CN112054322A - Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly - Google Patents
Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly Download PDFInfo
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- CN112054322A CN112054322A CN202010921214.8A CN202010921214A CN112054322A CN 112054322 A CN112054322 A CN 112054322A CN 202010921214 A CN202010921214 A CN 202010921214A CN 112054322 A CN112054322 A CN 112054322A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/594—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures for shielded flat cable
- H01R12/596—Connection of the shield to an additional grounding conductor, e.g. drain wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/594—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures for shielded flat cable
- H01R12/598—Each conductor being individually surrounded by shield, e.g. multiple coaxial cables in flat structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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Abstract
The invention provides a connecting structure of a cable and a PCB (printed circuit board), a plug assembly adopting the connecting structure and a preparation method of the plug assembly. The invention adopts the ultraviolet curing principle of the UV conductive adhesive to realize the fixed connection and the electrical connection of the shielding layer of the cable and the grounding layer of the PCB, replaces the traditional point tin welding process, and can realize the fixed connection of the shielding layer of the cable and the grounding layer of the PCB only through ultraviolet irradiation.
Description
Technical Field
The invention belongs to the technical field of electronic equipment, and relates to a connecting structure of a cable and a PCB (printed circuit board), a plug assembly adopting the connecting structure and a preparation method of the plug assembly, in particular to a connecting structure of a cable and a PCB solidified and connected by adopting UV (ultraviolet) conductive adhesive, a plug assembly adopting the connecting structure and a preparation method of the plug assembly.
Background
With the development of economic society and the continuous progress of scientific technology, digital products are more and more widely applied to our lives, and the signal transmission component therein is an indispensable component of the digital products and plays a very important role in signal transmission.
HDMI is a transmission interface developed for multimedia audio and video equipment, is one of the most advanced international digital interface standards at present, and can simultaneously transmit audio signals of up to 8 channels besides transmitting image data, i.e. one HDMI wire can simultaneously transmit audio and video signals without connecting a plurality of wires, thus greatly simplifying the installation of an audio and video system, undoubtedly, an HDMI connector is a great trend of future development of audio and video industry, an HDMI connector generally comprises an HDMI interface and wires connected with the HDMI connector, a traditional HDMI interface also comprises a printed circuit board, the printed circuit board is provided with through holes, and connecting terminals are arranged on two sides of the printed circuit board, so that each signal wire of the traditional HDMI connector needs to be manually arranged and then welded in the assembling process, thereby not only the appearance and the functional effect of the welded connector are not good, but also the labor cost is greatly increased, is not beneficial to the popularization and the application of the product.
CN102280793B discloses a method for manufacturing an HDMI connector, comprising the following steps: preparing an HDMI cable, pretreating the HDMI cable, and peeling off an insulating sheath to enable the wires outside the insulating sheath to be sequentially arranged on the same horizontal plane; providing an HDMI connector, wherein soldering tin points are arranged on the HDMI connector and are arranged on the same side of a PCB (printed circuit board) on the HDMI connector; automatic soldering tin, wherein conducting wires in the HDMI cable and soldering tin points on the PCB are arranged in a one-to-one contact manner and are automatically soldered; and (4) assembling and testing, namely performing injection molding assembly molding on the product according to requirements, and performing function and appearance test on the product.
CN206370572U discloses an HDMI connector head with a PCB shielding function, which comprises a plastic main body, a plastic rear plug, a contact terminal, a PCB and an EMI inner shield sheet, wherein a plastic main body contact terminal accommodating groove is formed in the plastic main body; the plastic rear plug is clamped with the plastic main body and is provided with a plastic rear plug contact terminal accommodating groove; the two ends of the contact terminal are respectively the head end and the tail end of the contact terminal; the head end of the contact terminal is fixedly arranged in the contact terminal accommodating groove of the plastic main body after passing through the contact terminal accommodating groove of the plastic rear plug respectively; the PCB is attached to and clamped with one end, far away from the plastic main body, of the plastic rear plug, and the tail end of the contact terminal is located at the upper part of the PCB; the PCB is provided with a PCB positioning hole; and the EMI inner shielding sheet is arranged in the PCB positioning hole.
CN207853136U discloses an HDMI2.0 optical fiber plug subassembly, including HDMI public joint one, HDMI optical fiber plug subassembly and HDMI public joint two, HDMI public joint one passes through HDMI optical fiber plug subassembly to be connected in HDMI public joint two, be equipped with the PCB board that is responsible for the electro-optical signal conversion in the HDMI public joint one, be equipped with the PCB board that is responsible for the photoelectric signal conversion in the HDMI public joint two, HDMI optical fiber plug subassembly includes HDMI plug subassembly wire rod quilt outward, be equipped with three low-speed signal lines in the HDMI plug subassembly wire rod quilt outward, four-core optical fiber line, the positive power line, the negative power line, the ground wire that the double-twisted signal line set up and the double-twisted signal line cooperation.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a plug assembly inserted with a high-definition multimedia interface and a preparation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a connection structure of a cable and a PCB, the cable comprises a plurality of conducting wires, insulators, shielding layers and insulating outer skins are sequentially wrapped on the outer sides of the conducting wires from inside to outside, a ground layer, a row of first golden fingers and a row of second golden fingers are arranged on the surface of the PCB, the tail ends of the conducting wires are respectively connected with the first golden fingers, and each shielding layer is fixed on the ground layer through UV (ultraviolet) conductive adhesive.
The cable and the PCB grounding layer are fixedly connected by adopting a traditional point tin welding process in the prior art, the welding temperature reaches more than 380 ℃, but the current cable leads are thinner and cannot bear the adverse effect of high temperature on the appearance of the leads, so that the invention adopts the UV conductive adhesive ultraviolet curing principle to realize the fixed connection of the cable shielding layer and the PCB grounding layer, replaces the traditional point tin welding process, can realize the fixed connection of the cable shielding layer and the PCB grounding layer only by ultraviolet irradiation, and on one hand, the fixation is not required to be carried out at high temperature, thereby ensuring that the cable leads are not melted due to high temperature and the data transmission of a plug assembly is not influenced; on the other hand, the ultraviolet irradiation curing process only needs 10-60 seconds, compared with a point tin soldering process, the processing time is greatly shortened, the production efficiency of the plug assembly is improved, and the product yield is effectively guaranteed. According to the invention, the UV conductive adhesive is coated on the shielding layers of the cables, and the shielding layers of the cables are connected in a short circuit manner after photocuring and then connected to the grounding layer together.
It should be noted that:
(1) the connection structure provided by the invention is characterized in that the connection structure between the cable shielding layer and the grounding layer of the PCB adopts a UV conductive adhesive photocuring mode, the electrical connection between the wire output end of the cable and the first golden finger of the PCB still adopts a welding mode, but theoretically, the UV conductive adhesive photocuring mode can still be adopted, but because the cable is thin and the interval between two adjacent cables is small, if the wire output end is fixed, the photocuring mode is also adopted, once the operation is improper, the wire tail ends of all the cables are easily connected in a short circuit mode, and the plug assembly is scrapped. It is understood that the following process is not excluded to achieve fine work with the progress of the manufacturing process, and the use of the photo-curing effect of the UV conductive adhesive to achieve the electrical connection between the end of the wire and the gold finger also falls within the scope and disclosure of the present invention.
(2) The UV conductive adhesive provided by the invention comprises a base resin and an active monomer. The main components of the photoinitiator and the like are matched with auxiliary agents of a stabilizer cross-linking agent, a coupling agent and the like, and under the irradiation of UV light with proper wavelength, the photoinitiator rapidly generates free radicals or ions, so that the base resin and the active monomer are initiated to be polymerized and cross-linked to form a network structure, and the bonding fixation between the cable and the PCB is realized.
As a preferable technical scheme, the UV conductive adhesive comprises a conductive agent, an anti-reflection agent, a prepolymer, an active diluent and a photoinitiator.
In the invention, the diluent plays a role in diluting, so that the glue solution has viscosity convenient for construction; on the other hand, the resin has good reactivity and enters a resin network after being cured, and the influence on the final performance of a cured product is manifold. Reactive diluents are often added to improve viscosity, adhesion, flexibility, hardness and cure speed. The mechanical properties obtained by the compatibility of different diluents with the base resin may vary widely and need to be adequately compared and selected. The requirements for the resin are mainly low viscosity, high dilutability and high reaction capability, and simultaneously, the resin also has the advantages of low volatility, toxicity, irritation and odor, low price, high stability, good compatibility with resin and the like. Mixed diluents are often used to adjust various properties.
The initiation mechanism of the photoinitiator includes: (1) the cleavage reaction mechanism: the photoinitiator molecules are excited after absorbing ultraviolet energy, and the covalent bonds of the excited molecules are broken to generate free radicals. (2) The hydrogen extraction reaction mechanism: the mechanism is that initiator molecules are excited after absorbing light energy and extract a hydrogen atom from monomer or oligomer molecules to make the molecules become free radicals. (3) The ionic reaction mechanism: the mechanism is that the electron donor and the electron acceptor may generate an electron transfer complex or an excited complex by electron or charge transfer. The electron transfer complex is formed under ground state interaction, whereas the excited complex is formed with each other only in an excited state. (4) The energy transfer mechanism is as follows: the triplet state of the excited molecule transfers energy to a monomer or other molecules, and the monomer which obtains the energy is excited into a triplet excited monomer, the triplet excited monomer decomposes to generate two radicals, or only a single radical is generated due to electron transfer.
Preferably, the UV conductive adhesive further comprises an auxiliary agent.
In the invention, the optional additives comprise a stabilizer, a leveling agent, a defoaming agent, a plasticizer, a coupling agent and the like, and the functions of the invention are to improve the production process of the UV conductive adhesive, improve the storage stability of the UV conductive adhesive, improve the workability of the UV conductive adhesive, improve the performance of an adhesive film and the like.
Preferably, the auxiliary agent comprises one or a combination of at least two of a stabilizer, a leveling agent, an antifoaming agent or a coupling agent.
In the present invention, the stabilizer is used to reduce polymerization during storage and improve storage stability of the resin. The leveling agent is used for improving the leveling performance of resin, preventing the generation of coating defects such as shrinkage cavity, needle hole and the like, leveling a coating film and improving the glossiness. The defoaming agent is used for preventing the UV conductive adhesive from generating bubbles in the manufacturing and using processes and preventing the coating from generating pinholes and other defects. The coupling agent is a substance with an amphoteric structure, and a part of groups in molecules of the coupling agent can react with chemical groups on the surface of an inorganic substance to form a strong chemical bonding; the other part of the group has the property of being organophilic, and can react with or physically intertwine with organic molecules, thereby firmly combining two materials with different properties and sizes. The coupling agents currently used in industry are classified into four major groups, i.e., silanes, phthalates, zirconates, and organochromium complexes, according to their chemical structures. Among the UV-curable adhesives, silanes such as gamma-methacryloxypropyltrimethoxysilane (KH570), gamma-aminopropyltriethoxysilane (KH550), etc. are frequently used.
Preferably, the mass fraction of the conductive agent is 30 to 40 wt%, and may be, for example, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt% or 40 wt%, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the mass fraction of the anti-reflective agent is 10 to 15 wt%, for example, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt% or 15 wt%, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
The prepolymer is preferably present in a mass fraction of 20 to 30 wt.%, for example 20 wt.%, 21 wt.%, 22 wt.%, 23 wt.%, 24 wt.%, 25 wt.%, 26 wt.%, 27 wt.%, 28 wt.%, 29 wt.% or 30 wt.%, but is not limited to the recited values, and other values not recited within this range are equally applicable.
Preferably, the reactive diluent has a mass fraction of 20 to 30 wt%, and may be, for example, 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt% or 30 wt%, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the photoinitiator is present in a mass fraction of 2 to 6 wt.%, for example 2 wt.%, 3 wt.%, 4 wt.%, 5 wt.% or 6 wt.%, but not limited to the recited values, and other values not recited within this range are equally applicable.
Preferably, the mass fraction of the auxiliary agent is 0 to 2 wt%, and may be, for example, 0 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1.0 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, or 2.0 wt%, but is not limited to the recited values, and other non-recited values within the range of values are also applicable.
Preferably, the conductive agent is silver nanopowder.
Preferably, the anti-reflective agent is carbon black.
Preferably, the prepolymer is a polyurethane acrylate prepolymer.
Preferably, the reactive diluent comprises a free radical reactive diluent and/or a cationic reactive diluent. Preferably, the free radical reactive diluent comprises one or a combination of at least two of 1, 6-hexanediol diacrylate, 1, 4-butanediol diacrylate, propylene glycol diacrylate, glycerol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, 1, 6-hexanediol methoxy monoacrylate, or ethoxylated neopentyl glycol methoxy monoacrylate.
Preferably, the cationic reactive diluent comprises one or a combination of at least two of cyclic ether, cyclic lactone or vinyl ether.
Preferably, the photoinitiator comprises a free radical photoinitiator and/or an ionic photoinitiator.
Preferably, the photoinitiator comprises a cleavage type photoinitiator and/or a hydrogen abstraction type initiator.
Preferably, the ionic photoinitiator comprises one or a combination of at least two of aromatic sulfur salt, iodine salt or ferrocenium salt.
Preferably, the cleavage type photoinitiator comprises one or a combination of at least two of benzoin ether, phthalein ketal or acetophenone.
Preferably, the hydrogen-extracting initiator comprises benzophenone and/or thioxanthone.
Preferably, the stabilizer comprises one or a combination of at least two of hydroquinone, p-methoxyphenol, p-benzoquinone, 2, 6-di-tert-butyl cresol, phenothiazine and anthraquinone.
Preferably, the leveling agent comprises one or a combination of at least two of organic silicon, polyacrylate, cellulose acetate butyrate, nitrocellulose or polyvinyl butyral.
Preferably, the defoaming agent comprises one or a combination of at least two of phosphate ester, fatty acid ester or organosilicon.
Preferably, the coupling agent is a silane coupling agent, and further preferably, the coupling agent comprises gamma-methyl acrylic acid propyl trimethoxy silane and/or gamma-aminopropyl triethoxy silane.
In a second aspect, the invention provides a plug assembly using the connection structure of the first aspect, the plug assembly includes at least one cable and a plug electrically connected thereto, the plug includes a PCB circuit board and a terminal mounting member, the PCB circuit board and the cable are electrically connected using the connection structure of claim 1, the cable wires are respectively connected to the first gold fingers of the PCB circuit board, and the terminal mounting member is respectively connected to the second gold fingers of the PCB circuit board.
It should be noted that the connection structure provided by the present invention is mainly used in the field of data transmission devices such as interface plugs, etc., and therefore, it can be understood that the connection structure provided by the present invention is not limited to specific data transmission lines, including but not limited to HDMI plug assembly connectors, USB data line connectors, type-c data line connectors, etc., and the connection structure provided by the present invention can be adopted as long as the fixed connection between the PCB circuit board and the cable is required.
As a preferable technical solution of the present invention, a metal sheet is laid on an upper surface or a lower surface of the shielding layer of the cable.
Preferably, the length direction of the metal sheet is perpendicular to the length direction of the cable.
According to the invention, the bending strength of the joint of the cable and the PCB is improved through the lapping metal sheet.
Preferably, the metal sheet is fixed in contact with shielding layers of cables arranged side by side through UV conductive adhesive.
Preferably, the outer periphery of each cable secured side-by-side is wrapped with an insulating sheath to form a flat section wire.
Preferably, the inside of the insulating outer skin is embedded with bulletproof wires along the length direction, and the tail ends of the bulletproof wires are fixed with the metal sheets through UV conductive adhesive.
As a preferred technical solution of the present invention, an insulating inner mold is injection molded on the surface of the PCB, and the insulating inner mold covers the connection between the terminal installation member and the PCB and the connection between the cable and the PCB.
As a preferred technical scheme of the invention, a metal inner shell is sleeved outside the insulating inner die, and the metal inner shell is formed by butting two metal half shells.
As a preferred technical solution of the present invention, the terminal mounting member includes a conductive terminal assembly and a fixing block, the fixing block penetrates the conductive terminal assembly and the tail thereof is inserted into the end of the PCB connected to the conductive terminal assembly, and the fixing block fixes the conductive terminal assembly.
Preferably, the terminal mounting member further includes a metal front case sleeved around the conductive terminal assembly and the fixing block, and the metal front case receives the conductive terminal assembly and the fixing block.
As a preferable technical scheme of the invention, the plug further comprises a metal shell, the metal shell penetrates through the metal front shell and is fixed on the periphery of the metal inner shell, the joint of the metal shell and the metal front shell is fixedly sleeved, and the joint of the metal shell and the cable is wrapped with a stress release block.
Preferably, the peripheries of the metal shell and the stress release block are wrapped with insulating shells.
In a second aspect, the present invention provides a method for preparing the plug assembly of the first aspect, the method comprising:
the terminal mounting part is connected with a second golden finger of the PCB; sequentially stripping an insulating sheath, a shielding layer and an insulator at the tail end of the cable from outside to inside to expose the wires, arranging the wires side by side and then connecting the wires with a first golden finger of the PCB in parallel; and stripping an insulating outer skin of the cable, exposing the shielding layer inside the cable, after the cables are connected in parallel, coating UV conductive adhesive on the contact area of the shielding layer of each cable and the grounding layer of the PCB circuit board, and curing the UV conductive adhesive after ultraviolet irradiation to fix the cable shielding layer on the grounding layer of the PCB circuit board.
As a preferred technical solution of the present invention, the preparation method further comprises:
the method comprises the following steps that (I) the tail end of an exposed cable wire is connected, an insulating sheath of the cable is continuously stripped along the length direction of the cable, an internal shielding layer is exposed, a metal sheet is placed on the upper surface or the lower surface of the shielding layer of each cable which is arranged side by side, the length direction of the metal sheet is perpendicular to the length direction of the cable, the contact area of the metal sheet and the shielding layer is coated with UV conductive adhesive, after ultraviolet irradiation, the UV conductive adhesive is cured to enable each cable to be fixed side by side, and the periphery of the cables fixed side by side is wrapped with the insulating sheath to obtain a wire with a flat section;
(II) injection molding an insulating inner mold on the outer surface of the PCB, wherein the insulating inner mold covers the connection part of the terminal installation part and the PCB and the connection part of the lead output end of the cable and the PCB;
(III) assembling a metal inner shell formed by butting two metal half shells on the periphery of the insulating inner die; the fixing block simultaneously passes through the first conductive terminal group and the second conductive terminal group by the through groove and then is inserted into one end of the PCB connected with the terminal mounting piece; a metal front shell is sleeved on the periphery of the terminal mounting piece;
(IV) the metal shell penetrates through the metal front shell and is fixed on the periphery of the metal inner shell, the joint of the metal shell and the metal front shell is fixedly sleeved, the joint of the metal shell and the wire is wrapped with the stress release block, and the peripheries of the metal shell and the stress release block are wrapped with the insulating shell to prepare the plug assembly.
Preferably, the terminal installation member is connected with the second golden finger of the PCB circuit board through a welding process.
Preferably, the tail end of the cable wire is connected with the first golden finger of the PCB through a welding process.
Preferably, the UV conductive adhesive is irradiated with the ultraviolet rays for 10 to 60 seconds, for example, 10 seconds, 15 seconds, 20 seconds, 25 seconds, 30 seconds, 35 seconds, 40 seconds, 45 seconds, 50 seconds, 55 seconds, or 60 seconds, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Compared with the prior art, the invention has the beneficial effects that:
the fixed connection of the cable shielding layer and the PCB grounding layer in the prior art adopts the traditional point tin soldering process, the soldering temperature reaches more than 380 ℃, but the existing cable leads are thinner and cannot bear the adverse effect of high temperature on the appearance of the leads, therefore, the invention adopts the UV conductive adhesive ultraviolet curing principle to realize the fixed connection of the cable shielding layer and the PCB grounding layer, and simultaneously realize the electric connection of each shielding layer and the grounding layer, thereby replacing the traditional point tin soldering process, realizing the fixed connection of the shielding layer and the grounding layer only through ultraviolet irradiation, on one hand, the fixed connection is not required to be carried out at high temperature, and ensuring that the cable leads cannot be melted due to high temperature to influence the data transmission of a plug assembly; on the other hand, the ultraviolet irradiation curing process only needs 10-60 seconds, compared with a point tin soldering process, the processing time is greatly shortened, the production efficiency of the plug assembly is improved, and the product yield is effectively guaranteed.
Drawings
Fig. 1 is a schematic view of a connection structure between a cable and a PCB according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the assembled plug assembly in step (4) of the manufacturing method according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the assembled plug assembly of step (5) in the manufacturing method according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of the assembled plug assembly at step (6) of the manufacturing method according to one embodiment of the present invention;
FIG. 5 is an assembly view of step (7) of the preparation process provided in one embodiment of the present invention;
FIG. 6 is a schematic diagram of the assembled plug assembly of step (7) of the manufacturing method according to one embodiment of the present invention;
FIG. 7 is a block diagram of the assembled plug assembly of step (8) of the manufacturing method according to one embodiment of the present invention;
FIG. 8 is a cross-sectional structural schematic view of a cable provided in accordance with an embodiment of the present invention;
wherein, 100-wire; 110-a cable; 111-a conductive line; 112-an insulator; 113-a shielding layer; 114-an insulating sheath; 120-bulletproof silk; 130-a metal sheet; 200-plug; 210-a terminal mount; 211-a conductive terminal assembly; 212-fixed block; 213-metal front shell; 220-a PCB circuit board; 221-a first gold finger; 222-a ground plane; 223-second golden finger; 230-UV conductive adhesive; 240-insulating inner mold; 250-a metal inner shell; 251-a first metal half-shell; 252-a second metal half-shell; 260-a metal housing; 270-insulating housing.
Detailed Description
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In a specific embodiment, the present invention provides a connection structure of a cable 110 and a PCB 220 as shown in fig. 1, where the cable 110 includes a plurality of conductive wires 111, an insulator 112, a shielding layer 113 and an insulating sheath 114 are sequentially wrapped on an outer side of each conductive wire 111 from inside to outside (as shown in fig. 8, in this embodiment, one shielding layer 113 is disposed outside two conductive wires 111), a ground layer 222, a row of first gold fingers 221 and a row of second gold fingers 223 are disposed on a surface of the PCB 220, (as shown in fig. 1), ends of the conductive wires 111 of the cable 110 are fixed to the first gold fingers 221 by welding, the shielding layers 113 of the cable 110 are fixed to the ground layer 222 through a UV conductive adhesive 230, and the UV conductive adhesive 230 electrically connects the shielding layers 113 of the cable 110 together.
In another embodiment, the invention provides a plug assembly using the above connection structure, as shown in fig. 2, the plug assembly includes at least one cable 110 and a plug 200 electrically connected thereto, the cable 110 includes a plurality of wires 111, and the wires 111 are sequentially wrapped with an insulator 112, a shielding layer 113 and an insulating sheath 114 from inside to outside. The plug 200 includes a PCB 220 and a terminal mounting member 210, wherein a ground layer 222, a row of first gold fingers 221 and a row of second gold fingers 223 are disposed on a surface of the PCB 220, and the first gold fingers 221 and the second gold fingers 223 are electrically connected. The ends of the conductive wires 111 of the cable 110 are soldered to the first gold fingers 221 one by one, and the shielding layers 113 of the cable 110 are fixed on the ground layer 222 by the UV conductive adhesive 230, so that the shielding layers 113 are electrically connected to the ground layer 222.
The first gold finger 221 of the PCB 220 is soldered to the ends of the wires 111 of at least two cables 110 arranged side by side. The upper and lower surfaces of the shielding layers 113 of the cables 110 arranged side by side are respectively provided with a metal sheet 130 so that the shielding layers 113 are electrically connected, and the length direction of the metal sheet 130 is perpendicular to the length direction of the cables 110. The metal sheet 130 is fixed in contact with the shielding layers 113 of the cables 110 arranged side by the UV conductive paste 230. The outer circumference of each cable 110 fixed side by side is covered with an insulating sheath to form the flat-section wire 100. The bulletproof wire 120 is embedded in the insulating sheath along the length direction, and the tail end of the bulletproof wire 120 is fixed with the metal sheet 130 through the UV conductive adhesive 230. The UV conductive adhesive 230 fixed on the shielding layers of the cable 110 and the ground layer 222 is spaced apart from the UV conductive adhesive 230 fixed on the shielding layers 113 of the cable 110 by a predetermined distance.
The surface of the PCB circuit board 220 is coated with an insulating inner mold 240, and the insulating inner mold 240 covers a connection of the terminal mounting member 210 and the PCB circuit board 220 and a connection of the output end of the wire 111 of the cable 110 and the PCB circuit board 220. Specifically, the inner mold 240 is coated on the outer surface of the PCB 220 through an injection molding process.
The outer circumference of the inner insulating mold 240 is provided with a metal inner casing 250, and the metal inner casing 250 is used for receiving the PCB 220 whose surface is wrapped with the inner insulating mold 240. Specifically, the metal inner shell 250 is formed by butting a first metal half shell 251 and a second metal half shell 251.
The terminal mounting member 210 includes a conductive terminal assembly 211, a fixing block 212, and a metal front case 213. The conductive terminal assembly 211 includes a first conductive terminal group and a second conductive terminal group which are parallel to each other. The conductive terminals contained in the first conductive terminal group and the conductive terminals contained in the second conductive terminal group are distributed in a staggered manner. After the fixing block 212 passes through the terminal mounting member 210, the tail portion is inserted into one end of the PCB 220 electrically connected to the conductive terminal assembly 211 for fixing two rows of conductive terminal sets. Two rows of parallel through grooves are formed in the fixing block 212, and the first conductive terminal group and the second conductive terminal group are arranged in a penetrating mode. The metal front shell 213 is sleeved on the conductive terminal assembly 211 and the fixed block 212.
The plug 200 further comprises a metal shell 260, the metal shell 260 penetrates through the metal front shell 213 and is fixed on the periphery of the metal inner shell 250, the joint of the metal shell 260 and the metal front shell 213 is fixedly sleeved, and the joint of the metal shell 260 and the wire 100 is wrapped with a stress release block. The metal shell 260 and the stress relief block are surrounded by an insulating shell 270.
In another embodiment, the present invention provides a method of making a plug assembly, the method comprising the steps of:
(1) the terminal mounting parts 210 are welded and fixed with the second gold fingers 223 of the PCB 220 one by one;
(2) sequentially stripping the insulating sheath 114, the shielding layer 113 and the insulator 112 at the front end of the cable 110 from outside to inside to expose the internal conducting wires 111, and welding and fixing the conducting wires 111 and the first golden fingers 221 of the PCB 220 one by one after being arranged side by side;
(3) as shown in fig. 1, after the exposed end of the conductive wire 111 of the cable 110 is next to the end of the conductive wire 111 of the cable 110, the insulating sheath 114 of the cable 110 is continuously peeled off along the length direction of the cable 110, the insulating sheath 114 of the cable 110 is peeled off, the shielding layer 113 inside is exposed, and the cables 110 are connected side by side, a UV conductive adhesive 230 is coated on a contact area between the shielding layer 113 of each cable 110 and the ground layer 222 of the PCB 220, and after the UV conductive adhesive 230 is cured after being irradiated by ultraviolet rays for 10 to 60 seconds, the shielding layer 113 of the cable 110 is fixed on the ground layer 222 of the PCB 220;
(4) as shown in fig. 2, stripping off a part of the insulating sheath 114 of each cable 110 far away from the front end, exposing the shielding layer 113 inside, placing metal sheets 130 on the upper surface and the lower surface of the shielding layer 113 of each cable 110 arranged side by side, wherein the length direction of the metal sheets 130 is perpendicular to the length direction of the cable 110, coating UV conductive adhesive 230 on the contact area of the metal sheets 130 and the shielding layer 113 of each cable 110 arranged side by side, after ultraviolet irradiation for 10-60 seconds, curing the UV conductive adhesive 230 to fix each cable 110 side by side, and wrapping the insulating sheath around the outer periphery of the cables 110 fixed side by side to obtain the wire 100 with a flat section;
(5) as shown in fig. 3, an inner insulating mold 240 is injection molded on the outer surface of the PCB 220, and the inner insulating mold 240 covers the electrical connection point between the terminal mounting member 210 and the PCB 220 and the electrical connection point between the output end of the wire 111 of the cable 110 and the PCB 220;
(6) as shown in fig. 4, a metal inner shell 250 formed by butting two metal half shells is assembled on the outer periphery of the insulating inner die 240;
(7) as shown in fig. 5 and 6, the fixing block 212 is provided with a first conductive terminal set and a second conductive terminal set through the through groove, and then inserted into one end of the PCB 220 electrically connected to the terminal mounting member 210; a metal front shell 213 is sleeved on the outer periphery of the terminal mounting part 210 to form a complete terminal mounting part 210;
(8) as shown in fig. 7, the metal shell 260 penetrates through the metal front shell 213 and is fixed to the periphery of the metal inner shell 250, the joint of the metal shell 260 and the metal front shell 213 is fixed in a sleeved manner, the joint of the metal shell 260 and the wire 100 is wrapped with the stress release block, and the periphery of the metal shell 260 and the stress release block is wrapped with the insulating outer shell 270, so as to prepare the plug assembly.
Example 1
The UV conductive adhesive 230 used in the steps (3) and (4) in the above preparation method includes silver nanoparticles (conductive agent), carbon black (anti-reflective agent), urethane acrylate prepolymer (prepolymer), isobornyl acrylate (reactive diluent), hydroxyethyl methacrylate (reactive diluent), 1-hydroxy-cyclohexyl-phenyl ketone (photoinitiator), benzoin bis-methyl ether (photoinitiator), p-methoxyphenol (stabilizer), polyacrylate (leveling agent), phosphate ester (defoaming agent), and γ -aminopropyltriethoxysilane (coupling agent).
The mass fractions of the components are as follows:
the UV conductive paste 230 of the above composition is photo-cured by ultraviolet irradiation for 10 seconds.
Example 2
The UV conductive adhesive 230 used in the steps (3) and (4) of the preparation method includes silver nanoparticles (conductive agent), carbon black (anti-reflective agent), urethane acrylate prepolymer (prepolymer), 1, 6-hexanediol diacrylate (reactive diluent), vinyl ether (reactive diluent), aromatic sulfur salt (photoinitiator), phthalein ketal (photoinitiator), hydroquinone (stabilizer), cellulose acetate butyrate (leveling agent), fatty acid ester (antifoaming agent), and γ -aminopropyltriethoxysilane (coupling agent).
The mass fractions of the components are as follows:
the UV conductive paste 230 of the above composition is photo-cured by ultraviolet irradiation for 30 seconds.
Example 3
The UV conductive adhesive 230 used in the steps (3) and (4) in the above preparation method includes silver nanoparticles (conductive agent), carbon black (anti-reflective agent), urethane acrylate prepolymer (prepolymer), 1, 4-butanediol diacrylate (reactive diluent), cyclic ether (reactive diluent), iodide salt (photoinitiator), acetophenone (photoinitiator), p-methoxyphenol (stabilizer), nitrocellulose (leveling agent), silicone (defoaming agent), and γ -methacryl propyl trimethoxy silane (coupling agent).
The mass fractions of the components are as follows:
the UV conductive paste 230 of the above composition is photo-cured by ultraviolet irradiation for 40 seconds.
Example 4
The UV conductive adhesive 230 used in the steps (3) and (4) in the above preparation method includes silver nanoparticles (conductive agent), carbon black (anti-reflective agent), urethane acrylate prepolymer (prepolymer), propylene glycol diacrylate (reactive diluent), cyclic lactone (reactive diluent), ferrocenium salt (photoinitiator), benzophenone (photoinitiator), p-benzoquinone (stabilizer), polyvinyl butyral (leveling agent), phosphate (defoaming agent), and γ -aminopropyltriethoxysilane (coupling agent).
The mass fractions of the components are as follows:
the UV conductive paste 230 of the above composition is photo-cured by ultraviolet irradiation for 50 seconds.
Example 5
The UV conductive adhesive 230 used in the steps (3) and (4) in the above preparation method includes silver nanoparticles (conductive agent), carbon black (anti-reflective agent), urethane acrylate prepolymer (prepolymer), glycerol diacrylate (reactive diluent), vinyl ether (reactive diluent), aromatic sulfur salt (photoinitiator), phthalide ketal (photoinitiator), 2, 6-di-tert-butyl cresol (stabilizer), polyvinyl butyral (leveling agent), silicone (defoaming agent), and γ -aminopropyltriethoxysilane (coupling agent).
The mass fractions of the components are as follows:
the UV conductive paste 230 of the above composition is photo-cured by ultraviolet irradiation for 60 seconds.
The applicant claims that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. The utility model provides a connection structure of cable and PCB circuit board, the cable includes a plurality of wires, the wire outside from interior to exterior wraps up insulator, shielding layer and insulating crust in proper order, PCB circuit board surface is equipped with ground plane, a row of first golden finger and a row of second golden finger, the wire end is connected respectively first golden finger, its characterized in that, each the shielding layer passes through UV conductive adhesive and fixes in the ground plane.
2. The connection structure according to claim 1, wherein the UV conductive paste comprises a conductive agent, an anti-reflective agent, a prepolymer, a reactive diluent, and a photoinitiator;
preferably, the UV conductive adhesive further comprises an auxiliary agent;
preferably, the auxiliary agent comprises one or a combination of at least two of a stabilizing agent, a leveling agent, an antifoaming agent or a coupling agent;
preferably, the mass fraction of the conductive agent is 30-40 wt%;
preferably, the mass fraction of the anti-reflection agent is 10-15 wt%;
preferably, the mass fraction of the prepolymer is 20-30 wt%;
preferably, the mass fraction of the reactive diluent is 20-30 wt%;
preferably, the mass fraction of the photoinitiator is 2-6 wt%;
preferably, the mass fraction of the auxiliary agent is 0-2 wt%;
preferably, the conductive agent is nano silver powder;
preferably, the anti-reflective agent is carbon black;
preferably, the prepolymer is a polyurethane acrylate prepolymer;
preferably, the reactive diluent comprises a free radical reactive diluent and/or a cationic reactive diluent;
preferably, the free radical reactive diluent comprises one or a combination of at least two of 1, 6-hexanediol diacrylate, 1, 4-butanediol diacrylate, propylene glycol diacrylate, glycerol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, 1, 6-hexanediol methoxy monoacrylate, or ethoxylated neopentyl glycol methoxy monoacrylate;
preferably, the cationic reactive diluent comprises one or a combination of at least two of cyclic ether, cyclic lactone or vinyl ether;
preferably, the photoinitiator comprises a free radical type photoinitiator and/or an ionic type photoinitiator;
preferably, the photoinitiator comprises a cracking type photoinitiator and/or a hydrogen extraction type initiator;
preferably, the ionic photoinitiator comprises one or a combination of at least two of aromatic sulfur salt, iodine salt or ferrocenium salt;
preferably, the cleavage type photoinitiator comprises one or a combination of at least two of benzoin ether, phthalein ketal or acetophenone;
preferably, the hydrogen-extracting initiator comprises benzophenone and/or thioxanthone;
preferably, the stabilizer comprises one or a combination of at least two of hydroquinone, p-methoxyphenol, p-benzoquinone, 2, 6-di-tert-butyl cresol, phenothiazine and anthraquinone;
preferably, the leveling agent comprises one or a combination of at least two of organic silicon, polyacrylate, cellulose acetate butyrate, nitrocellulose or polyvinyl butyral;
preferably, the defoaming agent comprises one or a combination of at least two of phosphate ester, fatty acid ester or organic silicon;
preferably, the coupling agent is a silane coupling agent, and further preferably, the coupling agent comprises gamma-methyl acrylic acid propyl trimethoxy silane and/or gamma-aminopropyl triethoxy silane.
3. The plug assembly adopting the connection structure of claim 1 or 2, wherein the plug assembly comprises at least one cable and a plug electrically connected therewith, the plug comprises a PCB and a terminal mounting member, the PCB and the cable are electrically connected by the connection structure of claim 1, the cable wires are respectively connected with the first golden fingers of the PCB, and the terminal mounting member is respectively connected with the second golden fingers of the PCB.
4. The plug assembly of claim 3, wherein a metal sheet is lapped on the upper surface or the lower surface of the shielding layer of the cable;
preferably, the length direction of the metal sheet is perpendicular to the length direction of the cable;
preferably, the metal sheet is fixed in contact with shielding layers of cables arranged side by side through UV conductive adhesive;
preferably, the periphery of each cable fixed side by side is wrapped with an insulating sheath to form a flat section wire;
preferably, the inside of the insulating outer skin is embedded with bulletproof wires along the length direction, and the tail ends of the bulletproof wires are fixed with the metal sheets through UV conductive adhesive.
5. The plug assembly of claim 3 or 4, wherein the surface of the PCB is injection molded with an inner insulating mold, and the inner insulating mold covers the connection between the terminal mounting member and the PCB and the connection between the cable and the PCB.
6. The plug assembly of any one of claims 3-5, wherein said insulating inner mold jacket is provided with a metal inner shell comprised of two metal half shells butted together.
7. The plug assembly of any one of claims 3-6, wherein said terminal mounting member includes a conductive terminal assembly and a retention block, the tail portion being inserted into an end of the PCB at which the conductive terminal assembly is connected, said retention block retaining said conductive terminal assembly;
preferably, the terminal mounting member further includes a metal front case sleeved around the conductive terminal assembly and the fixing block, and the metal front case receives the conductive terminal assembly and the fixing block.
8. The plug assembly according to any one of claims 3 to 7, wherein the plug further comprises a metal shell, the metal shell penetrates through the metal front shell and is fixed on the periphery of the metal inner shell, the joint of the metal shell and the metal front shell is fixedly sleeved, and the joint of the metal shell and the cable is wrapped with a stress release block;
preferably, the peripheries of the metal shell and the stress release block are wrapped with insulating shells.
9. A method of making a plug assembly according to any one of claims 3 to 8, wherein the method of making comprises:
the terminal mounting part is connected with a second golden finger of the PCB; sequentially stripping an insulating sheath, a shielding layer and an insulator at the tail end of the cable from outside to inside to expose the wires, arranging the wires side by side and then connecting the wires with a first golden finger of the PCB in parallel; and stripping an insulating outer skin of the cable, exposing the shielding layer inside the cable, after the cables are connected in parallel, coating UV conductive adhesive on the contact area of the shielding layer of each cable and the grounding layer of the PCB circuit board, and curing the UV conductive adhesive after ultraviolet irradiation to fix the cable shielding layer on the grounding layer of the PCB circuit board.
10. The method of claim 9, further comprising:
the method comprises the following steps that (I) the tail end of an exposed cable wire is connected, an insulating sheath of the cable is continuously stripped along the length direction of the cable, an internal shielding layer is exposed, a metal sheet is placed on the upper surface or the lower surface of the shielding layer of each cable which is arranged side by side, the length direction of the metal sheet is perpendicular to the length direction of the cable, the contact area of the metal sheet and the shielding layer is coated with UV conductive adhesive, after ultraviolet irradiation, the UV conductive adhesive is cured to enable each cable to be fixed side by side, and the periphery of the cables fixed side by side is wrapped with the insulating sheath to obtain a wire with a flat section;
(II) injection molding an insulating inner mold on the outer surface of the PCB, wherein the insulating inner mold covers the connection part of the terminal installation part and the PCB and the connection part of the lead output end of the cable and the PCB;
(III) assembling a metal inner shell formed by butting two metal half shells on the periphery of the insulating inner die; the fixing block simultaneously passes through the first conductive terminal group and the second conductive terminal group by the through groove and then is inserted into one end of the PCB connected with the terminal mounting piece; a metal front shell is sleeved on the periphery of the terminal mounting piece;
(IV) the metal shell penetrates through the metal front shell and is fixed on the periphery of the metal inner shell, the joint of the metal shell and the metal front shell is fixedly sleeved, the joint of the metal shell and the wire is wrapped with the stress release block, and the peripheries of the metal shell and the stress release block are wrapped with the insulating outer shell to prepare the plug assembly;
preferably, the terminal mounting member is connected with a second gold finger of the PCB by a soldering process;
preferably, the tail end of the cable wire is connected with a first golden finger of the PCB through a welding process;
preferably, the UV conductive adhesive is irradiated by the ultraviolet rays for 10-60 seconds.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010921214.8A CN112054322A (en) | 2020-09-04 | 2020-09-04 | Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010921214.8A CN112054322A (en) | 2020-09-04 | 2020-09-04 | Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly |
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| CN112054322A true CN112054322A (en) | 2020-12-08 |
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| CN202010921214.8A Pending CN112054322A (en) | 2020-09-04 | 2020-09-04 | Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly |
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| US11832799B2 (en) | 2021-08-24 | 2023-12-05 | Altek Biotechnology Corporation | Surface mounted assembly and related endoscope |
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| US11832799B2 (en) | 2021-08-24 | 2023-12-05 | Altek Biotechnology Corporation | Surface mounted assembly and related endoscope |
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