CN112038272B - Wafer transversely snatchs moving mechanism - Google Patents
Wafer transversely snatchs moving mechanism Download PDFInfo
- Publication number
- CN112038272B CN112038272B CN202010853900.6A CN202010853900A CN112038272B CN 112038272 B CN112038272 B CN 112038272B CN 202010853900 A CN202010853900 A CN 202010853900A CN 112038272 B CN112038272 B CN 112038272B
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- fixed
- block
- transverse
- plate
- connecting plate
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- 238000001179 sorption measurement Methods 0.000 claims description 7
- 241000252254 Catostomidae Species 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer transverse grabbing and moving mechanism which comprises a fixed bottom plate, wherein a vertical supporting plate is fixed in the middle of the top surface of the fixed bottom plate, a linear motor is fixed on the front wall surface of the vertical supporting plate, a connecting block is fixed on a sliding block of the linear motor, a transverse horizontal plate is fixed on the bottom surface of the connecting block, a transverse rodless cylinder is fixed on the top surface of the transverse horizontal plate, a bottom moving block of the transverse rodless cylinder is inserted and sleeved in a transverse through groove formed in the middle of the transverse horizontal plate, the bottom surface of the bottom moving block extends out of the transverse through groove and is fixedly provided with a connecting plate, an extension connecting plate is arranged on the connecting plate, and a rotary servo motor is fixed on the top surface of the right end of the extension connecting plate. The invention can be arranged in the equipment with the storage and placement of the wafers on the same straight line of the processing table, can directly grasp and move the wafers at the storage and placement position to the processing table, has convenient grasping, high efficiency and low manufacturing cost.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer transverse grabbing and moving mechanism.
Background
The existing wafer is generally grabbed by a grabbing hand during processing, in some processing steps, the stored and placed wafer is required to be grabbed and then directly moved to a processing table on the corresponding side, the processing table on the corresponding side and the storage and placement position are all located on the same straight line, and the multi-axis robot is adopted for grabbing and placement, so that the operation is troublesome, the efficiency is not high, and the cost is high.
Disclosure of Invention
The invention aims at overcoming the defects of the prior art, and provides a wafer transverse grabbing and moving mechanism which can be installed in equipment with wafers stored and placed on a processing table on the same straight line, can directly grab and move the wafers stored and placed on the processing table, and has the advantages of convenient grabbing, high efficiency and low manufacturing cost.
The technical solution of the invention is as follows:
The utility model provides a wafer transversely snatchs moving mechanism, includes PMKD, PMKD's top surface middle part is fixed with vertical support board, be fixed with linear electric motor on vertical support board's the front wall face, be fixed with the connecting block on linear electric motor's the sliding block, be fixed with horizontal board on the bottom surface of connecting block, be fixed with horizontal rodless cylinder on horizontal board's the top surface, horizontal board's middle part shaping is in horizontal logical groove of bottom movable block plug bush, horizontal logical groove is stretched out to bottom surface of bottom movable block and is fixed with the connecting plate, install on the connecting plate and extend the connecting plate, extend the right-hand member top surface of connecting plate and be fixed with rotatory servo motor, rotatory servo motor's output shaft passes the bottom surface of extending the connecting plate and is fixed with down the connecting plate, the bottom surface of connecting plate is fixed with the vacuum and snatches the hand down.
The bottom surface of connecting plate is fixed with the guide block, and the left portion and the right part of the bottom surface of horizontal plate all are fixed with vertical board, and the both ends of horizontal guide bar are fixed on two vertical boards, and horizontal guide bar plug bush runs through in the through-hole in the middle part of guide block.
The middle part runs through and is fixed with the uide bushing on the inside wall of through-hole, and horizontal guide bar plug bush is in the uide bushing.
The vacuum grabbing hand comprises a left connecting block and a right grabbing block, the left connecting block is fixedly connected to the bottom surface of the lower connecting plate through bolts, connecting portions are formed on the upper portion and the lower portion of the left end of the right grabbing block, and the right end of the left connecting block is clamped between the two connecting portions and is fixedly connected to the two connecting portions through bolts.
The right end shaping of right side snatch the piece has two arc adsorption blocks, and the bottom surface of arc adsorption block has the joint a plurality of sucking discs.
Elastic blocks are fixed on the left end wall surface and the right end wall surface of the transverse through groove, and the elastic blocks face the side walls of the bottom moving block.
The invention has the beneficial effects that: the device can be installed in equipment with the storage and placement of the wafers on the same straight line of the processing table, can directly grasp and move the wafers stored and placed on the processing table, is convenient to grasp, has high efficiency and is low in manufacturing cost.
Drawings
FIG. 1 is a schematic view of a partial structure between the present invention and a wafer storage location;
FIG. 2 is an enlarged view of a portion of FIG. 1;
Fig. 3 is a partial top view of a vacuum gripper hand.
Detailed Description
Examples: referring to fig. 1 to 3, a wafer horizontal grabbing moving mechanism comprises a fixed bottom plate 10, a vertical supporting plate 11 is fixed in the middle of the top surface of the fixed bottom plate 10, a linear motor 12 is fixed on the front wall surface of the vertical supporting plate 11, a connecting block 13 is fixed on a sliding block 121 of the linear motor 12, a horizontal plate 14 is fixed on the bottom surface of the connecting block 13, a horizontal rodless cylinder 15 is fixed on the top surface of the horizontal plate 14, a bottom moving block 151 of the horizontal rodless cylinder 15 is inserted in a horizontal through groove 141 formed in the middle of the horizontal plate 14, the bottom surface of the bottom moving block 151 extends out of the horizontal through groove 141 and is fixed with a connecting plate 16, an extending connecting plate 17 is mounted on the connecting plate 16, a rotary servo motor 18 is fixed on the top surface of the right end of the extending connecting plate 17, an output shaft of the rotary servo motor 18 penetrates through the bottom surface of the extending connecting plate 17 and is fixed with a lower connecting plate 19, and a vacuum grabbing hand 20 is fixed on the bottom surface of the lower connecting plate 19.
Further, the bottom surface of the connecting plate 16 is fixed with a guide block 21, the left and right parts of the bottom surface of the horizontal plate 14 are respectively fixed with a vertical plate 22, two ends of a horizontal guide rod 23 are fixed on the two vertical plates 22, and the horizontal guide rod 23 is inserted into a middle penetrating through hole 211 of the guide block 21.
Further, a guiding sleeve 212 is fixed on the inner sidewall of the middle through hole 211, and the transverse guiding rod 23 is inserted into the guiding sleeve 212.
Further, the vacuum gripper 20 includes a left connecting block 201 and a right gripping block 202, the left connecting block 201 is fixedly connected to the bottom surface of the lower connecting plate 19 through bolts, the upper and lower parts of the left end of the right gripping block 202 are respectively formed with a connecting portion 203, and the right end of the left connecting block 201 is clamped between the two connecting portions 203 and is fixedly connected to the two connecting portions 203 through bolts.
Further, two arc-shaped adsorption blocks 204 are formed at the right end of the right grabbing block 202, and a plurality of suckers 205 are connected to the bottom surface of the arc-shaped adsorption block 204. The inside shaping of right gripping piece 202 has interior cavity, also has the connection cavity in the connecting portion 203, and interior cavity is linked together with the air guide cavity that the middle part shaping of arc adsorption piece 204 had, and sucking disc 205 is linked together with the air guide cavity, and interior cavity is linked together with the connection cavity, has the connector of ventilating on the lateral wall of connecting portion 203, and the connector of ventilating communicates with each other with the connection cavity.
Further, elastic blocks 1 are fixed to both the left and right end wall surfaces of the transverse through groove 141, and the elastic blocks 1 face the side walls of the bottom moving block 151.
In this embodiment, when the device is used, the sliding block 121 of the linear motor 12 moves up and down, the height position of the vacuum gripper 20 can be adjusted, the vacuum gripper 20 can be moved to the position right below the left part of the wafer 300 to be gripped at the material storage frame 100 through the movement of the bottom moving block 151 of the transverse rodless cylinder 15, then the sliding block 121 of the linear motor 12 moves up, the sucker 205 of the vacuum gripper 20 is tightly attached to the wafer 300 and adsorbs the wafer 300, then the bottom moving block 151 of the transverse rodless cylinder 15 moves left to take out the wafer 300 and move left, and the wafer 300 can be rotated by a certain angle through the operation of the rotary servo motor 18, so that when the position deviation exists between the processing position and the material storage frame 100, the wafer 300 can be accurately moved to the position right above the processing position, the wafer 300 is placed at the processing position through the falling of the sliding block 121 of the linear motor 12, then the vacuum gripper 20 stops sucking air, and all the components can return, so that the normal placement and feeding of the wafer 300 are realized, and the effect is good.
Claims (6)
1. The utility model provides a horizontal moving mechanism that snatchs of wafer, includes fixed baseplate (10), its characterized in that: a vertical supporting plate (11) is fixed in the middle of the top surface of the fixed bottom plate (10), a linear motor (12) is fixed on the front wall surface of the vertical supporting plate (11), a connecting block (13) is fixed on a sliding block (121) of the linear motor (12), a transverse horizontal plate (14) is fixed on the bottom surface of the connecting block (13), a transverse rodless cylinder (15) is fixed on the top surface of the transverse horizontal plate (14), a bottom moving block (151) of the transverse rodless cylinder (15) is inserted and sleeved in a transverse through groove (141) formed in the middle of the transverse horizontal plate (14), the bottom surface of bottom movable block (151) stretches out horizontal logical groove (141) and is fixed with connecting plate (16), installs on connecting plate (16) and extends connecting plate (17), and the right-hand member top surface that extends connecting plate (17) is fixed with rotatory servo motor (18), and the output shaft of rotatory servo motor (18) passes the bottom surface that extends connecting plate (17) and is fixed with lower connecting plate (19), and the bottom surface of lower connecting plate (19) is fixed with vacuum and snatches hand (20).
2. The wafer lateral grabbing and moving mechanism as claimed in claim 1, wherein: the bottom surface of connecting plate (16) is fixed with guide block (21), and the left portion and the right part of the bottom surface of horizontal board (14) all are fixed with vertical board (22), and the both ends of horizontal guide rod (23) are fixed on two vertical boards (22), and horizontal guide rod (23) plug bush is in middle part through-hole (211) of guide block (21).
3. A wafer lateral grabbing and moving mechanism as claimed in claim 2, wherein: a guide sleeve (212) is fixed on the inner side wall of the middle through hole (211), and a transverse guide rod (23) is inserted into the guide sleeve (212).
4. The wafer lateral grabbing and moving mechanism as claimed in claim 1, wherein: the vacuum grabbing hand (20) comprises a left connecting block (201) and a right grabbing block (202), the left connecting block (201) is fixedly connected to the bottom surface of the lower connecting plate (19) through bolts, connecting portions (203) are formed on the upper portion and the lower portion of the left end of the right grabbing block (202), and the right end of the left connecting block (201) is clamped between the two connecting portions (203) and is fixedly connected to the two connecting portions (203) through bolts.
5. The wafer lateral grabbing and moving mechanism as claimed in claim 4, wherein: two arc-shaped adsorption blocks (204) are formed at the right end of the right grabbing block (202), and a plurality of suckers (205) are connected to the bottom surface of each arc-shaped adsorption block (204).
6. The wafer lateral grabbing and moving mechanism as claimed in claim 1, wherein: elastic blocks (1) are fixed on the left end wall surface and the right end wall surface of the transverse through groove (141), and the elastic blocks (1) face the side walls of the bottom moving block (151).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853900.6A CN112038272B (en) | 2020-08-24 | 2020-08-24 | Wafer transversely snatchs moving mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853900.6A CN112038272B (en) | 2020-08-24 | 2020-08-24 | Wafer transversely snatchs moving mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112038272A CN112038272A (en) | 2020-12-04 |
| CN112038272B true CN112038272B (en) | 2024-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010853900.6A Active CN112038272B (en) | 2020-08-24 | 2020-08-24 | Wafer transversely snatchs moving mechanism |
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| Country | Link |
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| CN (1) | CN112038272B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107839200A (en) * | 2016-07-14 | 2018-03-27 | 赵登林 | A kind of method of work of high-precision plastic plate grasping mechanism |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203325856U (en) * | 2013-07-05 | 2013-12-04 | 佛山市南海区宏乾电子有限公司 | Pickup device used in high-power transistor chip production |
| CN108644831A (en) * | 2018-06-05 | 2018-10-12 | 佛山信君安智能家居有限公司 | A kind of more baking tray domestic intelligents kitchen electromagnetic oven rack with automatic catching mechanism |
| CN109879036A (en) * | 2019-03-27 | 2019-06-14 | 夏安祥 | A kind of chip automatic charging device |
| CN211029993U (en) * | 2019-11-20 | 2020-07-17 | 常州工业职业技术学院 | Portable compact type material grabbing robot |
| CN110817426B (en) * | 2019-11-27 | 2021-02-05 | 昆山榕美电子科技有限公司 | Raw material plate grabbing and moving mechanism for stamping die |
| CN110758961A (en) * | 2019-12-06 | 2020-02-07 | 旺塔琦智能科技(苏州)有限公司 | Automatic logistics storage and taking device capable of intelligently sorting |
| CN110900594A (en) * | 2019-12-10 | 2020-03-24 | 湖州信倍连网络科技有限公司 | Automatic transverse moving type grabbing and reversing industrial robot |
-
2020
- 2020-08-24 CN CN202010853900.6A patent/CN112038272B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107839200A (en) * | 2016-07-14 | 2018-03-27 | 赵登林 | A kind of method of work of high-precision plastic plate grasping mechanism |
Non-Patent Citations (1)
| Title |
|---|
| 光伏组件全自动在线敷设机的设计;姜利;;机床与液压(第03期);全文 * |
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| Publication number | Publication date |
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| CN112038272A (en) | 2020-12-04 |
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Effective date of registration: 20240517 Address after: Room 02, North Area, 1st Floor, Electronic Building, No. 5, No. 777 Guanggu 3rd Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 (Free Trade Zone Wuhan Area) Applicant after: WUHAN ETERNAL TECHNOLOGIES CO.,LTD. Country or region after: China Address before: 318050 side of Changpu village vegetable market, Lunan street, Luqiao District, Taizhou City, Zhejiang Province Applicant before: Taizhou Laolin Decoration Co.,Ltd. Country or region before: China |
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