CN112013969A - Non-contact temperature measuring device and temperature measuring method thereof - Google Patents
Non-contact temperature measuring device and temperature measuring method thereof Download PDFInfo
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- G—PHYSICS
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Abstract
The invention discloses a non-contact temperature measuring device, which comprises a microprocessor, a thermopile chip, a thermistor and a semiconductor refrigerator, wherein the thermopile chip receives infrared radiation of a radiation source to be measured and outputs a voltage signal; the thermistor is used for detecting the temperature of the cold end of the thermopile chip; the semiconductor refrigerator is used for refrigerating or heating the cold end of the thermopile chip and the thermistor; the microprocessor continuously detects the voltage value of the voltage signal output by the thermoelectric reactor core, and when the voltage value is detected to be zero, the temperature of the cold end of the thermoelectric reactor chip is detected through the thermistor, so that the temperature value of the radiation source to be detected can be detected and output. The influence of the environmental temperature is not considered, and the measurement precision is improved; the complexity of the production process and the production cost of the rear-end equipment can be reduced; can be applied to high-temperature or low-temperature environments.
Description
Technical Field
The invention relates to the technical field of infrared temperature sensors, in particular to a non-contact temperature measuring device and a temperature measuring method thereof.
Background
The temperature measurement method is generally classified into two methods, a contact method and a non-contact method. The temperature measurement by the contact method is tested according to the heat balance principle that two objects reach equal temperature after long-time contact, and the used temperature sensors are thermocouples and thermal resistors. The non-contact temperature measurement is to measure the temperature of an object by utilizing the principle that the thermal radiation energy of the object changes along with the temperature change, and mainly adopts radiation temperature measurement. The temperature of the measured object is sensed by the infrared temperature sensor in the form of infrared radiation, a voltage signal corresponding to the intensity of the heat radiation is generated and output, and after the operation of the microprocessor, the corresponding temperature value of the measured object is displayed on the display terminal. Therefore, the accuracy and stability of the non-contact infrared thermometer for detecting the temperature of the human body basically need to rely on an infrared temperature sensor.
The thermopile infrared temperature sensor can measure temperature by utilizing the Seebeck effect, conducting the radiation source to the hot end of the sensor in a thermal radiation mode, and obtaining the temperature of the radiation source by utilizing the measured thermopile thermoelectric force. When temperature measurement is needed, after the thermopile thermo-electromotive force is measured, the radiation source temperature can be obtained by looking up a table through a V-T table (namely a relation table of the output voltage of the thermopile and the temperature of a radiation body) which is simultaneously provided with the temperature sensor. Since the V-T table lookup requires the temperature of the cold end of the thermopile (ambient temperature) as a parameter, the temperature of the thermopile infrared temperature sensor (also referred to as the ambient temperature) becomes critical in the temperature measurement process.
However, due to different environmental temperature influences and the accuracy of a V-T tabulation, the existing method for measuring the temperature of the infrared thermopile sensor adopts a temperature compensation method or an interpolation method to calculate so as to improve the overall accuracy, but the compensation values have large differences under different environmental temperatures and have batch or individual differences, so that the two methods cause high system errors or poor consistency.
Disclosure of Invention
The invention aims to provide a non-contact temperature measuring device and a temperature measuring method thereof, wherein the cold end of a thermopile chip is scanned from low temperature to high temperature by utilizing the refrigeration and heating functions of a semiconductor refrigerator, and when the temperature difference between the cold end of the thermopile chip and the hot end of radiation of a radiation source to be measured is zero, the temperature of the semiconductor refrigerator at the moment is measured to indirectly obtain the temperature of the radiation source, so that the influence of the environmental temperature is avoided, the measurement precision and the calculation complexity are improved, particularly, the measurement calculation is completely linearized by replacing a thermistor with a platinum resistor with high linearity, and the linearization error of an interpolation method is eliminated.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a non-contact temperature measuring device is characterized in that: including microprocessor, thermopile chip, thermistor and semiconductor cooler, the thermopile chip links to each other with microprocessor's first signal input part, thermistor links to each other with microprocessor's second signal input part, semiconductor cooler with microprocessor's control signal output part links to each other, and is specific:
the thermopile chip is used for receiving infrared radiation of a radiation source to be detected and outputting a voltage signal;
the thermistor is used for detecting the temperature of the cold end of the thermopile chip;
the semiconductor refrigerator is used for refrigerating or heating the cold end of the thermopile chip and the thermistor;
the microprocessor is used for controlling the semiconductor refrigerator to refrigerate or heat the cold end of the thermopile chip after receiving the voltage signal output by the thermoelectric reactor core, continuously detecting the voltage value of the voltage signal output by the thermoelectric reactor core, and detecting the temperature of the cold end of the thermoelectric reactor chip through the thermistor when detecting that the voltage value is zero, so that the temperature value of the radiation source to be detected can be detected and output.
Further, the microprocessor includes a zero-crossing detection module, a digital-to-analog conversion module, an electronic reversing switch, a logic calculation module and a data output interface, the thermopile chip is connected with a first signal input end of the logic calculation module through the zero-crossing detection module, the thermistor is connected with a second signal input end of the logic calculation module through the digital-to-analog conversion module, a control signal output end of the logic calculation module is connected with the semiconductor refrigerator through the electronic reversing switch, and a data output end of the logic calculation module is connected with the data output interface, wherein:
the zero-crossing detection module is used for carrying out zero-crossing detection on the voltage value of the output voltage signal of the thermoelectric reactor core and sending a trigger signal to the logic calculation module when the voltage value is zero;
the logic calculation module is used for outputting a control signal to the digital-to-analog conversion module and the electronic reversing switch according to a trigger signal sent by the zero-crossing detection module;
the electronic reversing switch is used for controlling the semiconductor refrigerator to refrigerate or heat the cold end of the thermopile chip according to the control signal;
the digital-to-analog conversion module is used for driving the thermistor to detect the cold end temperature of the thermopile chip according to the control signal;
the data output interface is used for outputting a measured temperature value signal of the radiation source to be measured.
Further, the zero-crossing detection module adopts a comparator circuit to detect whether the voltage value of the voltage signal output by the thermoelectric core crosses zero in the process of changing from negative to positive or from positive to negative, and sends a trigger signal to the logic calculation module when the voltage value crosses zero.
Further, the data output interface adopts an I2C interface.
Furthermore, the device also comprises a ceramic tube shell, wherein the center of the ceramic tube shell is provided with an accommodating cavity, the bottom of the accommodating cavity is provided with the microprocessor and the semiconductor refrigerator, and the upper surface of the semiconductor refrigerator is provided with the thermopile chip and the thermistor.
Furthermore, the hot end of the thermopile chip is arranged towards the opening direction of the accommodating cavity, the cold end of the thermopile chip is in contact with the refrigerating surface of the semiconductor refrigerator, and the temperature sensing end of the thermistor is in contact with the refrigerating surface of the semiconductor refrigerator.
Further, still be provided with the filter above the ceramic tube, this filter through sealed silica gel with the upside edge sealing connection of ceramic tube.
Furthermore, the ceramic tube shell is composed of a top support, an intermediate body and a base which are sequentially connected from top to bottom, the accommodating cavity penetrates through the top support and the intermediate body and extends to the base, the accommodating cavity is of a stepped structure with the size decreasing from top to bottom, and the microprocessor and the semiconductor refrigerator are arranged on the base.
The scheme also provides a temperature measuring method of the non-contact temperature measuring device, which comprises the following steps:
and 5, the microprocessor obtains and outputs a temperature value of the radiation source to be detected according to the measured cold end temperature of the thermopile chip.
Furthermore, in the scheme, the microprocessor performs zero-crossing detection on the voltage value of the voltage signal output by the thermoelectric reactor core through a zero-crossing detection module, and the zero-crossing detection module detects whether the voltage value of the voltage signal crosses zero or not in the process of changing from negative to positive or from positive to negative and sends a trigger signal when the voltage value crosses zero.
The invention has the following remarkable effects:
1. the refrigerating and heating functions of the semiconductor refrigerator are utilized, when the hot end of the thermopile chip receives thermal radiation output thermoelectric electromotive force of a radiation source to be detected, the cold end of the thermopile chip is refrigerated or heated through the semiconductor refrigerator, zero-crossing detection is carried out on the voltage value of the voltage signal output by the thermopile core, scanning from low temperature to high temperature is realized on the cold end of the thermopile chip, when the temperature difference between the cold end of the thermopile chip and the hot end of the radiation source to be detected is zero, the temperature of the semiconductor refrigerator at the moment is measured by controlling the thermistor as a trigger signal, the temperature of the radiation source to be detected can be indirectly obtained, the influence of the environment temperature is not considered, the influence of the environment temperature on the temperature measurement of the radiation source to be detected is avoided, and.
2. Compared with the traditional technology in which the temperature of the radiation source to be measured is obtained by calculating by using the measured thermoelectric electromotive force of the thermopile and inquiring a V-T table of the temperature sensor, the temperature-adjusting calibration is not needed during use, so that a matched measuring circuit and a matched calculating circuit are simpler, the complexity of the production process and the production cost of rear-end equipment can be reduced, and the production efficiency is improved;
3. the influence of the environmental temperature on the measurement precision is not considered during the use, the use environment is wider, the device can be suitable for high-temperature or low-temperature environments, and the economic applicability is strong.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a bottom view of the present invention;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
FIG. 6 is a schematic view of the internal structure of the present invention;
FIG. 7 is a top view of FIG. 6;
fig. 8 is a schematic block diagram of the circuit of the present invention.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
As shown in fig. 1 to 7, a non-contact temperature measuring device comprises a ceramic tube 1, a filter 2, a microprocessor 3, a thermopile chip 4, a thermistor 5 and a semiconductor refrigerator 6, wherein a holding cavity 7 is formed in the center of the ceramic tube 1, the microprocessor 3 and the semiconductor refrigerator 6 are arranged at the bottom of the holding cavity 7, the thermopile chip 4 and the thermistor 5 are arranged on the upper surface of the semiconductor refrigerator 6, the hot end of the thermopile chip 4 is arranged towards the opening direction of the holding cavity 7, the cold end of the thermopile chip 4 is in contact with the refrigerating surface of the semiconductor refrigerator 6, the temperature sensing end of the thermistor 5 is in contact with the refrigerating surface of the semiconductor refrigerator 6, and the cold end of the thermopile chip 4 is in contact with the refrigerating surface of the semiconductor refrigerator 6, so that the temperature sensing end of the thermistor 5 can pass through the refrigerating surface of the semiconductor refrigerator 6 with the cold end of the thermopile chip 4 The quick heat balance of people the top of ceramic tube 1 still sets up filter 2, this filter 2 through sealed silica gel 8 with the upside edge sealing connection of ceramic tube 1.
Preferably, the ceramic package 1 is composed of a top support 11, an intermediate 12 and a base 13 which are sequentially connected from top to bottom, the accommodating cavity 7 penetrates through the top support 11 and the intermediate 12 and extends to the base 13, a routing bonding pad is arranged on the intermediate 12 and can be interconnected with the bonding pads of the microprocessor 3, the thermopile chip 4, the thermistor 5 and the semiconductor refrigerator 6 through a gold wire bonding process, the accommodating cavity 7 is in a stepped structure with the size gradually reduced from top to bottom, and the microprocessor 3 and the semiconductor refrigerator 6 are arranged on the base 13.
At least three metallized grooves 14 are formed on the left and the right of the ceramic tube shell 1, and the interconnection between the intermediate body 12 and pins 15 on the back of the base 13 is realized through the metallized grooves 14, so that the interconnection between the whole package and the outside is realized.
The principle of the temperature measuring device in this embodiment is shown in fig. 8, wherein the thermopile chip 4 is connected to a first signal input terminal of the microprocessor 3, the thermistor 5 is connected to a second signal input terminal of the microprocessor 3, and the semiconductor refrigerator 6 is connected to a control signal output terminal of the microprocessor 3, specifically: the thermopile chip 4 is used for receiving infrared radiation of a radiation source to be detected and outputting a voltage signal; the thermistor 5 is used for detecting the temperature of the cold end of the thermopile chip 4; the semiconductor refrigerator 6 is used for refrigerating or heating the cold end of the thermopile chip 4 and the thermistor 5; the microprocessor 3 is used for controlling the semiconductor refrigerator to refrigerate or heat the cold end of the thermopile chip 4 after receiving the voltage signal output by the thermopile chip 4, and meanwhile, continuously detecting the voltage value of the voltage signal output by the thermopile core, and when detecting that the voltage value is zero, detecting the temperature of the cold end of the thermopile chip 4 through the thermistor 5, namely, detecting the temperature value of the detected radiation source and outputting the temperature value.
As can also be seen from fig. 8, the microprocessor 3 includes a zero-crossing detection module, a digital-to-analog conversion module, an electronic reversing switch, a logic computation module and a data output interface, the thermopile chip 4 is connected to a first signal input end of the logic computation module through the zero-crossing detection module, the thermistor 5 is connected to a second signal input end of the logic computation module through the digital-to-analog conversion module, a control signal output end of the logic computation module is connected to the semiconductor refrigerator 6 through the electronic reversing switch, and a data output end of the logic computation module is connected to the data output interface, where:
the zero-crossing detection module is used for carrying out zero-crossing detection on the voltage value of the output voltage signal of the thermoelectric reactor core and sending a trigger signal to the logic calculation module when the voltage value is zero;
the logic calculation module is used for outputting a control signal to the digital-to-analog conversion module and the electronic reversing switch according to a trigger signal sent by the zero-crossing detection module;
the electronic reversing switch is used for controlling the semiconductor refrigerator 6 to refrigerate or heat the cold end of the thermopile chip 4 according to the control signal;
the digital-to-analog conversion module is used for driving the thermistor 5 to detect the cold end temperature of the thermopile chip 4 according to the zero-crossing trigger signal;
the data output interface is used for outputting a measured temperature value signal of the radiation source to be measured.
In this example, the zero-crossing detection module employs a comparator circuit to detect whether the voltage value of the voltage signal output by the thermoelectric core crosses zero during the change from negative to positive or from positive to negative, and sends a trigger signal to the logic calculation module when the voltage value crosses zero; the data output interface adopts an I2C interface; the thermistor 5 adopts a PT1000 high-precision platinum resistor.
In the specific implementation process, when infrared radiation emitted by an external radiation source irradiates on the thermopile chip 4, the thermopile chip 4 generates a tiny voltage due to the temperature difference between the cold end and the hot end, and the voltage meets the Stefan-Boltzmann law:
where σ is the proportionality coefficient, TRadiation sourceIs the temperature of the radiation source, TEnvironment(s)Is the ambient temperature. Since σ is a constant, T is calculatedRadiation sourceTwo parameters must be known: vThermal reactorAnd TEnvironment(s)If the ambient temperature at that time is known (which can be measured by the thermistor 5 incorporated in the sensor), V is detectedThermal reactorA value of (d); then T in the above formulaRadiation sourceCan be obtained by solving this equation. This is the conventional non-contact temperature measurement principle.
In the traditional non-contact temperature measurement, because the ambient temperature needs to be measured for calculation every time, and the formula is a 4-time amplification function relationship, the calculation amount is large, so that a V-T table is usually made to facilitate table lookup to obtain the temperature, namely, the function is converted into a data table mode from an analytical expression, and the temperature measurement operation is conveniently realized by programming. However, the data table is a rounded inaccurate value, and when the calculation formula is calculated by using the data therein, the formula itself has an error, and the error becomes very large after the calculation due to the 4-degree functional relationship. In addition, the V-T table is measured according to a specific product, but it is impractical to measure the V-T table for each product in batch production, so that the V-T table of one product is used to represent the V-T tables of the group products in batch production, and the table look-up calculation error caused by the individual difference is inevitable.
Thus, observe
This publicationEquation, it can be seen that if we can control TEnvironment(s)Of such a size that TRadiation source＝TEnvironment(s)Then at this time VThermal reactorIs zero. Namely, a new temperature measuring method is provided: control TEnvironment(s)Changes from low temperature to high temperature, detects the voltage value of the voltage signal output by the thermopile chip 4, and when the voltage value meets V in the detection processThermal reactorWhen 0 is generated, the temperature of the radiation source is measured by measuring the resistance of the thermistor 5, which represents the ambient temperature.
Control TEnvironment(s)This is achieved by means of a semiconductor cooler 6(TEC), which can be cooled or heated (by electronic changeover of the switch to change the direction of the drive current). In the process of cooling and heating the thermopile chip 4 by using the semiconductor refrigerator 6, as the thermopile chip 4 is continuously cooled or heated by the semiconductor refrigerator 6, the temperature difference between the hot end and the cold end thereof will gradually become smaller, and the temperature difference electromotive force output by the thermopile chip 6 will change from negative to positive or from positive to negative. In this case, a zero-cross detection module formed by a comparator circuit is used to detect VThermal reactorWhether zero crossing is carried out in the process from negative to positive or from positive to negative, when the voltage value of the voltage signal is detected to be zero crossing, the voltage value is taken as a trigger signal, and the micro refrigerator 3 can obtain T through measuring the resistance value of the thermistor 5 (namely measuring the temperature of the cold end of the thermopile chip 4)Environment(s)And then the temperature of the radiation source to be detected is calculated.
In the temperature measuring process, whether the output voltage signal of the thermopile chip 4 is zero-crossing or not is only required to be detected, so whether the TEC driving current is linear or not and how large the TEC driving current is, the calculation method and the calculation precision are not influenced, and the requirements are not made. If the temperature detection time is shorter, it is sufficient to set the current value to be larger. Meanwhile, the refrigeration or heating capacity of the TEC can be realized by controlling the magnitude of the driving current of the TEC, so that the T can be changed in an accelerated mannerEnvironment(s)Thus achieving the purpose of rapid temperature measurement.
Based on the discussion of the temperature measurement principle, the embodiment further provides a temperature measurement method of the non-contact temperature measurement device, which includes the following steps:
and 5, the microprocessor 3 obtains the temperature value of the radiation source to be detected according to the measured cold end temperature of the thermopile chip 4 and outputs the temperature value to be displayed through the display device.
Further, in the present embodiment, the microprocessor 3 performs zero-crossing detection on the voltage value of the voltage signal output by the thermoelectric reactor core through a zero-crossing detection module, and the zero-crossing detection module detects whether the voltage value of the voltage signal crosses zero in the process of changing from negative to positive, and sends a trigger signal when the voltage value crosses zero.
The invention utilizes the refrigeration and heating functions of the semiconductor refrigerator 6, when the hot end of the thermopile chip 4 receives the thermal radiation output thermoelectric electromotive force of the radiation source to be detected, the semiconductor refrigerator 6 is used for refrigerating or heating the cold end of the thermopile chip 4, and zero-crossing detection is carried out on the voltage value of the voltage signal output by the thermopile chip 4, so that the cold end of the thermopile chip 4 can realize scanning from low temperature to high temperature, when the temperature difference between the cold end and the hot end of the radiation source to be detected is zero, the temperature of the semiconductor refrigerator 6 at the moment is measured by the thermistor 5 controlled by taking the temperature as a trigger signal, and the temperature of the radiation source to be detected can be indirectly obtained, thereby the influence of the environment temperature is not considered, the influence of the environment temperature on the temperature measurement of the radiation source to be detected is avoided, the measurement precision.
The technical solution provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A non-contact temperature measuring device is characterized in that: including microprocessor, thermopile chip, thermistor and semiconductor cooler, the thermopile chip links to each other with microprocessor's first signal input part, thermistor links to each other with microprocessor's second signal input part, semiconductor cooler with microprocessor's control signal output part links to each other, and is specific:
the thermopile chip is used for receiving infrared radiation of a radiation source to be detected and outputting a voltage signal;
the thermistor is used for detecting the temperature of the cold end of the thermopile chip;
the semiconductor refrigerator is used for refrigerating or heating the cold end of the thermopile chip and the thermistor;
the microprocessor is used for controlling the semiconductor refrigerator to refrigerate or heat the cold end of the thermopile chip after receiving the voltage signal output by the thermoelectric reactor core, continuously detecting the voltage value of the voltage signal output by the thermoelectric reactor core, and detecting the temperature of the cold end of the thermoelectric reactor chip through the thermistor when detecting that the voltage value is zero, so that the temperature value of the radiation source to be detected can be detected and output.
2. The non-contact temperature measuring device of claim 1, wherein: the microprocessor comprises a zero-crossing detection module, a digital-to-analog conversion module, an electronic reversing switch, a logic calculation module and a data output interface, the thermopile chip is connected with a first signal input end of the logic calculation module through the zero-crossing detection module, the thermistor is connected with a second signal input end of the logic calculation module through the digital-to-analog conversion module, a control signal output end of the logic calculation module is connected with the semiconductor refrigerator through the electronic reversing switch, and a data output end of the logic calculation module is connected with the data output interface, wherein:
the zero-crossing detection module is used for carrying out zero-crossing detection on the voltage value of the output voltage signal of the thermoelectric reactor core and sending a trigger signal to the logic calculation module when the voltage value is zero;
the logic calculation module is used for outputting a control signal to the digital-to-analog conversion module and the electronic reversing switch according to a trigger signal sent by the zero-crossing detection module;
the electronic reversing switch is used for controlling the semiconductor refrigerator to refrigerate or heat the cold end of the thermopile chip according to the control signal;
the digital-to-analog conversion module is used for driving the thermistor to detect the cold end temperature of the thermopile chip according to the control signal;
the data output interface is used for outputting a measured temperature value signal of the radiation source to be measured.
3. The non-contact temperature measuring device according to claim 2, wherein: the zero-crossing detection module adopts a comparator circuit to detect whether the voltage value of the voltage signal output by the thermoelectric reactor core crosses zero in the process of changing from negative to positive or from positive to negative, and sends a trigger signal to the logic calculation module when the voltage value crosses zero.
4. The non-contact temperature measuring device according to claim 2, wherein: the data output interface adopts an I2C interface.
5. The non-contact temperature measuring device according to claims 1 to 4, wherein: the thermoelectric module is characterized by further comprising a ceramic tube shell, wherein an accommodating cavity is formed in the center of the ceramic tube shell, the microprocessor and the semiconductor refrigerator are arranged at the bottom of the accommodating cavity, and the thermopile chip and the thermistor are arranged on the upper surface of the semiconductor refrigerator.
6. The non-contact temperature measuring device of claim 5, wherein: the hot end of the thermopile chip is arranged towards the opening direction of the accommodating cavity, the cold end of the thermopile chip is in contact with the refrigerating surface of the semiconductor refrigerator, and the temperature sensing end of the thermistor is in contact with the refrigerating surface of the semiconductor refrigerator.
7. The non-contact temperature measuring device of claim 5, wherein: the filter is arranged above the ceramic tube shell and is connected with the upper side edge of the ceramic tube shell in a sealing mode through sealing silica gel.
8. The non-contact temperature measuring device of claim 5, wherein: the ceramic tube shell is composed of a top support, an intermediate body and a base which are sequentially connected from top to bottom, the accommodating cavity penetrates through the top support and the intermediate body and extends to the base, the accommodating cavity is of a stepped structure with the size decreasing from top to bottom, and the microprocessor and the semiconductor refrigerator are arranged on the base.
9. A temperature measuring method of a non-contact temperature measuring device is characterized by comprising the following steps:
step 1, receiving infrared radiation of a radiation source to be detected by adopting a hot end of a thermopile chip, and outputting a voltage signal;
step 2, after receiving the voltage signal output by the thermoelectric reactor core, the microprocessor controls the semiconductor refrigerator to refrigerate or heat the cold end of the thermoelectric reactor chip;
step 3, in the process of refrigerating or heating the cold end of the thermopile chip, the microprocessor performs zero-crossing detection on the voltage value of the voltage signal output by the thermopile core;
step 4, when the voltage value of the voltage signal is detected to be zero, the microprocessor detects the temperature of the cold end of the thermopile chip through the thermistor;
and 5, the microprocessor obtains and outputs a temperature value of the radiation source to be detected according to the measured cold end temperature of the thermopile chip.
10. The temperature measuring method of the non-contact temperature measuring device according to claim 9, wherein: the microprocessor performs zero-crossing detection on the voltage value of the voltage signal output by the thermoelectric reactor core through a zero-crossing detection module, and the zero-crossing detection module detects whether the voltage value of the voltage signal crosses zero in the process of changing from negative to positive or from positive to negative and sends a trigger signal when the voltage value crosses zero.
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| CN (1) | CN112013969A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113588110A (en) * | 2021-08-02 | 2021-11-02 | 上海东软载波微电子有限公司 | Correction method and device of temperature measuring equipment |
| CN114441059A (en) * | 2022-02-07 | 2022-05-06 | 江苏锐地测控有限公司 | Non-contact microwave temperature measurement method |
| CN115598373A (en) * | 2022-10-24 | 2023-01-13 | 南方电网数字电网研究院有限公司（Cn） | Peltier effect-based wind speed and direction sensor, detection device and electronic equipment |
| CN116124728A (en) * | 2023-02-24 | 2023-05-16 | 上海烨映微电子科技股份有限公司 | Thermopile infrared detector, preparation method thereof and NDIR detection system |
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| CN202940243U (en) * | 2012-10-15 | 2013-05-15 | 重庆航伟光电科技有限公司 | Semiconductor optical detector with coaxial package |
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| JP2002214046A (en) * | 2001-01-23 | 2002-07-31 | Bio Ekoonetto:Kk | Non-contact temperature sensor and infrared clinical thermometer therefor |
| CN202940243U (en) * | 2012-10-15 | 2013-05-15 | 重庆航伟光电科技有限公司 | Semiconductor optical detector with coaxial package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113588110A (en) * | 2021-08-02 | 2021-11-02 | 上海东软载波微电子有限公司 | Correction method and device of temperature measuring equipment |
| CN114441059A (en) * | 2022-02-07 | 2022-05-06 | 江苏锐地测控有限公司 | Non-contact microwave temperature measurement method |
| CN115598373A (en) * | 2022-10-24 | 2023-01-13 | 南方电网数字电网研究院有限公司（Cn） | Peltier effect-based wind speed and direction sensor, detection device and electronic equipment |
| CN116124728A (en) * | 2023-02-24 | 2023-05-16 | 上海烨映微电子科技股份有限公司 | Thermopile infrared detector, preparation method thereof and NDIR detection system |
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Application publication date: 20201201 |