CN112080243B - Connection structure and anisotropic conductive adhesive - Google Patents

Connection structure and anisotropic conductive adhesive Download PDF

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CN112080243B
CN112080243B CN202010831018.1A CN202010831018A CN112080243B CN 112080243 B CN112080243 B CN 112080243B CN 202010831018 A CN202010831018 A CN 202010831018A CN 112080243 B CN112080243 B CN 112080243B
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anisotropic conductive
electronic component
connection structure
conductive film
electrode
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CN112080243A (en
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林慎一
田中雄介
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Dexerials Corp
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Dexerials Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Position Input By Displaying (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided are a connection structure and an anisotropic conductive adhesive, which can prevent the appearance of a decoration printing part from being damaged even when defects such as pinholes are generated in the decoration printing part. The connection structure is provided with: a 1 st electronic component 10 having an electrode 13 formed on the decoration layer 12, a 2 nd electronic component 20 having an electrode 22 formed to face the electrode 13 of the 1 st electronic component 10, and an anisotropic conductive film 30 connecting the electrode 13 of the 1 st electronic component 10 and the electrode 22 of the 2 nd electronic component 20; the anisotropic conductive film 30 is formed of a cured product of an anisotropic conductive adhesive containing conductive particles 31 and a black pigment 32. Thus, light leakage from the pinholes of the decorative printing portion can be reduced, and the design of the decorative printing portion can be maintained.

Description

Connection structure and anisotropic conductive adhesive
The present application is a divisional application of an invention patent application entitled "connection structure and anisotropic conductive adhesive", filed on 2014, 12/9, no. 201410462471.4.
Technical Field
The present invention relates to a connection structure in which electronic components are connected using an anisotropic conductive adhesive, and an anisotropic conductive adhesive.
Background
In recent years, in order to improve the degree of freedom in design, there have been proposed: for example, in a cover glass (cover glass) -integrated touch panel, an electrode is formed on a decorative layer printed on an outer peripheral portion in a frame-like decorative pattern, and a circuit member is bonded to the decorative layer.
However, when a defect such as a pinhole (pinhole) occurs in the decoration printing portion, light leakage occurs due to irradiation of a backlight, and the appearance is impaired. In addition, even if a pinhole is found in the decoration printed portion by inspection, since wiring is already formed on the decoration layer, repair is difficult.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2009-088465.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made in view of the above-described actual circumstances, and an object thereof is to: provided is a connection structure, wherein, even if defects such as pinholes are generated in a decoration printing portion, the appearance of the decoration printing portion can be prevented from being damaged; and an anisotropic conductive adhesive.
Means for solving the problems
In order to solve the above problem, a connection structure according to the present invention is characterized in that: the electronic component includes a 1 st electronic component having an electrode formed on a decorative layer, a 2 nd electronic component having an electrode formed thereon and facing the electrode of the 1 st electronic component, and an anisotropic conductive film connecting the electrode of the 1 st electronic component and the electrode of the 2 nd electronic component, wherein the anisotropic conductive film is formed from a cured product of an anisotropic conductive adhesive containing conductive particles and a black pigment.
Further, a touch panel according to the present invention is characterized in that: the display device includes a display window portion having a touch panel function, a decorative layer formed on a peripheral edge portion other than the display window portion, a 1 st electronic component having an electrode formed on the decorative layer, a 2 nd electronic component having an electrode formed thereon and facing the electrode of the 1 st electronic component, and an anisotropic conductive film connecting the electrode of the 1 st electronic component and the electrode of the 2 nd electronic component, wherein the anisotropic conductive film is formed of a cured product of an anisotropic conductive adhesive containing conductive particles and a black pigment.
Further, an anisotropic conductive adhesive according to the present invention is characterized in that: the composition contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment which does not contain carbon as a main raw material.
Further, a method for producing a connection structure according to the present invention is characterized in that: an anisotropic conductive film containing conductive particles and a black pigment is temporarily attached to an electrode of a 1 st electronic component having an electrode formed on a decorative layer, a 2 nd electronic component is arranged on the anisotropic conductive film, and the 2 nd electronic component is pressed by a pressure contact head from above.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, since the black pigment of the anisotropic conductive film reduces light leakage of the decoration printed portion, the appearance of the decoration printed portion can be prevented from being damaged.
Drawings
Fig. 1 is a sectional view showing a connection structure to which the present invention is applied.
Fig. 2 is a perspective view showing an example of the connection structure.
FIG. 3 is a photograph of a connection structure prepared using the anisotropic conductive film of example 3, which was observed from the side of the evaluation FPC by a metal microscope while lamp light was irradiated from the side of the evaluation glass substrate.
FIG. 4 is a photograph of a connection structure prepared using the anisotropic conductive film of comparative example 1, which was observed from the side of the evaluation FPC by a metal microscope while lamp light was irradiated from the side of the evaluation glass substrate.
Description of the symbols
10. The electronic component comprises a No. 1 electronic component, a transparent substrate 11, a decorative layer 12, an electrode 13, an electronic component 2, a substrate 21, an electrode 22, an anisotropic conductive film 30, a glass substrate 51, an FPC52 and an anisotropic conductive film 53.
Detailed Description
In the following description with reference to the drawings, the embodiments of the present invention will be described in detail by the following order:
1. connection structure
2. Anisotropic conductive adhesive
3. Examples are given.
<1. Connection Structure >
Fig. 1 is a sectional view showing a connection structure to which the present invention is applied. As shown in fig. 1, the connection structure includes: the decoration layer 12 is provided with a 1 st electronic component 10 having an electrode 13 formed thereon, a 2 nd electronic component 20 having an electrode 22 formed thereon so as to face the electrode 13 of the 1 st electronic component 10, and an anisotropic conductive film 30 connecting the electrode 13 of the 1 st electronic component 10 and the electrode 22 of the 2 nd electronic component 20. The anisotropic conductive film 30 is formed of a cured product of an anisotropic conductive adhesive containing conductive particles 31 and a black pigment 32. Thus, even when a defect such as a pinhole occurs in the decoration printed portion, the black pigment 32 of the anisotropic conductive film 30 can reduce light leakage in the decoration printed portion, thereby preventing the appearance of the decoration printed portion from being damaged.
The 1 st electronic component 10 includes: a transparent substrate 11, a decoration layer 12 decorated and printed on the transparent substrate, and an electrode 13 formed on the decoration layer 12.
As the transparent substrate 11, for example, a substrate having a transmittance of 80% or more with respect to visible light can be used, and a substrate having a transmittance of 95% or more can be preferably used. An inorganic transparent substrate such as glass, which is generally used for a liquid crystal display device, or a transparent resin substrate such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, and a cyclic olefin copolymer can be used.
The decorative layer 12 is formed from a cured product of the colored resin composition. The colored resin composition can be prepared by, for example, dispersing a colorant in a resin binder containing a monomer, a photopolymerization initiator, a sensitizer, a solvent, and the like. The coloring agent colors the decorative layer 12 to a desired color, and pigments and dyes can be used. As the pigment, any of organic pigments or inorganic pigments may be used; the amount of the additive is not particularly limited. As the color of the decorative layer 12, black having a light-shielding property is preferably used from the viewpoint of design and productivity. In some cases, a metal layer is provided when importance is attached to design, but in such cases, a resin layer is often provided on the outermost surface with a coating material or the like, and the material of the adhesive surface is substantially the same.
As the 1 st electronic component 10, for example, a touch panel integrated with a protective glass is exemplified. The cover glass integrated touch panel includes a display window portion in which a signal line for sensing a touch position is formed and which has a touch panel function, and a decorative layer 11 formed on a surface opposite to a viewing side of the transparent substrate 11 and on a peripheral portion other than the display window portion. The display window portion is formed with a transparent electrode such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), siNx (silicon nitride) or the like as a capacitive touch panel layer, for example. Even if the cover glass is replaced with a material that replaces glass, there is no particular problem because it is not essential to the invention.
The 2 nd electronic component 20 includes a substrate 21 and an electrode 22 formed on the substrate 21. As such a 2 nd electronic component, an FPC (Flexible Printed Circuit), an IC (Integrated Circuit), or the like can be cited.
The anisotropic conductive film 30 is formed of a cured product of an anisotropic conductive adhesive containing conductive particles 31 and a black pigment 32, and electrically connects the 1 st electronic component 10 and the 2 nd electronic component 20 via the conductive particles 31.
As the anisotropic conductive adhesive, any of radical polymerization type, anionic polymerization type, cationic polymerization type, and the like can be used, and radical polymerization type which can be cured at a lower temperature and causes less thermal damage to the decorative layer 12 is preferable.
The radical polymerization type anisotropic conductive adhesive contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles and a black pigment. Here, carbon black, which is generally used as a black pigment, has radical complementarity and is a factor of hindering curing, and therefore a black pigment not mainly composed of carbon is used for the radical polymerizable anisotropic conductive adhesive. As the black pigment not mainly composed of carbon, a titanium-based black pigment can be mentioned.
A connection structure including such a constitution is prepared by the following method: an anisotropic conductive film is temporarily attached to the electrodes 13 of the 1 st electronic component 10, the 2 nd electronic component 20 is placed on the anisotropic conductive film, and the pressure is applied from the top surface of the 2 nd electronic component 20 by a pressure contact. According to such a manufacturing method, the electrode 13 of the 1 st electronic component 10 and the electrode 22 of the 2 nd electronic component 20 are electrically connected by the conductive particles 31, and the 1 st electronic component 10 and the 2 nd electronic component 20 can be bonded by the anisotropic conductive film 30 obtained by curing the anisotropic conductive film.
<2 > Anisotropic conductive adhesive agent >
Next, an anisotropic conductive adhesive used for the connection structure will be described. The anisotropic conductive adhesive of the present embodiment contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, conductive particles, and a black pigment which does not contain carbon as a main raw material.
The film-forming resin corresponds to a high-molecular-weight resin having an average molecular weight of 10000 or more, and is preferably an average molecular weight of about 10000 to 80000 from the viewpoint of film-forming properties. Examples of the film-forming resin include various resins such as phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyimide resin, butyral resin, and the like, and these resins may be used alone or in combination of 2 or more. Among them, phenoxy resins are preferably used from the viewpoint of film formation state, connection reliability, and the like. The content of the film-forming resin is usually 30 to 80 parts by mass, preferably 40 to 70 parts by mass, per 100 parts by mass of the adhesive composition.
The radical polymerizable resin is a substance having a functional group by radical polymerization, and examples thereof include epoxy acrylate, urethane acrylate, and polyester acrylate, and these may be used alone or in combination of 2 or more. Among these, in the present embodiment, epoxy acrylate is preferably used. The content of the radical polymerizable resin is usually 10 to 60 parts by mass, preferably 20 to 50 parts by mass, per 100 parts by mass of the adhesive composition.
As the radical polymerization initiator, known ones can be used, and among them, organic peroxides can be preferably used. Examples of the organic peroxide include peroxy ketals, diacyl peroxides, peroxydicarbonates, peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and the like, and these may be used alone or in combination of 2 or more. Among them, in the present embodiment, peroxyketals are preferably used. The content of the radical polymerization initiator is usually 0.1 to 30 parts by mass, preferably 1 to 20 parts by mass, per 100 parts by mass of the radical adhesive composition.
As the conductive particles, for example, metal particles such as gold particles, silver particles, and nickel particles, and metal-coated resin particles in which the surface of resin particles such as benzoguanamine resin and styrene resin is coated with metal such as gold, nickel, and zinc can be used. The average particle diameter of the conductive particles is 1 to 30 μm, and more preferably 3 to 20 μm.
The black pigment is not particularly limited as long as it is mainly composed of carbon, and a titanium-based black pigment such as titanium oxide, an oxide-based black pigment such as an iron oxide (magnetite-type ferroferric oxide) or a composite oxide of copper and chromium, or a composite oxide of copper, chromium, and zinc may be used.
When a titanium-based black pigment is used, the average primary particle diameter is preferably 60nm or more and 800nm or less. Further, it is preferable that the titanium-based black pigment is blended in an amount of 2 to 40 parts by mass based on 100 parts by mass of the adhesive component. This makes it possible to obtain a connection structure having excellent on-resistance, peel strength, and light-shielding properties.
Further, as another additive component to the adhesive, a silane coupling agent is preferably added. Examples of the silane coupling agent include epoxy, amino, mercapto, thioether, and ureide coupling agents.
In addition, in order to improve adhesion to an inorganic substrate, phosphate acrylate is preferably added. Examples of the phosphate acrylate include a curable phosphate ester compound which is a reaction product of 2-hydroxyethyl methacrylate and phosphoric acid.
In addition, inorganic fillers may be added. As the inorganic filler, silica, talc, calcium carbonate, magnesium oxide, and the like can be used, and the type of the inorganic filler is not particularly limited. When each component of these binders is blended, toluene, ethyl acetate, or a mixed solvent thereof is preferably used.
The anisotropic conductive adhesive having such a configuration contains a black pigment not mainly composed of carbon, and therefore, the anisotropic conductive adhesive does not inhibit a radical reaction, reduces light leakage from pinholes in the decorative printed portion, and prevents the appearance of the decorative printed portion from being damaged.
Examples
<3. Example >
Examples of the present invention are explained below. In this example, a radical-curable anisotropic conductive film containing a black pigment was prepared, and the transmittance of the anisotropic conductive film was measured. Further, a connection structure was prepared using the anisotropic conductive adhesive film, and on-resistance, peel strength, and light-shielding properties of the connection structure were evaluated. It should be noted that the present invention is not limited to these examples.
The measurement of the transmittance of the anisotropic conductive film, the preparation of the connection structure, the measurement of the on-resistance, the measurement of the peel strength, and the evaluation of the light-shielding property were performed as follows.
[ measurement of transmittance of Anisotropic conductive film ]
The transmittance of the anisotropic conductive adhesive film in an uncured state was measured by using a spectrophotometer (UV-3600 manufactured by Shimadzu corporation).
[ preparation of connection Structure ]
Fig. 2 is a perspective model view showing the connection structure of the present embodiment. A glass substrate 51 for evaluation was prepared by coating a black ink (GLS-HF 919, produced by Imperial ink manufacturing Co., ltd.) to a thickness of 5 μm on the surface of a glass having a thickness of 0.7mm, and coating the surface with ITO (Indium Tin Oxide) to form a glass/black ink layer/ITO. In addition, the black ink layer is formed to have a size of 1 to 6 μm per 1mm 2 150 to 200 pinholes. The glass substrate 51 for evaluation had a black ink layer in the intermediate layer, and this was removedOtherwise, the same procedure as that of a known ITO (Indium Tin Oxide) coated glass substrate (ITO coated on the entire surface and having a glass thickness of 0.7 mm) was conducted. The glass substrate 51 for evaluation was bonded to an FPC52 for evaluation (400. Mu. MP, cu 18. Mu. Mt-Au plating, 25. Mu. Mt-Espanex-S base material) using an anisotropic conductive film 53.
An anisotropic conductive film 53 cut to a width of 1.5mm was attached to a glass substrate 51 for evaluation, and after temporarily fixing an FPC52 thereon, bonding was performed under conditions of 150 ℃ to 4MPa to 10 seconds by a heating tool having a width of 1.5mm using a buffer material (polytetrafluoroethylene) having a thickness of 100 μm to prepare a connection structure.
[ measurement of on-resistance ]
The connection structure was measured for initial connection resistance and connection resistance after a high temperature and high humidity test at 60 ℃/95%/500 hr. The connection resistance was measured by a 4-terminal method using a digital multimeter (model: digital multimeter 7555, manufactured by yokogawa electric corporation) when a current of 1mA was passed.
[ measurement of peeling Strength ]
The connection structure was measured for the initial peel strength and the peel strength after the high temperature and high humidity test at 60 ℃/95%/500 hr. A 90 ° peel test (JISK 6854-1) was performed in which the evaluation FPC52 was peeled from the evaluation glass substrate 51 in the 90 ° direction, and the peel strength (N/mm) was measured.
[ evaluation of light-shielding Properties ]
The connection structure was observed by irradiating a lamp light from the side of the glass substrate 51 for evaluation, on which pin holes were formed in advance, and observing the connection structure from the side of the FPC52 for evaluation with a metal microscope at intervals of 1mm 2 Is less than 10, is rated "very good" every 1mm 2 The number of pinholes of (1) was evaluated as "O" when it was 10 or more and less than 50, and the value was evaluated as "O" every 1mm 2 The number of pinholes of (a) was 50 or more and evaluated as "x".
[ Total judgment ]
When the light-shielding property was evaluated as ". Cndot", the on-resistance after the high-temperature and high-humidity test was evaluated as "a". Further, when the light-shielding property was evaluated as "excellent", the on-resistance after the high-temperature and high-humidity test was 5.0 Ω or more and less than 10.0 was evaluated as "B". When the light-shielding property was evaluated as "excellent", the on-resistance after the high-temperature and high-humidity test was 10.0 Ω or more was evaluated as "C". In the case where the light-shielding property was evaluated as "o", the on-resistance after the high-temperature and high-humidity test was evaluated as "B". In addition, when the light-shielding property was evaluated as "o", the on-resistance after the high-temperature and high-humidity test was 5.0 Ω or more, and the on-resistance was evaluated as "C". In addition, the case where the light-shielding property was evaluated as "x" was evaluated as "C".
[ example 1]
60 parts by mass of a polyester urethane resin (trade name: UR8200, manufactured by Toyo Seiki Kagaku K.K., dissolved to 20% by mass in a mixed solvent of methyl ethyl ketone/toluene = 50/50) as a film-forming resin, 34 parts by mass of a radical polymerizable resin (trade name: EB-600, daicel Cytec Co., ltd. (ダイセル, サイテック), 1 part by mass of a silane coupling agent (trade name: KBM-503, manufactured by shin-Etsu chemical Co., ltd.), 1 part by mass of a phosphoric acid acrylate (trade name: P-1M, manufactured by Kbm chemical Co., ltd.), and 4 parts by mass of a reaction initiator (trade name: perhexa C (パーヘキサ C), manufactured by Nippon oil & fats Co., ltd.) were blended to obtain a binder, conductive particles (trade name: AUL, manufactured by Water accumulation chemical industries, ltd.) were dispersed so that the particle density was 5000/mm 2 Further, 12 parts by mass of a titanium black pigment (trade name: 12S, manufactured by Mitsubishi materials, mitsubishi マテリアル) having an average primary particle diameter of 60nm was dispersed to prepare an anisotropic conductive film having a thickness of 20 μm.
The transmittance of the anisotropic conductive film of example 1 was 13.4%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 2.2 Ω, and the on-resistance after the high temperature and high humidity test was 7.0 Ω. Further, the initial peel strength was 6.0N/cm, and the peel strength after the high temperature and high humidity test was 4.1N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is B. These results are shown in table 1.
[ example 2]
An anisotropic conductive film was prepared in the same manner as in example 1, except that 12 parts by mass of a titanium black pigment (trade name: 13M-C, manufactured by Mitsubishi マテリアル) having an average primary particle diameter of 100nm was dispersed.
The transmittance of the anisotropic conductive film of example 2 was 13.3%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 2.0 Ω, and the on-resistance after the high-temperature and high-humidity test was 5.5 Ω. Further, the initial peel strength was 6.1N/cm, and the peel strength after the high temperature and high humidity test was 4.0N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is B. These results are shown in table 1.
[ example 3]
An anisotropic conductive film was prepared in the same manner as in example 1, except that 12 parts by mass of a titanium black pigment (trade name: tilack D, manufactured by Chiko chemical industries, ltd.) having an average primary particle diameter of 800nm was dispersed.
The transmittance of the anisotropic conductive film of example 3 was 13.8%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 1.8 Ω, and the on-resistance after the high-temperature and high-humidity test was 3.2 Ω. Further, the initial peel strength was 6.0N/cm, and the peel strength after the high temperature and high humidity test was 4.3N/cm.
In addition, fig. 3 is: a photograph of a connection structure prepared using the anisotropic conductive film of example 3, which was observed from the evaluation FPC side with a metal microscope by irradiating light from the evaluation glass substrate side on which pinholes were formed in advance. No pinhole was observed, and the light-shielding property was evaluated very good. Therefore, the overall judgment is a. These results are shown in table 1.
Comparative example 1
An anisotropic conductive film was prepared in the same manner as in example 1, except that the black pigment was not dispersed.
The anisotropic conductive film of comparative example 1 had a transmittance of 84.6%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 1.8 Ω, and the on-resistance after the high-temperature and high-humidity test was 3.0 Ω. Further, the initial peel strength was 5.8N/cm, and the peel strength after the high temperature and high humidity test was 4.0N/cm.
In addition, fig. 4 is: a photograph of the connection structure prepared for the anisotropic conductive film of comparative example 1, which was observed from the evaluation FPC side with a metal microscope by irradiating a lamp light from the evaluation glass substrate side on which pinholes were formed in advance. Pinhole was observed and the light-shielding property was evaluated as X. Therefore, the overall judgment is C. These results are shown in table 1.
Comparative example 2
An anisotropic conductive film was prepared in the same manner as in example 1 except that 1 part by mass of a titanium black pigment (trade name: tilack D, manufactured by Chiko chemical industries, ltd.) having an average primary particle diameter of 800nm was dispersed.
The anisotropic conductive film of comparative example 2 had a transmittance of 67.4%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 1.8 Ω, and the on-resistance after the high-temperature and high-humidity test was 3.2 Ω. Further, the initial peel strength was 5.9N/cm, and the peel strength after the high temperature and high humidity test was 4.0N/cm. Further, the light-shielding property was evaluated as ×. Therefore, the overall judgment is C. These results are shown in table 1.
[ example 4]
An anisotropic conductive film was prepared in the same manner as in example 1, except that 2 parts by mass of a titanium black pigment (trade name: tilack D, manufactured by Chiko chemical industries, ltd.) having an average primary particle diameter of 800nm was dispersed.
The transmittance of the anisotropic conductive film of example 4 was 50.3%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 1.8 Ω, and the on-resistance after the high-temperature and high-humidity test was 3.0 Ω. Further, the initial peel strength was 6.0N/cm, and the peel strength after the high temperature and high humidity test was 4.2N/cm. The light-shielding property was evaluated as o. Therefore, the overall judgment is B. These results are shown in table 1.
[ example 5]
An anisotropic conductive film was prepared in the same manner as in example 1, except that 5 parts by mass of a titanium black pigment (trade name: tilack D, manufactured by Chiko chemical industries, ltd.) having an average primary particle diameter of 800nm was dispersed.
The anisotropic conductive film of example 5 had a transmittance of 17.9%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 1.8 Ω, and the on-resistance after the high-temperature and high-humidity test was 3.1 Ω. Further, the initial peel strength was 6.1N/cm, and the peel strength after the high temperature and high humidity test was 4.0N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is a. These results are shown in table 1.
[ example 6]
An anisotropic conductive film was prepared in the same manner as in example 1, except that 36 parts by mass of a titanium black pigment (trade name: tilack D, manufactured by Hakka chemical Co., ltd.) having an average primary particle diameter of 800nm was dispersed.
The transmittance of the anisotropic conductive film of example 6 was 11.2%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 2.3 Ω, and the on-resistance after the high-temperature and high-humidity test was 7.9 Ω. Further, the initial peel strength was 6.3N/cm, and the peel strength after the high temperature and high humidity test was 4.1N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is B. These results are shown in table 1.
Comparative example 3
An anisotropic conductive film was prepared in the same manner as in example 1, except that 48 parts by mass of a titanium black pigment (trade name: tilack D, manufactured by Chiko chemical industries, ltd.) having an average primary particle diameter of 800nm was dispersed.
The anisotropic conductive film of comparative example 3 had a transmittance of 10.7%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 2.5 Ω, and the on-resistance after the high-temperature and high-humidity test was 11.3 Ω. Further, the initial peel strength was 6.5N/cm, and the peel strength after the high temperature and high humidity test was 4.2N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is C. These results are shown in table 1.
Comparative example 4
An anisotropic conductive film was prepared in the same manner as in example 1, except that 12 parts by mass of carbon black (trade name: #2350, manufactured by mitsubishi chemical) having an average primary particle diameter of 15nm was dispersed as a black pigment.
The anisotropic conductive film of comparative example 4 had a transmittance of 12.0%. In addition, the initial on-resistance of the connection structure prepared using the anisotropic conductive film was 5.2 Ω, and the on-resistance after the high-temperature and high-humidity test was 10.6 Ω. Further, the initial peel strength was 1.5N/cm, and the peel strength after the high temperature and high humidity test was 0.5N/cm. The light-shielding property was evaluated ∈. Therefore, the overall judgment is C. These results are shown in table 1.
[ Table 1]
Figure DEST_PATH_IMAGE001
As shown in table 1, it was found that a repair function for preventing light leakage from a pinhole can be provided by blending an appropriate amount of a black pigment, and the design of the decorative part can be maintained. As shown in example 1~6, it is found that when a titanium-based black pigment is used, a connection structure having excellent on-resistance, peel strength and light-shielding properties can be obtained by blending 2 to 40 parts by mass of a titanium-based black pigment having an average primary particle diameter of 60nm or more and 800nm or less with respect to 100 parts by mass of an adhesive component. As shown in comparative example 4, since carbon black has a radical-supplementing property and is a factor of inhibiting curing, it is necessary to use a black pigment other than carbon black in the case of the radical-curable anisotropic conductive film.

Claims (15)

1. A connection structure body, comprising:
a substrate having an electrode formed on the decorative layer,
an electronic component formed with electrodes opposed to the electrodes of the substrate, and
an anisotropic conductive film connecting the electrode of the substrate and the electrode of the electronic component;
the anisotropic conductive film is formed from a cured product of an anisotropic conductive adhesive containing a black pigment which does not contain carbon as a main raw material,
when the anisotropic conductive film is used, the film is formed every 1mm 2 150 to 200 pinholesWhen the substrate with the electrode formed on the decoration layer is connected with the electronic component, the number of pinholes for transmitting illumination light is less than 1mm 2 50 of the Chinese medicinal materials.
2. The connection structure according to claim 1, wherein the anisotropic conductive film further contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, and conductive particles.
3. The connection structure according to claim 1 or 2, wherein the substrate is an inorganic transparent substrate or a transparent resin substrate.
4. The connection structure according to claim 1 or 2, wherein the electronic component is an FPC or an IC.
5. The connection structure according to claim 1 or 2, wherein the black pigment is a titanium-based black pigment.
6. A touch panel provided with:
a display window section having a touch panel function, a decorative layer formed on a peripheral edge portion other than the display window section, and a 1 st electronic component having an electrode formed on the decorative layer,
a 2 nd electronic component formed with an electrode opposed to the electrode of the 1 st electronic component, and
an anisotropic conductive film connecting an electrode of the 1 st electronic component and an electrode of the 2 nd electronic component;
the anisotropic conductive film is formed from a cured product of an anisotropic conductive adhesive containing a black pigment which does not contain carbon as a main raw material,
when the anisotropic conductive film is used, the film is formed every 1mm 2 When the 1 st electronic component and the 2 nd electronic component, which have electrodes formed on the decorative layer of 150 to 200 pinholes, are connected, the number of pinholes through which illumination light passes is less than 1mm per chip 2 50 of the Chinese medicinal materials.
7. The touch panel according to claim 6, wherein the anisotropic conductive film further contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, and conductive particles.
8. The touch panel according to claim 6 or 7, wherein the 1 st electronic component is an inorganic transparent substrate or a transparent resin substrate.
9. The touch panel according to claim 6 or 7, wherein the 2 nd electronic component is an FPC or an IC.
10. A method for producing a connection structure, wherein,
an anisotropic conductive film containing a black pigment which is not mainly composed of carbon is temporarily stuck to an electrode of a substrate having the electrode formed on a decorative layer,
an electronic component is disposed on the anisotropic conductive film,
pressing the electronic component from the upper surface thereof with a press contact;
will form every 1mm 2 When the substrate having electrodes formed on the decorative layer of 150 to 200 pinholes is connected to the electronic component, the number of pinholes through which illumination light is transmitted is less than 1mm per substrate 2 50 of the Chinese medicinal materials.
11. The method of producing a connection structure according to claim 10, wherein the anisotropic conductive film further contains a film-forming resin, a radical polymerizable resin, a radical polymerization initiator, and conductive particles.
12. The method of producing a connection structure according to claim 10 or 11, wherein the black pigment is a titanium-based black pigment.
13. The method of producing a connection structure according to claim 10 or 11, wherein the black pigment is blended in an amount of 2 to 40 parts by mass per 100 parts by mass of an adhesive component containing a film-forming resin, a radical polymerizable resin, and a radical polymerization initiator.
14. The method of producing a connection structure according to claim 10 or 11, wherein the substrate is an inorganic transparent substrate or a transparent resin substrate.
15. The production method of a connection structure according to claim 10 or 11, wherein the electronic component is an FPC or an IC.
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Publication number Priority date Publication date Assignee Title
JP6346877B2 (en) * 2015-06-25 2018-06-20 株式会社タムラ製作所 Anisotropic conductive adhesive and method for producing printed wiring board using the same
JP5974147B1 (en) 2015-07-31 2016-08-23 株式会社フジクラ Wiring assembly, structure with conductor layer, and touch sensor
CN109614017B (en) * 2018-11-27 2021-07-06 武汉华星光电半导体显示技术有限公司 Touch panel and display device
CN112768590A (en) * 2020-12-30 2021-05-07 深圳市华星光电半导体显示技术有限公司 Preparation method of display panel and display panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532903A (en) * 2002-03-25 2004-09-29 索尼化学株式会社 Method for producing connection member
JP2012088412A (en) * 2010-10-18 2012-05-10 Sekisui Chem Co Ltd Light-shielding sealing agent for liquid crystal display element, vertical conducting material and liquid crystal display element
CN103092404A (en) * 2011-11-04 2013-05-08 Smk株式会社 Transparent touch panel
CN103890966A (en) * 2011-10-18 2014-06-25 迪睿合电子材料有限公司 Conductive adhesive, solar cell module using same, and method for manufacturing solar cell module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001126541A (en) * 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd Anisotropic-conductive film and electric/electronic parts
WO2003000816A1 (en) * 2001-06-25 2003-01-03 Telephus, Inc. Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same
JP5029372B2 (en) 2007-09-14 2012-09-19 日立化成工業株式会社 Anisotropic conductive adhesive, anisotropic conductive film, and method for manufacturing circuit connection structure
KR101025620B1 (en) * 2009-07-13 2011-03-30 한국과학기술원 Anisotropic Conductive Adhesives for UltraSonic Bonding and Electrical Interconnection Method of Electronic Components Using Thereof
JP5690637B2 (en) * 2011-04-12 2015-03-25 デクセリアルズ株式会社 Anisotropic conductive film, connection method and connection structure
JP5844599B2 (en) * 2011-10-12 2016-01-20 デクセリアルズ株式会社 CONNECTION DEVICE, CONNECTION MANUFACTURING METHOD, CONNECTION METHOD
KR101355854B1 (en) * 2011-12-16 2014-01-29 제일모직주식회사 Anisotropic conductive film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532903A (en) * 2002-03-25 2004-09-29 索尼化学株式会社 Method for producing connection member
JP2012088412A (en) * 2010-10-18 2012-05-10 Sekisui Chem Co Ltd Light-shielding sealing agent for liquid crystal display element, vertical conducting material and liquid crystal display element
CN103890966A (en) * 2011-10-18 2014-06-25 迪睿合电子材料有限公司 Conductive adhesive, solar cell module using same, and method for manufacturing solar cell module
CN103092404A (en) * 2011-11-04 2013-05-08 Smk株式会社 Transparent touch panel

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