CN113852736B - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
- Publication number
- CN113852736B CN113852736B CN202111022319.0A CN202111022319A CN113852736B CN 113852736 B CN113852736 B CN 113852736B CN 202111022319 A CN202111022319 A CN 202111022319A CN 113852736 B CN113852736 B CN 113852736B
- Authority
- CN
- China
- Prior art keywords
- heat
- module
- heat dissipation
- area
- chip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
Abstract
The application discloses a camera module and electronic equipment belongs to communication equipment technical field. The application discloses a module of making a video recording includes: lens, chip module, heat dissipation module, module casing and mainboard, wherein: the lens is arranged on the module shell, the chip module is arranged opposite to the lens, the chip module, the heat dissipation module and the main board are arranged in the module shell, the heat dissipation module is arranged between the chip module and the main board and comprises a flexible heat conduction assembly and a heat dissipation assembly, the heat dissipation assembly comprises a first heat dissipation area and a second heat dissipation area, a heat insulation gap is reserved between the first heat dissipation area and the second heat dissipation area, the flexible heat conduction assembly is connected with the chip module and the first heat dissipation area, and the main board is connected with the second heat dissipation area. The technical scheme adopted by the application can solve the problem of how to realize better heat dissipation of the chip module with a certain degree of freedom in the space compact camera module in the background technology.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to a camera module and electronic equipment.
Background
Along with the development of science and technology, the pixels of the chip module in the camera module are continuously improved, but the heating value of the chip module is gradually increased, and meanwhile, due to the differences of installation environments, shooting directions, customer requirements and the like, the chip module still needs a certain degree of freedom in the camera module so as to achieve a better shooting effect.
Aiming at the problems of the chip module, the chip module generally adopts a mode of adding a heat dissipation structural member with a larger volume to realize heat dissipation, so that the volume of the camera module is increased to a larger extent, the freedom degree of the chip module is hindered, the contradiction with the miniaturization pursuit of the camera module by a user, the shooting quality of the camera module is influenced, and the problem of how to realize better heat dissipation of the chip module with a certain freedom degree in the camera module with compact space is solved.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, which can solve the problem of how to realize better heat dissipation of a chip module with a certain degree of freedom in a camera module with compact space in the background technology.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application discloses a camera module, the disclosed camera module includes: lens, chip module, heat dissipation module, module casing and mainboard, wherein:
the lens is arranged on the module shell, the chip module and the lens are arranged oppositely, the chip module, the heat dissipation module and the main board are arranged in the module shell, the heat dissipation module is arranged between the chip module and the main board,
the heat dissipation module comprises a flexible heat conduction assembly and a heat dissipation assembly, the heat dissipation assembly comprises a first heat dissipation area and a second heat dissipation area, a heat insulation gap is arranged between the first heat dissipation area and the second heat dissipation area, the flexible heat conduction assembly is connected with the chip module and the first heat dissipation area, and the main board is connected with the second heat dissipation area.
In a second aspect, embodiments of the present application disclose an electronic device, including a camera module of any of the above.
The technical scheme that this application adopted can reach following beneficial effect:
the embodiment of the application discloses make a video recording module through improving the structure of making a video recording module among the correlation technique, divide into first heat dissipation region and second heat dissipation region with the radiator unit through thermal-insulated clearance for first heat dissipation region and second heat dissipation region can dispel the heat to chip module and mainboard respectively, thereby the regional pertinence of messenger's heat dissipation module when the heat dissipation is stronger, and, heat between first heat dissipation region and the second heat dissipation region can not mutual transfer, thereby can avoid on the mainboard higher temperature heat loops through second heat dissipation region and first heat dissipation region transfer to chip module on, cause the influence even harm to chip module's function, can realize the better heat dissipation purpose to chip module in comparatively compact space.
Meanwhile, as the flexible heat conduction component can be bent or rotated to a certain extent according to the physical characteristic of the flexible heat conduction component, the flexible heat conduction component can adapt to the degree of freedom of the chip module, namely, the flexible heat conduction component can realize heat conduction to the chip module and simultaneously can move or rotate along with the chip module, that is, the flexible heat conduction component can conduct heat and simultaneously can not obstruct the degree of freedom of the chip module. The technical scheme adopted by the embodiment of the application does not need to add an extra heat dissipation device, and can solve the problem that how to realize better heat dissipation of the chip module with a certain degree of freedom in the space compact camera module in the background technology.
Drawings
FIG. 1 is a cross-sectional view of a camera module disclosed in an embodiment of the present application;
fig. 2 is a schematic perspective view of a camera module according to an embodiment of the present disclosure;
fig. 3 is a schematic plan view of a camera module according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an exploded structure of a heat dissipating module disclosed in an embodiment of the present application;
fig. 5 is an exploded view of a camera module according to an embodiment of the present disclosure;
fig. 6 is a schematic perspective view of another camera module according to an embodiment of the present disclosure;
FIG. 7 is a schematic perspective view of a camera module according to another embodiment of the present disclosure;
FIG. 8 is a schematic diagram of an exploded view of another camera module according to an embodiment of the present disclosure;
fig. 9 is a simplified schematic structural diagram of a heat dissipation method in the camera module disclosed in the embodiment of the present application.
Reference numerals illustrate:
100-lens;
200-chip module;
300-heat dissipation module, 310-flexible heat conduction assembly, 311-first heat conduction pad, 312-flexible heat conduction member, 3121 first heat conduction region, 3122-second heat conduction region, 3123-first redundancy section, 313-elastic support member, 3131-first support region, 3132-second support region, 3133-second redundancy section, 314-third redundancy section, 315-fixed section, 320-heat dissipation assembly, 321-first heat dissipation region, 322-second heat dissipation region, 323-heat insulation gap, 324-connector;
400-module housing;
500-main board;
600-first insulation;
700-light panel;
800-a second insulation;
900-a second thermal pad.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more.
The image capturing module and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings by means of specific embodiments and application scenarios thereof.
As shown in fig. 1 to 9, an embodiment of the present application discloses an image capturing module, which includes a lens 100, a chip module 200, a heat dissipation module 300, a module housing 400, and a motherboard 500.
The lens 100 is disposed on the module housing 400, the lens 100 is a light-transmitting member of the camera module, the lens 100 may be composed of a plurality of lenses and lens fixing members, and is mainly responsible for focusing light, and the lens 100 can refract and transmit incident light from the outside. The chip module 200 is arranged opposite to the lens 100, the chip module 200 is a photosensitive member of the camera module, and the chip module 200 can sense light entering the lens 100 and convert a received light signal into an electrical signal, thereby realizing a shooting function of the camera module. Typically, the chip module 200 may include a circuit board, imaging chip and other electronic components, which are electronic parts of an optoelectronic imaging system that generate a large amount of heat during operation.
The module housing 400 is an external component of the camera module, and can protect the internal components arranged therein, and the chip module 200, the heat dissipation module 300 and the main board 500 are all arranged in the module housing 400, that is, the module housing 400 can protect the chip module 200, the heat dissipation module 300 and the main board 500, and meanwhile, the module housing 400 can also emit heat generated by the internal components to the external environment, so that the convection heat dissipation between the inside of the camera module and the external environment is realized. The main board 500 is a functional component of the camera module, on which high power consumption devices are disposed, and during the operation of the camera module, a large amount of heat is generated by the main board 500, and in general, the temperature tolerance value of the main board 500 is higher than the temperature tolerance value of the chip module 200, so that the temperature of the heat generated by the main board 500 is higher than the temperature tolerance value of the chip module 200, and the chip module 200 is affected.
The heat dissipation module 300 is an adjusting member of the camera module, and the heat dissipation module 300 is arranged between the chip module 200 and the main board 500, so that heat generated on the chip module 200 and the main board 500 can be dissipated in the module housing 400 during operation, convection heat dissipation between the module housing 400 and the external environment can be facilitated, and further the problem that the functions of the chip module 200 and the main board 500 are affected by high temperature can be relieved.
The heat dissipation module 300 includes a flexible heat conduction assembly 310 and a heat dissipation assembly 320, the heat dissipation assembly 320 includes a first heat dissipation area 321 and a second heat dissipation area 322, a heat insulation gap 323 is provided between the first heat dissipation area 321 and the second heat dissipation area 322, the flexible heat conduction assembly 310 connects the chip module 200 and the first heat dissipation area 321, and the motherboard 500 is connected with the second heat dissipation area 322.
Under the above circumstances, the flexible heat conducting component 310 can transfer the heat generated on the chip module 200 to the first heat dissipating area 321, meanwhile, the flexible heat conducting component 310 can adapt to the degree of freedom of the chip module 200, so as to move or rotate along with the chip module 200, while the heat on the motherboard 500 can be transferred to the second heat dissipating area 322, and, because the heat between the first heat dissipating area 321 and the second heat dissipating area 322 is not transferred to each other, the first heat dissipating area 321 mainly dissipates the heat on the chip module 200, the second heat dissipating area 322 mainly dissipates the heat on the motherboard 500, so as to realize the heat dissipation of the heat dissipating module 300 to the sub-areas of different heat sources in the camera module, so that the heat dissipating object of the heat dissipating area is more targeted, and meanwhile, the functional influence or damage of the component of the high temperature heat source to the low temperature heat source can be avoided to a certain extent, that is, in the camera module has a compact original structure, the better heat dissipation of the chip module 200 can be realized.
The camera shooting module disclosed in the embodiment of the application improves the structure of the camera shooting module in the related art, and the heat dissipation assembly 320 is divided into the first heat dissipation area 321 and the second heat dissipation area 322 through the heat insulation gap 323, so that the first heat dissipation area 321 and the second heat dissipation area 322 can respectively dissipate heat for the chip module 200 and the main board 500, the area pertinence of the heat dissipation module 300 in heat dissipation is high, heat between the first heat dissipation area 321 and the second heat dissipation area 322 can not be mutually transferred, and accordingly heat with high temperature on the main board 500 can be prevented from being sequentially transferred to the chip module 200 through the second heat dissipation area 322 and the first heat dissipation area 321, the function of the chip module 200 is affected or even damaged, and the purpose of better heat dissipation for the chip module 200 can be achieved in a compact space.
Meanwhile, since the flexible heat conducting component 310 can bend or rotate to a certain extent according to the physical characteristic of the flexible heat conducting component 310, the flexible heat conducting component 310 can adapt to the degree of freedom of the chip module 200, that is, the flexible heat conducting component 310 can move or rotate along with the chip module 200 while conducting heat to the chip module 200, that is, the flexible heat conducting component 310 can conduct heat without obstructing the degree of freedom of the chip module 200. The technical scheme adopted by the embodiment of the application does not need to add an extra heat dissipation device, and can solve the problem that how to realize better heat dissipation on a chip module with a certain degree of freedom in a compact space camera module in the background art.
Since the temperature tolerance value of the motherboard 500 is higher than that of the chip module 200 under normal conditions, in order to prevent the heat of the motherboard 500 at a higher temperature from being transferred to the chip module 200 and affecting or even damaging the function of the chip module 200, in the camera module disclosed in the embodiment of the present application, the camera module may further include a first heat insulating member 600, where the first heat insulating member 600 is disposed between the flexible heat conducting component 310 and the second heat dissipation area 322. In this case, the first heat insulator 600 can block heat transfer between the flexible heat conductive member 310 and the second heat dissipation region 322, that is, the first heat insulator 600 can prevent heat of a higher temperature on the main board 500 from being transferred to the chip module 200.
In the embodiment disclosed in the application, the material used for the first heat insulating piece 600 may be an aerogel heat insulating material, and may also be a foam material such as foam, so that the heat insulating purpose can be achieved, and under the condition that the functions of other components cannot be interfered, the material used for the first heat insulating piece 600 may also be other materials.
In the image capturing module disclosed in the embodiment of the present application, the lens 100 may move relative to the module housing 400, so that the image capturing module may achieve photographing at different angles or in different ranges through the lens 100, the chip module 200 is disposed on the lens 100, and the lens 100 may drive the chip module 200 to move, so that the chip module 200 and the lens 100 may cooperate with each other to capture a higher quality image.
The flexible heat conduction assembly 310 may include a first heat conduction pad 311 and a flexible heat conduction member 312, the first heat conduction pad 311 connects the chip module 200 and the flexible heat conduction member 312, and the flexible heat conduction member 312 connects the first heat conduction pad 311 and the first heat dissipation area 321. In this case, the flexible heat conducting member 312 is not directly disposed on the chip module 200, but by disposing the first heat conducting pad 311, heat on the chip module 200 can be accurately and directly transferred to the flexible heat conducting member 312, and at the same time, the flexible heat conducting member 312 can be bent by itself, so that the flexible heat conducting member 312 can adapt to the movement of the chip module 200 relative to the module housing 400, that is, the flexible heat conducting assembly 310 can also adapt well when the chip module 200 follows the movement of the lens 100 relative to the module housing 400, thereby realizing better heat transfer and heat dissipation to the chip module 200. In the embodiments disclosed herein, the flexible heat conductive member 312 may use other flexible and thermally conductive materials such as graphene, graphite, copper foil, etc., and the embodiments of the present application do not limit the specific materials used for the flexible heat conductive member 312.
In a further embodiment, the flexible heat conducting component 310 may further include an elastic supporting member 313, where the elastic supporting member 313 is disposed on a side of the flexible heat conducting member 312 facing away from the first heat conducting pad 311, and the elastic supporting member 313 is detachably connected to the chip module 200. In this case, the elastic supporting member 313 can compensate the supporting force and the elastic force of the flexible heat conducting member 312, so that the elastic supporting member 313 can avoid the flexible heat conducting member 312 from tearing when twisting during the following process of the movement of the chip module 200, and the elastic supporting member 313 is detachably connected with the chip module 200, so that the elastic supporting member 313 can fasten the first heat conducting pad 311 and the flexible heat conducting member 312 between them on the chip module 200, thereby achieving the purpose of better heat conduction of the flexible heat conducting assembly 310 to the chip module 200. The mode of detachable connection between the elastic support 313 and the chip module 200 disclosed in the embodiment of the present application may be threaded connection, and of course, may also be other connection modes with good connection effect or convenient operation.
In order to make the flexible heat conducting member 312 better cooperate with the heat dissipation component 320 to conduct heat and dissipate heat, and simultaneously better follow the chip module 200 to twist together for conducting heat, in a more specific scheme, the flexible heat conducting member 312 may include a first heat conducting area 3121 and a second heat conducting area 3122, the first heat conducting area 3121 is connected with the second heat conducting area 3122, the first heat conducting pad 311 is disposed between the chip module 200 and the second heat conducting area 3122, and the first heat conducting area 3121 is connected with the first heat dissipation area 321.
In the above case, the heat generated on the chip module 200 is transferred to the second heat conductive area 3122 through the first heat conductive pad 311, then transferred from the second heat conductive area 3122 to the first heat conductive area 3121, and then transferred from the first heat conductive area 3121 to the first heat dissipation area 321, so as to dissipate the heat of the chip module 200 from the first heat dissipation area 321. While the main torsion portion of the flexible heat conductive member 312 is located at the junction of the first heat conductive region 3121 and the second heat conductive region 3122, that is, the tearing upon torsion is more likely to occur at the junction.
For the situation that the connection is easy to tear during torsion, the elastic support member 313 may include a first support region 3131 and a second support region 3132, where the first support region 3131 is connected to the second support region 3132, the first support region 3131 is disposed at the connection position of the first heat conduction region 3121 and the second heat conduction region 3122, the second support region 3132 is connected to the second heat conduction region 3122, and the first support region 3131 is an elastic support region, so that the first support region 3131 which is an elastic support region can play a targeted supporting role on the connection position of the first heat conduction region 3121 and the second heat conduction region 3122, and can also promote the torsion elastic force of the connection position, thereby avoiding the situation that the flexible heat conduction member 312 tears during torsion, and further promoting the heat-conductive performance of the flexible heat conduction member 312.
In another alternative technical solution, under the circumstances that the self strength and the tearing resistance degree of the flexible heat conducting element 312 allow, the flexible heat conducting element 312 can be directly attached to the chip module 200, so that the contact area between the flexible heat conducting element 312 and the chip module 200 is larger, the heat conducting speed of the whole flexible heat conducting assembly 310 is also faster, so as to improve the heat conducting efficiency of the flexible heat conducting assembly 310, and of course, in order to ensure the tearing resistance degree of the flexible heat conducting element 312, measures such as adding a tearing-resistant protective film on one surface of the flexible heat conducting element 312 can be adopted.
In the image capturing module disclosed in the embodiment of the present application, the connection between the first heat conducting area 3121 and the second heat conducting area 3122 may have a first redundancy section 3123, and the elastic support area may have a second redundancy section 3133, where the first redundancy section 3123 corresponds to the second redundancy section 3133. In this case, the first redundant segment 3123 and the second redundant segment 3133 can support the flexible heat conductive member 312 and the elastic support member 313 to twist or move in a larger range, respectively, and can cooperate to achieve the heat dissipation purpose when the chip module 200 moves in a larger range because of the mutual correspondence of the two.
In the camera module disclosed in the embodiment of the present application, the heat dissipating component 320 may further include a connecting piece 324, the connecting piece 324 is disposed on the heat insulation gap 323, the first heat dissipating area 321 is connected with the second heat dissipating area 322 through the connecting piece 324, and the three are in an integrated structure. In this case, the integrated heat dissipating component 320 may be manufactured conveniently, and the connecting piece 324 may be a structure with a smaller volume and capable of transferring heat, so that less heat can be transferred between the first heat dissipating area 321 and the second heat dissipating area 322, but the main effect of the two heat dissipating areas is not affected, or the connecting piece 324 may be a structure filled with a heat insulating material, and the heat dissipating performance of the first heat dissipating area 321 and the second heat dissipating area 322 is not affected while the two heat dissipating areas 321 and 322 are integrally formed. In addition, the position of the heat insulation gap 323 disclosed in the embodiment of the present application may be specifically adjusted according to the heat dissipating amounts or the temperature values of the first heat dissipating area 321 and the second heat dissipating area 322, which is not specifically limited in the present application.
In the camera module disclosed in the embodiment of the application, the camera module may further include a light board 700 and a second heat insulating member 800, the second heat insulating member 800 is disposed between the chip module 200 and the light board 700, the light board 700 and the second heat insulating member 800 are disposed in the module housing 400, and the light board 700 is connected with the module housing 400. In this case, the light panel 700 can provide the light when shooting for the lens 100 for improving the shooting effect of the camera module, the second heat insulator 800 can block a large amount of heat generated by the light panel 700 in the working process from being transferred to the chip module 200, and the light panel 700 is connected with the module housing 400, so that the heat generated by the light panel 700 can be dissipated outside the module housing 400 through the module housing 400.
In the camera module disclosed in the embodiment of the present application, the camera module may further include a second thermal pad 900, where the second thermal pad 900 is disposed between the motherboard 500 and the second heat dissipation area 322, so that the second thermal pad 900 can transfer heat generated by the motherboard 500 to the second heat dissipation area 322, thereby implementing efficient heat dissipation of the motherboard 500 in the second heat dissipation area 322.
In the camera module disclosed in the embodiments of the present application, the heat dissipation component 320 may be a metal bracket, and the flexible heat conduction component 310 is connected to the metal bracket, and the metal bracket is connected to the module housing 400. Under such circumstances, the heat on the chip module 200 and the motherboard 500 can be directly transferred to the metal bracket by the flexible heat conduction component 310, and because the area of the metal bracket is generally larger, and the heat conductivity of the metal is better, the heat in the module housing 400 can be quickly transferred to the module housing 400 through the metal bracket, so that the heat convection between the module housing 400 and the external environment is realized, and the heat dissipation speed of the camera module can be accelerated, and the heat dissipation efficiency is improved.
In the camera module disclosed in this embodiment of the present application, the direction along the optical axis of the lens 100 is the first direction, the heat dissipation assembly 320 is provided with an installation space, the chip module 200 is disposed in the installation space, and can move relative to the heat dissipation assembly 320 in the first direction, the flexible heat conduction assembly 310 is made of a flexible material, the flexible heat conduction assembly 310 includes a third redundant section 314 and a fixed section 315, the third redundant section 314 is connected with the fixed section 315, the fixed section 315 is fixedly connected with the heat dissipation assembly 320, and the third redundant section 314 is connected with the chip module 200 and the fixed section 315. In this case, the chip module 200 can realize displacement in the first direction, and because of the third redundant segment 314 of the flexible material, while the flexible material can realize heat conduction to the chip module 200, the flexible material can support the chip module 200 to realize torsion of a certain angle or movement of a certain distance in a plurality of directions, which can be any direction intersecting with the first direction, and a technician can set the length of the third redundant segment 314 as required, the length and the torsion angle of the third redundant segment 314 are not specifically limited in the embodiment of the present application.
The embodiment of the application also discloses electronic equipment, which comprises any one of the camera modules. The electronic equipment can be monitoring equipment, such as security check equipment, automobile data recorder, mobile phone and other equipment, and the type of the electronic equipment is not limited in the embodiment of the application.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (12)
1. A camera module, comprising: lens (100), chip module (200), heat dissipation module (300), module casing (400) and mainboard (500), wherein:
the lens (100) is arranged on the module shell (400), the chip module (200) and the lens (100) are arranged opposite to each other, the chip module (200), the heat dissipation module (300) and the main board (500) are arranged in the module shell (400), the heat dissipation module (300) is arranged between the chip module (200) and the main board (500),
the heat dissipation module (300) comprises a flexible heat conduction assembly (310) and a heat dissipation assembly (320), the heat dissipation assembly (320) comprises a first heat dissipation area (321) and a second heat dissipation area (322), a heat insulation gap (323) is formed between the first heat dissipation area (321) and the second heat dissipation area (322), the flexible heat conduction assembly (310) is connected with the chip module (200) and the first heat dissipation area (321), and the main board (500) is connected with the second heat dissipation area (322).
2. The camera module of claim 1, further comprising a first thermal shield (600), the first thermal shield (600) disposed between the flexible thermally conductive assembly (310) and the second heat dissipation region (322).
3. The camera module according to claim 1, wherein the lens (100) is movable relative to the module housing (400), and the chip module (200) is disposed on the lens (100), the lens (100) is capable of driving the chip module (200) to move,
the flexible heat conduction assembly (310) comprises a first heat conduction pad (311) and a flexible heat conduction piece (312), the first heat conduction pad (311) is connected with the chip module (200) and the flexible heat conduction piece (312), and the flexible heat conduction piece (312) is connected with the first heat conduction pad (311) and the first heat dissipation area (321).
4. A camera module according to claim 3, wherein the flexible heat conducting assembly (310) further comprises an elastic support (313), the elastic support (313) being arranged on a side of the flexible heat conducting member (312) facing away from the first heat conducting pad (311), the elastic support (313) being detachably connected to the chip module (200).
5. The camera module according to claim 4, wherein the flexible heat conducting member (312) includes a first heat conducting area (3121) and a second heat conducting area (3122), the first heat conducting area (3121) is connected to the second heat conducting area (3122), the first heat conducting pad (311) is disposed between the chip module (200) and the second heat conducting area (3122), the first heat conducting area (3121) is connected to the first heat dissipating area (321),
the elastic support member (313) comprises a first support region (3131) and a second support region (3132), the first support region (3131) is connected with the second support region (3132), the first support region (3131) is arranged at the joint of the first heat conduction region (3121) and the second heat conduction region (3122), the second support region (3132) is connected with the second heat conduction region (3122), and the first support region (3131) is an elastic support region.
6. The camera module according to claim 5, wherein the junction of the first thermally conductive area (3121) and the second thermally conductive area (3122) has a first redundant segment (3123), the resilient support area has a second redundant segment (3133), and the first redundant segment (3123) corresponds to the second redundant segment (3133).
7. The camera module according to claim 1, wherein the heat dissipating component (320) further comprises a connecting member (324), the connecting member (324) is disposed on the heat insulation gap (323), and the first heat dissipating region (321) is connected to the second heat dissipating region (322) through the connecting member (324), and the three are in an integrated structure.
8. The camera module of claim 1, further comprising a light panel (700) and a second heat insulator (800), wherein the second heat insulator (800) is disposed between the chip module (200) and the light panel (700), the light panel (700) and the second heat insulator (800) are disposed in the module housing (400), and the light panel (700) is connected to the module housing (400).
9. The camera module of claim 1, further comprising a second thermal pad (900), the second thermal pad (900) disposed between the motherboard (500) and the second heat dissipation area (322).
10. The camera module of claim 1, wherein the heat sink assembly (320) is a metal bracket, the flexible thermally conductive assembly (310) is coupled to the metal bracket, and the metal bracket is coupled to the module housing (400).
11. The camera module according to claim 1, wherein the direction along the optical axis of the lens (100) is a first direction,
the heat dissipation assembly (320) is provided with an installation space, the chip module (200) is arranged in the installation space and can move relative to the heat dissipation assembly (320) in the first direction, the flexible heat conduction assembly (310) is made of flexible materials, the flexible heat conduction assembly (310) comprises a third redundant section (314) and a fixed section (315), the third redundant section (314) is connected with the fixed section (315), the fixed section (315) is fixedly connected with the heat dissipation assembly (320), and the third redundant section (314) is connected with the chip module (200) and the fixed section (315).
12. An electronic device comprising the camera module of any one of claims 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111022319.0A CN113852736B (en) | 2021-09-01 | 2021-09-01 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111022319.0A CN113852736B (en) | 2021-09-01 | 2021-09-01 | Camera module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113852736A CN113852736A (en) | 2021-12-28 |
| CN113852736B true CN113852736B (en) | 2023-05-30 |
Family
ID=78976729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111022319.0A Active CN113852736B (en) | 2021-09-01 | 2021-09-01 | Camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113852736B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114355709B (en) * | 2022-01-07 | 2024-03-29 | 杭州海康威视数字技术股份有限公司 | Surgical field camera |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014081504A (en) * | 2012-10-17 | 2014-05-08 | Ricoh Co Ltd | Imaging unit and electronic apparatus |
| CN111385448A (en) * | 2018-12-27 | 2020-07-07 | 松下知识产权经营株式会社 | Heat dissipation structure and heat dissipation method of electronic device |
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
| CN212649970U (en) * | 2020-07-22 | 2021-03-02 | 天津七所精密机电技术有限公司 | Flexible heat dissipation module mounting structure for thin electronic equipment |
| CN113163074A (en) * | 2020-01-22 | 2021-07-23 | 华为技术有限公司 | Camera shooting assembly and electronic equipment |
-
2021
- 2021-09-01 CN CN202111022319.0A patent/CN113852736B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014081504A (en) * | 2012-10-17 | 2014-05-08 | Ricoh Co Ltd | Imaging unit and electronic apparatus |
| CN111385448A (en) * | 2018-12-27 | 2020-07-07 | 松下知识产权经营株式会社 | Heat dissipation structure and heat dissipation method of electronic device |
| CN113163074A (en) * | 2020-01-22 | 2021-07-23 | 华为技术有限公司 | Camera shooting assembly and electronic equipment |
| CN212649970U (en) * | 2020-07-22 | 2021-03-02 | 天津七所精密机电技术有限公司 | Flexible heat dissipation module mounting structure for thin electronic equipment |
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113852736A (en) | 2021-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10701249B1 (en) | Heat dissipation assembly and action camera | |
| CN105898117B (en) | Electronic equipment capable of efficiently and uniformly radiating heat | |
| WO2011147208A1 (en) | Optical module and optical communication system | |
| JPWO2012137267A1 (en) | Solid-state imaging device and method for manufacturing solid-state imaging device | |
| US8369703B2 (en) | Moving picture camera and electronic device including the same | |
| CN113852736B (en) | Camera module and electronic equipment | |
| JP6000337B2 (en) | Imaging device | |
| CN214544466U (en) | Camera module and electronic equipment | |
| CN101848326A (en) | Picture pick-up device | |
| JP6218469B2 (en) | Imaging device | |
| CN212413687U (en) | Heat radiation structure and electronic terminal | |
| JP2016019005A (en) | Imaging device | |
| JP5460178B2 (en) | Imaging device | |
| CN110658667A (en) | Projector with a light source | |
| CN216774838U (en) | Radiation-resistant camera | |
| CN220307683U (en) | Image acquisition equipment | |
| JP2011023647A (en) | Electronic apparatus | |
| CN216748400U (en) | Heat radiation structure and camera | |
| JP2002072341A (en) | Heat dissipating device | |
| JP6201627B2 (en) | Heat dissipation structure of monitor device | |
| JP2019219458A (en) | Imaging device | |
| CN114355709B (en) | Surgical field camera | |
| CN218273069U (en) | DMD packaging heat dissipation structure and projection light machine | |
| CN216351735U (en) | Lens assembly and projection equipment | |
| CN213455876U (en) | Infrared engine assembly with good heat dissipation performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |