CN112111074B - 一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板 - Google Patents

一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板 Download PDF

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CN112111074B
CN112111074B CN202011039037.7A CN202011039037A CN112111074B CN 112111074 B CN112111074 B CN 112111074B CN 202011039037 A CN202011039037 A CN 202011039037A CN 112111074 B CN112111074 B CN 112111074B
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resin composition
heat
mixture
crosslinkable
uniform dispersion
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CN112111074A (zh
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俞卫忠
俞丞
顾书春
冯凯
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Changzhou Zhongying Science&technology Co ltd
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Abstract

本发明涉及一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板。本发明通过球磨方法将高导热填料良好分散于板材基体中，再选用较小的高导热填料来填充缝隙，又利用长纤维状的高导热填料进一步辅助高导热填料彼此之间的搭接，最后再通过半固化片压合过程中树脂体系的溢胶流动而一定程度地抑制了具有二维片层结构的高导热填料完全在板材平面方向的取向排列，有效提高了覆铜板厚度方向上高导热填料逾渗网络的形成，提升了板材的热导率，同时还兼顾了板材其他的综合性能，确保其拥有优异的介电性能、热‑机械强度、尺寸稳定性和高铜箔剥离强度。

Description

一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化 片和高导热热固型覆铜板
技术领域
本发明属于通信材料领域，具体涉及一种可交联碳氢树脂组合物及其制备的半固化片和高导热热固型覆铜板。
背景技术
电子产品正朝着小型化、轻型化、薄型化和多功能化的方向快速发展，作为电子元器件主要载体的覆铜板，其集成度越来越高、线路布置越来越精细。因此，覆铜板除了要拥有优异的绝缘性和热-机械性能之外，还应具备良好的导热、散热功能。金属基覆铜板虽拥有最好的散热能力，但其制造成本居高不下、生产难度大，多用于高电流模块。氧化铝基、氮化铝基和氮化硅基等陶瓷基板也拥有良好的热导率，但其机械性能较差。以FR-4为代表的传统热固型覆铜板绝缘性佳、热-机械性能高，又物美价廉、加工方便、通用性强，然而，其热导率极低，仅0.25W/m*K，介电常数和介质损耗又都很高，致使它们只能在低频下使用。为此，人们开发出了聚苯醚类和聚二烯烃类碳氢聚合物基热固型的覆铜板，一方面提升了基板高频下的介电性能；另一方面，通过向基体树脂中引入高填充量的导热材料，例如氮化硼、氮化铝等，提高了基板的热导率。
然而，前述各类热固型树脂与导热填料的复合，常通过溶液混合法、再经上胶-烘烤-固化等步骤来实现，在该工艺中，导热填料的添加量很有限，致使覆铜板的热导率提升也很有限；同时，高填充量的高导热填料还会严重影响到覆铜板的介电常数；更为重要的是，以氮化硼和氮化铝为代表的六方晶型高导热填料，因其具有各向异性，致使覆铜板在其厚度方向上的热导率远小于其平面方向的热导率，综合性能难以满足当下高速、高频、无损和大容量信息传送的需求。
发明内容
本发明提供了一种可交联碳氢树脂组合物及其制备的半固化片和高导热热固型覆铜板。
为解决背景技术中所述的问题，本发明首先将六方晶型的氮化铝或氮化硼等高导热填料与热固型聚芳醚寡聚物共同混合于有机溶剂中进行球磨：一方面，球磨过程有效剥离了六方晶型氮化铝或氮化硼的片层结构，降低了它们的堆叠层数，提升了高导热填料的利用率；另一方面，球磨过程中因有热固型聚芳醚寡聚物的保护，氮化铝或氮化硼的二维片层结构不致于被严重破坏而变得太小。
随后，通过体系溶剂的置换及后续冻干过程，六方晶型氮化铝或氮化硼与热固型聚芳醚寡聚物复合物可保持良好分散的多孔结构；然后辅以合适的辅助高导热填料、可交联基体树脂、改性树脂、其他辅助填料、阻燃剂和引发剂而配制得到可交联碳氢聚合物组合物的上胶液，由此制备得到的半固化片含胶量均匀、树脂附着力强、表面平整、韧性和粘性均适宜；
最后在真空压合时，在半固化片中间添加纤维布而使得可交联碳氢聚合物组合物因溢胶流动而缓慢渗入到纤维布的缝隙中，通过这种厚度方向上的垂直流动而一定程度地抑制了具有二维片层结构的高导热填料完全在板材平面方向的取向排列；同时，因在半固化片中引入了粒径较小的高导热填料来填充缝隙，又利用长纤维状的高导热填料进一步辅助高导热填料彼此之间的搭接，有效提高了覆铜板厚度方向上高导热填料逾渗网络的形成，提升了板材的热导率，同时还可以兼顾板材其他的综合性能，确保其拥有优异的介电性能、热-机械强度、尺寸稳定性和高铜箔剥离强度，适合于制作多层覆铜板，可满足当下高频、高速通信领域对覆铜板材料的功能多元化和复杂化的各项性能要求。
本发明提供的一种可交联碳氢树脂组合物的均匀分散液，制备方法为将高导热填料A与热固型聚芳醚寡聚物共同混合于有机溶剂B中，在惰性气体保护下经球磨分散后制备得到均匀分散液；随后，向所述均匀分散液中加入热固型聚芳醚寡聚物的不良溶剂C而使得整体体系析出，经多次过滤以使得体系的溶剂整体置换为热固型聚芳醚寡聚物的不良溶剂C；接着，经冻干工艺充分除去不良溶剂C，再经低温粉碎得到高导热填料A与热固型聚芳醚寡聚物的混合物D；最后，将混合物D与辅助高导热填料E、辅助高导热填料F、可交联基体树脂、改性树脂、其他辅助填料、阻燃剂和引发剂共同混合于有机溶剂G中，再经搅拌剪切分散均匀之后制备得到固含量为20~75wt/v%的可交联碳氢树脂组合物的均匀分散液。
进一步优选的技术方案在于：所述的高导热填料A为六方晶型的氮化铝和氮化硼中的一种或两种的混合物，粒径D50控制在5~40um之间，其用量占可交联碳氢树脂组合物的2~30wt%；所述的辅助高导热填料E为氮化铝、氮化硼、碳化硅、氮化硅和金刚石中的一种或几种的混合物，粒径D50控制在0.3~4um之间，其用量占可交联碳氢树脂组合物的0.5~20wt%；所述的辅助高导热填料F为纤维状氮化铝和纤维状氮化硼中的一种或两种的混合物，纤维直径为0.5~15um、长度为5~500um，其用量占可交联碳氢树脂组合物的0.5~10wt%。
进一步优选的技术方案在于：所述的热固型聚芳醚寡聚物为乙烯基修饰聚苯醚及其衍生物中的一种或几种的混合物；所述聚苯醚的数均分子量控制在400~4000之间，所述的乙烯基存在于聚苯醚的端基或侧基上，单条所述聚苯醚的高分子链上至少含有2个乙烯基官能团；所述热固型聚芳醚寡聚物的用量占可交联碳氢树脂组合物的5~50wt%。
进一步优选的技术方案在于：所述的有机溶剂B为N,N-二甲基甲酰胺、N,N-二甲基乙酰胺和四氢呋喃中的一种或几种的混合物；所述的有机溶剂G为N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、苯、甲苯和二甲苯中的一种或几种的混合物；所述的不良溶剂C为水。
进一步优选的技术方案在于：所述的可交联基体树脂为聚二烯烃中的一种或几种的混合物；所述可交联基体树脂的数均分子量控制在500~6000之间，其1,2-乙烯基含量≥25%；所述可交联基体树脂的用量占所述可交联碳氢树脂组合物的15~70wt%；
所述的改性树脂为二烯烃-马来酸酐共聚物中的一种或几种的混合物，在单条所述改性树脂高分子链的聚二烯烃嵌段上，至少含有一个反应型碳碳双键侧基；所述改性树脂的数均分子量控制在500~50000之间，其用量占所述可交联碳氢树脂组合物的0~10wt%；
所述的其他辅助填料为SiO2、Al2O3、TiO2、ZnO、MgO、Bi2O3、Al(OH)3、Mg(OH)2、BaTiO3、SrTiO3、Mg2TiO4、Bi2(TiO3)3、PbTiO3、NiTiO3、CaTiO3、ZnTiO3、Zn2TiO4、BaSnO3、Bi2(SnO3)3、CaSnO3、PbSnO3、MgSnO3、SrSnO3、ZnSnO3、BaZrO3、CaZrO3、PbZrO3、MgZrO3、SrZrO3、ZnZrO3、氧化石墨、氟化石墨、滑石粉、云母粉、高岭土、粘土、实心玻璃微珠、空心玻璃微珠、玻璃纤维、玄武岩纤维和碳纤维中的一种或是几种的混合物，还包括聚四氟乙烯预烧结料、超高分子量聚乙烯纤维、凯夫拉纤维、聚酰亚胺、聚醚酰亚胺、聚醚醚酮和聚苯硫醚中的一种或是几种的混合物；所述其他辅助填料的用量占所述可交联碳氢树脂组合物的0~60wt%；
所述的阻燃剂为铝镁系阻燃剂、硼锌系阻燃剂、钼锡系阻燃剂、溴系阻燃剂、三氧化二锑、磷系阻燃剂和氮系阻燃剂中的一种或多种的混合物；所述阻燃剂的用量占所述可交联碳氢树脂组合物的0~40wt%；
所述的引发剂为过氧化物和偶氮化物中的一种或几种的混合物，其半衰期为10h时的热分解温度≥50℃，用量占所述可交联碳氢树脂组合物的0.1~5wt%。
一种采用可交联碳氢树脂组合物的均匀分散液来制作的半固化片，具体制备步骤为：将所述均匀分散液浸渍纤维布，经烘烤干燥得到半固化片。
所述的纤维布为电子级无碱玻纤布、碳纤维、硼纤维、凯夫拉、聚酰亚胺、聚四氟乙烯、聚酯纤维布和LCP纤维布中的一种；
所述的烘烤干燥分为两个阶段，第一阶段烘烤干燥温度为50~120℃, 时间为1~30min；第二阶段烘烤干燥温度为150~250℃，时间为1~30min。
一种采用可交联碳氢树脂组合物的均匀分散液来制作的半固化片制作的高导热热固型覆铜板，具体步骤为：将半固化片、纤维布、膜和覆于表面的铜箔叠合在一起，经层压工艺制备得到热固型覆铜板；
其中，所述半固化片的张数≥2，纤维布的张数≥1，膜的张数≥0，铜箔的张数为1或2；在叠合过程中，所述纤维布的上下两侧均为所述的半固化片；
所述层压工艺的层压温度为180~250℃，层压压力为80~150kg/cm2，层压时间为0.5~18h；
所述的膜为含氟聚合物、聚酰亚胺、聚烯烃、聚芳烃、聚酰胺、聚醚酮、聚醚醚酮、聚芳醚、聚芳硫醚、聚芳醚砜、聚芳硫醚砜、聚芳醚酮、聚芳硫醚酮、聚醚砜酮、聚芳醚腈砜、聚芳硫醚腈砜、聚苯基喹喔啉、酚醛树脂、环氧树脂、氰酸酯树脂、聚碳酸酯、聚氨酯和聚甲醛中的一种或多种的混合物；
所述高导热热固型覆铜板的厚度控制在0.1~10mm之间。
因此，本发明具有良好的工业化生产基础和广阔的应用前景。
具体实施方式
以下通过实施例进一步详细说明本发明提供的一种可交联碳氢树脂组合物及其制备的半固化片和高导热热固型覆铜板。然而，该实施例仅仅是作为提供说明而不是限定本发明。
实施例 1
取18份六方晶型的AlN（D50=20um）和60份端乙烯基修饰的聚苯醚（Sabic SA9000）分散于600份THF中，球磨12h之后取出，向体系中加入过量的去离子水而使得体系析出，再经多次洗涤-过滤而充分除去THF，随后再将体系重新分散于水中，经冻干除去水得到复合物；然后向甲苯中加入该复合物，同时再加入4份六方晶型的BN（D50=1um）、3份BN纤维（直径2~10um、长度为10~100um）、8份氧化铝、380份氧化硅，60份聚丁二烯（克雷威利Ricon130）、30份聚丁二烯（克雷威利Ricon154）、15份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）、5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8）、5份聚苯乙烯-马来酸酐共聚物（克雷威利SMA1000）、60份十溴二苯乙烷和20份三氧化二锑，于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入7份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃, 时间为3min，第二阶段烘烤温度为160℃，时间为2min；取7张半固化片和2张106玻纤布叠合在一起，确保1080玻纤布两侧均为半固化片，然后最上下两面分别附上loz铜箔，在压力为80~105kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
实施例 2
取20份六方晶型的BN（D50=20um）和25份端乙烯基修饰的聚苯醚（Sabic SA9000）分散于800份THF中，球磨12h之后取出，向体系中加入过量的去离子水而使得体系析出，再经多次洗涤-过滤而充分除去THF，随后再将体系重新分散于水中，经冻干除去水得到复合物；然后向甲苯中加入该复合物，同时再加入5份六方晶型的BN（D50=1um）、7份BN纤维（直径2~10um、长度为10~100um）、12份氧化铝、120份氢氧化镁，35份聚丁二烯（克雷威利Ricon130）、10份聚丁二烯（克雷威利Ricon154）、6份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）和5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8），于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入2.5份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃,时间为2min，第二阶段烘烤温度为150℃，时间为2min；取7张半固化片和2张1080玻纤布叠合在一起，确保1078玻纤布两侧均为半固化片，然后最上下两面分别附上loz铜箔，在压力为100~125kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
实施例 3
取10份六方晶型的BN（D50=30um）、5份六方晶型的BN（D50=10um）、5份六方晶型的AlN（D50=20um）和25份端乙烯基修饰的聚苯醚（Sabic SA9000）分散于600份THF中，球磨12h之后取出，向体系中加入过量的去离子水而使得体系析出，再经多次洗涤-过滤而充分除去THF，随后再将体系重新分散于水中，经冻干除去水得到复合物；然后向甲苯中加入该复合物，同时再加入3份六方晶型的BN（D50=1um）、5份BN纤维（直径2~10um、长度为10~100um）、4份AlN纤维（直径1~5um、长度为10~50um）、12份氧化铝、100份氢氧化镁、15份氧化硅、30份聚丁二烯（克雷威利Ricon130）、15份聚丁二烯（克雷威利Ricon154）、6份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）和5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8），于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入2.5份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃, 时间为2min，第二阶段烘烤温度为150℃，时间为2min；取7张半固化片和2张1078玻纤布叠合在一起，确保1080玻纤布两侧均为半固化片，然后最上下两面分别附上loz铜箔，在压力为100~125kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
对比例 1
取18份六方晶型的AlN（D50=20um）、60份端乙烯基修饰的聚苯醚（Sabic SA9000）、4份六方晶型的BN（D50=1um）、3份BN纤维（直径2~10um、长度为10~100um）、8份氧化铝、380份氧化硅，60份聚丁二烯（克雷威利Ricon130）、30份聚丁二烯（克雷威利Ricon154）、15份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）、5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8）、5份聚苯乙烯-马来酸酐共聚物（克雷威利SMA1000）、60份十溴二苯乙烷和20份三氧化二锑共同分散于甲苯中，于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入7份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃, 时间为3min，第二阶段烘烤温度为160℃，时间为2min；取7张半固化片和2张106玻纤布叠合在一起，确保1080玻纤布两侧均为半固化片，然后最上下两面分别附上loz铜箔，在压力为60~85kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
对比例 2
取32份六方晶型的BN（D50=20um）和25份端乙烯基修饰的聚苯醚（Sabic SA9000）分散于1000份THF中，球磨12h之后取出，向体系中加入过量的去离子水而使得体系析出，再经多次洗涤-过滤而充分除去THF，随后再将体系重新分散于水中，经冻干除去水得到复合物；然后向甲苯中加入该复合物，同时再加入12份氧化铝、120份氢氧化镁，35份聚丁二烯（克雷威利Ricon130）、10份聚丁二烯（克雷威利Ricon154）、6份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）和5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8），于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入2.5份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃, 时间为2min，第二阶段烘烤温度为150℃，时间为2min；取7张半固化片和2张1078玻纤布叠合在一起，确保1080玻纤布两侧均为半固化片，然后最上下两面分别附上loz铜箔，在压力为80~105kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
对比例 3
取20份六方晶型的BN（D50=20um）和25份端乙烯基修饰的聚苯醚（Sabic SA9000）分散于800份THF中，球磨12h之后取出，向体系中加入过量的去离子水而使得体系析出，再经多次洗涤-过滤而充分除去THF，随后再将体系重新分散于水中，经冻干除去水得到复合物；然后向甲苯中加入该复合物，同时再加入5份六方晶型的BN（D50=1um）、7份BN纤维（直径2~10um、长度为10~100um）、12份氧化铝、120份氢氧化镁，35份聚丁二烯（克雷威利Ricon130）、10份聚丁二烯（克雷威利Ricon154）、6份聚二烯烃-苯乙烯-二乙烯基苯三元共聚物（克雷威利Ricon257）和5份聚丁二烯-马来酸酐共聚物（克雷威利Ricon130MA8），于50℃下搅拌24h以充分溶解-分散均匀后，降至室温，加入2.5份过氧化二苯甲酰，进一步搅拌均匀；采用1080玻纤布浸胶，再经烘烤干燥得到半固化片，其中，第一阶段烘烤温度为80℃,时间为2min，第二阶段烘烤温度为150℃，时间为2min；取9张半固化片叠合在一起，最上下两面分别附上loz铜箔，在压力为100~125kg/cm2、温度为220℃情况下层压2h，制得高导热热固型碳氢聚合物基覆铜板。
如表1所示，通过球磨过程分散高导热填料，再选用较小的高导热填料来填充缝隙，又利用长纤维状的高导热填料进一步辅助高导热填料彼此之间的搭接，最后再通过树脂体系的溢胶流动而一定程度地抑制了具有二维片层结构的高导热填料完全在板材平面方向的取向排列，有效提高了覆铜板厚度方向上高导热填料逾渗网络的形成，提升了板材的热导率，同时还可以兼顾板材其他的综合性能，确保其拥有优异的介电性能、热-机械强度、尺寸稳定性和高铜箔剥离强度，适合于制作多层覆铜板，可满足当下高频、高速通信领域对覆铜板材料的功能多元化和复杂化的各项性能要求。
综上所述，本发明具有良好的工业化生产基础和广阔的应用前景。
以上实施例并非对本发明中组合物的含量作任何限制。凡是依据本发明的技术实质或组合物成份或含量对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (3)

1.一种可交联碳氢树脂组合物的均匀分散液，其特征在于制备方法为将高导热填料A与热固型聚芳醚寡聚物共同混合于有机溶剂B中，在惰性气体保护下经球磨分散后制备得到均匀分散液；随后，向所述均匀分散液中加入热固型聚芳醚寡聚物的不良溶剂C而使得整体体系析出，经多次过滤以使得体系的溶剂整体置换为热固型聚芳醚寡聚物的不良溶剂C；接着，经冻干工艺充分除去不良溶剂C，再经低温粉碎得到高导热填料A与热固型聚芳醚寡聚物的混合物D；最后，将混合物D与辅助高导热填料E、辅助高导热填料F、可交联基体树脂、改性树脂、其他辅助填料、阻燃剂和引发剂共同混合于有机溶剂G中，再经搅拌剪切分散均匀之后制备得到固含量为20~75wt/v%的可交联碳氢树脂组合物的均匀分散液，
所述的高导热填料A为六方晶型的氮化铝和氮化硼中的一种或两种的混合物，粒径D50控制在5~40um之间，其用量占可交联碳氢树脂组合物的2~30wt%；所述的辅助高导热填料E为氮化铝、氮化硼、碳化硅、氮化硅和金刚石中的一种或几种的混合物，粒径D50控制在0.3~4um之间，其用量占可交联碳氢树脂组合物的0.5~20wt%；所述的辅助高导热填料F为纤维状氮化铝和纤维状氮化硼中的一种或两种的混合物，纤维直径为0.5~15um、长度为5~500um，其用量占可交联碳氢树脂组合物的0.5~10wt%，
所述的热固型聚芳醚寡聚物为乙烯基修饰聚苯醚中的一种或几种的混合物；所述聚苯醚的数均分子量控制在400~4000之间，所述的乙烯基存在于聚苯醚的端基或侧基上，单条所述聚苯醚的高分子链上至少含有2个乙烯基官能团；所述热固型聚芳醚寡聚物的用量占可交联碳氢树脂组合物的5~50wt%，
所述的有机溶剂B为N,N-二甲基甲酰胺、N,N-二甲基乙酰胺和四氢呋喃中的一种或几种的混合物；所述的有机溶剂G为N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、苯、甲苯和二甲苯中的一种或几种的混合物；所述的不良溶剂C为水，
所述均匀分散液制作半固化片的具体制备步骤为：将所述均匀分散液浸渍纤维布，经烘烤干燥得到半固化片，
所述的纤维布为电子级无碱玻纤布、碳纤维、硼纤维、凯夫拉、聚酰亚胺、聚四氟乙烯、聚酯纤维布和LCP纤维布中的一种；
所述的烘烤干燥分为两个阶段，第一阶段烘烤干燥温度为50~120℃, 时间为1~30min；第二阶段烘烤干燥温度为150~250℃，时间为1~30min。
2.如权利要求1所述的一种可交联碳氢树脂组合物的均匀分散液，其特征在于所述的可交联基体树脂为聚二烯烃中的一种或几种的混合物；所述可交联基体树脂的数均分子量控制在500~6000之间，其1,2-乙烯基含量≥25%；所述可交联基体树脂的用量占所述可交联碳氢树脂组合物的15~70wt%；
所述的改性树脂为二烯烃-马来酸酐共聚物中的一种或几种的混合物，在单条所述改性树脂高分子链的聚二烯烃嵌段上，至少含有一个反应型碳碳双键侧基；所述改性树脂的数均分子量控制在500~50000之间，其用量占所述可交联碳氢树脂组合物的0~10wt%；
所述的其他辅助填料为SiO2、Al2O3、TiO2、ZnO、MgO、Bi2O3、Al(OH)3、Mg(OH)2、BaTiO3、SrTiO3、Mg2TiO4、Bi2(TiO3)3、PbTiO3、NiTiO3、CaTiO3、ZnTiO3、Zn2TiO4、BaSnO3、Bi2(SnO3)3、CaSnO3、PbSnO3、MgSnO3、SrSnO3、ZnSnO3、BaZrO3、CaZrO3、PbZrO3、MgZrO3、SrZrO3、ZnZrO3、氧化石墨、氟化石墨、滑石粉、云母粉、高岭土、粘土、实心玻璃微珠、空心玻璃微珠、玻璃纤维、玄武岩纤维和碳纤维中的一种或是几种的混合物，还包括聚四氟乙烯预烧结料、超高分子量聚乙烯纤维、凯夫拉纤维、聚酰亚胺、聚醚酰亚胺、聚醚醚酮和聚苯硫醚中的一种或是几种的混合物；所述其他辅助填料的用量占所述可交联碳氢树脂组合物的0~60wt%；
所述的阻燃剂为铝镁系阻燃剂、硼锌系阻燃剂、钼锡系阻燃剂、溴系阻燃剂、三氧化二锑、磷系阻燃剂和氮系阻燃剂中的一种或多种的混合物；所述阻燃剂的用量占所述可交联碳氢树脂组合物的0~40wt%；
所述的引发剂为过氧化物和偶氮化物中的一种或几种的混合物，其半衰期为10h时的热分解温度≥50℃，用量占所述可交联碳氢树脂组合物的0.1~5wt%。
3.一种采用如权利要求1所述的可交联碳氢树脂组合物的均匀分散液来制作的半固化片制作的高导热热固型覆铜板，其特征在于具体步骤为：将半固化片、纤维布、膜和覆于表面的铜箔叠合在一起，经层压工艺制备得到热固型覆铜板；
其中，所述半固化片的张数≥2，纤维布的张数≥1，膜的张数≥0，铜箔的张数为1或2；在叠合过程中，所述纤维布的上下两侧均为所述的半固化片；
所述层压工艺的层压温度为180~250℃，层压压力为80~150kg/cm2，层压时间为0.5~18h；
所述的膜为含氟聚合物、聚酰亚胺、聚烯烃、聚芳烃、聚酰胺、聚醚酮、聚醚醚酮、聚芳醚、聚芳硫醚、聚芳醚砜、聚芳硫醚砜、聚芳醚酮、聚芳硫醚酮、聚醚砜酮、聚芳醚腈砜、聚芳硫醚腈砜、聚苯基喹喔啉、酚醛树脂、环氧树脂、氰酸酯树脂、聚碳酸酯、聚氨酯和聚甲醛中的一种或多种的混合物；
所述高导热热固型覆铜板的厚度控制在0.1~10mm之间。
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