electronic parts;
controlling the driving assembly to drive the heat absorption end of the heat conduction piece to move to the target electronic piece so as to radiate heat of the target electronic piece;
receiving a touch area of the display screen detected by the detector;
when the heat dissipation end of the heat conduction piece is overlapped with the touch area, the driving assembly is controlled to drive the heat dissipation end of the heat conduction piece to move, so that the heat dissipation end of the heat conduction piece moves to a position which is not overlapped with the orthographic projection of the touch area.
6. The method of claim 5, wherein determining a target electronic component among the plurality of electronic components comprises:
and acquiring a target application program operated by the electronic equipment, and determining a main heating device operated by the target application program as the target electronic component.
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| CN113677170A (en) * | 2021-09-16 | 2021-11-19 | 维沃移动通信有限公司 | Electronic device and heat dissipation method |
| CN114010957B (en) * | 2021-11-30 | 2023-11-03 | 固安翌光科技有限公司 | Heat recovery system for phototherapy apparatus and control method |
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