CN112117567A - Conductive connection structure - Google Patents
Conductive connection structure Download PDFInfo
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- CN112117567A CN112117567A CN201910531249.8A CN201910531249A CN112117567A CN 112117567 A CN112117567 A CN 112117567A CN 201910531249 A CN201910531249 A CN 201910531249A CN 112117567 A CN112117567 A CN 112117567A
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- conductive
- film layer
- connection structure
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- conductive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/732—Printed circuits being in the same plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a conductive connection structure which comprises at least two conductive layers, wherein at least one conductive layer is provided with a hole penetrating through the surfaces of two sides of the conductive layer, an inner glue film layer is arranged between any two adjacent conductive layers, the surface of the conductive layer facing the inner glue film layer is a relief surface with a convex part and a concave part, and any two adjacent conductive layers are connected through the convex part. Compared with the prior art, the conductive connection structure has the advantages of simple manufacturing process, low production cost, high firmness, good conductivity and the like.
Description
Technical Field
The invention relates to the technical field of electronic element packaging, in particular to a conductive connection structure.
Background
With the development of electronic products towards miniaturization and high integration, the requirements of the packaging technology of electronic components and the manufacturing technology of printed circuit boards on interconnection materials become more and more severe, and the traditional interconnection materials cannot meet the requirements of environment and technology.
The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and the conductive adhesive becomes an ideal substitute of the traditional Sn-Pb solder as a new electronic material and has higher competitiveness. However, it is found that the conductive paste has not only a problem of poor conductive effect but also a problem of unstable connection performance during use.
In order to solve the above problems, a flexible connector is proposed in the art, which includes a first conductive layer, an insulating layer, and a second conductive layer stacked in sequence, and the first conductive layer and the second conductive layer are connected and conducted through a conductive hole formed in the insulating layer, so that an electronic component and a circuit board are electrically connected through the first conductive layer, the conductive hole, and the second conductive layer. However, the manufacturing process of the flexible connector is complex, and a large amount of time cost and labor cost are required to be consumed — in order to enable the first conductive layer and the second conductive layer to be electrically connected, when manufacturing, firstly, mechanical drilling, laser drilling or stamping and other manners are required to be adopted to form connecting holes for connecting copper foils on two sides on the flexible copper-clad plate, and then, hole metallization is required to be performed on the connecting holes to form conductive holes.
Therefore, it is necessary to design an interconnection structure with good conductive effect, stable connection performance, simple manufacturing process and low cost.
Disclosure of Invention
In order to solve the technical problems, the invention provides a conductive connection structure which is used for mounting and connecting a circuit board and has the advantages of simple manufacturing process, low production cost, high firmness, good conductivity and the like.
Based on the structure, the invention provides a conductive connection structure, which comprises at least two conductive layers, wherein at least one conductive layer is provided with holes penetrating through the surfaces of two sides of the conductive layer, an inner glue film layer is arranged between any two adjacent conductive layers, and the surface of the conductive layer facing to the inner glue film layer is a relief surface with convex parts and concave parts;
and respectively marking any two adjacent conductive layers as a first conductive layer and a second conductive layer, wherein at least one convex part of the first conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the second conductive layer, and at least one convex part of the second conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the first conductive layer.
Preferably, the shape of each of the convex portions is the same or different, and the size of each of the concave portions is the same or different.
Preferably, the inner glue film layer is made of thermosetting glue or thermoplastic glue.
Preferably, the conductive layer located at the outermost side of the conductive connection structure is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also the relief surface.
Preferably, an outer adhesive film layer is further arranged on one side of the outer conductive layer, which faces away from the inner adhesive film layer, and the convex part of the outer conductive layer, which faces away from the inner adhesive film layer, is hidden in the outer adhesive film layer or extends into the outer adhesive film layer and is exposed.
Preferably, the convex part of the outer conductive layer, which faces away from the inner adhesive film layer, is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the convex part.
Preferably, the outer adhesive film layer is made of pressure-sensitive adhesive, heat-curable adhesive or thermoplastic adhesive.
Preferably, the height of the projections is in the range of 0.2 to 30 μm.
Preferably, the conductive layer is provided with two or more holes, the shape of each hole is the same or different, and the size of each hole is the same or different.
Preferably, the relief surface is further provided with a convex portion, and the convex portion is distributed on the convex portion and/or the concave portion.
Preferably, the convex part is in a regular or irregular solid geometry.
Preferably, the shape of the convex part is sharp angle shape, inverted cone shape, particle shape, dendritic shape, column shape or block shape.
Preferably, the material of the protrusion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
Preferably, the height of the protrusions themselves is in the range of 0.2 to 15 μm.
Preferably, the number of the convex portions on the same relief surface is two or more, the shapes of the convex portions are the same or different, and the sizes of the convex portions are the same or different.
The embodiment of the invention has the following beneficial effects:
on one hand, compared with the traditional welding and bonding, the conductive connection structure provided by the embodiment of the invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and two outermost conductive layers are respectively connected with the two circuit boards or the circuit board and the grounding metal plate, so that the circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate is realized, the repeated disassembly and assembly of the circuit boards can be realized, the maintenance of the circuit boards is facilitated, the manufacturing cost of electronic products is reduced, and the installation reliability of the circuit boards can be ensured while the electrical connection is realized.
On the other hand, compared with the existing flexible connector, the conductive connection structure provided by the invention does not need hole metallization when being manufactured, and only needs to extrude the two conductive layers oppositely, so that the conductive connection structure is more convenient and faster to manufacture, and the consumed cost is lower; moreover, the two conductive layers are electrically connected by the convex part extending into the inner glue film layer, so that the conductive connection structure provided by the invention has better conductive effect and more stable connection performance; and because the inner rubber film layer has certain elasticity and deformation resistance, the inner rubber film layer can play a role of buffering, so that the conductive connection structure provided by the invention is not easy to deform when being repeatedly disassembled and assembled, and the reliability of electrical connection between two circuit boards or between the circuit board and the grounding metal plate is ensured. In addition, because the conducting layer is provided with the holes, when the conducting connection structure is pressed between two circuit boards or between the circuit board and the grounding metal plate, glue of the inner glue film layer can flow into the holes of the conducting layer to tightly connect the two adjacent conducting layers together, and meanwhile, the holes are favorable for discharging volatile matters in the inner glue film layer at high temperature, so that the problem that the conducting layers are stripped due to the layering of bubbles generated by the inner glue film layer is avoided, the stripping strength between the conducting layers is improved, and the conducting layers can be effectively and firmly connected together.
Drawings
FIG. 1 is a schematic cross-sectional view of a conductive connection structure of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a conductive connection structure using three conductive layers according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a conductive connection structure with an outer adhesive film layer according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a conductive connection structure provided with a projection according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a conductive connection structure using a double-layer conductive layer according to an embodiment of the present invention.
Description of reference numerals:
1. a conductive layer; 1a, a first conductive layer; 1b, a second conductive layer; 101. an outer conductive layer; 102. an inner conductive layer; 11. an aperture; 11a first hole; 11b, a second hole; 12. a convex portion; 12a, a first convex portion; 12b, a second convex portion; 12c, a third convex portion; 12d, a fourth convex portion; 13. a recess; 13a, a first recess; 13b, a second recess; 13c, a third recess; 13d, a fourth recess; 14. a boss portion; 14a, a first boss; 14b, a second boss; 14c, a third boss; 14d, a fourth boss; 2. an inner glue film layer; 3. an outer adhesive film layer; 3a, a first outer adhesive film layer; 3b and a second outer adhesive film layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a conductive connection structure, which mainly includes at least two conductive layers 1, wherein at least one conductive layer 1 has holes 11 penetrating through two side surfaces thereof, an inner adhesive film layer 2 is disposed between any two adjacent conductive layers 1, and a surface of the conductive layer 1 facing the inner adhesive film layer 2 is a relief surface having convex portions 12 and concave portions 13; any two adjacent conductive layers 1 are referred to as a first conductive layer 1a and a second conductive layer 1b, respectively, at least one convex portion 12 of the first conductive layer 1a extends into the internal glue film layer 2 between the two conductive layers 1 and is connected to the relief surface of the second conductive layer 1b, and similarly, at least one convex portion 12 of the second conductive layer 1b extends into the internal glue film layer 2 between the two conductive layers 1 and is connected to the relief surface of the first conductive layer 1a, that is, the convex portion 12 may be connected to the convex portion 12, the convex portion 12 may be connected to the concave portion 13, or the convex portion 12 and the concave portion 13 may be connected at a transition between one of the convex portions 12 and the other of the convex portions 12 and the concave portion 13.
Based on the structure, the conductive connection structure provided by the embodiment of the invention has the following beneficial effects:
on one hand, compared with the traditional welding and bonding, the conductive connection structure provided by the embodiment of the invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and two outermost conductive layers 1 are respectively connected with the two circuit boards or the circuit board and the grounding metal plate, so that the circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate is realized, the repeated disassembly and assembly of the circuit boards can be realized, the maintenance of the circuit boards is facilitated, the manufacturing cost of electronic products is reduced, and the installation reliability of the circuit boards can be ensured while the electrical connection is realized.
On the other hand, compared with the existing flexible connector, the conductive connection structure provided by the invention does not need hole metallization when being manufactured, and only two conductive layers 1 are extruded oppositely, so that the manufacture is more convenient and faster, and the cost is lower; moreover, the two conductive layers 1 are electrically connected by the convex part 12 extending into the inner glue film layer 2, so that the conductive connection structure provided by the invention has better conductive effect and more stable connection performance; and because the inner glue film layer 2 has certain elasticity and deformation resistance, the inner glue film layer can play a role of buffering, so that the conductive connection structure provided by the invention is not easy to deform when being repeatedly disassembled and assembled, and the reliability of the electrical connection between two circuit boards or between the circuit board and the grounding metal plate is ensured. In addition, because the conducting layer 1 is provided with the hole 11, when the conducting connection structure is pressed between two circuit boards or between a circuit board and a grounding metal plate, glue of the inner glue film layer 2 can flow into the hole 11 of the conducting layer 1, the two adjacent conducting layers 1 are tightly connected together, meanwhile, the hole 11 is favorable for discharging volatile matters in the inner glue film layer 2 at high temperature, so that the problem that the conducting layers 1 are stripped due to the layering of bubbles generated by the inner glue film layer 2 is avoided, the stripping strength between the conducting layers 1 is improved, and the conducting layers 1 can be effectively and firmly connected together.
Alternatively, as shown in fig. 1, the projections 12 may have the same or different shapes and the recesses 13 may have the same or different sizes, that is, the curvature, height, shape, etc. of each projection 12 may be different and the curvature, depth, shape, etc. of each recess 13 may be different. In the present embodiment, the range of the height H of the projections 12 itself is preferably 0.2 to 30 μm. The relief surface formed by the protrusions 12 and the recesses 13 may be a regular and periodic corrugated pattern or an irregular and disordered corrugated pattern, but it is understood that only one of these patterns is illustrated here, and other similar shapes are also within the scope of the present application and are not illustrated here.
Alternatively, as shown in fig. 1 and fig. 2, the conductive layer 1 located at the outermost side of the conductive connection structure is referred to as an outer conductive layer 101, and the outer conductive layer 101 is generally provided with two layers; marking the rest of the conductive layers 1 as inner conductive layers 102, and then all the inner conductive layers 102 are positioned between the two outer conductive layers 101; in order to further improve the conductive effect of the conductive connection structure, the surface of two or any one of the outer conductive layers 101, which faces away from the inner adhesive film layer 2, is also a relief surface, and therefore, when the conductive connection structure provided by the embodiment of the invention is clamped between the circuit board and the grounding metal plate, the convex part 12 of the outer conductive layer 101, which faces away from the inner adhesive film layer 2, can ensure that the conductive layer 1 and the grounding layer of the circuit board or the grounding metal plate form more effective electrical connection, so that the conductive connection structure provided by the embodiment of the invention can effectively lead out static charges accumulated on the circuit board, and avoid the static charges accumulated on the circuit board to form an interference source to influence signal transmission.
Optionally, as shown in fig. 3, an outer adhesive film layer 3 is further disposed on a side of the outer conductive layer 101 facing away from the inner adhesive film layer 2, and for the convex portion 12 of the outer conductive layer 101 facing away from the inner adhesive film layer 2, the convex portion 12 is hidden in the outer adhesive film layer 3 or extends into the outer adhesive film layer 3 and is exposed, in this embodiment, the convex portion 12 of the outer conductive layer 101 facing away from the inner adhesive film layer 2 is hidden in the outer adhesive film layer 3, and the thickness of the outer adhesive film layer 3 is smaller than the average height of the convex portion 12. Based on this, like the inner glue film layer 2, the outer glue film layer 3 also has certain elasticity and deformation resistance, and can play a role of buffering, so that when the conductive connection structure is clamped between two circuit boards or between a circuit board and a grounding metal plate, the convex part 12 of the outer conductive layer 101, which faces away from the inner glue film layer 2, and the circuit board or the grounding metal plate form more reliable electrical connection thanks to the elastic force of the outer glue film layer 3 and the inner glue film layer 2.
Alternatively, the shape of the holes 11 may be circular, triangular, rectangular, elliptical, irregular polygonal, or the like, and one conductive layer is provided with two or more holes 11, the shape of each hole 11 is the same or different, and the size of each hole 11 is the same or different, that is, the shape of two or more holes 11 may be one or more of circular, triangular, rectangular, elliptical, and polygonal, and the size of two or more holes 11 of the same shape may be different. In addition, the holes 11 of the same conductive layer may be arranged regularly, such as equidistantly, incrementally, degressively, etc., or randomly. The holes 11 of any two adjacent conductive layers can be completely staggered, can also be completely opposite to each other, or can be partially staggered and partially opposite to each other, and the exhaust effect of the conductive connection structure with all the holes 11 of all the conductive layers opposite to each other is optimal.
Optionally, as shown in fig. 4, in order to further improve the reliability of the electrical connection between two adjacent conductive layers 1 and the electrical conductivity of the conductive connection structure, a protruding portion 14 is further disposed on the undulating surface of the conductive layer 1, the protruding portion 14 is disposed on both the protruding portion 12 and the recessed portion 13, and if the outer conductive layer 101 is further disposed on the side facing away from the inner adhesive film layer 2, the protruding portion 14 on the undulating surface of the outer conductive layer 101 facing the outer adhesive film layer 3 is hidden in the outer adhesive film layer 3 or protrudes into and is exposed from the outer adhesive film layer 3. Based on this, the protruding portion 14 can increase the contact area between the two adjacent conductive layers 1 and the contact area between the conductive layer 1 and the ground layer or the ground metal plate of the circuit board, and simultaneously increase the friction force between the two adjacent conductive layers 1 and the friction force between the conductive layer 1 and the ground layer or the ground metal plate of the circuit board, thereby achieving the purpose of improving the electrical connection reliability and the conductive performance. It should be noted that the above technical effect can also be produced when the protruding portions 14 are distributed only on the protruding portions 12 or the recessed portions 13.
Specifically, as shown in fig. 4, the protrusions 14 have a regular or irregular solid geometry, such as an acute angle shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, a block shape, and the like, and the protrusions 14 located on the same relief surface are provided in two or more numbers, the shape of each protrusion 14 may be the same or different, and the size of each protrusion 14 may also be the same or different, that is, the shape of two or more protrusions 14 may be one or more of an acute angle shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, and a block shape, and the size of two or more protrusions 14 of the same shape may be different. In the present embodiment, the range of the height h of the convex portion 14 itself is preferably 0.2 to 15 μm. In addition, two or more than two protrusions 14 are continuously or discontinuously distributed, and when the two or more than two protrusions 14 are in the shape of sharp corners and are continuously distributed, a regular and periodic three-dimensional insection pattern or an irregular and disordered three-dimensional insection pattern can be formed.
Alternatively, the material of the conductive layer 1 is preferably copper, and the material of the protruding portion 14 is preferably one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold and silver, that is, the protruding portion 14 may be a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold and silver, or may be a body made of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold and silver, and then one or more of metals other than the body is formed on the surface of the body by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, thereby forming the protruding portion 14 of a composite material. In the present embodiment, the bump 14 is preferably made of a composite material mainly made of copper, and one or more metals selected from nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of copper, because the bump 14 made of copper alone is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the bump 14, and can further prolong the service life of the conductive connection structure.
Optionally, in order to prevent the adjacent two conductive layers 1 from separating, the material of the inner glue film layer 2 is preferably a heat-curable glue or a thermoplastic glue with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide, acrylic acid, modified acrylic acid, epoxy resin, modified epoxy resin, and the like. Different from the inner glue film layer 2, according to the practical application of the conductive connection structure, the material of the outer glue film layer 3 can be a pressure-sensitive adhesive which can be repeatedly peeled off, such as acrylic, silica gel and polyurethane pressure-sensitive adhesives, or a heat-curable adhesive or a thermoplastic adhesive which has good stability, and when the outer glue film layer 3 and the inner glue film layer 2 are both made of the heat-curable adhesive or the thermoplastic adhesive, the two can be different.
In order to make the features and advantages of the conductive connection structure provided by the embodiment of the present invention comprehensible, a conductive connection structure using the double-layer conductive layer 1 will be described in detail with reference to fig. 5.
As shown in fig. 5, the conductive connection structure includes a first conductive layer 1a, an inner glue film layer 2, and a second conductive layer 1b stacked in sequence, and it is obvious that the first conductive layer 1a and the second conductive layer 1b are outer conductive layers 101 of the conductive connection structure, and the conductive connection structure does not have an inner conductive layer 102. The first conductive layer 1a is provided with first holes 11a penetrating both side surfaces thereof, the second conductive layer 1 is provided with second holes 11b penetrating both side surfaces thereof, and the first holes 11a are completely staggered from the second holes 11 b. The surface of the first conductive layer 1a facing the inner glue film layer 2 is a relief surface and comprises a first convex portion 12a and a first concave portion 13a, the surface of the second conductive layer 1b facing the inner glue film layer 2 is also a relief surface and comprises a second convex portion 12b and a second concave portion 13b, the first convex portion 12a extends into the inner glue film layer 2 and is connected with the second concave portion 13b, and the second convex portion 12b extends into the inner glue film layer 2 and is connected with the first concave portion 13 a. Thereby, an electrical connection is established between the first conductive layer 1a and the second conductive layer 1 b.
Further, as shown in fig. 5, the surface of the first conductive layer 1a facing away from the inner adhesive film layer 2 is also a relief surface, which includes a third convex portion 12c and a third concave portion 13c, and a first outer adhesive film layer 3a is further disposed on the side of the first conductive layer 1a facing away from the inner adhesive film layer 2, and the third convex portion 12c is hidden in the first outer adhesive film layer 3 a; similarly, the surface of the second conductive layer 1b facing away from the inner adhesive film layer 2 is also a relief surface, which includes a fourth convex portion 12d and a fourth concave portion 13d, and a second outer adhesive film layer 3b is further disposed on the side of the second conductive layer 1b facing away from the inner adhesive film layer 2, and the fourth convex portion 12d is hidden in the second outer adhesive film layer 3 b.
Still further, as shown in fig. 5, a first protruding portion 14a is disposed on a relief surface of the first conductive layer 1a facing the inner glue film layer 2, and the first protruding portion 14a is distributed on both the first protruding portion 12a and the first recessed portion 13 a; similarly, the second conductive layer 1b has a second protruding portion 14b on the undulation surface facing the inner film layer 2, and the second protruding portion 14b is distributed in both the second protruding portion 12b and the second recessed portion 13 b.
Furthermore, as shown in fig. 5, a third protrusion 14c is disposed on the relief surface of the first conductive layer 1a facing away from the inner adhesive film layer 2, the third protrusion 14c is distributed on the third protrusion 12c and the third recess 13c, and the third protrusion 14c is hidden in the first outer adhesive film layer 3 a; similarly, a fourth protrusion 14d is disposed on the undulation surface of the second conductive layer 1b facing away from the inner adhesive film layer 2, the fourth protrusion 14d is distributed in the fourth protrusion 12d and the fourth recess 13d, and the fourth protrusion 14d is hidden in the second outer adhesive film layer 3 b.
Based on the above structure, when the conductive connection structure is clamped between two circuit boards or between a circuit board and a grounding metal plate, the static charge on the circuit board on the same side as the first conductive layer 1a is conducted to the circuit board or the grounding metal plate on the same side as the second conductive layer 1b through the third protruding part 14c, the first conductive layer 1a, the first protruding part 14a, the second protruding part 14b, the second conductive layer 1b and the fourth protruding part 14d in sequence, so as to realize the transfer of the static charge.
In summary, the present invention provides a conductive connection structure, which includes at least two conductive layers 1, an inner adhesive film layer 2 is disposed between any two adjacent conductive layers 1, at least one conductive layer 1 has a hole 11 penetrating through both side surfaces thereof, the surface of the conductive layer 1 facing the inner adhesive film layer 2 is a relief surface having a convex portion 12 and a concave portion 13, and any two adjacent conductive layers 1 are connected by the convex portion 12. Compared with the prior art, the conductive connection structure has the advantages of simple manufacturing process, low production cost, high firmness, good conductivity and the like.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
The foregoing is directed to the preferred embodiment of the present invention, and it is understood that various changes and modifications may be made by one skilled in the art without departing from the spirit of the invention, and it is intended that such changes and modifications be considered as within the scope of the invention.
Claims (15)
1. A conductive connection structure is characterized by comprising at least two conductive layers, wherein at least one conductive layer is provided with holes penetrating through the surfaces of two sides of the conductive layer, an inner glue film layer is arranged between any two adjacent conductive layers, and the surface of the conductive layer facing the inner glue film layer is a relief surface with convex parts and concave parts;
and respectively marking any two adjacent conductive layers as a first conductive layer and a second conductive layer, wherein at least one convex part of the first conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the second conductive layer, and at least one convex part of the second conductive layer extends into the inner glue film layer between the two conductive layers and is connected with the relief surface of the first conductive layer.
2. The conductive connection structure according to claim 1, wherein the shape of each of the convex portions is the same or different, and the size of each of the concave portions is the same or different.
3. The conductive connection structure of claim 1, wherein the inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.
4. The conductive connection structure according to claim 1, wherein the conductive layer located at the outermost side of the conductive connection structure is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also the relief surface.
5. The structure of claim 4, wherein an outer adhesive film layer is further disposed on a side of the outer conductive layer opposite to the inner adhesive film layer, and the convex portion of the outer conductive layer opposite to the inner adhesive film layer is hidden in the outer adhesive film layer or extends into the outer adhesive film layer and is exposed.
6. The structure of claim 5, wherein the convex portion of the outer conductive layer facing away from the inner adhesive film layer is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the convex portion.
7. The structure of claim 5, wherein the outer adhesive layer is made of a pressure-sensitive adhesive, a heat-curable adhesive, or a thermoplastic adhesive.
8. The conductive connection structure according to claim 1, wherein the height of the convex portion itself is in the range of 0.2 to 30 μm.
9. The conductive connection structure according to claim 1, wherein the conductive layer is provided with two or more holes, and the shape of each of the holes is the same or different, and the size of each of the holes is the same or different.
10. The conductive connection structure according to claim 1, wherein the relief surface is further provided with a convex portion, and the convex portion is distributed on the convex portion and/or the concave portion.
11. The conductive connection structure according to claim 10, wherein the convex portion has a regular or irregular solid geometry.
12. The conductive connection structure according to claim 11, wherein the shape of the convex portion is a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, or a block shape.
13. The conductive connection structure of claim 10, wherein the material of the bump is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
14. The conductive connection structure according to claim 10, wherein the height of the bump itself is in the range of 0.2 to 15 μm.
15. The conductive connection structure according to claim 10, wherein the protrusions on the same undulating surface are provided in two or more numbers, the shapes of the protrusions are the same or different, and the sizes of the protrusions are the same or different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910531249.8A CN112117567A (en) | 2019-06-19 | 2019-06-19 | Conductive connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910531249.8A CN112117567A (en) | 2019-06-19 | 2019-06-19 | Conductive connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112117567A true CN112117567A (en) | 2020-12-22 |
Family
ID=73795419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910531249.8A Pending CN112117567A (en) | 2019-06-19 | 2019-06-19 | Conductive connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112117567A (en) |
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2019
- 2019-06-19 CN CN201910531249.8A patent/CN112117567A/en active Pending
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