CN112067968A - V-shaped groove detection method and equipment - Google Patents
V-shaped groove detection method and equipment Download PDFInfo
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- CN112067968A CN112067968A CN201910496713.4A CN201910496713A CN112067968A CN 112067968 A CN112067968 A CN 112067968A CN 201910496713 A CN201910496713 A CN 201910496713A CN 112067968 A CN112067968 A CN 112067968A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
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Abstract
The embodiment of the invention provides a V-shaped groove detection method and equipment, wherein the method comprises the following steps: the method comprises the steps of obtaining the position of each test welding disc assembly on a circuit board to be tested, wherein an intersection point exists between the test welding disc assembly and at least one V-shaped groove needing to exist on the circuit board, the V-shaped groove is arranged on the position, needing to exist, on the circuit board, the preset testing device is controlled to conduct electrical testing on each test welding disc assembly according to the position of each test welding disc assembly, the electrical state of each test welding disc assembly is obtained, if a target test welding disc assembly with the electrical state being a conducting state exists, it is determined that no V-shaped groove exists on the position, needing to exist, corresponding to the target test welding disc assembly, of the V-shaped groove, automatic detection of the V-shaped groove is achieved, and the missing rate is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of PCB processing, in particular to a V-shaped groove detection method and equipment.
Background
In the process of manufacturing a Printed Circuit Board (PCB), PCB units are designed to be connected on a large Board, and after corresponding functional patterns, solder resist ink coverage and corresponding surface treatment are completed, the large Board is cut into small units by molding. In order to facilitate the carrying and assembling operation of the PCB in the subsequent assembly process of the components, a process edge (also called a breaking edge) is generally added at the edge of the shipment unit of the PCB; and after the PCB is assembled, the broken edge is manually separated and broken from the PCB, and in order to enable the technical edge to be easily separated, a V-CUT knife is adopted to CUT into a groove with a certain depth, namely a V-shaped groove, between the minimum units of the delivered PCB in the PCB forming process through special equipment, so that the technical edge can be conveniently separated after the assembly of a customer.
In the actual production process, the phenomenon of missing making the V-shaped groove easily exists, namely, the corresponding V-shaped groove does not exist at the position where the V-shaped groove needs to exist. And when the V-shaped groove which is missed to be made exists on the PCB, the reworking treatment is required.
However, the inventors found that at least the following problems exist in the prior art: whether the corresponding V-shaped grooves exist at the positions where the V-shaped grooves need to exist is manually checked one by one, so that the checking efficiency is low, the condition of missing checking is easy to occur, and the missing checking rate is high.
Disclosure of Invention
The embodiment of the invention provides a V-shaped groove detection method and equipment, and aims to solve the problems of low detection efficiency and high omission factor caused by the fact that whether a missed V-shaped groove exists on a PCB needs to be manually detected in the prior art.
In a first aspect, an embodiment of the present invention provides a method for detecting a V-shaped groove, including:
acquiring the position of each test pad assembly on a circuit board to be tested, wherein the test pad assembly and at least one V-shaped groove required to be present on the circuit board have an intersection point, and the V-shaped groove is arranged at the position required to be present on the circuit board;
controlling a preset testing device to perform electrical testing on each testing pad component according to the position of each testing pad component to obtain the electrical state of each testing pad component;
and if the target test pad assembly with the electric state being the conducting state exists, determining that no V-shaped groove exists at the position, corresponding to the target test pad assembly, where the V-shaped groove needs to exist.
In one possible design, before acquiring the position of each test pad assembly on the circuit board to be tested, the method includes:
obtaining the component type and the component direction corresponding to each test pad component;
and adding each test pad component to the circuit board according to the component type, the component direction and the position corresponding to each test pad component.
In a possible design, the obtaining a component type corresponding to each test pad component includes:
and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight line type, a right angle type and a V-shaped type.
In one possible design, the adding each test pad component to the circuit board according to the component type, the component direction, and the position corresponding to each test pad component includes:
acquiring the position of each first test pad assembly in a first assembly direction, wherein the first assembly direction is any one of the assembly directions;
respectively calculating the distance between every two adjacent first test bonding pad assemblies according to the position of each first test bonding pad assembly;
and if all the calculated distances are the same, adding each first test pad component to the circuit board according to an array adding mode.
In one possible design, the in-line test pad assembly comprises two pads connected by a connecting line in the form of a straight line.
In a second aspect, an embodiment of the present invention provides a V-groove detection apparatus, including:
the device comprises a component position acquisition module, a test welding disc module and a test welding disc module, wherein the component position acquisition module is used for acquiring the position of each test welding disc module on a circuit board to be tested, an intersection point exists between the test welding disc module and at least one V-shaped groove needing to exist on the circuit board, and the V-shaped groove is arranged on the position needing to exist on the circuit board;
the electrical testing module is used for controlling a preset testing device to perform electrical testing on each testing pad component according to the position of each testing pad component to obtain the electrical state of each testing pad component;
and the V-shaped groove determining module is used for determining that no V-shaped groove exists at the position where the V-shaped groove needs to exist corresponding to the target test pad assembly if the target test pad assembly with the electric property state being the conducting state exists.
In one possible design, the V-groove detection apparatus further includes: the device comprises a component information acquisition module and a component adding module;
the component information acquisition module is used for acquiring the component type and the component direction corresponding to each test pad component before acquiring the position of each test pad component on the circuit board to be tested;
and the assembly adding module is used for adding each test welding pad assembly to the circuit board according to the assembly type, the assembly direction and the position corresponding to each test welding pad assembly.
In one possible design, the component information obtaining module is specifically configured to: and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight line type, a right angle type and a V-shaped type.
In one possible design, the component addition module is specifically configured to:
acquiring the position of each first test pad assembly in a first assembly direction, wherein the first assembly direction is any one of the assembly directions;
respectively calculating the distance between every two adjacent first test bonding pad assemblies according to the position of each first test bonding pad assembly;
and if all the calculated distances are the same, adding each first test pad component to the circuit board according to an array adding mode.
In one possible design, the in-line test pad assembly comprises two pads connected by a connecting line in the form of a straight line.
In a third aspect, an embodiment of the present invention provides a V-groove detection apparatus, including: at least one processor and memory;
the memory stores computer-executable instructions;
the at least one processor executing the computer-executable instructions stored by the memory causes the at least one processor to perform the V-groove detection method as described above in the first aspect and in various possible designs of the first aspect.
In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, where the computer-readable storage medium stores computer-executable instructions, and when a processor executes the computer-executable instructions, the V-groove detection method according to the first aspect and various possible designs of the first aspect is implemented.
According to the V-shaped groove detection method and the equipment, the preset testing device is controlled to perform electrical testing on each test pad assembly according to the position of each test pad assembly on the circuit board to be tested to obtain the electrical state of each test pad assembly, whether a corresponding V-shaped groove exists at the position, corresponding to the position where the V-shaped groove needs to exist, of each test pad assembly is determined according to the electrical state of each test pad assembly, automatic detection of the V-shaped groove on the circuit board is achieved, manual detection is not needed, detection efficiency of the V-shaped groove is improved, and due to the fact that each test pad assembly is associated with the V-shaped groove needing to exist, detection of all the V-shaped grooves on the circuit board is achieved through detection of each test pad assembly, the condition of missing detection is avoided, and the missing detection rate is low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of a V-shaped groove on a circuit board according to an embodiment of the present invention;
fig. 2 is a first schematic flow chart of a V-groove detection method according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a test pad assembly provided by an embodiment of the present inventors;
FIG. 4 is a schematic view of a test pad assembly in the shape of a straight line intersecting a V-groove according to an embodiment of the present invention;
FIG. 5 is a schematic view of a V-shaped test pad assembly intersecting a V-shaped groove as provided by an embodiment of the present inventors;
FIG. 6 is a schematic view of the intersection of a rectangular test pad assembly and a V-groove provided by an embodiment of the present inventors
Fig. 7 is a second schematic flowchart of a V-groove detection method according to an embodiment of the present invention;
fig. 8 is a first schematic structural diagram of a V-groove detection apparatus according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a V-groove detection apparatus according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a hardware structure of the V-groove detection apparatus according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic view of a V-shaped groove on a circuit board according to an embodiment of the present invention. As shown in fig. 1, a plurality of V-CUTs, i.e., V-grooves, are present on the PCB board. In the actual production process of the PCB, the phenomenon of missing V-shaped grooves is easy to occur, in order to avoid the V-shaped grooves which are missed on the PCB, whether corresponding V-shaped grooves exist at positions where the V-shaped grooves need to be made is generally manually checked one by one, if not, reworking processing needs to be carried out on the PCB, because the positions where the V-shaped grooves need to be made are manually checked one by one, when the positions where the V-shaped grooves need to be made are more, the condition of missing detection is easy to occur, and the checking efficiency is low.
The application provides a V-shaped groove detection method aiming at the problems in the prior art, and whether a corresponding V-shaped groove exists at the position where the V-shaped groove is required to be made is automatically detected, so that the condition of missing detection is avoided, and the detection efficiency of the V-shaped groove is improved. The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Fig. 2 is a schematic flow chart of a V-groove detection method according to an embodiment of the present invention, as shown in fig. 2, the method includes:
s201, obtaining the position of each test welding disc assembly on the circuit board to be tested, wherein an intersection point exists between the test welding disc assembly and at least one V-shaped groove needing to exist on the circuit board, and the V-shaped groove is arranged on the position, where the V-shaped groove needs to exist, on the circuit board.
In this embodiment, the test pad assembly types include a straight type, a right angle type and a V type, and the circuit board is a PCB circuit board, as shown in fig. 3.
Wherein, the intersection point exists between the in-line test pad assembly and a V-shaped groove which needs to exist on the circuit board, as shown in fig. 4.
Wherein, there is an intersection point between the test pad assembly in the shape of V and a V-shaped groove to be present on the circuit board, as shown in fig. 5.
Wherein, there is an intersection point between the right-angle test pad and two V-shaped grooves that need to exist on the circuit board, as shown in fig. 6.
In this embodiment, the V-shaped groove to be present is disposed at a position where the V-shaped groove needs to be present on the circuit board, and whether the corresponding V-shaped groove exists at the position where the V-shaped groove needs to be present is detected, that is, the V-shaped groove to be present is the V-shaped groove to be detected.
S202, controlling a preset testing device to perform electrical testing on each testing pad assembly according to the position of each testing pad assembly to obtain the electrical state of each testing pad assembly.
In this embodiment, the preset testing device is moved to the position of the first testing pad assembly, and the first testing pad assembly is subjected to an electrical test to obtain an electrical state of the first testing pad assembly, where the first testing pad assembly is any one of the testing pad assemblies on the circuit board.
The electrical property test is a conductivity test, and the electrical property state comprises a conduction state or a disconnection state.
And S203, if the target test pad assembly with the electric state being the conducting state exists, determining that no V-shaped groove exists at the position where the V-shaped groove needs to exist corresponding to the target test pad assembly.
In this embodiment, if the electrical states of all the test pad assemblies are off states, it is determined that all the positions on the circuit board where V-shaped grooves need to be present have corresponding V-shaped grooves. If the target test pad with the electrical property state being the conducting state exists, the fact that the corresponding V-shaped groove does not exist at the position, corresponding to the target test pad, where the V-shaped groove needs to exist indicates that the circuit board needs to be reworked.
According to the above description, the preset testing device is controlled to perform electrical testing on each test pad assembly according to the position of each test pad assembly on the circuit board to be tested, so as to obtain the electrical state of each test pad assembly, whether a corresponding V-shaped groove exists at the position, corresponding to the position where the V-shaped groove needs to exist, of each test pad assembly is determined according to the electrical state of each test pad assembly, so that the automatic detection of the V-shaped groove on the circuit board is realized, the detection efficiency of the V-shaped groove is improved, and the detection of all the V-shaped grooves on the circuit board is realized by detecting each test pad assembly as each test pad assembly is associated with the V-shaped groove needing to exist, so that the condition of missing detection is avoided, and the missing detection rate is low.
The circuit board is produced according to a simulation diagram of the circuit board, and in order to improve the detection efficiency of the V-shaped groove on the circuit, a test pad assembly needs to be used, so that the test pad assembly needs to be added to the simulation diagram of the circuit board, and then a circuit diagram containing the test pad assembly is produced according to the added simulation diagram, and the process of adding the test pad assembly will be described in detail in a specific embodiment.
Fig. 7 is a schematic flow chart of a V-groove detection method according to an embodiment of the present invention, and this embodiment describes in detail a specific implementation process of testing a pad assembly on the basis of the embodiment of fig. 2. As shown in fig. 7, the method includes:
s701, obtaining the component type and the component direction corresponding to each testing pad component.
In one possible design, step S701 includes: and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight type, a right-angle type and a V-shaped type.
Wherein, the component direction includes the upper, lower, left and right of the circuit board.
In this embodiment, the component type, position, and component direction of the test pad assembly are determined by a user according to the V-shaped groove that needs to be present on the circuit board, and the V-shaped groove that needs to be present corresponds to the component type, component direction, and position of the test pad assembly one to one. And aiming at each V-shaped groove needing to exist, acquiring the component type, the component direction and the position of the test pad component corresponding to the V-shaped groove needing to exist, which are input by a user.
Wherein the position is a position coordinate of the test pad assembly.
The testing welding disc assembly in the shape of a straight line comprises two welding discs, and the two welding discs are connected through a linear connecting line.
The right-angle test welding disc assembly comprises a first welding disc, a second welding disc and a third welding disc, the first welding disc is connected with the second welding disc through a first connecting line which is linear, the second welding disc is connected with the third welding disc through a second connecting line which is linear, and the first connecting line and the second connecting line are right angles.
The V-shaped test welding disc assembly comprises two welding discs, and the two welding discs are connected through a V-shaped connecting line.
S702, adding each test pad component to the circuit board according to the component type, the component direction and the position corresponding to each test pad component.
In this embodiment, each test pad component needs to be added to the circuit board one by one according to the component type, the component direction, and the position corresponding to each test pad component, and the specific adding process is as follows: and acquiring a second test welding disc component corresponding to the first V-shaped groove to be existed, and adding the second test welding disc component to the simulation diagram of the circuit board according to the component type, the component direction and the position of the second test welding disc component.
Wherein, the V type groove that first needs to exist is arbitrary one that needs to exist on the circuit board V type groove.
In order to improve the adding efficiency of the test pad assembly, a plurality of test pad assemblies of the same assembly type need to be added at equal intervals in a certain assembly direction, an array adding mode can be adopted, the test pad assembly in the direction can be added into a simulation diagram of a circuit board at one time, and the specific process is as follows: the position of each first test pad assembly in a first assembly direction is obtained, wherein the first assembly direction is any one of the assembly directions. And respectively calculating the distance between every two adjacent first test bonding pad assemblies according to the position of each first test bonding pad assembly. And if all the calculated distances are the same, adding each first test pad component to the circuit board according to the array adding mode.
Wherein the component type of each first test pad assembly in the first component direction is the same.
In order to improve the adding efficiency of the test pad assembly, a mirror image adding mode can be also carried out, and the test pad assemblies symmetrical in the opposite direction are added into the simulation diagram of the circuit board at one time. For example, the test pad assemblies of the same assembly type need to be added above and below, and the test pad assembly needing to be added above and the test pad assembly needing to be added below have a vertically symmetrical relationship, that is, one test pad assembly above and the test pad assembly below the test pad assembly above are symmetrical to each other.
Because in the process of generating the circuit board, the test pad assembly needs to be etched, and the test pad assembly can be corroded by liquid medicine to be reduced, the compensation value corresponding to each test pad assembly can be obtained in the process of adding the test pad assembly to the simulation graph of the circuit board, the size of the test pad assembly is increased according to the compensation value corresponding to each test pad assembly, and the condition that the detection is inaccurate due to the fact that the test pad assembly is corroded is avoided.
The compensation value of the test pad assembly is obtained according to the copper thickness of the circuit board, and the compensation value corresponding to the copper thickness of the circuit board can be obtained from a preset table.
When the size of the welding disc assembly is tested to be increased, the size is increased according to a preset size increasing rule, for example, the diameter of the welding disc is increased by a compensation value.
In this embodiment, when the test pad assembly is added to the circuit board, the capture center function is turned on, and the test pad assembly is added to the center of the V-shaped groove on the circuit board.
S703, obtaining the position of each test pad assembly on the circuit board to be tested, wherein an intersection point exists between the test pad assembly and at least one V-shaped groove which needs to exist on the circuit board, and the V-shaped groove is arranged on the position where the V-shaped groove needs to exist on the circuit board.
And S704, controlling a preset testing device to perform electrical testing on each test pad assembly according to the position of each test pad assembly to obtain the electrical state of each test pad assembly.
S705, if the target test pad assembly with the electric state being the conducting state exists, determining that no V-shaped groove exists at the position where the V-shaped groove needs to exist corresponding to the target test pad assembly.
S703 to S705 are similar to S201 to S203 in the embodiment of fig. 2, and details of this embodiment are not repeated here.
Fig. 8 is a first schematic structural diagram of a V-groove detection apparatus according to an embodiment of the present invention. As shown in fig. 8, the V-groove detecting apparatus 80 includes: a component position acquisition module 801, an electrical test module 802, and a V-groove determination module 803.
The component position obtaining module 801 is configured to obtain positions of each test pad assembly on the circuit board to be tested, where an intersection point exists between the test pad assembly and at least one V-shaped groove that needs to exist on the circuit board, and the V-shaped groove is disposed on the circuit board where the V-shaped groove needs to exist.
And the electrical test module 802 is configured to control the preset test device to perform electrical test on each test pad assembly according to the position of each test pad assembly, so as to obtain an electrical state of each test pad assembly.
And a V-groove determining module 803, configured to determine that no V-groove exists at a position where a V-groove needs to exist, where the V-groove corresponds to the target test pad assembly, if the target test pad assembly with the electrical property in the conducting state exists.
The device provided in this embodiment may be used to implement the technical solution of the above method embodiment, and the implementation principle and technical effect are similar, which are not described herein again.
Fig. 9 is a schematic structural diagram of a V-groove detection apparatus according to an embodiment of the present invention. As shown in fig. 9, this embodiment further includes, on the basis of the embodiment in fig. 8: a component information acquisition module 804 and a component addition module 805.
In one possible design, the component information obtaining module 804 is configured to obtain a component type and a component direction corresponding to each test pad component before obtaining a position of each test pad component on the circuit board to be tested.
And the component adding module 805 is used for adding each test pad component to the circuit board according to the component type, the component direction and the position corresponding to each test pad component.
In one possible design, the component information obtaining module 804 is specifically configured to: and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight type, a right-angle type and a V-shaped type.
In one possible design, the component addition module 805 is specifically configured to:
the position of each first test pad assembly in a first assembly direction is obtained, wherein the first assembly direction is any one of the assembly directions.
And respectively calculating the distance between every two adjacent first test bonding pad assemblies according to the position of each first test bonding pad assembly.
And if all the calculated distances are the same, adding each first test pad component to the circuit board according to the array adding mode.
In one possible design, the in-line test pad assembly includes two pads connected by a connecting line in a straight line.
The device provided in this embodiment may be used to implement the technical solution of the above method embodiment, and the implementation principle and technical effect are similar, which are not described herein again.
Fig. 10 is a schematic diagram of a hardware structure of the V-groove detection apparatus according to the embodiment of the present invention. As shown in fig. 10, the V-groove detecting apparatus 90 of the present embodiment includes: a processor 901 and a memory 902; wherein
A memory 902 for storing computer-executable instructions;
the processor 901 is configured to execute computer-executable instructions stored in the memory to implement the steps performed by the receiving device in the above embodiments. Reference may be made in particular to the description relating to the method embodiments described above.
Alternatively, the memory 902 may be separate or integrated with the processor 901.
When the memory 902 is separately provided, the V-groove detection apparatus further includes a bus 903 for connecting the memory 902 and the processor 901.
The embodiment of the present invention further provides a computer-readable storage medium, where computer-executable instructions are stored in the computer-readable storage medium, and when a processor executes the computer-executable instructions, the V-groove detection method is implemented as described above.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the modules is only one logical division, and other divisions may be realized in practice, for example, a plurality of modules may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present invention may be integrated into one processing unit, or each module may exist alone physically, or two or more modules are integrated into one unit. The unit formed by the modules can be realized in a hardware form, and can also be realized in a form of hardware and a software functional unit.
The integrated module implemented in the form of a software functional module may be stored in a computer-readable storage medium. The software functional module is stored in a storage medium and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network device) or a processor (processor) to execute some steps of the methods according to the embodiments of the present application.
It should be understood that the Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in a hardware processor, or in a combination of the hardware and software modules within the processor.
The memory may comprise a high-speed RAM memory, and may further comprise a non-volatile storage NVM, such as at least one disk memory, and may also be a usb disk, a removable hard disk, a read-only memory, a magnetic or optical disk, etc.
The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended ISA (EISA) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, the buses in the figures of the present application are not limited to only one bus or one type of bus.
The storage medium may be implemented by any type or combination of volatile or non-volatile memory devices, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks. A storage media may be any available media that can be accessed by a general purpose or special purpose computer.
An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. Of course, the storage medium may also be integral to the processor. The processor and the storage medium may reside in an Application Specific Integrated Circuits (ASIC). Of course, the processor and the storage medium may reside as discrete components in an electronic device or host device.
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A V-shaped groove detection method is characterized by comprising the following steps:
acquiring the position of each test pad assembly on a circuit board to be tested, wherein the test pad assembly and at least one V-shaped groove required to be present on the circuit board have an intersection point, and the V-shaped groove is arranged at the position required to be present on the circuit board;
controlling a preset testing device to perform electrical testing on each testing pad component according to the position of each testing pad component to obtain the electrical state of each testing pad component;
and if the target test pad assembly with the electric state being the conducting state exists, determining that no V-shaped groove exists at the position, corresponding to the target test pad assembly, where the V-shaped groove needs to exist.
2. The method of claim 1, prior to obtaining the location of each test pad assembly on a circuit board to be tested, comprising:
obtaining the component type and the component direction corresponding to each test pad component;
and adding each test pad component to the circuit board according to the component type, the component direction and the position corresponding to each test pad component.
3. The method of claim 2, wherein the obtaining the component type corresponding to each test pad component comprises:
and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight line type, a right angle type and a V-shaped type.
4. The method of claim 2, wherein adding each test pad component to the circuit board according to its corresponding component type, component orientation, and location comprises:
acquiring the position of each first test pad assembly in a first assembly direction, wherein the first assembly direction is any one of the assembly directions;
respectively calculating the distance between every two adjacent first test bonding pad assemblies according to the position of each first test bonding pad assembly;
and if all the calculated distances are the same, adding each first test pad component to the circuit board according to an array adding mode.
5. The method of claim 3, wherein the in-line test pad assembly comprises two pads connected by a straight connecting line.
6. A V type groove check out test set which characterized in that includes:
the device comprises a component position acquisition module, a test welding disc module and a test welding disc module, wherein the component position acquisition module is used for acquiring the position of each test welding disc module on a circuit board to be tested, an intersection point exists between the test welding disc module and at least one V-shaped groove needing to exist on the circuit board, and the V-shaped groove is arranged on the position needing to exist on the circuit board;
the electrical testing module is used for controlling a preset testing device to perform electrical testing on each testing pad component according to the position of each testing pad component to obtain the electrical state of each testing pad component;
and the V-shaped groove determining module is used for determining that no V-shaped groove exists at the position where the V-shaped groove needs to exist corresponding to the target test pad assembly if the target test pad assembly with the electric property state being the conducting state exists.
7. The apparatus of claim 6, wherein the V-groove detection apparatus further comprises: the device comprises a component information acquisition module and a component adding module;
the component information acquisition module is used for acquiring the component type and the component direction corresponding to each test pad component before acquiring the position of each test pad component on the circuit board to be tested;
and the assembly adding module is used for adding each test welding pad assembly to the circuit board according to the assembly type, the assembly direction and the position corresponding to each test welding pad assembly.
8. The device of claim 7, wherein the component information obtaining module is specifically configured to: and acquiring the test pad component type and the component direction corresponding to each V-shaped groove selected by a user, wherein the test pad component type comprises a straight line type, a right angle type and a V-shaped type.
9. A V type groove check out test set which characterized in that includes: at least one processor and memory;
the memory stores computer-executable instructions;
execution of computer-executable instructions stored by the memory by the at least one processor causes the at least one processor to perform the V-groove detection method of any of claims 1 to 5.
10. A computer-readable storage medium having computer-executable instructions stored thereon, which when executed by a processor, implement the V-groove detection method of any one of claims 1 to 5.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188482A (en) * | 2001-12-20 | 2003-07-04 | Hitachi Communication Technologies Ltd | Printed wiring board |
| CN201213331Y (en) * | 2008-07-08 | 2009-03-25 | 常州澳弘电子有限公司 | PCB board capable of avoiding omission of v-cut operation |
| CN202218477U (en) * | 2011-08-12 | 2012-05-09 | 湖北建浩科技有限公司 | PCB (Printed Circuit Board) capable of quickly judging V-CUT |
| CN102721384A (en) * | 2012-06-26 | 2012-10-10 | 胜华电子（惠阳）有限公司 | V-shaped cutting deviation detecting method of circuit board |
| CN104089982A (en) * | 2014-07-11 | 2014-10-08 | 深圳市景旺电子股份有限公司 | Missing-prevention forming detection method for PCB (Printed Circuit Board) |
| CN105072808A (en) * | 2015-07-09 | 2015-11-18 | 华进半导体封装先导技术研发中心有限公司 | Etching compensation method for high-precision packaging substrate |
| CN107787122A (en) * | 2016-08-24 | 2018-03-09 | 深圳市嘉立创科技发展有限公司 | Circuit board line compensation method and device |
-
2019
- 2019-06-10 CN CN201910496713.4A patent/CN112067968A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188482A (en) * | 2001-12-20 | 2003-07-04 | Hitachi Communication Technologies Ltd | Printed wiring board |
| CN201213331Y (en) * | 2008-07-08 | 2009-03-25 | 常州澳弘电子有限公司 | PCB board capable of avoiding omission of v-cut operation |
| CN202218477U (en) * | 2011-08-12 | 2012-05-09 | 湖北建浩科技有限公司 | PCB (Printed Circuit Board) capable of quickly judging V-CUT |
| CN102721384A (en) * | 2012-06-26 | 2012-10-10 | 胜华电子（惠阳）有限公司 | V-shaped cutting deviation detecting method of circuit board |
| CN104089982A (en) * | 2014-07-11 | 2014-10-08 | 深圳市景旺电子股份有限公司 | Missing-prevention forming detection method for PCB (Printed Circuit Board) |
| CN105072808A (en) * | 2015-07-09 | 2015-11-18 | 华进半导体封装先导技术研发中心有限公司 | Etching compensation method for high-precision packaging substrate |
| CN107787122A (en) * | 2016-08-24 | 2018-03-09 | 深圳市嘉立创科技发展有限公司 | Circuit board line compensation method and device |
Non-Patent Citations (3)
| Title |
|---|
| JOSEPH DIMARCO: "Calibration technique for rotating PCB coil magnetic field sensors", 《SENSORS AND ACTUATORS A: PHYSICAL》 * |
| 周志元: "PCB V割的标准与 品质控制", 《第三届全国青年印制电路学术年会论文汇编》 * |
| 张庭主: "V-cut线过PTH产生铜披锋问题的研究", 《机械加工》 * |
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Application publication date: 20201211 |