CN112038241A - Method for packaging non-bonding electronic tag chip - Google Patents

Method for packaging non-bonding electronic tag chip Download PDF

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Publication number
CN112038241A
CN112038241A CN202010887850.3A CN202010887850A CN112038241A CN 112038241 A CN112038241 A CN 112038241A CN 202010887850 A CN202010887850 A CN 202010887850A CN 112038241 A CN112038241 A CN 112038241A
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China
Prior art keywords
chip
lifting frame
packaging
glue
dispensing
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Withdrawn
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CN202010887850.3A
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Chinese (zh)
Inventor
张晓宇
周晨
庞敏
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Individual
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Individual
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Priority to CN202010887850.3A priority Critical patent/CN112038241A/en
Publication of CN112038241A publication Critical patent/CN112038241A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Labeling Devices (AREA)

Abstract

The invention belongs to the technical field of electronic tag chip packaging, in particular to a non-bonding electronic tag chip packaging method.A used automatic packaging device comprises a conveyor belt, a support, a substrate, a glue dispensing module, a hot pressing module and a controller, wherein the conveyor belt is fixedly connected to the support; according to the invention, the substrate is placed in the automatic packaging device, the controller controls the conveyor belt, the dispensing module and the hot-pressing module to be matched, and the working processes of dispensing and hot-pressing packaging are automatically carried out on the RFID antenna and the RFID chip, so that the working process is stable and accurate, and the working efficiency is improved.

Description

Method for packaging non-bonding electronic tag chip
Technical Field
The invention belongs to the technical field of electronic tag chip packaging, and particularly relates to a method for packaging a non-bonding electronic tag chip.
Background
The electronic tag is called as an RFID (radio frequency identification) tag, i.e., a radio frequency identification tag. The RFID is a non-contact automatic identification technology, which automatically identifies a target object and obtains related data through a radio frequency signal, does not need manual intervention in identification work, and can work in various severe environments. The RFID technology can identify high-speed moving objects and can identify a plurality of electronic tags at the same time, is fast and convenient to operate and is frequently used in supermarkets.
The structure of the electronic tag is composed of an RFID chip, an RFID antenna, a base material and an outer packaging material of the tag, the packaging of the electronic tag chip generally uses a pulse hot press to carry out hot-pressing solidification on the RFID chip to make the RFID chip attached to the RFID antenna to manufacture Inlay, and then the Inlay is manufactured into the electronic tag or the radio frequency intelligent card through secondary packaging. Because the processing technology for attaching the RFID chip to the RFID antenna is complex, the production efficiency is low, and great hidden danger exists in the product quality.
Some technical solutions related to a method for packaging a chip of a non-bonded electronic tag also appear in the prior art, for example, the application numbers are: 2006100138799 discloses a method for packaging an embedded non-bonding electronic label chip, which comprises using a layer of paper, plastic or synthetic material film as the outer packaging material of the electronic label or electronic label chip module; an electronic tag antenna or a module connecting circuit printed with a conductive material; the electronic label chip embedded in the cavity of the substrate chip is a quick-drying adhesive, wherein one layer of the electronic label chip can be printed or blank paper, plastic or a film made of synthetic materials, the cavity implanted into the chip is pressed out by pressure processing and serves as a substrate of an electronic label antenna or an electronic label chip module, and the bottom of the electronic label chip and the bottom of the cavity are fixedly positioned.
The method improves the packaging quality of the electronic tag chip and reduces the packaging and processing cost; however, the patent cannot solve the problems that the manual operation of electronic tag chip packaging causes unstable working flow, uneven dispensing and wrong chip placement position due to proficiency and technical level factors, and reduces the working efficiency; accordingly, the invention provides a method for packaging a non-bonding electronic tag chip.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a method for packaging a non-bonded electronic tag chip.
The technical scheme adopted by the invention for solving the technical problems is as follows: a method for packaging a non-bonding electronic label chip comprises the following steps:
s1: preparing an RFID antenna and an RFID chip, adhering the RFID antenna to a substrate, placing the RFID chip on a lifting frame on the substrate, and placing the substrate on a conveyor belt in an automatic packaging device;
s2: when the substrate in the S1 passes through the dispensing module in the automatic packaging device, an electric push rod in the dispensing module pushes the glue storage tank, and the dispensing tube on the glue storage tank dispenses glue to the middle of the substrate;
s3: when the substrate passes through a hot-pressing module in the automatic packaging device, the hot-pressing module presses the lifting frame back into the substrate, the RFID antenna, the RFID chip and the conductive adhesive are in contact, then the hot-pressing module carries out hot pressing on the RFID chip to solidify the conductive adhesive, the RFID chip is packaged on the RFID antenna, and a packaged electronic tag chip is obtained;
the automatic packaging device in the S2 comprises a conveyor belt, a support, a substrate, a dispensing module, a hot pressing module and a controller, wherein the conveyor belt is arranged on the support, the controller is also arranged on the support and used for controlling the automatic packaging device to automatically operate, a group of stop blocks are fixedly connected onto the conveyor belt, the substrate is placed between every two stop blocks, and the substrate is positioned by the conveyor belt and the stop blocks; a lifting groove is formed in the base plate, a lifting frame is arranged in the lifting groove and is in sliding connection with the lifting groove, a lifting spring is further arranged in the lifting groove, one end of the lifting spring is fixedly connected with the bottom end of the lifting groove, the other end of the lifting spring is fixedly connected with the bottom end of the lifting frame, the lifting frame is located in the middle of the base plate, and a glue dispensing opening is formed in one side of the lifting frame;
the glue dispensing module is positioned in the middle of the conveying belt and comprises a first fixing frame, an electric push rod, a glue storage tank and a glue dispensing pipe, wherein the section of the first fixing frame is Z-shaped, the lower end of the first fixing frame is fixedly connected with the support, the electric push rod is fixedly connected to one side, facing the lifting frame, of the first fixing frame, the glue storage tank is fixedly connected to the push rod of the electric push rod, a push plate is arranged inside the glue storage tank, conductive glue is stored in one side, close to the lifting frame, of the push plate, the glue dispensing pipe is arranged at one end, close to the lifting frame, of the glue storage tank, the glue dispensing pipe is communicated with the glue storage tank, and; a hollow chamber is reserved on one side of the push plate, which is far away from the lifting frame, and an air inlet is arranged on the glue storage tank corresponding to the hollow chamber;
the hot pressing module is located on one side of the dispensing module and comprises a second fixing frame, a hydraulic cylinder, a positioning plate, a hot pressing plate, a heating system and an inflator, the section of the second fixing frame is L-shaped, the lower end of the second fixing frame is fixedly connected with the support, the upper end face of the top of the second fixing frame is provided with the heating system, the hydraulic cylinder is inversely and fixedly connected with the lower end face of the top of the second fixing frame, a piston rod of the hydraulic cylinder is fixedly connected with the positioning plate, the lower end of the positioning plate is fixedly connected with the hot pressing plate corresponding to the position of a substrate, the positioning plate extends towards the direction far away from the second fixing frame, the inflator is arranged below the extending part of the positioning plate, one side of the inflator close to the support is fixedly connected with; be equipped with the gas pole in the inflator, the gas pole top has linked firmly the briquetting, reset spring has been linked firmly between briquetting bottom surface and the inflator top surface, reset spring is located the gas pole outside, and one side that the support was kept away from to the inflator has linked firmly one-way admission valve, and inflator bottom side is provided with the gas outlet, through the trachea intercommunication between gas outlet and the air inlet. When the electronic tag chip packaging machine works, the manual operation of electronic tag chip packaging can cause unstable working flow due to proficiency and technical level factors, the phenomena of uneven dispensing and error chip placement position occur, and the working efficiency is reduced; in order to solve the problem, when the chip of the non-bonding electronic tag is packaged, a substrate adhered with an RFID antenna is placed on a conveying belt of an automatic packaging device, a lifting frame is lifted from the substrate under the action of a lifting spring, the RFID chip is placed at the top end of the lifting frame, when the automatic packaging device starts to work, the substrate is positioned on a glue dispensing module, a controller firstly controls a hydraulic cylinder to drive a positioning plate to move downwards, an extending part of the positioning plate pushes a pressing plate, the pressing plate drives an air rod to move downwards to exhaust an air cylinder to an air outlet, air enters a glue storage tank from an air inlet through an air pipe, meanwhile, the controller controls an electric push rod to work, the electric push rod drives the glue storage tank to move towards the lifting frame until a pipe orifice of a glue dispensing pipe completely passes through a glue dispensing port, the air pressure of a hollow chamber in the glue storage tank rises to enable the pressing plate to move towards the glue dispensing pipe, and, dropping the conductive adhesive in the middle of the substrate; after dispensing is finished, the controller controls the electric push rod and the hydraulic cylinder to return to the original position, the air rod returns to the initial position under the combined action of the return spring and the one-way air inlet valve, then the controller controls the conveyor belt to move, the base plate moves to a station, the base plate located in the dispensing module before moves to the hot-pressing module, the RFID chip is located under the hot-pressing plate, the controller controls the hot-pressing plate to move downwards, the hot-pressing plate presses the lifting frame back into the base plate, the RFID chip, the RFID antenna and the conductive adhesive are in contact, the RFID chip is located at the packaging position, the hot-pressing plate solidifies the conductive adhesive to finish packaging, and meanwhile, the dispensing process of the next base plate to be processed is also finished synchronously through the air cylinder; finally, the substrate leaves the conveyor belt, and due to the action of the lifting spring, workers take the Inlay which is packaged and manufactured out of the substrate to finish all the working processes; the conveying belt performs intermittent motion, so that the dispensing and hot pressing processes in the working process are finished in the moving clearance of the conveying belt, and the automatic packaging device can realize flow production; according to the invention, the substrate is placed in the automatic packaging device, the controller controls the conveyor belt, the dispensing module and the hot-pressing module to be matched, and the working processes of dispensing and hot-pressing packaging are automatically carried out on the RFID antenna and the RFID chip, so that the working process is stable and accurate, and the working efficiency is improved; the relative sliding of the lifting frame and the base plate in the automatic packaging device enables the packaging positions of the RFID chip and the RFID antenna to be more accurate, and the working precision is improved; the cooperation of locating plate, inflator and storage glue jar makes the flow of gluing can accomplish with the hot pressing flow is synchronous, has greatly promoted work efficiency.
Preferably, the bottom end of the chute is fixedly connected with a limiting plate, the shape of one end, close to the support, of the limiting plate is consistent with that of the chute, a threaded hole is formed in the middle of the limiting plate, the middle of the limiting plate is connected with an adjusting screw through threads, a gasket is arranged at the tail of the adjusting screw and is made of elastic materials, and the gasket is in contact with the bottom surface of the inflator; when the RFID chip packaging machine works, the quantity of the conductive adhesive injected into the substrate by the adhesive dispensing module depends on the telescopic quantity of the air rod, and the glue injection quantity of the adhesive dispensing module is kept unchanged because the moving strokes of the positioning plate are consistent each time, so that the packaging quality of the RFID chip can be influenced when the glue injection quantity is too much or too little; in order to accurately control the glue injection amount of the glue dispensing module, the middle part of the limiting plate is provided with the adjusting screw, and a worker can control the position of the air cylinder in the chute through the adjusting screw to change the telescopic amount of the air rod, so that the glue injection amount of the glue dispensing module is adjusted, the adjusting screw is adjusted to a proper position, and the packaging quality of the automatic packaging device can be improved; the threaded hole is connected with the adjusting screw in a threaded manner, the tail of the adjusting screw is in contact with the bottom surface of the air cylinder, and the adjusting screw can control the air cylinder to slide up and down in the sliding groove and be positioned, so that the glue injection amount of the glue dispensing module is adjusted, and the packaging quality is improved.
Preferably, the support is symmetrically and fixedly connected with a pair of third fixing frames, the section of each third fixing frame is Z-shaped, one side of each third fixing frame, which faces the support, is fixedly connected with an ultrasonic device, and the ultrasonic devices are positioned between the glue dispensing modules and the hot pressing modules; when the RFID chip packaging machine works, the conductive adhesive in the lifting frame may be distributed unevenly, and the conductive adhesive at the connecting position of the RFID chip and the RFID antenna may be insufficient, so that the packaging quality of the RFID chip is influenced; in order to solve the problem, a station is additionally arranged between the dispensing module and the hot pressing module, the station is provided with an ultrasonic device, and when the substrate passes through the ultrasonic device, the conductive adhesive in the lifting frame can be subjected to the vibration effect of ultrasonic waves, so that the conductive adhesive is uniformly distributed in the lifting frame, and the packaging quality is improved.
Preferably, the connection position of the dispensing tube and the glue storage tank is positioned at the bottom of the end face of the glue storage tank, the tube body of the dispensing tube inclines upwards, and the tube opening of the dispensing tube faces downwards; when the dispensing module stops using, if the dispensing tube is horizontally arranged, the conductive adhesive remained in the dispensing tube may be solidified, so that the dispensing tube is blocked, and the dispensing module cannot normally work; in order to solve the problem, the dispensing tube is arranged in an inclined shape, when the dispensing module stops using, the conductive adhesive in the dispensing tube flows back to the adhesive storage tank along the inclined direction of the tube body, so that the conductive adhesive is prevented from blocking the dispensing tube, and the normal work of the dispensing module is ensured.
Preferably, heating sheets are arranged on two sides of the pipe orifice of the dispensing pipe, the heating sheets heat the pipe orifice when the dispensing module works, and the temperature of the heating sheets is not enough to solidify the conductive adhesive; when the conductive adhesive dispensing module works, the conductive adhesive stays at the pipe orifice of the dispensing pipe due to the balance of air pressure in the working interval of the dispensing pipe, and the pipe orifice part of the dispensing pipe can be solidified in the process of contacting with the outside, so that the dispensing pipe is blocked, and the dispensing module cannot work normally; in order to solve the problem, the heating sheets are arranged on the two sides of the pipe orifice of the dispensing pipe, the temperature of the heating sheets is not enough to solidify the conductive adhesive, and the heating sheets can ensure that the pipe orifice part of the dispensing pipe keeps a flowing state, prevent the conductive adhesive from being solidified and blocking the dispensing pipe, and ensure the normal work of the dispensing module.
Preferably, a group of taper angles are arranged on the bottom end face of the dispensing opening, the top ends of the taper angles are flush with the dispensing tube, the taper angles are bent towards the interior of the lifting frame, and an inclined plane is further arranged at the bottom ends of the taper angles close to the inner side of the lifting frame; when the automatic packaging device works, as the conductive adhesive has viscosity, the conductive adhesive which is not dropped may remain at the position of the pipe orifice of the dispensing pipe, so that the glue injection quantity of the dispensing module is different, and the packaging quality of the automatic packaging device is influenced; in order to solve the problem, the bottom end face of the dispensing opening is provided with a group of cone angles, when the dispensing tube returns, the cone angles can scrape off residual conductive adhesive on the dispensing tube, and the conductive adhesive can flow back into the lifting frame along the side face and the inclined plane of the cone angles, so that the difference of the glue injection quantity of the dispensing module is prevented, and the packaging quality is ensured.
Preferably, the upper end of the dispensing opening is hinged with a rotating plate, the shape of the rotating plate is consistent with that of the dispensing opening, and the lower end of the rotating plate is provided with a notch corresponding to the cone angle; when the automatic packaging device works, in the process that the hot pressing plate presses the lifting frame back to the base plate, as only the position of the glue dispensing opening outside the lifting frame is communicated with the outside, the conductive adhesive in the lifting frame can overflow to the position of the glue dispensing opening, so that the conductive adhesive on the base plate is unevenly distributed, and the packaging quality of the automatic packaging device is influenced; in order to solve the problem, the upper end of the dispensing opening is hinged with the rotating plate, when the dispensing module works, the dispensing tube can push the rotating plate open and pass through the dispensing opening, so that the normal work of the dispensing module is not influenced, when the hot-pressing module works, the rotating plate can ensure that the position of the dispensing opening is closed, the conductive adhesive is prevented from overflowing from the dispensing opening, and the design can ensure the packaging quality while the normal work of the dispensing module is not influenced.
Preferably, the side surface of the RFID chip is provided with a micro-bump, a corresponding position on the RFID antenna is provided with a micro-groove, and the shape of the micro-bump is consistent with that of the micro-groove; when the RFID chip packaging machine works, when the hot pressing plate presses the lifting frame back to the base plate and the RFID chip, the RFID antenna and the conductive adhesive are in contact, if the RFID chip and the RFID antenna are not in close contact, the packaging quality can be influenced; in order to solve the problem, the side surface of the RFID chip is provided with the micro convex points, the RFID antenna is provided with the micro grooves, and the micro convex points are in sliding connection with the micro grooves in the process that the lifting frame is pressed back to the base plate, so that the RFID chip is in close contact with the RFID antenna, and the packaging quality of the automatic packaging device is improved; according to the invention, the micro-convex points and the micro-grooves with the same shapes are respectively arranged at the corresponding positions of the RFID chip and the RFID antenna, and the sliding connection between the micro-convex points and the micro-grooves is realized by utilizing the movement of the lifting frame, so that the RFID chip and the RFID antenna are in close contact, and the packaging quality is improved.
Preferably, four corners of the top end of the lifting frame are provided with positioning frames corresponding to the bottom end of the RFID chip in shape, and when the RFID chip is fixed on the positioning frames, gaps exist between the RFID chip and two sides of the lifting frame; when the RFID chip packaging device works, the RFID chip is possibly extruded by the hot pressing plate in the process that the lifting frame is pressed back to the base plate, so that the RFID chip deviates from the initial position, the RFID chip and the RFID antenna cannot be accurately connected, and the packaging quality is influenced; in order to solve the problem, the positioning frame is arranged at the top end of the lifting frame, and the positioning frame can be tightly attached to the bottom of the RFID chip for positioning, so that the position of the RFID chip cannot deviate, and the connection accuracy of the RFID chip and the RFID antenna is ensured; meanwhile, gaps are reserved on two sides of the bottom end of the RFID chip, so that when the RFID chip, the RFID antenna and the conductive adhesive are in contact, the conductive adhesive can flow out from the gaps, the connection part between the RFID chip and the RFID antenna is fully covered, and the packaging quality is improved.
Preferably, the gap between the positioning frame and the lifting frame is positioned at two sides of the lifting frame, and the position of the gap corresponds to the position of the micro convex point; during operation, the micro-bumps and the micro-grooves can not be connected due to the fact that the RFID chip is not placed in the right direction; the gap position between the positioning frame and the lifting frame limits the placement direction of the RFID chip, ensures that the micro-convex points and the micro-grooves can be accurately connected, and improves the packaging quality.
Preferably, the micro-convex points are conical, the upper ends of the openings of the micro-convex points are large, the lower ends of the openings of the micro-convex points are small, and the micro-grooves correspond to the micro-convex points in shape; during operation, the shape design of the micro-convex points can ensure that the micro-grooves can be accurately jointed with the micro-convex points on a moving path in the moving process of the micro-convex points, and the packaging quality is improved.
The invention has the following beneficial effects:
1. according to the method for packaging the non-bonding electronic tag chip, the relative sliding of the lifting frame and the substrate of the automatic packaging device is adopted, so that the packaging positions of the RFID chip and the RFID antenna are more accurate, and the working precision is improved; the cooperation of locating plate, inflator and storage glue jar makes the flow of gluing can accomplish with the hot pressing flow is synchronous, has greatly promoted work efficiency.
2. According to the method for packaging the non-bonding electronic tag chip, the automatic packaging device is used, the threaded hole is in threaded connection with the adjusting screw, the tail of the adjusting screw is in contact with the bottom surface of the air cylinder, and the adjusting screw can control the air cylinder to slide up and down in the sliding groove and be positioned, so that the glue injection amount of the glue dispensing module is adjusted, and the packaging quality is improved.
3. According to the method for packaging the chip of the non-bonding electronic tag, the automatic packaging device used in the method is provided with the micro convex points and the micro grooves which are consistent in shape on the corresponding positions of the RFID chip and the RFID antenna respectively, and the sliding connection between the micro convex points and the micro grooves is realized by utilizing the movement of the lifting frame, so that the RFID chip is in close contact with the RFID antenna, and the packaging quality is improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a flow chart of a method of the present invention;
FIG. 2 is a three-dimensional view of the automated packaging apparatus of the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 is a top view of the automated packaging apparatus of the present invention;
FIG. 5 is a cross-sectional view taken along line B-B of FIG. 4;
FIG. 6 is an enlarged view taken at D in FIG. 5;
FIG. 7 is a cross-sectional view taken along line C-C of FIG. 4;
FIG. 8 is a schematic diagram of the structure of an RFID antenna and an RFID chip according to the present invention;
in the figure: the device comprises an RFID antenna 1, a micro-groove 11, an RFID chip 2, micro bumps 21, a conveyor belt 3, a stop block 31, a support 4, a slider 41, a sliding groove 42, a limit plate 43, an adjusting screw 44, a gasket 45, a third fixing frame 46, an ultrasonic device 47, a base plate 5, a lifting groove 51, a lifting frame 52, a lifting spring 53, a dispensing opening 54, a taper angle 55, a rotating plate 56, a positioning frame 57, a dispensing module 6, a first fixing frame 61, an electric push rod 62, a glue storage tank 63, a dispensing tube 64, a push plate 65, an air inlet 66, an air outlet 67, a heating sheet 68, a hot-pressing module 7, a second fixing frame 71, a hydraulic cylinder 72, a positioning plate 73, a hot-pressing plate 74, a heating system 75, an air cylinder 76, an air rod 77, a pressing block.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 8, the method for packaging a non-bonded electronic tag chip according to the present invention includes the following steps:
s1: preparing an RFID antenna 1 and an RFID chip 2, adhering the RFID antenna 1 to a substrate 5, placing the RFID chip 2 on a lifting frame 52 on the substrate 5, and placing the substrate 5 on a conveyor belt 3 in an automatic packaging device;
s2: when the substrate 5 in S1 passes through the dispensing module 6 in the automatic packaging device, the electric push rod 62 in the dispensing module 6 pushes the glue storage tank 63, and the dispensing tube 64 on the glue storage tank 63 dispenses glue to the middle of the substrate 5;
s3: when the substrate 5 passes through the hot-pressing module 7 in the automatic packaging device, the hot-pressing module 7 presses the lifting frame 52 back into the substrate 5, the RFID antenna 1 and the RFID chip 2 are in contact with the conductive adhesive, then the hot-pressing module 7 carries out hot pressing on the RFID chip 2, the conductive adhesive is solidified, the RFID chip 2 is packaged on the RFID antenna 1, and a packaged electronic tag chip is obtained;
the automatic packaging device in the S2 comprises a conveyor belt 3, a support 4, a substrate 5, a dispensing module 6, a hot-pressing module 7 and a controller 8, wherein the conveyor belt 3 is arranged on the support 4, the controller 8 is also arranged on the support 4, the controller 8 is used for controlling the automatic packaging device to automatically operate, a group of stop blocks 31 are fixedly connected to the conveyor belt 3, the substrate 5 is placed between every two stop blocks 31, and the substrate 5 is positioned by the conveyor belt 3 and the stop blocks 31; a lifting groove 51 is arranged in the base plate 5, a lifting frame 52 is arranged in the lifting groove 51, the lifting frame 52 is in sliding connection with the lifting groove 51, a lifting spring 53 is further arranged in the lifting groove 51, one end of the lifting spring 53 is fixedly connected with the bottom end of the lifting groove 51, the other end of the lifting spring is fixedly connected with the bottom end of the lifting frame 52, the lifting frame 52 is positioned in the middle of the base plate 5, and a glue dispensing opening 54 is formed in one side of the lifting frame;
the glue dispensing module 6 is positioned in the middle of the conveyor belt 3, the glue dispensing module 6 comprises a first fixing frame 61, an electric push rod 62, a glue storage tank 63 and a glue dispensing pipe 64, the cross section of the first fixing frame 61 is Z-shaped, the lower end of the first fixing frame 61 is fixedly connected with the support 4, the electric push rod 62 is fixedly connected to one side of the first fixing frame 61, which faces the lifting frame 52, the glue storage tank 63 is fixedly connected to the push rod of the electric push rod 62, a push plate 65 is arranged inside the glue storage tank 63, conductive glue is stored at one side, which is close to the lifting frame 52, of the push plate 65, the glue dispensing pipe 64 is arranged at one end, which is close to the lifting frame 52, the glue dispensing pipe 64 is communicated with the glue storage tank 63, and the pipe orifice of; a vacant chamber is reserved on one side of the push plate 65, which is far away from the lifting frame 52, and an air inlet 66 is arranged on the glue storage tank 63 corresponding to the vacant chamber;
the hot-pressing module 7 is located at one side of the dispensing module 6, the hot-pressing module 7 comprises a second fixing frame 71, a hydraulic cylinder 72, a positioning plate 73, a hot-pressing plate 74, a heating system 75 and an air cylinder 76, the section of the second fixing frame 71 is L-shaped, the lower end of the second fixing frame 71 is fixedly connected with the bracket 4, the upper end surface of the top of the second fixing frame 71 is provided with the heating system 75, the hydraulic cylinder 72 is inversely fixedly connected to the lower end face of the top of the second fixing frame 71, a piston rod of the hydraulic cylinder 72 is fixedly connected with the positioning plate 73, the lower end of the positioning plate 73 is fixedly connected with the hot pressing plate 74 corresponding to the position of the base plate 5, the positioning plate 73 extends towards the direction far away from the second fixing frame 71, the air cylinder 76 is arranged below the extending part of the positioning plate 73, one side of the air cylinder 76 close to the support 4 is fixedly connected with a T-shaped sliding block 41, the support 4 is provided with a sliding groove 42 with the same shape as the sliding block 41, and the sliding groove 42 is; be equipped with gas pole 77 in the inflator 76, gas pole 77 top has linked firmly briquetting 78, linked firmly reset spring 79 between briquetting 78 bottom surface and the inflator 76 top surface, reset spring 79 is located the gas pole 77 outside, and one side that support 4 was kept away from to inflator 76 has linked firmly one-way admission valve, and inflator 76 bottom side is provided with gas outlet 67, communicate through the trachea between gas outlet 67 and the air inlet 66. When the electronic tag chip packaging machine works, the manual operation of electronic tag chip packaging can cause unstable working flow due to proficiency and technical level factors, the phenomena of uneven dispensing and error chip placement position occur, and the working efficiency is reduced; in order to solve the problem, when the invention carries out the non-bonding electronic tag chip packaging, the substrate 5 adhered with the RFID antenna 1 is placed on the conveyor belt 3 of the automatic packaging device, the lifting frame 52 is lifted from the substrate 5 under the action of the lifting spring 53, the RFID chip 2 is placed at the top end of the lifting frame 52, when the automatic packaging device starts to work, the substrate 5 is positioned at the glue dispensing module 6, the controller 8 firstly controls the hydraulic cylinder 72 to drive the positioning plate 73 to move downwards, the extension part of the positioning plate 73 pushes the pressing plate, the pressing plate drives the air rod 77 to move downwards, the air cylinder 76 exhausts air to the air outlet 67, the air enters the glue storage tank 63 from the air inlet 66 through the air pipe, meanwhile, the controller 8 controls the electric push rod to work, the electric push rod 62 drives the glue storage tank 63 to move towards the lifting frame 52 until the pipe orifice of the glue dispensing pipe 64 completely passes through the glue dispensing port 54, because the air pressure of, the push plate 65 moves towards the dispensing tube 64, and the conductive adhesive in the adhesive storage tank 63 is extruded to flow out along the dispensing tube 64, so that the conductive adhesive is dropped in the middle of the substrate 5; after dispensing, the controller 8 controls the electric push rod and the hydraulic cylinder 72 to return to the original position, the air rod 77 returns to the initial position under the combined action of the return spring 79 and the one-way air inlet valve, then the controller 8 controls the conveyor belt 3 to move, so that the substrate 5 moves to a station, the substrate 5 located in the dispensing module 6 before moves to the hot pressing module 7, the RFID chip 2 is located right below the hot pressing plate 74, the controller 8 controls the hot pressing plate 74 to move downwards, the hot pressing plate 74 presses the lifting frame 52 back into the substrate 5, at the moment, the RFID chip 2, the RFID antenna 1 and the conductive adhesive are in contact, the RFID chip 2 is just located at the packaging position, the hot pressing plate 74 solidifies the conductive adhesive to complete packaging, and meanwhile, the dispensing process of the next substrate 5 to be processed is synchronously completed through the air cylinder 76 and the dispensing module 6; finally, the substrate 5 leaves the conveyor belt 3, and due to the action of the lifting spring 53, the staff takes the Inlay which is packaged and manufactured out of the substrate 5 to finish all the working processes; the conveyor belt 3 performs intermittent motion, so that the dispensing and hot-pressing processes in the working process are finished in the motion clearance of the conveyor belt 3, and the automatic packaging device can realize flow production; according to the invention, the substrate 5 is placed into the automatic packaging device, the controller 8 controls the conveyor belt 3, the dispensing module 6 and the hot-pressing module 7 to be matched, and the working processes of dispensing and hot-pressing packaging are automatically carried out on the RFID antenna 1 and the RFID chip 2, so that the working process is stable and accurate, and the working efficiency is improved; the relative sliding of the lifting frame 52 and the substrate 5 in the automatic packaging device enables the packaging positions of the RFID chip 2 and the RFID antenna 1 to be more accurate, and the working precision is improved; the cooperation of the positioning plate 73, the air cylinder 76 and the glue storage tank 63 enables the glue dispensing process and the hot pressing process to be completed synchronously, thereby greatly improving the working efficiency.
As an embodiment of the invention, the bottom end of the sliding chute 42 is fixedly connected with a limit plate 43, the shape of one end of the limit plate 43 close to the bracket 4 is consistent with the shape of the sliding chute 42, the middle part of the limit plate 43 is provided with a threaded hole, the middle part of the limit plate 43 is connected with an adjusting screw 44 through a thread, the tail part of the adjusting screw 44 is provided with a gasket 45, the gasket 45 is made of an elastic material, and the gasket 45 is in contact with the bottom surface of the air cylinder 76; during operation, the amount of the conductive adhesive injected into the substrate 5 by the dispensing module 6 depends on the expansion amount of the air rod 77, and since the stroke of each movement of the positioning plate 73 is consistent, the glue injection amount of the dispensing module 6 remains unchanged, and the packaging quality of the RFID chip 2 is affected when too much or too little glue injection amount is used; in order to accurately control the glue injection amount of the glue dispensing module 6, the middle part of the limiting plate 43 is provided with the adjusting screw 44, a worker can control the position of the air cylinder 76 in the chute 42 through the adjusting screw 44 and change the telescopic amount of the air rod 77, so that the glue injection amount of the glue dispensing module 6 is adjusted, the adjusting screw 44 is adjusted to a proper position, and the packaging quality of the automatic packaging device can be improved; the threaded hole is connected with the thread of the adjusting screw 44, and the tail of the adjusting screw 44 is contacted with the bottom surface of the air cylinder 76, so that the adjusting screw 44 can control the air cylinder 76 to slide up and down in the chute 42 and be positioned, the glue injection amount of the glue dispensing module 6 is adjusted, and the packaging quality is improved.
As an embodiment of the present invention, a pair of No. three fixing frames 46 is symmetrically and fixedly connected to the support 4, the section of the No. three fixing frame 46 is Z-shaped, one side of the No. three fixing frame 46 facing the support 4 is fixedly connected with an ultrasonic device 47, and the ultrasonic device 47 is located between the dispensing module 6 and the hot-pressing module 7; during operation, the conductive adhesive in the lifting frame 52 may be unevenly distributed, and the conductive adhesive at the connection position of the RFID chip 2 and the RFID antenna 1 may be insufficient, thereby affecting the packaging quality of the RFID chip 2; in order to solve the problem, a station is additionally arranged between the dispensing module 6 and the hot pressing module 7, the station is provided with an ultrasonic device 47, and when the substrate 5 passes through the ultrasonic device 47, the conductive adhesive in the lifting frame 52 can be subjected to the vibration effect of ultrasonic waves, so that the conductive adhesive is uniformly distributed in the lifting frame 52, and the packaging quality is improved.
As an embodiment of the present invention, the position where the dispensing tube 64 is communicated with the glue storage tank 63 is located at the bottom of the end surface of the glue storage tank 63, the tube body of the dispensing tube 64 is inclined upward, and the orifice of the dispensing tube 64 is downward; when the dispensing module 6 stops using, if the dispensing tube 64 is horizontally arranged, the conductive adhesive remained in the dispensing tube 64 may be solidified, so that the dispensing tube 64 is blocked, and the dispensing module 6 cannot normally work; in order to solve the problem, the dispensing tube 64 is arranged in an inclined shape, when the dispensing module 6 stops using, the conductive adhesive in the dispensing tube 64 flows back to the adhesive storage tank 63 along the inclined direction of the tube body, so that the conductive adhesive is prevented from blocking the dispensing tube 64, and the normal work of the dispensing module 6 is ensured.
As an embodiment of the present invention, heating sheets 68 are disposed on two sides of the pipe orifice of the dispensing pipe 64, and the heating sheets 68 heat the pipe orifice when the dispensing module 6 is working, and the temperature of the heating sheets 68 is not enough to solidify the conductive adhesive; when the dispensing tube 64 works, the conductive adhesive stays at the tube opening of the dispensing tube 64 due to the balance of air pressure in the working interval, and the tube opening part of the dispensing tube 64 may be solidified in the process of contacting with the outside, so that the dispensing tube 64 is blocked, and the dispensing module 6 cannot work normally; in order to solve the problem, the heating sheets 68 are arranged on the two sides of the pipe orifice of the dispensing pipe 64, the temperature of the heating sheets 68 is not enough to solidify the conductive adhesive, and the heating sheets 68 can ensure that the pipe orifice part of the dispensing pipe 64 keeps a flowing state, so that the dispensing pipe 64 is prevented from being blocked by the conductive adhesive, and the normal work of the dispensing module 6 is ensured.
As an embodiment of the present invention, a set of taper angles 55 is provided on the bottom end surface of the dispensing opening 54, the top ends of the taper angles 55 are flush with the dispensing tube 64, the taper angles 55 are bent toward the inside of the lifting frame 52, and the bottom ends of the taper angles 55 are further provided with an inclined surface near the inner side of the lifting frame 52; when the automatic packaging device works, as the conductive adhesive has viscosity, the conductive adhesive which is not dropped may remain at the position of the pipe orifice of the dispensing pipe 64, so that the glue injection amount of the dispensing module 6 is different, and the packaging quality of the automatic packaging device is influenced; in order to solve the problem, the invention is provided with a group of cone angles 55 on the bottom end surface of the dispensing opening 54, when the dispensing tube 64 returns, the cone angles 55 can scrape off the residual conductive adhesive on the dispensing tube 64, and the conductive adhesive can flow back into the lifting frame 52 along the side surface and the inclined surface of the cone angles 55, thereby preventing the difference of the glue injection quantity of the dispensing module 6 and ensuring the packaging quality.
As an embodiment of the present invention, the upper end of the dispensing opening 54 is hinged with a rotating plate 56, the shape of the rotating plate 56 is consistent with that of the dispensing opening 54, and the lower end of the rotating plate 56 is provided with a notch corresponding to the cone angle 55; during operation, in the process that the hot press plate 74 presses the lifting frame 52 back to the substrate 5, since only the position of the dispensing opening 54 outside the lifting frame 52 is communicated with the outside, the conductive adhesive in the lifting frame 52 may overflow to the position of the dispensing opening 54, so that the conductive adhesive on the substrate 5 is unevenly distributed, and the packaging quality of the automatic packaging device is affected; in order to solve the problem, the upper end of the dispensing opening 54 is hinged with the rotating plate 56, when the dispensing module 6 works, the dispensing tube 64 can push the rotating plate 56 open and pass through the dispensing opening 54, so that the normal work of the dispensing module 6 is not influenced, when the hot-pressing module 7 works, the rotating plate 56 can ensure that the position of the dispensing opening 54 is closed, the conductive adhesive is prevented from overflowing from the dispensing opening 54, and the design can ensure the packaging quality while the normal work of the dispensing module 6 is not influenced.
As an embodiment of the invention, a micro-bump 21 is arranged on a side surface of the RFID chip 2, a micro-groove 11 is arranged at a corresponding position on the RFID antenna 1, and the shape of the micro-bump 21 is consistent with that of the micro-groove 11; in operation, when the hot-press board 74 presses the lifting frame 52 back to the substrate 5, and the RFID chip 2, the RFID antenna 1 and the conductive adhesive are in contact, if the RFID chip 2 and the RFID antenna 1 are not in close contact, the packaging quality may be affected; in order to solve the problem, the side surface of the RFID chip 2 is provided with the micro-convex points 21, the RFID antenna 1 is provided with the micro-grooves 11, and when the lifting frame 52 is pressed back to the substrate 5, the micro-convex points 21 are in sliding connection with the micro-grooves 11, so that the RFID chip 2 is in close contact with the RFID antenna 1, and the packaging quality of the automatic packaging device is improved; according to the invention, the micro-bumps 21 and the micro-grooves 11 with the same shape are respectively arranged at the corresponding positions of the RFID chip 2 and the RFID antenna 1, and the sliding connection between the micro-bumps 21 and the micro-grooves 11 is realized by the movement of the lifting frame 52, so that the RFID chip 2 and the RFID antenna 1 are in close contact, and the packaging quality is improved.
As an embodiment of the invention, four corners of the top end of the lifting frame 52 are provided with positioning frames 57 corresponding to the bottom end shape of the RFID chip 2, and when the RFID chip 2 is fixed on the positioning frames 57, a gap exists between the RFID chip 2 and the lifting frame 52; during operation, when the lifting frame 52 is pressed back to the substrate 5, the hot pressing plate 74 may press the RFID chip 2, so that the RFID chip 2 deviates from the initial position, and the RFID chip 2 and the RFID antenna 1 cannot be accurately connected, thereby affecting the packaging quality; in order to solve the problem, the top end of the lifting frame 52 is provided with the positioning frame 57, the positioning frame 57 can be tightly attached to the bottom of the RFID chip 2 for positioning, so that the position of the RFID chip 2 cannot deviate, and the connection accuracy of the RFID chip 2 and the RFID antenna 1 is ensured; meanwhile, gaps are reserved on two sides of the bottom end of the RFID chip 2, so that the conductive adhesive can flow out from the gaps when the RFID chip 2, the RFID antenna 1 and the conductive adhesive are in contact, the connecting part between the RFID chip 2 and the RFID antenna 1 is fully covered, and the packaging quality is improved.
As an embodiment of the invention, the gap between the positioning frame 57 and the lifting frame 52 is located at both sides of the lifting frame 52, and the position of the gap corresponds to the position of the micro-bump 21; during operation, the micro bumps 21 and the micro grooves 11 may not be connected due to the fact that the RFID chips 2 are not placed in the opposite directions; the position of the gap between the positioning frame 57 and the lifting frame 52 limits the placement direction of the RFID chip 2, ensures that the micro-bumps 21 and the micro-grooves 11 can be accurately connected, and improves the packaging quality.
As an embodiment of the invention, the micro-bump 21 is conical, the upper end of the opening of the micro-bump 21 is large, and the lower end is small, and the shape of the micro-groove 11 corresponds to that of the micro-bump 21; during operation, the shape design of the micro-convex points 21 can ensure that the micro-grooves 11 can be accurately jointed with the micro-convex points 21 on a moving path in the moving process of the micro-convex points 21, and the packaging quality is improved.
When the electronic tag chip packaging machine works, the manual operation of electronic tag chip packaging can cause unstable working flow due to proficiency and technical level factors, the phenomena of uneven dispensing and error chip placement position occur, and the working efficiency is not high; in order to solve the problem, when the invention carries out the non-bonding electronic tag chip packaging, the substrate 5 adhered with the RFID antenna 1 is placed on the conveyor belt 3 of the automatic packaging device, the lifting frame 52 is lifted from the substrate 5 under the action of the lifting spring 53, the RFID chip 2 is placed at the top end of the lifting frame 52, when the automatic packaging device starts to work, the substrate 5 is positioned at the glue dispensing module 6, the controller 8 firstly controls the hydraulic cylinder 72 to drive the positioning plate 73 to move downwards, the extension part of the positioning plate 73 pushes the pressing plate, the pressing plate drives the air rod 77 to move downwards, the air cylinder 76 exhausts air to the air outlet 67, the air enters the glue storage tank 63 from the air inlet 66 through the air pipe, meanwhile, the controller 8 controls the electric push rod to work, the electric push rod 62 drives the glue storage tank 63 to move towards the lifting frame 52 until the pipe orifice of the glue dispensing pipe 64 completely passes through the glue dispensing port 54, because the air pressure of, the push plate 65 moves towards the dispensing tube 64, and the conductive adhesive in the adhesive storage tank 63 is extruded to flow out along the dispensing tube 64, so that the conductive adhesive is dropped in the middle of the substrate 5; after dispensing, the controller 8 controls the electric push rod and the hydraulic cylinder 72 to return to the original position, the air rod 77 returns to the initial position under the combined action of the return spring 79 and the one-way air inlet valve, then the controller 8 controls the conveyor belt 3 to move, so that the substrate 5 moves to a station, the substrate 5 located in the dispensing module 6 before moves to the hot pressing module 7, the RFID chip 2 is located right below the hot pressing plate 74, the controller 8 controls the hot pressing plate 74 to move downwards, the hot pressing plate 74 presses the lifting frame 52 back into the substrate 5, at the moment, the RFID chip 2, the RFID antenna 1 and the conductive adhesive are in contact, the RFID chip 2 is just located at the packaging position, the hot pressing plate 74 solidifies the conductive adhesive to complete packaging, and meanwhile, the dispensing process of the next substrate 5 to be processed is synchronously completed through the air cylinder 76 and the dispensing module 6; finally, the substrate 5 leaves the conveyor belt 3, and due to the action of the lifting spring 53, the worker takes the packaged RFID chip 2 and the packaged RFID antenna 1 out of the substrate 5 to complete all the working processes; the conveyor belt 3 performs intermittent motion, so that the dispensing and hot-pressing processes in the working process are finished in the motion clearance of the conveyor belt 3, and the automatic packaging device can realize flow production; according to the invention, the substrate 5 is placed into the automatic packaging device, the controller 8 controls the conveyor belt 3, the dispensing module 6 and the hot-pressing module 7 to be matched, and the working processes of dispensing and hot-pressing packaging are automatically carried out on the RFID antenna 1 and the RFID chip 2, so that the working process is stable and accurate, and the working efficiency is improved; the relative sliding of the lifting frame 52 and the substrate 5 in the automatic packaging device enables the packaging positions of the RFID chip 2 and the RFID antenna 1 to be more accurate, and the working precision is improved; the cooperation of the positioning plate 73, the air cylinder 76 and the glue storage tank 63 enables the glue dispensing process and the hot pressing process to be completed synchronously, thereby greatly improving the working efficiency.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (11)

1. A method for packaging a non-bonding electronic label chip is characterized by comprising the following steps:
s1: preparing an RFID antenna (1) and an RFID chip (2), adhering the RFID antenna (1) to a substrate (5), placing the RFID chip (2) on a lifting frame (52) on the substrate (5), and placing the substrate (5) on a conveyor belt (3) in an automatic packaging device;
s2: when the substrate (5) in the S1 passes through the glue dispensing module (6) in the automatic packaging device, an electric push rod (62) in the glue dispensing module (6) pushes a glue storage tank (63), and a glue dispensing pipe (64) on the glue storage tank (63) dispenses glue to the middle part of the substrate (5);
s3: when the substrate (5) passes through a hot-pressing module (7) in the automatic packaging device, the hot-pressing module (7) presses the lifting frame (52) back into the substrate (5), the RFID antenna (1), the RFID chip (2) are contacted with the conductive adhesive, then the hot-pressing module (7) carries out hot pressing on the RFID chip (2), the conductive adhesive is solidified, the RFID chip (2) is packaged on the RFID antenna (1), and the packaged electronic tag chip is obtained;
the automatic packaging device in the S2 comprises a conveyor belt (3), a support (4), a substrate (5), a dispensing module (6), a hot pressing module (7) and a controller (8), wherein the conveyor belt (3) is arranged on the support (4), the controller (8) is further arranged on the support (4), the controller (8) is used for controlling the automatic packaging device to automatically run, a group of stop blocks (31) are fixedly connected to the conveyor belt (3), the substrate (5) is placed between every two stop blocks (31), and the substrate (5) is positioned by the conveyor belt (3) and the stop blocks (31); a lifting groove (51) is arranged in the base plate (5), a lifting frame (52) is arranged in the lifting groove (51), the lifting frame (52) is connected with the lifting groove (51) in a sliding mode, a lifting spring (53) is further arranged in the lifting groove (51), one end of the lifting spring (53) is fixedly connected with the bottom end of the lifting groove (51), the other end of the lifting spring is fixedly connected with the bottom end of the lifting frame (52), the lifting frame (52) is located in the middle of the base plate (5), and a glue dispensing opening (54) is formed in one side of the lifting frame (52);
the glue dispensing module (6) is positioned in the middle of the conveyor belt (3), the glue dispensing module (6) comprises a first fixing frame (61), an electric push rod (62), a glue storage tank (63) and a glue dispensing pipe (64), the cross section of the first fixing frame (61) is Z-shaped, the lower end of the first fixing frame (61) is fixedly connected with the bracket (4), one side of the first fixing frame (61) facing the lifting frame (52) is fixedly connected with the electric push rod (62), the push rod of the electric push rod (62) is fixedly connected with the glue storage tank (63), and the push plate (65) is arranged inside the glue storage tank (63), conductive adhesive is stored at one side, close to the lifting frame (52), of the push plate (65), one end, close to the lifting frame (52), of the adhesive storage tank (63) is provided with the adhesive dispensing pipe (64), the adhesive dispensing pipe (64) is communicated with the adhesive storage tank (63), and the position of a pipe orifice of the adhesive dispensing pipe (64) corresponds to the position of the adhesive dispensing opening (54) of the lifting frame (52); a vacant chamber is reserved on one side of the push plate (65) far away from the lifting frame (52), and an air inlet (66) is arranged on the glue storage tank (63) corresponding to the vacant chamber;
hot pressing module (7) is located module (6) one side is glued to the point, and hot pressing module (7) is including No. two mount (71), pneumatic cylinder (72), locating plate (73), hot pressboard (74), heating system (75) and inflator (76), No. two mount (71) cross-sections are the L type, and No. two mount (71) lower extreme links firmly with support (4), and No. two mount (71) top up end is equipped with heating system (75), pneumatic cylinder (72) inversion links firmly terminal surface under No. two mount (71) top, the piston rod of pneumatic cylinder (72) with locating plate (73) link firmly, and locating plate (73) lower extreme corresponds base plate (5) position and has linked firmly hot pressboard (74), and locating plate (73) extend towards the direction of keeping away from No. two mount (71), and locating plate (73) extend part below is equipped with inflator (76), one side of the air cylinder (76) close to the support (4) is fixedly connected with a T-shaped sliding block (41), a sliding groove (42) with the same shape as the sliding block (41) is arranged on the support (4), and the sliding groove (42) is in sliding connection with the sliding block (41); be equipped with gas pole (77) in inflator (76), gas pole (77) top has linked firmly briquetting (78), reset spring (79) have been linked firmly between briquetting (78) bottom surface and inflator (76) top surface, reset spring (79) are located the gas pole (77) outside, and one side that support (4) were kept away from in inflator (76) has linked firmly one-way admission valve, and inflator (76) bottom side is provided with gas outlet (67), through the trachea intercommunication between gas outlet (67) and gas inlet (66).
2. The method for packaging a chip without bonding electronic tag according to claim 1, wherein: spout (42) bottom has linked firmly limiting plate (43), the one end shape that limiting plate (43) are close to support (4) is unanimous with spout (42) shape, and limiting plate (43) middle part is equipped with the screw hole, and there is adjusting screw (44) limiting plate (43) middle part through threaded connection, the afterbody of adjusting screw (44) is equipped with gasket (45), gasket (45) comprise elastic material, gasket (45) and inflator (76) bottom surface contact.
3. The method for packaging a chip without bonding electronic tag according to claim 1, wherein: the symmetry has linked firmly a pair of No. three mount (46) on support (4), No. three mount (46) cross-section is the Z type, and No. three mount (46) have linked firmly ultrasonic device (47) towards one side of support (4), ultrasonic device (47) are located and are glued between module (6) and hot pressing module (7).
4. The method for packaging a chip without bonding electronic tag according to claim 1, wherein: the connection position of the glue dispensing pipe (64) and the glue storage tank (63) is positioned at the bottom of the end surface of the glue storage tank (63), the pipe body of the glue dispensing pipe (64) inclines upwards, and the pipe opening of the glue dispensing pipe (64) faces downwards.
5. The method for packaging a chip without bonding electronic tag according to claim 4, wherein: heating sheets (68) are arranged on two sides of the pipe orifice of the glue dispensing pipe (64), the heating sheets (68) heat the pipe orifice when the glue dispensing module (6) works, and the temperature of the heating sheets (68) is not enough to solidify the conductive adhesive.
6. The method for packaging a chip without bonding electronic tag according to claim 5, wherein: the bottom end face of the glue dispensing opening (54) is provided with a group of taper angles (55), the top ends of the taper angles (55) are flush with the glue dispensing pipe (64), the taper angles (55) are bent towards the inside of the lifting frame (52), and the bottom ends of the taper angles (55) are also provided with inclined planes close to the inner side of the lifting frame (52).
7. The method for packaging a chip without bonding electronic tag according to claim 6, wherein: the upper end of the glue dispensing opening (54) is hinged with a rotating plate (56), the shape of the rotating plate (56) is consistent with that of the glue dispensing opening (54), and the lower end of the rotating plate (56) is provided with a notch corresponding to the cone angle (55).
8. The method for packaging a chip without bonding electronic tag according to claim 1, wherein: the RFID antenna is characterized in that a micro-bump (21) is arranged on the side surface of the RFID chip (2), a micro-groove (11) is arranged at a corresponding position on the RFID antenna (1), and the shape of the micro-bump (21) is consistent with that of the micro-groove (11).
9. The method for packaging a chip without bonding electronic tag according to claim 8, wherein: four corners of the top end of the lifting frame (52) are provided with positioning frames (57) corresponding to the bottom end of the RFID chip (2) in shape, and when the RFID chip (2) is fixed on the positioning frames (57), a gap exists between the RFID chip (2) and the lifting frame (52).
10. The method for packaging a chip without bonding electronic tag according to claim 9, wherein: the gap between the positioning frame (57) and the lifting frame (52) is positioned at two sides of the lifting frame (52), and the position of the gap corresponds to the position of the micro convex point (21).
11. The method for packaging a chip without bonding electronic tag as claimed in claim 10, wherein: the micro convex points (21) are conical, the upper ends of the openings of the micro convex points (21) are large, the lower ends of the openings of the micro convex points are small, and the shapes of the micro grooves (11) correspond to those of the micro convex points (21).
CN202010887850.3A 2020-08-28 2020-08-28 Method for packaging non-bonding electronic tag chip Withdrawn CN112038241A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112893018A (en) * 2021-02-04 2021-06-04 深圳群芯微电子有限责任公司 Adhesive dispensing packaging device for automobile integrated circuit chip
CN113257719A (en) * 2021-06-15 2021-08-13 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof
CN113554136A (en) * 2021-08-13 2021-10-26 杭州中芯微电子有限公司 RFID wrist strap chip substrate jointing device
CN113705757A (en) * 2021-08-30 2021-11-26 杭州中芯微科技有限公司 Filter substrate processing device for RFID
CN115796683A (en) * 2022-12-02 2023-03-14 武汉万驰机械设备租赁有限公司 Electronic anti-counterfeit label production monitoring management system based on artificial intelligence

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112893018A (en) * 2021-02-04 2021-06-04 深圳群芯微电子有限责任公司 Adhesive dispensing packaging device for automobile integrated circuit chip
CN112893018B (en) * 2021-02-04 2021-12-21 深圳群芯微电子有限责任公司 Adhesive dispensing packaging device for automobile integrated circuit chip
CN113257719A (en) * 2021-06-15 2021-08-13 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof
CN113257719B (en) * 2021-06-15 2021-09-28 中科长光精拓智能装备(苏州)有限公司 Packaging device and packaging method thereof
CN113554136A (en) * 2021-08-13 2021-10-26 杭州中芯微电子有限公司 RFID wrist strap chip substrate jointing device
CN113554136B (en) * 2021-08-13 2022-04-01 杭州中芯微电子有限公司 RFID wrist strap chip substrate jointing device
CN113705757A (en) * 2021-08-30 2021-11-26 杭州中芯微科技有限公司 Filter substrate processing device for RFID
CN115796683A (en) * 2022-12-02 2023-03-14 武汉万驰机械设备租赁有限公司 Electronic anti-counterfeit label production monitoring management system based on artificial intelligence
CN115796683B (en) * 2022-12-02 2023-09-01 成都星盘科技有限公司 Electronic anti-counterfeit label production monitoring management system based on artificial intelligence

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