CN112117566A - Conductive connector and manufacturing method thereof - Google Patents

Conductive connector and manufacturing method thereof Download PDF

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Publication number
CN112117566A
CN112117566A CN201910531245.XA CN201910531245A CN112117566A CN 112117566 A CN112117566 A CN 112117566A CN 201910531245 A CN201910531245 A CN 201910531245A CN 112117566 A CN112117566 A CN 112117566A
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China
Prior art keywords
layer
film layer
conductive
copper foil
conductive connector
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CN201910531245.XA
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Chinese (zh)
Inventor
苏陟
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Guangzhou Fangbang Electronics Co Ltd
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Guangzhou Fangbang Electronics Co Ltd
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Priority to CN201910531245.XA priority Critical patent/CN112117566A/en
Publication of CN112117566A publication Critical patent/CN112117566A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

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Abstract

The invention provides a conductive connector which comprises at least two conductive layers, wherein an inner glue film layer is arranged between any two adjacent conductive layers, a protruding part is arranged on the surface of each conductive layer facing the inner glue film layer, and the protruding parts on the two opposite side surfaces of any two adjacent conductive layers protrude into the inner glue film layer between the two conductive layers and are connected with each other. Compared with the prior art, the conductive connector has the advantages of simple manufacturing process, low production cost, good conductive performance and the like. In addition, the invention also provides a manufacturing method of the conductive connector, which has the advantages of simple operation, easy implementation and the like.

Description

Conductive connector and manufacturing method thereof
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to a conductive connector and a manufacturing method thereof.
Background
With the development of electronic products towards miniaturization and high integration, the requirements of the packaging technology of electronic components and the manufacturing technology of printed circuit boards on interconnection materials become more and more severe, and the traditional interconnection materials cannot meet the requirements of environment and technology.
The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and the conductive adhesive becomes an ideal substitute of the traditional Sn-Pb solder as a new electronic material and has higher competitiveness. However, it is found that the conductive paste has not only a problem of poor conductive effect but also a problem of unstable connection performance during use.
In order to solve the above problems, a flexible connector is proposed in the art, which includes a first conductive layer, an insulating layer, and a second conductive layer stacked in sequence, and the first conductive layer and the second conductive layer are connected and conducted through a conductive hole formed in the insulating layer, so that an electronic component and a circuit board are electrically connected through the first conductive layer, the conductive hole, and the second conductive layer. However, the manufacturing process of the flexible connector is complex, and a large amount of time cost and labor cost are required to be consumed — in order to enable the first conductive layer and the second conductive layer to be electrically connected, when manufacturing, firstly, mechanical drilling, laser drilling or stamping and other manners are required to be adopted to form connecting holes for connecting copper foils on two sides on the flexible copper-clad plate, and then, hole metallization is required to be performed on the connecting holes to form conductive holes.
Therefore, it is necessary to design an interconnection structure with good conductive effect, stable connection performance, simple manufacturing process and low cost.
Disclosure of Invention
In order to solve the technical problems, the invention provides a conductive connector and a manufacturing method thereof.
Based on the above, the invention provides a conductive connector, which comprises at least two conductive layers, wherein an inner adhesive film layer is arranged between any two adjacent conductive layers, the surface of the conductive layer facing the inner adhesive film layer is provided with a convex part, and the convex parts on the two opposite side surfaces of any two adjacent conductive layers protrude into the inner adhesive film layer between the two conductive layers and are connected with each other.
Preferably, the convex part is in a regular or irregular solid geometry.
Preferably, the shape of the convex part is sharp angle shape, inverted cone shape, particle shape, dendritic shape, column shape or block shape.
Preferably, the material of the protrusion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
Preferably, the height of the protrusions themselves is in the range of 0.2 to 30 μm.
Preferably, the two or more protrusions located on the same side surface of the conductive layer are distributed continuously or discontinuously, the shape of each protrusion is the same or different, and the size of each protrusion is the same or different.
Preferably, the thickness of the conductive layer ranges from 1 to 18 μm.
Preferably, the surface of the conductive layer is a rough surface or a flat surface.
Preferably, the inner glue film layer is made of thermosetting glue or thermoplastic glue.
Preferably, the conductive layer located at the outermost side of the conductive connector is referred to as an outer conductive layer, and the surface of the outer conductive layer, which faces away from the inner adhesive film layer, is also provided with the protrusion.
Preferably, an outer adhesive film layer is further disposed on a side of the outer conductive layer opposite to the inner adhesive film layer, and the protruding portion on the surface of the outer conductive layer opposite to the inner adhesive film layer is hidden in the outer adhesive film layer or penetrates through the outer adhesive film layer and is exposed.
Preferably, the protruding portion on the surface of the outer conductive layer, which faces away from the inner adhesive film layer, is hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the protruding portion.
Preferably, the outer adhesive film layer is made of pressure-sensitive adhesive, heat-curable adhesive or thermoplastic adhesive.
The invention also provides a manufacturing method of the conductive connector, which comprises the following steps:
forming a convex part on the outer side surface of the thin copper layer of the strippable copper foil;
forming an inner glue film layer on the thin copper layer of the strippable copper foil, wherein the thin copper layer is provided with the bulge;
taking any two peelable copper foils, respectively marking the two peelable copper foils as a first peelable copper foil and a second peelable copper foil, mutually pressing the first peelable copper foil and the second peelable copper foil in a mode that the thin copper layers are opposite until the two peelable copper foils are pressed together, forming an inner glue film layer between the two peelable copper foils at the moment, marking the inner glue film layer as a first inner glue film layer, and enabling a protruding part on the outer side surface of the thin copper layer of the first peelable copper foil and a protruding part on the outer side surface of the thin copper layer of the second peelable copper foil to protrude into the first inner glue film layer and be mutually connected;
the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off, respectively.
In the above method for manufacturing an electrically conductive connector, after peeling off the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil, the method further comprises the steps of:
forming a convex part on the surface of the thin copper layer of the second strippable copper foil, which is back to the first inner glue film layer;
taking a piece of strippable copper foil, marking the strippable copper foil as a third strippable copper foil, and pressing a thin copper layer of the third strippable copper foil and a thin copper layer of the second strippable copper foil mutually until the third strippable copper foil and the thin copper layer of the second strippable copper foil are pressed together, wherein an inner glue film layer is formed between the thin copper layer of the third strippable copper foil and the thin copper layer of the second strippable copper foil and is marked as a second inner glue film layer, and a protruding part on the surface of the thin copper layer of the second strippable copper foil, which is back to the first inner glue film layer, and a protruding part on the outer side surface of the thin copper layer of the third strippable copper foil;
stripping the carrier layer of the third peelable copper foil;
and according to the requirements, continuously pressing the new strippable copper foil according to the steps.
In the above method for manufacturing a conductive connector, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, the method further comprises the steps of:
and forming a convex part on the surface of the thin copper layer positioned at the outermost side of the conductive connector, which is opposite to the inner glue film layer.
In the above method for manufacturing the conductive connector, after forming the protrusion on the surface of the thin copper layer located at the outermost side of the conductive connector, which is opposite to the inner glue film layer, the method further includes the steps of:
and forming an outer adhesive film layer on one side, which is opposite to the inner adhesive film layer, of the thin copper layer positioned on the outermost side of the conductive connector.
In the above method for manufacturing the conductive connector, the step of forming the inner adhesive film layer or the outer adhesive film layer includes:
coating an inner glue film layer or an outer glue film layer on a release film, and then transferring the inner glue film layer or the outer glue film layer onto the surface of the thin copper layer through the release film in a pressing mode;
or directly coating an inner glue film layer or an outer glue film layer on the surface of the thin copper layer.
In the above method for manufacturing the conductive connector, the protrusion is formed on the surface of the thin copper layer by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, and the like.
In the above method of manufacturing the conductive connector, the carrier layer includes a peelable layer, a barrier layer, and a bulk layer, and the thin copper layer, the peelable layer, the barrier layer, and the bulk layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer, and the bulk layer are sequentially stacked.
The embodiment of the invention has the following beneficial effects:
on one hand, compared with the traditional welding and bonding, the conductive connector provided by the embodiment of the invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and two outermost conductive layers are respectively connected with the two circuit boards or the circuit board and the grounding metal plate, so that the circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate is realized, the repeated disassembly and assembly of the circuit boards can be realized, the maintenance of the circuit boards is facilitated, the manufacturing cost of electronic products is reduced, and the installation reliability of the circuit boards can be ensured while the electrical connection is realized.
On the other hand, compared with the existing flexible connector, the conductive connector provided by the invention has no conductive hole, and only two conductive layers are oppositely extruded without drilling and hole metallization during manufacturing, so that the conductive connector is more convenient and faster to manufacture, and the consumed cost is lower; moreover, the two conductive layers are electrically connected through the protruding part protruding into the inner adhesive film layer, so that the conductive connector provided by the invention has a better conductive effect and more stable connection performance; and because the inner rubber film layer has certain elasticity and deformation resistance, the conductive connector can play a role of buffering, thereby being difficult to deform when being repeatedly disassembled and assembled, and ensuring the reliability of the electrical connection between two circuit boards or between the circuit board and the grounding metal plate.
The invention also provides a manufacturing method of the conductive connector, which has the advantages of simple operation, easy implementation and the like.
Drawings
Fig. 1 is a schematic cross-sectional view of a conductive connector in which a surface of a conductive layer is a flat surface according to a first embodiment of the present invention;
FIG. 2 is an enlarged view of area I of FIG. 1;
FIG. 3 is an enlarged view of area II of FIG. 1;
fig. 4 is a partial sectional view of the conductive connector according to the first embodiment of the present invention under a scanning electron microscope;
fig. 5 is a schematic cross-sectional view of a conductive connector employing three conductive layers according to a first embodiment of the present invention;
fig. 6 is a second sectional view of a portion of the conductive connector according to the first embodiment of the invention under a scanning electron microscope;
fig. 7 is a third sectional view of a part of the conductive connector according to the first embodiment of the invention under a scanning electron microscope;
fig. 8 is a fourth sectional view of a part of the conductive connector according to the first embodiment of the present invention under a scanning electron microscope;
fig. 9 is a schematic cross-sectional view of a conductive connector in which the surface of the conductive layer is roughened according to a first embodiment of the invention;
FIG. 10 is an enlarged view of area III of FIG. 9;
FIG. 11 is an enlarged view of the area IV in FIG. 9;
fig. 12 is a schematic cross-sectional view of a conductive connector provided with an outer adhesive film layer according to a first embodiment of the present invention;
fig. 13 is a schematic cross-sectional view of a conductive connector employing a double conductive layer according to a first embodiment of the present invention.
Description of reference numerals:
1. a conductive layer; 1a, a first conductive layer; 1b, a second conductive layer; 101. an outer conductive layer; 102. an inner conductive layer; 11. a boss portion; 11a, a first boss; 11b, a second boss; 11c, a third boss; 11d, a fourth boss; 2. an inner glue film layer; 3. an outer adhesive film layer; 3a, a first outer adhesive film layer; 3b and a second outer adhesive film layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
As shown in fig. 1 to 4, an embodiment of the present invention provides a conductive connector, which mainly includes at least two conductive layers 1, an inner adhesive film layer 2 is disposed between any two adjacent conductive layers 1, a protruding portion 11 is disposed on a surface of the conductive layer 1 facing the inner adhesive film layer 2, and the protruding portions 11 on two opposite side surfaces of any two adjacent conductive layers 1 protrude into the inner adhesive film layer 2 between the two conductive layers 1 and are connected to each other. Based on the structure, the conductive connector provided by the embodiment of the invention has the following beneficial effects:
on one hand, compared with the traditional welding and bonding, the conductive connector provided by the embodiment of the invention can be clamped between two circuit boards or between a circuit board and a grounding metal plate, and two outermost conductive layers 1 are respectively connected with the two circuit boards or the circuit board and the grounding metal plate, so that the circuit conduction between the two circuit boards or between the circuit board and the grounding metal plate is realized, the repeated disassembly and assembly of the circuit boards can be realized, the maintenance of the circuit boards is facilitated, the manufacturing cost of electronic products is reduced, and the installation reliability of the circuit boards can be ensured while the electrical connection is realized.
On the other hand, compared with the existing flexible connector, the conductive connector provided by the invention has no conductive hole, and only two conductive layers 1 are oppositely extruded without drilling and hole metallization during manufacturing, so that the conductive connector is more convenient and faster to manufacture, and the consumed cost is lower; moreover, the two conductive layers 1 are electrically connected through the convex part 11 which is protruded into the inner adhesive film layer 2, so that the conductive connector provided by the invention has better conductive effect and more stable connection performance; and because the inner glue film layer 2 has certain elasticity and deformation resistance, the conductive connector can play a role of buffering, thereby being difficult to deform when being repeatedly disassembled and assembled, and ensuring the reliability of the electrical connection between two circuit boards or between the circuit board and the grounding metal plate.
Alternatively, as shown in fig. 1 and fig. 5 to 8, the conductive layer 1 located at the outermost side of the conductive connector is referred to as an outer conductive layer 101, and the outer conductive layer 101 is generally provided with two layers; marking the rest of the conductive layers 1 as inner conductive layers 102, and then all the inner conductive layers 102 are positioned between the two outer conductive layers 101; in order to further improve the conductive effect of the conductive connector, the surface of two or any one of the outer conductive layers 101 facing away from the inner adhesive film layer 2 is also provided with a convex part 11. Based on this, when the conductive connector provided by the embodiment of the present invention is clamped between the circuit board and the grounding metal plate, the protruding portion 11 on the surface of the outer conductive layer 101 facing away from the inner glue film layer 2 can ensure that the conductive layer 1 and the grounding layer of the circuit board or the grounding metal plate form a more effective electrical connection, so that the conductive connector provided by the embodiment of the present invention can effectively lead out the static charge accumulated on the circuit board, and prevent the static charge from accumulating on the circuit board to form an interference source to affect the signal transmission.
Specifically, as shown in fig. 1 to 8, the protruding portions 11 have a regular or irregular solid geometry, such as an acute angle shape, an inverted cone shape, a particle shape, a dendrite shape, a pillar shape, a block shape, and the like, and two or more protruding portions 11 located on the same side surface of the conductive layer 1 are provided, the shape of each protruding portion 11 may be the same or different, and the size of each protruding portion 11 may also be the same or different, that is, the shape of two or more protruding portions 11 may be one or more of an acute angle shape, an inverted cone shape, a particle shape, a dendrite shape, a pillar shape, and a block shape, and the size of two or more protruding portions 11 having the same shape may be different. In addition, two or more protrusions 11 are continuously or discontinuously distributed, for example, when the two or more protrusions 11 are in the shape of sharp corners and are continuously distributed, a regular and periodic three-dimensional insection pattern or an irregular and disordered three-dimensional insection pattern can be formed.
Alternatively, as shown in fig. 1 to 3, the thickness T of the conductive layer 1 preferably ranges from 1 to 18 μm, and the height of the convex portion 11 itself ranges from h1Preferably 0.2 to 30 μm.
Alternatively, as shown in fig. 1 and fig. 9 to 11, both side surfaces of the conductive layer 1 may be flat surfaces or rough surfaces. Note that the flat surface and the rough surface referred to herein refer to a surface of the conductive layer 1 on which the protruding portion 11 is located, that is, a reference surface on which the protruding portion 11 is located, rather than a plane formed by two or more protruding portions 11. When the surface of the conductive layer 1 is a rough surface, it includes valleys and peaks, the protrusions 11 are distributed on the valleys and the peaks, and the height H of any peak is1Range h from the height of the boss 11 itself on the crest1The sum of which is 0.2 to 30 μm. Of course, the two side surfaces of each conductive layer 1 may be different, that is, one side surface is a flat surface and the other side surface is a rough surface, and each conductive layer 1 may also beDifferent from each other.
Optionally, as shown in fig. 12, the side of the outer conductive layer 101 facing away from the inner adhesive film layer 2 is further provided with an outer adhesive film layer 3, and for the protrusion 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive film layer 2, the protrusion is hidden in the outer adhesive film layer 3 or penetrates through the outer adhesive film layer 3 and is exposed. In the present embodiment, the protruding portions 11 on the surface of the outer conductive layer 101 facing away from the inner adhesive film layer 2 are hidden in the outer adhesive film layer 3, and the thickness of the outer adhesive film layer 3 is smaller than the average height of the protruding portions 11. Like the inner adhesive film layer 2, the outer adhesive film layer 3 has certain elasticity and deformation resistance, and can play a role in buffering, so that when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, due to the elastic force of the outer adhesive film layer 3 and the inner adhesive film layer 2, the protruding part 11 of the surface of the outer conductive layer 101, which is back to the inner adhesive film layer 2, can be electrically connected with the circuit board or the grounding metal plate more reliably.
Alternatively, the material of the conductive layer 1 is preferably copper, and the material of the protruding portion 11 is preferably one or a combination of more of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold and silver, that is, the protruding portion 11 may be a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold and silver, or may be a body made of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold and silver, and then one or more of metals other than the body is formed on the surface of the body by one or more of electroplating, chemical plating, physical vapor deposition, chemical vapor deposition and the like, thereby forming the protruding portion 11 of a composite material. In the present embodiment, the bump 11 is preferably made of a composite material mainly made of copper, and one or more metals of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of copper, because the bump 11 made of copper alone is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the bump 11, and thus can extend the service life of the conductive connector.
Optionally, in order to prevent the adjacent two conductive layers 1 from separating, the material of the inner glue film layer 2 is preferably a heat-curable glue or a thermoplastic glue with good stability, such as thermoplastic polyimide, modified thermoplastic polyimide, acrylic acid, modified acrylic acid, epoxy resin, modified epoxy resin, and the like. Different from the inner adhesive film layer 2, according to the practical application of the conductive connector, the material of the outer adhesive film layer 3 can be a pressure-sensitive adhesive which can be repeatedly peeled off, such as acrylic, silica gel and polyurethane pressure-sensitive adhesives, or a heat-curable adhesive or a thermoplastic adhesive which has good stability, and when the outer adhesive film layer 3 and the inner adhesive film layer 2 are both made of the heat-curable adhesive or the thermoplastic adhesive, the two can be different.
In order to make the features and advantages of the conductive connector provided by the embodiment of the present invention comprehensible, a conductive connector using a double-layer conductive layer 1 will be described in detail with reference to fig. 13.
As shown in fig. 13, the conductive connector includes a first conductive layer 1a, an inner glue film layer 2, and a second conductive layer 1b, which are sequentially stacked, and it is obvious that the first conductive layer 1a and the second conductive layer 1b are the outer conductive layer 101 of the conductive connector, and the conductive connector has no inner conductive layer 102; the surface of the two sides of the first conducting layer 1a is provided with a first protruding portion 11a and a second protruding portion 11b respectively, the surface of the two sides of the second conducting layer 1b is provided with a third protruding portion 11c and a fourth protruding portion 11d respectively, wherein the surface of the first conducting layer 1a where the first protruding portion 11a is located is opposite to the surface of the second conducting layer 1b where the third protruding portion 11c is located, the surface of the first conducting layer 1a where the second protruding portion 11b is located is opposite to the surface of the second conducting layer 1b where the fourth protruding portion 11d is located, and the first protruding portion 11a and the third protruding portion 11c protrude into the inner glue film layer 2 and are connected with each other. Based on this, electrical connection is established between the first conductive layer 1a and the second conductive layer 1b through the first protruding portion 11a and the third protruding portion 11 c.
Further, as shown in fig. 13, a first outer adhesive film layer 3a is disposed on the surface of the first conductive layer 1a where the second protruding portion 11b is located, and the second protruding portion 11b is hidden in the first outer adhesive film layer 3 a; similarly, a second outer adhesive film layer 3b is disposed on the surface of the second conductive layer 1b where the fourth protrusion 11d is located, and the fourth protrusion 11d is hidden in the second outer adhesive film layer 3 b. Therefore, when the conductive connector is clamped between two circuit boards or between a circuit board and a grounding metal plate, the static charge on the circuit board on the same side as the first conductive layer 1a is conducted to the circuit board or the grounding metal plate on the same side as the second conductive layer 1b through the second protruding part 11b, the first conductive layer 1a, the first protruding part 11a, the third protruding part 11c, the second conductive layer 1b and the fourth protruding part 11d in sequence, so that the static charge is transferred.
Example two
The embodiment of the invention provides a manufacturing method of the conductive connector, which comprises the following steps:
forming a convex part on the outer side surface of a thin copper layer of the strippable copper foil;
forming an inner glue film layer on the thin copper layer of the strippable copper foil, wherein the thin copper layer is provided with the bulge;
taking any two peelable copper foils, respectively marking the two peelable copper foils as a first peelable copper foil and a second peelable copper foil, mutually pressing the first peelable copper foil and the second peelable copper foil in a mode that the copper foils are opposite until the two peelable copper foils are pressed together, forming an inner glue film layer between the two peelable copper foils at the moment, marking the inner glue film layer as a first inner glue film layer, and enabling a protruding part on the outer side surface of the copper foil of the first peelable copper foil and a protruding part on the outer side surface of the copper foil of the second peelable copper foil to protrude into the first inner glue film layer and be mutually connected;
and fourthly, respectively stripping the carrier layer of the first strippable copper foil and the carrier layer of the second strippable copper foil, marking the thin copper layer of the first strippable copper foil as a first thin copper layer, and marking the thin copper layer of the second strippable copper foil as a second thin copper layer, so that the first thin copper layer, the first inner glue film layer and the second thin copper layer are sequentially laminated to form the conductive connector with the simplest structure (namely, only two thin copper layers are arranged).
If a more complex structure of the conductive connector is to be obtained (i.e. at least three thin copper layers are provided), the following steps are performed after the fourth step:
fifthly, forming a convex part on the surface of the second thin copper layer, which faces away from the first inner glue film layer;
taking a piece of strippable copper foil, marking the strippable copper foil as a third strippable copper foil, pressing a thin copper layer of the third strippable copper foil and a second thin copper layer together until the thin copper layer and the second thin copper layer are pressed together, forming an inner glue film layer between the thin copper layer of the third strippable copper foil and the second thin copper layer, marking the inner glue film layer as a second inner glue film layer, and protruding parts of the second thin copper layer, which are back to the surface of the first inner glue film layer, and protruding parts of the outer side surfaces of the thin copper layers of the third strippable copper foil protrude into the second inner glue film layer and are connected with each other;
stripping the carrier layer of the third strippable copper foil, and marking the thin copper layer of the third strippable copper foil as a third thin copper layer, so that the first thin copper layer, the first inner glue film layer, the second thin copper layer, the second inner glue film layer and the third thin copper layer are sequentially laminated to form the conductive connector with three thin copper layers;
and step eight, according to requirements, referring to the steps five to seven, continuously pressing the new strippable copper foil until the required conductive connector is obtained.
Alternatively, if the conductive effect of the conductive connector is further improved, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, the following steps may be further performed:
and forming a convex part on the surface of the thin copper layer positioned at the outermost side of the conductive connector, which is opposite to the inner glue film layer.
Alternatively, if the conductive connector provided with the outer adhesive film layer is to be obtained, after the previous step, the following steps may be further performed:
and forming an outer adhesive film layer on one side, which is opposite to the inner adhesive film layer, of the thin copper layer positioned on the outermost side of the conductive connector.
In the above manufacturing method, the specific steps of forming the inner adhesive film layer or the outer adhesive film layer include:
firstly, coating an inner glue film layer or an outer glue film layer on a release film, and then, laminating and transferring the inner glue film layer or the outer glue film layer onto the surface of the thin copper layer through the release film;
or directly coating an inner glue film layer or an outer glue film layer on the surface of the thin copper layer.
In the above manufacturing methods, the protrusions are formed on the surface of the thin copper layer by one or more of electroplating, chemical plating, physical vapor deposition, and chemical vapor deposition.
Further, the carrier layer of the peelable copper foil includes a peelable layer, a barrier layer, and a bulk layer, and the thin copper layer, the peelable layer, the barrier layer, and the bulk layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer, and the bulk layer are sequentially stacked, wherein the bulk layer may be an organic thin film layer, or may be a metal thin film layer, such as a copper layer.
Finally, it should be noted that the thin copper layer in the present embodiment is the conductive layer in the first embodiment.
In summary, the present invention provides a conductive connector, which includes at least two conductive layers 1, an inner adhesive film layer 2 is disposed between any two adjacent conductive layers 1, a protrusion 11 is disposed on a surface of the conductive layer 1 facing the inner adhesive film layer 2, and the protrusions 11 on two opposite side surfaces of any two adjacent conductive layers 1 protrude into the inner adhesive film layer 2 between the two conductive layers 1 and are connected to each other. Compared with the prior art, the conductive connector has the advantages of simple manufacturing process, low production cost, good conductive performance and the like.
In addition, the invention also provides a manufacturing method of the conductive connector, which has the advantages of simple operation, easy implementation and the like.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
The foregoing is directed to the preferred embodiment of the present invention, and it is understood that various changes and modifications may be made by one skilled in the art without departing from the spirit of the invention, and it is intended that such changes and modifications be considered as within the scope of the invention.

Claims (20)

1. The utility model provides a conductive connector, its characterized in that includes two-layer conducting layer at least, arbitrary adjacent two-layer be equipped with interior glued membrane layer between the conducting layer, the conducting layer orientation interior glued membrane layer be equipped with the bellying on the surface, and arbitrary adjacent two-layer the relative both sides of conducting layer are on the surface the bellying is protruding into this two-layer between the conducting layer interior glued membrane in situ and interconnect.
2. The conductive connector of claim 1, wherein the raised portion has a regular or irregular solid geometry.
3. The conductive connector according to claim 2, wherein the shape of the projection is a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, or a block shape.
4. The connector of claim 1, wherein the material of the protrusion is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.
5. The conductive connector of claim 1, wherein the boss has a height in the range of 0.2 to 30 μm.
6. The conductive connector according to claim 1, wherein the protrusions on the same side surface of the conductive layer are provided in two or more numbers, and the two or more protrusions are continuously or discontinuously distributed, and the protrusions have the same or different shapes and the same or different sizes.
7. The conductive connector of claim 1, wherein the thickness of the conductive layer is in the range of 1 to 18 μ ι η.
8. The conductive connector of claim 1, wherein the surface of the conductive layer is a rough surface or a flat surface.
9. The conductive connector of claim 1, wherein the inner adhesive film layer is made of thermosetting adhesive or thermoplastic adhesive.
10. The conductive connector according to any one of claims 1 to 9, wherein the conductive layer located at the outermost side of the conductive connector is referred to as an outer conductive layer, and a surface of the outer conductive layer facing away from the inner adhesive film layer is also provided with the protrusions.
11. The conductive connector of claim 10, wherein an outer adhesive film layer is further disposed on a side of the outer conductive layer facing away from the inner adhesive film layer, and the protrusion on the surface of the outer conductive layer facing away from the inner adhesive film layer is hidden in the outer adhesive film layer or penetrates through the outer adhesive film layer and is exposed.
12. The conductive connector of claim 11, wherein the protrusions on the surface of the outer conductive layer facing away from the inner adhesive film layer are hidden in the outer adhesive film layer, and the thickness of the outer adhesive film layer is smaller than the average height of the protrusions.
13. The conductive connector of claim 11, wherein the outer adhesive film layer is made of a pressure sensitive adhesive, a heat curable adhesive or a thermoplastic adhesive.
14. A method of making a conductive connector, comprising the steps of:
forming a convex part on the outer side surface of the thin copper layer of the strippable copper foil;
forming an inner glue film layer on the thin copper layer of the strippable copper foil, wherein the thin copper layer is provided with the bulge;
taking any two peelable copper foils, respectively marking the two peelable copper foils as a first peelable copper foil and a second peelable copper foil, mutually pressing the first peelable copper foil and the second peelable copper foil in a mode that the thin copper layers are opposite until the two peelable copper foils are pressed together, forming an inner glue film layer between the two peelable copper foils at the moment, marking the inner glue film layer as a first inner glue film layer, and enabling a protruding part on the outer side surface of the thin copper layer of the first peelable copper foil and a protruding part on the outer side surface of the thin copper layer of the second peelable copper foil to protrude into the first inner glue film layer and be mutually connected;
the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil are peeled off, respectively.
15. The method of claim 14, further comprising the step of, after peeling the carrier layer of the first peelable copper foil and the carrier layer of the second peelable copper foil:
forming a convex part on the surface of the thin copper layer of the second strippable copper foil, which is back to the first inner glue film layer;
taking a piece of strippable copper foil, marking the strippable copper foil as a third strippable copper foil, and pressing a thin copper layer of the third strippable copper foil and a thin copper layer of the second strippable copper foil mutually until the third strippable copper foil and the thin copper layer of the second strippable copper foil are pressed together, wherein an inner glue film layer is formed between the thin copper layer of the third strippable copper foil and the thin copper layer of the second strippable copper foil and is marked as a second inner glue film layer, and a protruding part on the surface of the thin copper layer of the second strippable copper foil, which is back to the first inner glue film layer, and a protruding part on the outer side surface of the thin copper layer of the third strippable copper foil;
stripping the carrier layer of the third peelable copper foil;
and according to the requirements, the new strippable copper foil is pressed continuously by referring to the steps.
16. The method for manufacturing a conductive connector according to any one of claims 14 or 15, further comprising, after peeling off the carrier layer of the peelable copper foil located at the outermost side of the conductive connector, the steps of:
and forming a convex part on the surface of the thin copper layer positioned at the outermost side of the conductive connector, which is opposite to the inner glue film layer.
17. The method for manufacturing the conductive connector according to claim 16, further comprising the step of, after forming the protruding portion on the surface of the thin copper layer located at the outermost side of the conductive connector, the surface facing away from the inner adhesive film layer:
and forming an outer adhesive film layer on one side, which is opposite to the inner adhesive film layer, of the thin copper layer positioned on the outermost side of the conductive connector.
18. The method of manufacturing a conductive connector according to any one of claims 15 or 17, wherein the step of forming the inner or outer adhesive film layer comprises:
coating an inner glue film layer or an outer glue film layer on a release film, and then transferring the inner glue film layer or the outer glue film layer onto the surface of the thin copper layer through the release film in a pressing mode;
or directly coating an inner glue film layer or an outer glue film layer on the surface of the thin copper layer.
19. The method of claim 16, wherein the protrusions are formed on the surface of the thin copper layer by one or more of electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, and the like.
20. The method of manufacturing a conductive connector according to any one of claims 14 or 15, wherein the carrier layer includes a peelable layer, a barrier layer, and a bulk layer, and the thin copper layer, the peelable layer, the barrier layer, and the bulk layer are sequentially stacked, or the thin copper layer, the barrier layer, the peelable layer, and the bulk layer are sequentially stacked.
CN201910531245.XA 2019-06-19 2019-06-19 Conductive connector and manufacturing method thereof Pending CN112117566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910531245.XA CN112117566A (en) 2019-06-19 2019-06-19 Conductive connector and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910531245.XA CN112117566A (en) 2019-06-19 2019-06-19 Conductive connector and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN112117566A true CN112117566A (en) 2020-12-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN112117566A (en)

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