CN112110019A - Electronic component packaging device - Google Patents
Electronic component packaging device Download PDFInfo
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- CN112110019A CN112110019A CN202010981610.XA CN202010981610A CN112110019A CN 112110019 A CN112110019 A CN 112110019A CN 202010981610 A CN202010981610 A CN 202010981610A CN 112110019 A CN112110019 A CN 112110019A
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- electronic component
- spring
- buffering
- buffer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to the technical field of sealing equipment product accessories and discloses an electronic component packaging device which comprises a packaging box, wherein four corners of the lower surface of the packaging box are fixedly connected with fixed bases, a cover plate is arranged on the upper surface of the packaging box, an operating handle is fixedly connected with the upper surface of the cover plate, a placing plate is arranged at the inner bottom of the packaging box, a damping device is arranged on the inner bottom side wall of the packaging box, and a side surface supporting and buffering device is arranged on the inner wall of the packaging box. This electronic components packaging hardware carries out elementary buffering shock attenuation to electronic components through bracing piece compression damping spring post and first compression spring cooperation buffering spring post, has better shock attenuation effect to electronic components, effectively avoids taking place because of the condition that rocks and causes electronic components damage in the transportation, is favorable to better to encapsulate the processing to electronic components, very big improvement the buffering shock attenuation effect to electronic components.
Description
Technical Field
The invention relates to the technical field of sealing equipment product accessories, in particular to an electronic component packaging device.
Background
With the development of electronic technology, electronic components are gradually developed towards miniaturization, light weight, high frequency, large current, low EMI (electromagnetic interference), low manufacturing cost and high reliability, products are required to still maintain excellent performance under the conditions of severe temperature change and external force impact, and more electronic components need to be packaged during processing in order to meet the performance requirements; the existing packaging device generally adopts a contact or semi-contact packaging mode to stabilize the electronic component; the existing packaging device has poor buffering effect on electronic components in the using process, is very easy to cause the damage of the electronic components due to shaking in the transportation process, is not favorable for better packaging the electronic components, and is not favorable for better damping and buffering protection on the electronic components.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an electronic component packaging device, which solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an electronic components packaging hardware, includes the encapsulation case, the equal fixedly connected with unable adjustment base in four corners of encapsulation case lower surface, the upper surface of encapsulation case is provided with the apron, the last fixed surface of apron is connected with the operating handle, the interior bottom of encapsulation case is provided with places the board, the interior bottom lateral wall of encapsulation case is provided with damping device, the inner wall of encapsulation case is provided with side support buffer, the lower surface of apron is provided with supplementary buffer, the equal fixedly connected with spacing box in top at the encapsulation case front and the back, the inside of spacing box is provided with the spacer pin, the lateral surface fixedly connected with extrusion spring of spacer pin, the front of apron and the equal fixedly connected with fixed pin in the back.
Preferably, damping device includes the fixed support board, the first stabilizer of lateral surface fixedly connected with of fixed support board, and the bottom of first stabilizer is provided with the bracing piece, and the bottom of bracing piece is provided with the second stabilizer, and the medial surface fixedly connected with damping spring post of second stabilizer, damping spring post's surface are provided with first compression spring, and fixed support board's lower fixed surface is connected with the buffering spring post.
Preferably, the side supporting and buffering device comprises a stable clamping vertical plate, a stable fixing frame is fixedly connected to the outer side surface of the stable clamping vertical plate, a supporting stabilizer bar is arranged on the outer side of the stable fixing frame, a sliding moving block is arranged on the outer side of the supporting stabilizer bar, a second compression spring is fixedly connected to the inner side of the sliding moving block, and a fixed sliding vertical plate is arranged on the outer side of the second compression spring.
Preferably, supplementary buffer includes the fixed diaphragm of centre gripping, the equal first support fixed frame of fixedly connected with in the left and right sides of the fixed diaphragm upper surface of centre gripping, and the top of first support fixed frame is provided with the pulling stabilizer bar, and the top of pulling stabilizer bar is provided with the second and supports the fixed frame, and the upper surface that the second supported the fixed frame is provided with fixed sliding block, the lateral surface fixedly connected with steadying plate of fixed sliding block, the medial surface fixedly connected with stabilizing spring of steadying plate.
Preferably, the upper surface of the second support fixing frame is provided with a fixed sliding groove, and the fixed sliding groove is in sliding connection with the fixed sliding block.
Preferably, the outer surface of the operating handle is provided with an anti-slip layer, and the outer surface of the anti-slip layer is uniformly provided with friction anti-slip grains.
Preferably, the left and right sides face of placing the board all is provided with T shape slider, and T shape spout has all been seted up to the left and right sides of encapsulation incasement wall, T shape slider and T shape spout sliding connection.
Preferably, the method further comprises the following steps: the system comprises a central processor, an alarm, a photographing device, an image processing device and an intelligent electronic component collecting device;
the central processor is arranged on the left side outside the packaging box;
the alarm is arranged on the right side outside the packaging box;
the photographing device is placed at the upper end inside the packaging box;
the image processing device is arranged at the left end of the photographing device;
the intelligent electronic component collecting device is placed at the upper end of the side surface supporting and buffering device;
the central processor is connected with the alarm, the photographing device, the image processing device and the intelligent electronic component collecting device;
the photographing device is used for acquiring an original surface image of the electronic component, analyzing the original surface image through the image processing device, and meanwhile, judging whether the surface of the electronic component has defects or not, and the specific working steps comprise:
the photographing device is used for acquiring an original surface image of the electronic component entering the packaging box at present;
the image processing device is used for receiving the original surface image and acquiring the original surface image with stripes;
meanwhile, carrying out two-dimensional Fourier transform on the original surface image with the stripes to obtain an initial frequency spectrum of the image;
acquiring the fringe interference of a corresponding zero frequency spectrum domain according to the amplitude value of the initial frequency spectrum at the zero frequency, and simultaneously reserving the self frequency spectrum of the original surface image;
the image processing device is also used for placing the stripe interference of the zero frequency spectrum in a preset interference-removing frequency spectrum to perform two-dimensional inverse Fourier transform to obtain a processed image after interference removal;
the central processor is used for dividing the processed image into a plurality of detection area images and extracting characteristic parameters from the detection areas;
matching the characteristic parameters with preset standard parameters;
if the characteristic parameters are matched with the preset standard parameters, the electronic component packaging device is indicated to work normally;
otherwise, controlling the alarm to give an alarm, and simultaneously controlling the intelligent electronic component collecting device to collect the electronic components.
Preferably, the method further comprises the following steps: the intelligent buffer device comprises a computer, a weight sensor and an intelligent buffer device;
the weight sensor is placed on the upper part of the fixed support plate;
the intelligent buffer device is placed inside the buffer spring column;
wherein the computer is connected with the weight sensor and the intelligent buffer device;
the computer is used for calculating a spring buffering threshold value of the buffering spring column, so that whether the weight of the electronic component exceeds the buffering threshold value or not is judged, the starting time of the intelligent buffering device is further determined, and the specific working process comprises the following steps:
the computer is used for calculating a spring buffering threshold value of the buffering spring column;
wherein M represents a spring damping threshold of the damping spring post, n represents an elastic modulus of the damping spring post, x represents an ideal compression amount of the damping spring, and ω is1Representing the relative amplitude, ω, of said damping spring2Represents the absolute amplitude of the buffer spring, g represents the gravity acceleration, and the value of g is 9.8m/s2μ denotes a damping coefficient of the cushion spring, k denotes a damping of the cushion spring, ρ denotes an elastic coefficient of the cushion spring, and k denotes an elastic coefficient of the cushion spring1Representing the stiffness, k, of said damping spring in a practical configuration2Representing the stiffness of the buffer spring in an equivalent structure, wherein ln (·) represents a logarithmic function with e as a base;
the weight sensor is used for acquiring the weight of the current electronic component;
the computer is further used for acquiring the gravity of the electronic component on the buffer spring column (607) through the current weight of the electronic component;
simultaneously, comparing the gravity force to a spring buffer threshold of the buffer spring post (607); if the mass of the electronic component is less than or equal to the spring buffering threshold value of the buffering spring column, the buffering spring column works normally;
otherwise, calculating the buffering force required by the intelligent buffering device according to the weight of the current electronic component;
wherein, F represents the buffer force needed by the intelligent buffer device, m represents the weight of the electronic component, p represents the working power of the intelligent buffer device, F represents the friction force of the electronic component on the fixed supporting plate, xi represents the friction coefficient, t represents the working time of the intelligent buffer device, F0Indicating the pre-pressure, omega, of the smart damping device before the start of operation0Representing the operating frequency, omega, of said intelligent damping means1Representing a preset working frequency of the intelligent buffer device;
and the computer is also used for controlling the intelligent buffer device to buffer the electronic component according to the buffer force.
(III) advantageous effects
Compared with the prior art, the invention provides an electronic component packaging device, which has the following beneficial effects:
1. this electronic components packaging hardware carries out elementary buffering shock attenuation to electronic components through bracing piece compression damping spring post and first compression spring cooperation buffering spring post, has better shock attenuation effect to electronic components, effectively avoids taking place because of the condition that rocks and causes electronic components damage in the transportation, is favorable to better to encapsulate the processing to electronic components, very big improvement the buffering shock attenuation effect to electronic components.
2. This electronic components packaging hardware carries out the side direction buffering to electronic components and supports the shock attenuation through stabilizing centre gripping riser and supporting stabilizer bar extrusion second compression spring, and the effectual stability of having guaranteed that electronic components rocks about, very big improvement the security of electronic components in the transportation, avoid electronic components to receive the damage.
3. This electronic components packaging hardware carries out the top surface buffering through the fixed diaphragm of centre gripping and pulling stabilizer bar extrusion stabilizing spring to electronic components and supports the shock attenuation, can be better carry out omnidirectional protection to electronic components, the effectual security of having guaranteed in the electronic components transportation, further improved the convenience of using.
4. This electronic components packaging hardware carries out spacing fixed to the fixed pin through spacer pin and extrusion spring cooperation, can more effectual assurance encapsulation case and the stability of cover connection, effectively prevents that encapsulation case and apron break away from because of great vibrations in the transportation, very big improvement the stability in the transportation.
5. The method comprises the steps of obtaining an original surface image of a current electronic component entering a packaging box through a photographing device, facilitating the receiving of an image processing device, obtaining the original surface image with stripes, obtaining an initial frequency spectrum of the image quickly and accurately through two-dimensional Fourier transform, obtaining stripe interference of a corresponding zero frequency spectrum domain through the amplitude value of the initial frequency spectrum at a zero frequency, simultaneously keeping the frequency spectrum of the original surface image, analyzing the image more accurately after removing the interference, extracting characteristic parameters corresponding to the regional image one by one through dividing the processed image into a plurality of images of detection regions, efficiently judging whether the surface of the intelligent electronic component is defective or not through matching the characteristic parameters with preset standard parameters, and completing the collection of the electronic component through an electronic component collecting device if the surface of the intelligent electronic component is defective, thereby avoiding the error of encapsulation and greatly improving the practicability of the device.
6. The spring buffering threshold value of the buffering spring column can be accurately calculated through the computer according to the elastic modulus and the ideal compression amount of the buffering spring column, the weight of the current electronic component can be quickly and accurately acquired through the weight sensor, the comparison is carried out with the spring buffering threshold value of the buffering spring column, whether the intelligent buffering device is started or not can be efficiently and accurately judged, the buffering force required by the intelligent buffering device is accurately calculated through the weight of the electronic component, the working power and the working frequency of the intelligent buffering device, mechanical resources are greatly saved, the method is favorable for the device to better finish the buffering protection effect on the electronic component, and the intelligence and the effectiveness of the device are greatly improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic vertical sectional view of the structure of the present invention;
FIG. 3 is a schematic view of the shock absorbing device according to the present invention;
FIG. 4 is a schematic view of a side support cushion of the present invention;
FIG. 5 is a schematic view of an auxiliary buffering device according to the present invention;
FIG. 6 is a schematic diagram of the CPU control connections of the present invention;
FIG. 7 is a schematic diagram of the computer control connection of the present invention.
In the figure: 1. packaging the box; 2. a fixed base; 3. a cover plate; 4. an operating handle; 5. placing the plate; 6. a damping device; 601. fixing the support plate; 602. a first stabilizer frame; 603. a support bar; 604. a second stabilizer frame; 605. a shock absorbing spring post; 606. a first compression spring; 607. a buffer spring post; 7. the side surface supports the buffer device; 701. stably clamping the vertical plate; 702. stabilizing the fixing frame; 703. a support stabilizer bar; 704. a sliding moving block; 705. a second compression spring; 706. fixing a sliding vertical plate; 8. an auxiliary buffer device; 801. clamping and fixing the transverse plate; 802. a first supporting and fixing frame; 803. pulling the stabilizer bar; 804. a second supporting and fixing frame; 805. fixing the sliding block; 806. a stabilizing plate; 807. a stabilizing spring; 9. a limiting box; 10. a spacing pin; 11. a compression spring; 12. and fixing the pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides an electronic components packaging hardware, including packaging box 1, the equal fixedly connected with unable adjustment base 2 in four corners of packaging box 1 lower surface, packaging box 1's upper surface is provided with apron 3, the last fixed surface of apron 3 is connected with operating handle 4, packaging box 1's interior bottom is provided with places board 5, packaging box 1's interior bottom lateral wall is provided with damping device 6, packaging box 1's inner wall is provided with side support buffer 7, the lower surface of apron 3 is provided with supplementary buffer 8, the equal fixedly connected with spacing box 9 in top at packaging box 1 front and the back, the inside of spacing box 9 is provided with spacer pin 10, the lateral surface fixedly connected with extrusion spring 11 of spacer pin 10, the equal fixedly connected with fixed pin 12 in front and the back of apron 3.
In order to further improve the damping effect, the damping device 6 comprises a fixed support plate 601, a first stabilizing frame 602 is fixedly connected to the outer side surface of the fixed support plate 601, a support rod 603 is arranged at the bottom of the first stabilizing frame 602, a second stabilizing frame 604 is arranged at the bottom of the support rod 603, a damping spring column 605 is fixedly connected to the inner side surface of the second stabilizing frame 604, a first compression spring 606 is arranged on the outer surface of the damping spring column 605, a buffer spring column 607 is fixedly connected to the lower surface of the fixed support plate 601, the damping spring column 605 and the first compression spring 606 are compressed by the support rod 603 and matched with the buffer spring column 607 to perform primary buffering and damping on the electronic component, so that the damping device has a better damping effect on the electronic component, the electronic component is effectively prevented from being damaged due to shaking in the transportation process, and is favorable for packaging the electronic component, the buffering and damping effects on the electronic components are greatly improved.
In order to improve the side damping effect on the electronic component, the side supporting and buffering device 7 comprises a stable clamping vertical plate 701, a stable fixing frame 702 is fixedly connected to the outer side surface of the stable clamping vertical plate 701, a supporting and stabilizing rod 703 is arranged on the outer side of the stable fixing frame 702, a sliding moving block 704 is arranged on the outer side of the supporting and stabilizing rod 703, a second compression spring 705 is fixedly connected to the inner side of the sliding moving block 704, a fixed sliding vertical plate 706 is arranged on the outer side of the second compression spring 705, the second compression spring 705 is extruded by the stable clamping vertical plate 701 and the supporting and stabilizing rod 703 to laterally buffer, support and damp the electronic component, effectively ensure the stability of the electronic component when the electronic component shakes left and right, greatly improve the safety of the electronic component in the transportation process, and avoid the.
In order to improve the auxiliary damping and buffering effect, the auxiliary buffering device 8 comprises a clamping and fixing transverse plate 801, wherein the left side and the right side of the upper surface of the clamping and fixing transverse plate 801 are fixedly connected with a first supporting and fixing frame 802, the top of the first supporting and fixing frame 802 is provided with a pulling stabilizing rod 803, the top of the pulling stabilizing rod 803 is provided with a second supporting and fixing frame 804, the upper surface of the second supporting and fixing frame 804 is provided with a fixing sliding block 805, the outer side surface of the fixing sliding block 805 is fixedly connected with a stabilizing plate 806, the inner side surface of the stabilizing plate 806 is fixedly connected with a stabilizing spring 807, through fixed diaphragm 801 of centre gripping and pulling stabilizer bar 803 extrusion stabilizing spring 807 to carry out the top surface buffering to electronic components and support the shock attenuation, can be better carry out omnidirectional protection to electronic components, the effectual security of guaranteeing in the electronic components transportation, further improved the convenience of using.
In order to improve the sliding stability, a fixed sliding groove is formed in the upper surface of the second supporting and fixing frame 804, the fixed sliding groove is in sliding connection with the fixed sliding block 805, and the fixed sliding groove in the upper surface of the second supporting and fixing frame 804 is matched with the fixed sliding block 805, so that the sliding stability is improved.
In order to improve the anti-skid effect, the outer surface of the operating handle 4 is provided with the anti-skid layer, the outer surface of the anti-skid layer is uniformly provided with the friction anti-skid grains, and the friction anti-skid grains on the outer surface of the operating handle 4 increase the friction force and improve the anti-skid effect.
In order to improve the stability during the vertical movement, T-shaped sliding blocks are arranged on the left side surface and the right side surface of the placing plate 5, T-shaped sliding grooves are formed in the left side surface and the right side surface of the inner wall of the packaging box 1, the T-shaped sliding blocks are connected with the T-shaped sliding grooves in a sliding mode, the T-shaped sliding blocks on the left side surface and the right side surface of the placing plate 5 are matched with the T-shaped sliding grooves on the left side surface and the right side surface of the inner wall of.
When the device is used, the limiting pin 10 is controlled to push inwards, the operation handle 4 is controlled to drive the cover plate 3 and the fixing pin 12 to be opened, an electronic component to be packaged is placed on the placing plate 5, the side supporting buffer device 7 is used for clamping, then the operation handle 4 is controlled to drive the cover plate 3 and the fixing pin 12 to be inserted into the limiting box 9 for limiting and fixing, transportation can be carried out after fixing is completed, the damping spring column 605 and the first compression spring 606 are compressed through the supporting rod 603 in the transportation process and are matched with the damping spring column 607 for primary buffering and damping of vibration received by the electronic component, then the second compression spring 705 is extruded through the stable clamping vertical plate 701 and the supporting and stabilizing rod 703 for lateral buffering and supporting and damping of lateral vibration received by the electronic component, then the stable spring stabilizing rod 807 is extruded through the clamping and fixing horizontal plate 801 and the pulling rod 803 for top surface buffering and supporting and, and the three-level shock absorption carries out omnibearing protection on the electronic components.
To sum up, this electronic components packaging hardware carries out elementary buffering shock attenuation to electronic components through bracing piece 603 compression damping spring post 605 and first compression spring 606 cooperation buffering spring post 607, has better shock attenuation effect to electronic components, effectively avoids causing the condition emergence of electronic components damage because of rocking in the transportation, is favorable to better to electronic components to encapsulate the processing, very big improvement to electronic components's buffering shock attenuation effect.
This electronic components packaging hardware carries out the side direction buffering through stabilizing centre gripping riser 701 and supporting stabilizer bar 703 extrusion second compression spring 705 to electronic components and supports the shock attenuation, and the effectual stability of having guaranteed that electronic components rocks when controlling has greatly improved the security of electronic components in the transportation, avoids electronic components to receive the damage.
This electronic components packaging hardware carries out the top surface buffering through the fixed diaphragm 801 of centre gripping and pulling stabilizer bar 803 extrusion stabilizing spring 807 to electronic components and supports the shock attenuation, can be better carry out the omnidirectional protection to electronic components, the effectual security of having guaranteed in the electronic components transportation, further improved the convenience of using.
This electronic components packaging hardware carries out spacing fixedly to fixed pin 12 through the cooperation of spacer pin 10 and extrusion spring 11, can more effectual assurance packaging box 1 and the stability of lapping 3 connection, effectively prevents that packaging box 1 and apron 3 break away from because of great vibrations in the transportation, very big improvement the stability in the transportation.
The present invention provides an electronic component packaging apparatus, as shown in fig. 6, further comprising: the system comprises a central processor, an alarm, a photographing device, an image processing device and an intelligent electronic component collecting device;
the central processor is arranged on the left side outside the packaging box 1;
the alarm is arranged on the right side outside the packaging box 1;
the photographing device is arranged at the upper end inside the packaging box 1;
the image processing device is arranged at the left end of the photographing device;
the intelligent electronic component collecting device is placed at the upper end of the side supporting and buffering device 7;
the central processor is connected with the alarm, the photographing device, the image processing device and the intelligent electronic component collecting device;
the photographing device is used for acquiring an original surface image of the electronic component, analyzing the original surface image through the image processing device, and meanwhile, judging whether the surface of the electronic component has defects or not, and the specific working steps comprise:
the photographing device is used for acquiring an original surface image of the electronic component entering the packaging box 1 at present;
the image processing device is used for receiving the original surface image and acquiring the original surface image with stripes;
meanwhile, carrying out two-dimensional Fourier transform on the original surface image with the stripes to obtain an initial frequency spectrum of the image;
acquiring the fringe interference of a corresponding zero frequency spectrum domain according to the amplitude value of the initial frequency spectrum at the zero frequency, and simultaneously reserving the self frequency spectrum of the original surface image;
the image processing device is also used for placing the stripe interference of the zero frequency spectrum in a preset interference-removing frequency spectrum to perform two-dimensional inverse Fourier transform to obtain a processed image after interference removal;
the central processor is used for dividing the processed image into a plurality of detection area images and extracting characteristic parameters from the detection areas;
matching the characteristic parameters with preset standard parameters;
if the characteristic parameters are matched with the preset standard parameters, the electronic component packaging device is indicated to work normally;
otherwise, controlling the alarm to give an alarm, and simultaneously controlling the intelligent electronic component collecting device to collect the electronic components.
In this embodiment, the characteristic parameter may be a parameter for judging the surface smoothness of the electronic component in the image representing the detection area.
The working principle and the beneficial effects of the technical scheme are as follows: the method comprises the steps of obtaining an original surface image of a current electronic component entering the packaging box 1 through a photographing device, facilitating the receiving of an image processing device, obtaining the original surface image with stripes, obtaining an initial frequency spectrum of the image quickly and accurately through two-dimensional Fourier transform, obtaining stripe interference of a corresponding zero frequency spectrum domain through the amplitude value of the initial frequency spectrum at a zero frequency, simultaneously keeping the frequency spectrum of the original surface image, more accurately analyzing the image after removing the interference, extracting characteristic parameters corresponding to the regional image one by one through dividing the processed image into images of a plurality of detection regions, efficiently judging whether the surface of the intelligent electronic component is defective or not through matching the characteristic parameters with preset standard parameters, and if so, completing the collection of the electronic component through an electronic component collecting device, thereby avoiding the error of encapsulation and greatly improving the practicability of the device.
The present invention provides an electronic component packaging apparatus, as shown in fig. 7, further comprising: the intelligent buffer device comprises a computer, a weight sensor and an intelligent buffer device;
the weight sensor is placed on the upper part of the fixed support plate 602;
the intelligent buffer device is placed inside the buffer spring column 607;
wherein the computer is connected with the weight sensor and the intelligent buffer device;
the computer is configured to calculate a spring buffering threshold of the buffering spring column 607, so as to determine whether the weight of the electronic component exceeds the buffering threshold, and further determine a start time of the intelligent buffering device, where the specific working process includes:
the computer is used for calculating the spring buffer threshold value of the buffer spring column 607;
wherein M represents a spring damping threshold of the damping spring post 607, n represents an elastic modulus of the damping spring post 607, x represents an ideal compression amount of the damping spring 607, ω1Represents the relative amplitude, ω, of the damper spring 6072Represents the absolute amplitude of the buffer spring 607, g represents the gravitational acceleration, which takes 9.8m/s2μ represents a damping coefficient of the damper spring 607, k represents a damping of the damper spring 607, ρ represents an elastic coefficient of the damper spring 607, and k represents an elastic coefficient of the damper spring 6071Represents the stiffness, k, of the damper spring 607 in a practical configuration2Represents the stiffness of the damper spring 607 in the equivalent structure, ln (·) represents a logarithmic function with e as the base;
the weight sensor is used for acquiring the weight of the current electronic component;
the computer is further used for acquiring the gravity of the electronic component on the buffer spring column (607) through the current weight of the electronic component;
simultaneously, comparing the gravity force to a spring buffer threshold of the buffer spring post (607);
if the mass of the electronic component is less than or equal to the spring buffer threshold of the buffer spring column 607, the buffer spring column 607 works normally;
otherwise, calculating the buffering force required by the intelligent buffering device according to the weight of the current electronic component;
wherein F represents a buffering force required by the intelligent buffering device, m represents a weight of the electronic component, p represents an operating power of the intelligent buffering device, F represents a friction force of the electronic component on the fixed supporting plate 602, ξ represents a friction coefficient, t represents an operating time of the intelligent buffering device, F represents a buffering force required by the intelligent buffering device, m represents a weight of the electronic component, p represents an operating power of the intelligent buffering device, F represents a friction force of the electronic component on the fixed supporting plate0Indicating the pre-pressure, omega, of the smart damping device before the start of operation0Representing the operating frequency, omega, of said intelligent damping means1Representing a preset working frequency of the intelligent buffer device;
and the computer is also used for controlling the intelligent buffer device to buffer the electronic component according to the buffer force.
In this embodiment, the spring buffer threshold may be the maximum weight that the buffer spring post 607 bears.
The working principle and the beneficial effects of the technical scheme are as follows: the spring buffering threshold value of the buffering spring column 607 can be accurately calculated through the computer according to the elastic modulus and the ideal compression amount of the buffering spring column 607, the weight of the current electronic component can be quickly and accurately acquired through the weight sensor, and the spring buffering threshold value of the buffering spring column 607 is compared, whether the intelligent buffering device is started can be efficiently and accurately judged, the buffering force required by the intelligent buffering device is accurately calculated through the weight of the electronic component, the working power and the working frequency of the intelligent buffering device, mechanical resources are greatly saved, the method is favorable for the device to better finish the buffering protection effect on the electronic component, and the intelligence and the effectiveness of the device are greatly improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides an electronic components packaging hardware, includes encapsulation case (1), its characterized in that: four corners of the lower surface of the packaging box (1) are fixedly connected with fixed bases (2), a cover plate (3) is arranged on the upper surface of the packaging box (1), an operating handle (4) is fixedly connected with the upper surface of the cover plate (3), a placing plate (5) is arranged at the inner bottom of the packaging box (1), a damping device (6) is arranged on the inner bottom side wall of the packaging box (1), the inner wall of the packaging box (1) is provided with a side surface supporting and buffering device (7), the lower surface of the cover plate (3) is provided with an auxiliary buffer device (8), the tops of the front surface and the back surface of the packaging box (1) are fixedly connected with limit boxes (9), a limiting pin (10) is arranged in the limiting box (9), the outer side surface of the limiting pin (10) is fixedly connected with an extrusion spring (11), the front and the back of the cover plate (3) are fixedly connected with fixing pins (12).
2. An electronic component packaging apparatus as claimed in claim 1, wherein: damping device (6) are including fixed support plate (601), the first stabilizer (602) of lateral surface fixedly connected with of fixed support plate (601), the bottom of first stabilizer (602) is provided with bracing piece (603), the bottom of bracing piece (603) is provided with second stabilizer (604), the medial surface fixedly connected with damping spring post (605) of second stabilizer (604), the surface of damping spring post (605) is provided with first compression spring (606), the lower fixed surface fixedly connected with buffer spring post (607) of fixed support plate (601).
3. An electronic component packaging apparatus as claimed in claim 1, wherein: the side supporting and buffering device (7) comprises a stable clamping vertical plate (701), a stable fixing frame (702) is fixedly connected to the outer side face of the stable clamping vertical plate (701), a supporting stabilizer bar (703) is arranged on the outer side of the stable fixing frame (702), a sliding moving block (704) is arranged on the outer side of the supporting stabilizer bar (703), a second compression spring (705) is fixedly connected to the inner side of the sliding moving block (704), and a fixed sliding vertical plate (706) is arranged on the outer side of the second compression spring (705).
4. An electronic component packaging apparatus as claimed in claim 1, wherein: the auxiliary buffering device (8) comprises a clamping fixing transverse plate (801), a first supporting and fixing frame (802) is fixedly connected to the left side and the right side of the upper surface of the clamping fixing transverse plate (801), a pulling stabilizing rod (803) is arranged at the top of the first supporting and fixing frame (802), a second supporting and fixing frame (804) is arranged at the top of the pulling stabilizing rod (803), a fixing sliding block (805) is arranged on the upper surface of the second supporting and fixing frame (804), a stabilizing plate (806) is fixedly connected to the outer side surface of the fixing sliding block (805), and a stabilizing spring (807) is fixedly connected to the inner side surface of the stabilizing plate (806).
5. An electronic component packaging apparatus as claimed in claim 4, wherein: and the upper surface of the second supporting and fixing frame (804) is provided with a fixed sliding groove, and the fixed sliding groove is in sliding connection with the fixed sliding block (805).
6. An electronic component packaging apparatus as claimed in claim 1, wherein: the outer surface of the operating handle (4) is provided with an anti-skid layer, and the outer surface of the anti-skid layer is evenly provided with friction anti-skid grains.
7. An electronic component packaging apparatus as claimed in claim 1, wherein: the left side face and the right side face of the placing plate (5) are provided with T-shaped sliding blocks, T-shaped sliding grooves are formed in the left side face and the right side face of the inner wall of the packaging box (1), and the T-shaped sliding blocks are connected with the T-shaped sliding grooves in a sliding mode.
8. An electronic component packaging apparatus as claimed in claim 1, further comprising: the system comprises a central processor, an alarm, a photographing device, an image processing device and an intelligent electronic component collecting device;
the central processor is arranged at the left side outside the packaging box (1);
the alarm is placed on the right side outside the packaging box (1);
the photographing device is placed at the upper end inside the packaging box (1);
the image processing device is arranged at the left end of the photographing device;
the intelligent electronic component collecting device is placed at the upper end of the side supporting and buffering device (7);
the central processor is connected with the alarm, the photographing device, the image processing device and the intelligent electronic component collecting device;
the photographing device is used for acquiring an original surface image of the electronic component, analyzing the original surface image through the image processing device, and meanwhile, judging whether the surface of the electronic component has defects or not, and the specific working steps comprise:
the photographing device is used for acquiring an original surface image of the electronic component entering the packaging box (1);
the image processing device is used for receiving the original surface image and acquiring the original surface image with stripes;
meanwhile, carrying out two-dimensional Fourier transform on the original surface image with the stripes to obtain an initial frequency spectrum of the image;
acquiring the fringe interference of a corresponding zero frequency spectrum domain according to the amplitude value of the initial frequency spectrum at the zero frequency, and simultaneously reserving the self frequency spectrum of the original surface image;
the image processing device is also used for placing the stripe interference of the zero frequency spectrum in a preset interference-removing frequency spectrum to perform two-dimensional inverse Fourier transform to obtain a processed image after interference removal;
the central processor is used for dividing the processed image into a plurality of detection area images and extracting characteristic parameters from the detection areas;
matching the characteristic parameters with preset standard parameters;
if the characteristic parameters are matched with the preset standard parameters, the electronic component packaging device is indicated to work normally;
otherwise, controlling the alarm to give an alarm, and simultaneously controlling the intelligent electronic component collecting device to collect the electronic components.
9. An electronic component packaging apparatus as claimed in claim 2, further comprising: the intelligent buffer device comprises a computer, a weight sensor and an intelligent buffer device;
the weight sensor is placed on the upper part of the fixed support plate (602);
the intelligent buffer device is placed inside the buffer spring column (607);
wherein the computer is connected with the weight sensor and the intelligent buffer device;
the computer is used for calculating a spring buffering threshold value of the buffering spring column (607), so that whether the weight of the electronic component exceeds the buffering threshold value or not is judged, the starting time of the intelligent buffering device is further determined, and the specific working process comprises the following steps:
the computer is used for calculating a spring buffer threshold value of the buffer spring column (607);
wherein M represents a spring damping threshold of the damping spring post (607), n represents an elastic modulus of the damping spring post (607), x represents an ideal compression amount of the damping spring (607), ω1Represents the relative amplitude, omega, of the damping spring (607)2Represents the absolute amplitude of the buffer spring (607), g represents the gravitational acceleration, and the value thereof is 9.8m/s2Mu represents a damping coefficient of the damper spring (607), k represents a damping of the damper spring (607), ρRepresents the elastic coefficient k of the buffer spring 6071Represents the stiffness, k, of the damping spring (607) in a practical configuration2Represents the stiffness of the buffer spring (607) in the equivalent structure, ln (·) represents a logarithmic function with e as the base;
the weight sensor is used for acquiring the weight of the current electronic component;
the computer is further used for acquiring the gravity of the electronic component on the buffer spring column (607) through the current weight of the electronic component;
simultaneously, comparing the gravity force to a spring buffer threshold of the buffer spring post (607);
if the mass of the electronic component is less than or equal to the spring buffer threshold value of the buffer spring column (607), the buffer spring column (607) works normally;
otherwise, calculating the buffering force required by the intelligent buffering device according to the weight of the current electronic component;
wherein F represents the buffering force required by the intelligent buffering device, m represents the weight of the electronic component, p represents the working power of the intelligent buffering device, F represents the friction force of the electronic component on the fixed supporting plate (602), xi represents the friction coefficient, t represents the working time of the intelligent buffering device, F0Indicating the pre-pressure, omega, of the smart damping device before the start of operation0Representing the operating frequency, omega, of said intelligent damping means1Representing a preset working frequency of the intelligent buffer device;
and the computer is also used for controlling the intelligent buffer device to buffer the electronic component according to the buffer force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010981610.XA CN112110019A (en) | 2020-09-17 | 2020-09-17 | Electronic component packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010981610.XA CN112110019A (en) | 2020-09-17 | 2020-09-17 | Electronic component packaging device |
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| Publication Number | Publication Date |
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| CN112110019A true CN112110019A (en) | 2020-12-22 |
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| CN202010981610.XA Withdrawn CN112110019A (en) | 2020-09-17 | 2020-09-17 | Electronic component packaging device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112938128A (en) * | 2021-04-09 | 2021-06-11 | 贵州民族大学 | Anti-flatulence fresh-keeping device for prepackaged lactobacillus fermented food |
-
2020
- 2020-09-17 CN CN202010981610.XA patent/CN112110019A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112938128A (en) * | 2021-04-09 | 2021-06-11 | 贵州民族大学 | Anti-flatulence fresh-keeping device for prepackaged lactobacillus fermented food |
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Application publication date: 20201222 |