CN112106453A - 壳体组件及终端 - Google Patents

壳体组件及终端 Download PDF

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Publication number
CN112106453A
CN112106453A CN201880093301.XA CN201880093301A CN112106453A CN 112106453 A CN112106453 A CN 112106453A CN 201880093301 A CN201880093301 A CN 201880093301A CN 112106453 A CN112106453 A CN 112106453A
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CN
China
Prior art keywords
gap
assembly
adhesive layer
adhesive
bezel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201880093301.XA
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English (en)
Other versions
CN112106453B (zh
Inventor
李诗哲
卢汉文
代晓涛
兰友鎣
朱统
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN112106453A publication Critical patent/CN112106453A/zh
Application granted granted Critical
Publication of CN112106453B publication Critical patent/CN112106453B/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/08—Constructional details, e.g. cabinet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请公开一种壳体组件，包括壳体、装饰件及粘胶组件，壳体设有通孔，装饰件包括基板及凸设于基板的装饰圈，基板上设有透气孔，透气孔位于装饰圈的外侧，装饰圈至少部分收容于通孔，装饰圈的外周侧面与通孔的孔壁之间形成缝隙，粘胶组件密封地粘接在基板与壳体之间，粘胶组件环绕装饰圈和透气孔设置，且粘胶组件与装饰圈的外周侧面之间形成通道，通道连通缝隙与透气孔。上述壳体组件能够快速平衡内外气压。本申请还公开一种终端。

Description

PCT国内申请，说明书已公开。

Claims (12)

  1. PCT国内申请，权利要求书已公开。
CN201880093301.XA 2018-05-11 2018-05-11 壳体组件及终端 Active CN112106453B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/086584 WO2019213956A1 (zh) 2018-05-11 2018-05-11 壳体组件及终端

Publications (2)

Publication Number Publication Date
CN112106453A true CN112106453A (zh) 2020-12-18
CN112106453B CN112106453B (zh) 2021-09-14

Family

ID=68467672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880093301.XA Active CN112106453B (zh) 2018-05-11 2018-05-11 壳体组件及终端

Country Status (5)

Country Link
US (1) US11165894B2 (zh)
EP (1) EP3780919B1 (zh)
CN (1) CN112106453B (zh)
ES (1) ES2942012T3 (zh)
WO (1) WO2019213956A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023160256A1 (zh) * 2022-02-25 2023-08-31 荣耀终端有限公司 装饰件、壳体组件及电子设备
WO2024104071A1 (zh) * 2022-11-18 2024-05-23 维沃移动通信有限公司 电子设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210101701A (ko) 2020-02-10 2021-08-19 삼성전자주식회사 스피커 및 스피커를 위한 음향 출력 경로를 포함하는 휴대용 단말기
CN112165543B (zh) * 2020-09-21 2022-06-07 Oppo广东移动通信有限公司 电子设备、镜头装饰件、后壳组件及其装配方法
EP4195630A4 (en) * 2020-12-16 2024-04-10 Samsung Electronics Co Ltd ELECTRONIC DEVICE
CN213754589U (zh) * 2021-05-20 2021-07-20 荣耀终端有限公司 外壳及含该外壳的终端设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1100365A (zh) * 1993-04-26 1995-03-22 林和国 金属复合玻璃钢材料及其制造工艺
US20170280576A1 (en) * 2015-09-24 2017-09-28 Cheng Uei Precision Industry Co., Ltd. Electronics housing and manufacturing method of electronics housing
JP6227810B1 (ja) * 2017-01-06 2017-11-08 京セラ株式会社 電子機器

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JP2006319018A (ja) * 2005-05-11 2006-11-24 Waatekkusu:Kk 電子装置
DE102006053113A1 (de) * 2006-11-10 2008-05-15 Robert Bosch Gmbh Druckausgleichelement für ein Gehäuse
US8718316B2 (en) * 2009-09-07 2014-05-06 Qualcomm Incorporated Structure for supporting an audio receiver component of a computing device
JP5057597B2 (ja) * 2010-11-30 2012-10-24 パナソニック株式会社 電子機器
JP6075163B2 (ja) * 2013-03-29 2017-02-08 富士通株式会社 携帯型電子機器及び携帯型電子機器の防水方法
JP2015201696A (ja) * 2014-04-04 2015-11-12 富士通株式会社 電子機器および電子機器の組み立て方法
JP6777759B2 (ja) * 2016-04-06 2020-10-28 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティドＷ．Ｌ． Ｇｏｒｅ ＆ Ａｓｓｏｃｉａｔｅｓ， Ｉｎｃｏｒｐｏｒａｔｅｄ 非多孔質 音響 メンブレンのための圧力平衡構造
CN106931203B (zh) * 2017-04-28 2019-01-04 维沃移动通信有限公司 一种压力平衡组件及电子设备
CN207039671U (zh) * 2017-08-04 2018-02-23 维沃移动通信有限公司 一种移动终端
KR102369614B1 (ko) * 2017-09-05 2022-03-03 삼성전자주식회사 방수 구조를 포함하는 전자 장치
KR101880465B1 (ko) * 2017-09-22 2018-07-20 엘지전자 주식회사 이동 단말기
CN107707694A (zh) * 2017-09-26 2018-02-16 广东欧珀移动通信有限公司 盖板组件、摄像组件及移动终端
CN107707796B (zh) * 2017-10-17 2023-08-22 Oppo广东移动通信有限公司 摄像头装饰件、终端、壳体组件及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1100365A (zh) * 1993-04-26 1995-03-22 林和国 金属复合玻璃钢材料及其制造工艺
US20170280576A1 (en) * 2015-09-24 2017-09-28 Cheng Uei Precision Industry Co., Ltd. Electronics housing and manufacturing method of electronics housing
JP6227810B1 (ja) * 2017-01-06 2017-11-08 京セラ株式会社 電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023160256A1 (zh) * 2022-02-25 2023-08-31 荣耀终端有限公司 装饰件、壳体组件及电子设备
WO2024104071A1 (zh) * 2022-11-18 2024-05-23 维沃移动通信有限公司 电子设备

Also Published As

Publication number Publication date
WO2019213956A1 (zh) 2019-11-14
EP3780919B1 (en) 2023-01-25
EP3780919A4 (en) 2021-04-14
EP3780919A1 (en) 2021-02-17
CN112106453B (zh) 2021-09-14
US11165894B2 (en) 2021-11-02
US20210234948A1 (en) 2021-07-29
ES2942012T3 (es) 2023-05-29

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