CN112024519A - Silicon chip box on convertible cleaning machine - Google Patents

Silicon chip box on convertible cleaning machine Download PDF

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Publication number
CN112024519A
CN112024519A CN202010902802.7A CN202010902802A CN112024519A CN 112024519 A CN112024519 A CN 112024519A CN 202010902802 A CN202010902802 A CN 202010902802A CN 112024519 A CN112024519 A CN 112024519A
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CN
China
Prior art keywords
box body
arc
wafer cassette
shaped
end cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010902802.7A
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Chinese (zh)
Other versions
CN112024519B (en
Inventor
魏运秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Danqing
Original Assignee
Ganzhou Yerun Automation Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ganzhou Yerun Automation Equipment Co ltd filed Critical Ganzhou Yerun Automation Equipment Co ltd
Priority to CN202010902802.7A priority Critical patent/CN112024519B/en
Publication of CN112024519A publication Critical patent/CN112024519A/en
Application granted granted Critical
Publication of CN112024519B publication Critical patent/CN112024519B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/06—Cleaning involving contact with liquid using perforated drums in which the article or material is placed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a silicon wafer box on an overturning type cleaning machine, which comprises a cylindrical box body, wherein a drawer frame is inserted in the box body and comprises two arc-shaped supporting plates with T-shaped sections, a plurality of arc-shaped slots are formed in the inner walls of the arc-shaped supporting plates, an outer end cover is fixed on the inner wall of one end of each arc-shaped supporting plate, and an inner end cover is fixed on the inner wall of the other end of each arc-shaped supporting plate; the novel drawer is characterized in that T-shaped guide rail grooves are formed in two side walls of the lower end of the box body, an arc-shaped supporting plate on the drawer frame is inserted into the guide rail grooves of the box body, a circular hole is formed in a sealing plate of the box body, an eccentric shaft is fixedly inserted into the inner end cover in an inserting mode, the eccentric shaft penetrates through the circular hole of the sealing plate to be formed into a connecting shaft, a magnetic locking rod is inserted into the connecting shaft, a limiting sleeve is fixedly arranged on an outer end inserting sleeve of the connecting shaft, and permanent magnet blocks opposite to the magnetic locking rod are fixedly inserted.

Description

Silicon chip box on convertible cleaning machine
Technical Field
The invention relates to the technical field of semiconductor cleaning equipment, in particular to a silicon wafer box on an overturning type cleaning machine.
Background
The integrated circuit chip made of the silicon chip is a conventional semiconductor product, and the silicon chip needs to be cleaned before the integrated circuit chip is made. The existing silicon wafer cleaning is firstly put into a liquid medicine tank for surface chemical treatment, and then is put into a cleaning tank (adopting pure water for cleaning, also called as a pure water tank) to clean the liquid medicine adhered to the surface. The specific cleaning method is to place the silicon wafer on a material frame (also called a silicon wafer box) bearing the silicon wafer, soak the material frame bearing the silicon wafer in a liquid medicine tank, lift the material frame, drain water, and then place the material frame in a pure water tank for soaking and cleaning. The stroke of the material frame falls, lifts and translates to the upper part of the next cleaning tank, the actions need to be repeated for many times, and when the last cleaning tank is reached, the material frame falls, lifts and translates to the upper part of the first cleaning tank, the stroke control of the material frame needs a plurality of control mechanisms to be matched and needs a complex control system, the structure is complex, and the manufacturing cost is high;
therefore, the material frame capable of being moved and turned over through the gear is provided, the material frame is turned over in the water tank to achieve cleaning, the material frame is designed, and the designed material frame has the advantages that the silicon wafer can be conveniently taken and placed, and the material frame can be prevented from being separated from the material frame in the turning process.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a silicon wafer box on an overturning type cleaning machine, which is convenient for taking and placing silicon wafers; meanwhile, the silicon wafer can not be separated from the silicon wafer box in the process of overturning the silicon wafer box.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a silicon wafer box on an overturning type cleaning machine comprises a cylindrical box body, wherein a sealing plate is formed at one end of the box body, a plurality of water passing grooves are formed in the outer wall of the box body, a drawer frame is inserted in the box body and comprises two arc-shaped supporting plates with T-shaped cross sections, a plurality of arc-shaped inserting grooves are formed in the inner walls of the arc-shaped supporting plates, a circular outer end cover is fixed on the inner wall of one end of each arc-shaped supporting plate, and a circular inner end cover is fixed on the inner wall of the other end of each arc-shaped supporting plate; t-shaped guide rail grooves are formed in two side walls of the lower end of the box body, an arc-shaped supporting plate on the drawer frame is inserted into the guide rail grooves of the box body, a circular hole is formed in a sealing plate of the box body, an eccentric shaft is inserted and fixed on an inner end cover, the eccentric shaft penetrates through the circular hole of the sealing plate to form a connecting shaft, a magnetic locking rod is inserted and sleeved on the connecting shaft, a limiting sleeve is fixed on an outer end inserting sleeve of the connecting shaft, and permanent magnet blocks opposite to the magnetic locking rod are inserted and fixed on the sealing plate around the circular hole; the lower extreme of box body is equipped with the connecting seat, and the connecting seat includes the spline housing, and the shaping has the gusset on the outer wall of spline housing, and the shaping has convex connecting plate on the gusset, and the connecting plate is fixed on the outer wall of box body.
Preferably, the water passing grooves are uniformly distributed in an annular shape around the central axis of the box body.
Preferably, the slots on the drawer frame are linearly and uniformly distributed on the arc-shaped support plate.
Preferably, the diameter of the inner end cover on the drawer frame is equal to that of the inner wall of the box body, the diameter of the outer end cover is smaller than that of the inner end cover, and the outer end face of the inner end cover is flush with the end face of the box body.
Preferably, the outer end cover is formed with a handle groove.
Preferably, the central moment from the permanent magnet block to the eccentric shaft is not more than the length of the magnetic lock rod, and the distance from the outer end of the magnetic lock rod to the eccentric shaft is less than the maximum distance from the inner wall of the circular hole to the eccentric shaft.
Preferably, a plurality of circular arc-shaped drain holes are formed in the box body sealing plate around the circular hole, and a water through hole opposite to the drain holes is formed in the inner end cover.
Preferably, the arc radius of the bottom surface of the slot of the arc-shaped support plate on the drawer frame is equal to the radius of the inner wall of the box body.
The invention has the beneficial effects that: the silicon chip box is convenient for taking and placing the silicon chip; meanwhile, the silicon wafer can not be separated from the silicon wafer box in the process of overturning the silicon wafer box.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a rear view of the present invention;
fig. 4 is a schematic perspective view of the drawer frame according to the present invention;
fig. 5 is a schematic top view of the drawer frame of the present invention.
In the figure: 1. a box body; 11. closing the plate; 12. a water trough; 13. a guide rail groove; 14. a circular hole; 15. a drain hole; 2. a drawer frame; 21. an arc-shaped support plate; 211. a slot; 22. an outer end cover; 221. 22, an outer end cover; (ii) a 23. An inner end cap; 231. a water through hole; 24. an eccentric shaft; 241. a connecting shaft; 25. a magnetic lock lever; 26. a limiting sleeve; 3. a connecting seat; 31. a spline housing; 32. a rib plate; 33. a connecting plate; 4. permanent magnet blocks.
Detailed Description
Example (b): as shown in fig. 1 to 5, a silicon wafer box on a turnover cleaning machine comprises a cylindrical box body 1, a sealing plate 11 is formed at one end of the box body 1, a plurality of water passing grooves 12 are formed on the outer wall of the box body 1, a drawer frame 2 is inserted into the box body 1, the drawer frame 2 comprises two arc-shaped support plates 21 with T-shaped cross sections, a plurality of arc-shaped slots 211 are formed in the inner walls of the arc-shaped support plates 21, a circular outer end cover 22 is fixed on the inner wall of one end of each arc-shaped support plate 21, and a circular inner end cover 23 is fixed on the inner wall of the other end of each arc-shaped support plate 21; t-shaped guide rail grooves 13 are formed in two side walls of the lower end of the box body 1, an arc-shaped support plate 21 on the drawer frame 2 is inserted into the guide rail grooves 13 of the box body 1, a circular hole 14 is formed in a sealing plate 11 of the box body 1, an eccentric shaft 24 is inserted and fixed on an inner end cover 23, the eccentric shaft 24 penetrates through the circular hole 14 of the sealing plate 11 to form a connecting shaft 241, a magnetic lock rod 25 is inserted and sleeved on the connecting shaft 241, a limit sleeve 26 is fixed on an outer end insertion sleeve of the connecting shaft 241, and permanent magnet blocks 4 opposite to the magnetic lock rod 25 are inserted and fixed on the sealing plate 11 around the circular hole 14; the lower end of the box body 1 is provided with a connecting seat 3, the connecting seat 3 comprises a spline sleeve 31, a rib plate 32 is formed on the outer wall of the spline sleeve 31, a circular arc-shaped connecting plate 33 is formed on the rib plate 32, and the connecting plate 33 is fixed on the outer wall of the box body 1.
The water trough 12 is uniformly distributed around the central axis of the box body 1 in a ring shape.
The slots 211 on the drawer frame 2 are linearly and uniformly distributed on the arc-shaped support plate 21.
The diameter of the inner end cover 23 on the drawer frame 2 is equal to that of the inner wall of the box body 1, the diameter of the outer end cover 22 is smaller than that of the inner end cover 23, and the outer end face of the inner end cover 23 is flush with the end face of the box body 1.
The outer end cap 22 is formed with a handle groove 221.
The central moment from the permanent magnet block 4 to the eccentric shaft 24 is not more than the length of the magnetic lock rod 25, and the distance from the outer end of the magnetic lock rod 25 to the eccentric shaft 24 is less than the maximum distance from the inner wall of the round hole 14 to the eccentric shaft 24.
A plurality of circular arc-shaped drainage holes 15 are formed on the sealing plate 11 of the box body 1 around the round hole 14, and a water through hole 231 opposite to the drainage holes 15 is formed on the inner end cover 23.
The arc radius of the bottom surface of the slot 211 of the arc-shaped support plate 21 on the drawer frame 2 is equal to the radius of the inner wall of the box body 1.
The working principle is as follows: the invention relates to a silicon wafer box on a turnover cleaning machine, which consists of a box body 1 and a drawer frame 2 in the box body 1, wherein the drawer frame 2 can be drawn out from the box body 1, so that the silicon wafers can be conveniently taken and placed in a slot 211 of an arc-shaped supporting plate 21;
after the slot 211 of the arc-shaped supporting plate 21 is filled with the silicon wafer, the drawer frame 2 is closed, the magnetic lock rod 25 on the drawer frame 2 is shifted, the magnetic lock rod 25 moves to abut against the permanent magnet 4, and then the drawer frame 2 cannot be pulled out from the box body 1, so that in the process of turning the silicon wafer box, the drawer frame 2 cannot be separated from the box body 1, and the silicon wafer cannot be separated from the box body 1.
The examples are intended to illustrate the invention, but not to limit it. The described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the present invention, and therefore, the scope of the appended claims should be accorded the full scope of the invention as set forth in the appended claims.

Claims (8)

1. The utility model provides a silicon wafer box on convertible cleaning machine, includes box body (1) of cylinder, and the one end shaping of box body (1) has shrouding (11), and the shaping has a plurality of water service grooves (12), its characterized in that on the outer wall of box body (1): a drawer frame (2) is inserted into the box body (1), the drawer frame (2) comprises two arc-shaped supporting plates (21) with T-shaped sections, a plurality of arc-shaped slots (211) are formed in the inner walls of the arc-shaped supporting plates (21), a circular outer end cover (22) is fixed on the inner wall of one end of each arc-shaped supporting plate (21), and a circular inner end cover (23) is fixed on the inner wall of the other end of each arc-shaped supporting plate (21); t-shaped guide rail grooves (13) are formed in two side walls of the lower end of the box body (1), an arc-shaped support plate (21) on the drawer frame (2) is inserted into the guide rail grooves (13) of the box body (1), a circular hole (14) is formed in a sealing plate (11) of the box body (1), an eccentric shaft (24) is inserted and fixed on an inner end cover (23), the eccentric shaft (24) penetrates through the circular hole (14) of the sealing plate (11) to form a connecting shaft (241), a magnetic locking rod (25) is inserted and sleeved on the connecting shaft (241), a limiting sleeve (26) is fixed on an outer end of the connecting shaft (241), and permanent magnet blocks (4) opposite to the magnetic locking rod (25) are inserted and fixed on the sealing plates (11) around the circular hole (14); the connecting box is characterized in that a connecting seat (3) is arranged at the lower end of the box body (1), the connecting seat (3) comprises a spline sleeve (31), rib plates (32) are formed on the outer wall of the spline sleeve (31), arc-shaped connecting plates (33) are formed on the rib plates (32), and the connecting plates (33) are fixed on the outer wall of the box body (1).
2. The wafer cassette of claim 1, wherein the wafer cassette comprises: the water passing grooves (12) are uniformly distributed in an annular shape around the central axis of the box body (1).
3. The wafer cassette of claim 2, wherein the wafer cassette comprises: the slots (211) on the drawer frame (2) are linearly and uniformly distributed on the arc-shaped supporting plate (21).
4. The wafer cassette of claim 1, wherein the wafer cassette comprises: the diameter of an inner end cover (23) on the drawer frame (2) is equal to that of the inner wall of the box body (1), the diameter of an outer end cover (22) is smaller than that of the inner end cover (23), and the outer end face of the inner end cover (23) is flush with the end face of the box body (1).
5. The wafer cassette of claim 4, wherein the wafer cassette comprises: a handle groove (221) is formed on the outer end cover (22).
6. The wafer cassette of claim 1, wherein the wafer cassette comprises: the central moment from the permanent magnet block (4) to the eccentric shaft (24) is not more than the length of the magnetic lock rod (25), and the distance from the outer end of the magnetic lock rod (25) to the eccentric shaft (24) is less than the maximum distance from the inner wall of the round hole (14) to the eccentric shaft (24).
7. The wafer cassette of claim 1, wherein the wafer cassette comprises: a plurality of circular arc-shaped drain holes (15) are formed in the sealing plate (11) of the box body (1) on the periphery of the round hole (14), and a water through hole (231) opposite to the drain holes (15) is formed in the inner end cover (23).
8. The wafer cassette of claim 1, wherein the wafer cassette comprises: the arc radius of the bottom surface of the slot (211) of the arc-shaped support plate (21) on the drawer frame (2) is equal to the radius of the inner wall of the box body (1).
CN202010902802.7A 2020-09-01 2020-09-01 Silicon chip box on convertible cleaning machine Active CN112024519B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010902802.7A CN112024519B (en) 2020-09-01 2020-09-01 Silicon chip box on convertible cleaning machine

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Application Number Priority Date Filing Date Title
CN202010902802.7A CN112024519B (en) 2020-09-01 2020-09-01 Silicon chip box on convertible cleaning machine

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CN112024519A true CN112024519A (en) 2020-12-04
CN112024519B CN112024519B (en) 2021-08-06

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113578849A (en) * 2021-09-27 2021-11-02 邳州众鑫机械有限公司 Special cleaning equipment for diode device
CN113909198A (en) * 2021-09-06 2022-01-11 邱献超 Cleaning device for wafer semiconductor processing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
JP2002176019A (en) * 2000-12-05 2002-06-21 Ses Co Ltd Work treating tank
CN1615256A (en) * 2002-01-16 2005-05-11 诚实公司 Wafer carrier door with form fitting mechanism cover
EP2088621A1 (en) * 2008-02-08 2009-08-12 Insotech OHG Substrate carrier
CN110211907A (en) * 2019-05-24 2019-09-06 上海提牛机电设备有限公司 A kind of chip cassette and wafer cleaning equipment
CN111081614A (en) * 2019-12-27 2020-04-28 上海至纯洁净***科技股份有限公司 Wafer bearing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
JP2002176019A (en) * 2000-12-05 2002-06-21 Ses Co Ltd Work treating tank
CN1615256A (en) * 2002-01-16 2005-05-11 诚实公司 Wafer carrier door with form fitting mechanism cover
EP2088621A1 (en) * 2008-02-08 2009-08-12 Insotech OHG Substrate carrier
CN110211907A (en) * 2019-05-24 2019-09-06 上海提牛机电设备有限公司 A kind of chip cassette and wafer cleaning equipment
CN111081614A (en) * 2019-12-27 2020-04-28 上海至纯洁净***科技股份有限公司 Wafer bearing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113909198A (en) * 2021-09-06 2022-01-11 邱献超 Cleaning device for wafer semiconductor processing
CN113909198B (en) * 2021-09-06 2023-09-01 天津晟龙科技发展有限公司 Cleaning device for wafer semiconductor processing
CN113578849A (en) * 2021-09-27 2021-11-02 邳州众鑫机械有限公司 Special cleaning equipment for diode device
CN113578849B (en) * 2021-09-27 2021-12-14 邳州众鑫机械有限公司 Special cleaning equipment for diode device

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Effective date of registration: 20210716

Address after: 317500 No.199, Yingqian village, Daxi Town, Wenling City, Taizhou City, Zhejiang Province

Applicant after: Sun Danqing

Address before: 341003 Ganzhou yerun automation equipment Co., Ltd. north of Gongyi Road, Hong Kong Industrial Park, Ganzhou Economic Development Zone, Ganzhou City, Jiangxi Province

Applicant before: Ganzhou yerun automation equipment Co.,Ltd.

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