CN112005326B - Multilayer structure element with external contact - Google Patents

Multilayer structure element with external contact Download PDF

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Publication number
CN112005326B
CN112005326B CN201980028624.5A CN201980028624A CN112005326B CN 112005326 B CN112005326 B CN 112005326B CN 201980028624 A CN201980028624 A CN 201980028624A CN 112005326 B CN112005326 B CN 112005326B
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conductor
base body
conductor lines
conductor line
structural element
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CN112005326A (en
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M·科尼
T·威佩
F·林纳
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

A multilayer component (10) with external contacting comprises a base body (100) having a first and a second internal electrode (110, 120) and having an external contact (200) for external contacting of the internal electrodes (110, 120). The outer contact (200) comprises at least two strip-shaped first conductor lines (210) arranged on the first surface (0100 a) of the base body (100), wherein the first conductor lines (210) are each electrically connected to one of the first inner electrodes (110). Furthermore, the outer contact (200) comprises at least two strip-shaped second conductor lines (220) arranged on the second surface (0100 b) of the main body (100), wherein the second conductor lines (220) are each electrically connected to one of the second inner electrodes (120).

Description

Multilayer structure element with external contact
Technical Field
The invention relates to a multilayer component, in particular a ceramic current-blocking capacitor, having an external contact for contacting an internal electrode of the multilayer component.
Background
The multilayer component can be embodied, for example, as a ceramic capacitor, in particular as a power capacitor. Such a multilayer structure element comprises a base body made of a piezoelectric material, in which an electrode layer is arranged. The inner electrode layers are led out alternately at different sides of the base body. In order to apply a voltage to the electrode layer from the outside, a contact must be provided.
The base body of the multilayer structure element has piezoelectric expansion in addition to thermal expansion when a voltage is applied to the internal electrode. The piezoelectric material of the base body generally expands in the stacking direction in which the electrode layers are stacked inside the base body and contracts in the plane of the inner electrode. The contacts of the multilayer structure element must be such that the thermal expansion differences occurring between the piezoelectric ceramic of the base body and the external contacts and the piezoelectric expansion of the piezoelectric ceramic only slightly impair the fatigue strength of the multilayer structure element.
Furthermore, the multilayer component and in particular the outer contact should have a very high current-carrying capacity, for example of several hundred amperes. Furthermore, the multilayer structure element and in particular the outer contact have a high resistance to high temperatures, for example up to approximately 200 ℃.
Disclosure of Invention
The object of the invention is to provide a multilayer component having an external contact, wherein the external contact has a high current-carrying capacity and a high temperature resistance, and wherein the fatigue strength of the multilayer component is influenced only to a small extent by the difference in thermal expansion between the material of the base body of the multilayer component and the external contact and by the piezoelectric expansion of the base body.
In the present invention, an embodiment of a multilayer component is described which has an external contact with high current-carrying capacity and high temperature resistance and which has a good thermal expansion match with the material of the base body of the multilayer component.
According to one possible embodiment, the multilayer component comprises a base body having first and second internal electrodes arranged alternately and electrically insulated from one another in the interior of the base body and an external contact for external contacting of the internal electrodes. The outer contact has at least two strip-shaped first conductor lines which are arranged on the first surface of the base body. The first conductor lines are electrically connected to one of the first inner electrodes, respectively. The outer contact furthermore comprises at least two strip-shaped second conductor tracks which are arranged on the second surface of the base body. The second surface of the substrate is opposite to the first surface of the substrate. The second conductor lines are electrically connected to one of the second inner electrodes, respectively.
The first conductor line is mechanically disconnected from the second inner electrode, and the second conductor line is mechanically disconnected from the first inner electrode.
The substrate may be constructed from a piezoelectric material, for example from PLZT (lead lanthanum zirconium trititanate) ceramic.
In one embodiment of the multilayer component, the strip-shaped first conductor tracks are arranged spaced apart from one another on the first surface of the base body. The second conductor lines are arranged spaced apart from one another on the second surface of the base body. By means of this strip-shaped arrangement of the first and second conductor tracks on opposite surfaces of the multilayer component, a two-dimensional relief of the outer contact is achieved, so that the piezo-mechanical movement of the base body only slightly influences the stability of the outer contact.
Furthermore, the special shaping of the first and second conductor lines ensures that the remaining expansion differences between the material of the base body of the multilayer component and the first and second conductor lines of the outer contact are compensated by the bending of the first and second conductor lines, respectively. For this purpose, the first and second conductor lines each have a first surface section which is fastened to the respective surface of the base body and a second surface section which is arranged at a distance from the first or second surface of the base body. The respective second surface sections of the first and second conductor lines may have a punch or a curvature oriented away from the first or second surface of the base body. The stamped-out sections in the individual strip-shaped conductor tracks ensure that the first and second conductor tracks can follow thermal or piezoelectric expansions of the base body without damaging the outer contacts.
In order to ensure a high current-carrying capacity of the outer contact, the first and second conductor tracks are each formed as a sufficiently thick composite sheet (CIC composite sheet) from first and second layers of copper, between which a third layer of invar steel is arranged. According to one advantageous embodiment, the copper/invar/copper composite sheet has the following thickness ratios: first and second layers of 20% copper composite board and a third layer of 60% invar.
By means of the embodiment of the outer contact as a CIC composite plate with a thickness ratio of 20/60/20 of the first layer made of copper, the intermediate layer made of invar steel and the second layer made of copper, the coefficient of thermal expansion in the transverse direction of the CIC composite plate, which is 7 to 8 ppm/k, is well matched to the coefficient of thermal expansion in the transverse direction of the substrate, which is, for example, about 8 to 10 ppm/k of PLZT (lead lanthanum zirconium trititanate) ceramic.
The high temperature resistance of the outer contact can be further improved by means of a special connection layer arranged between the base body and the first and second conductor tracks. The connection layer is established using sintered silver technology. This joining technique is thermomechanical and extremely stable in terms of thermal cycling.
As a connection layer, a porous layer made of silver, a so-called sintered silver layer, is arranged between the base body and the first and second conductor tracks. The high temperature resistance of the outer contact is ensured by connecting the first and second conductor tracks to a sprayed layer arranged on the surface of the ceramic base body by means of a porous connecting layer made of silver.
Drawings
The invention is explained in more detail below with the aid of the drawings, which show embodiments of the invention.
In the drawings:
fig. 1 shows an embodiment of a multilayer structure element with external contacting of internal electrodes in a perspective view of a first surface of the multilayer structure element;
FIG. 2 is a top view of a second surface of a multilayer structure element having external contacts to internal electrodes;
FIG. 3A is an enlarged view of one embodiment of an external contact on a first surface of a substrate of a multi-layer structural component;
FIG. 3B is an enlarged view of one embodiment of an external contact on a second surface of the base of the multi-layer structural component; and is
FIG. 4 is a lateral view of one embodiment of a multi-layered structural element with external contacts.
Detailed Description
Fig. 1 shows a perspective view of a multilayer structural element 10. Fig. 1 shows a perspective view of the first surface O100a of the base body 100 of the multilayer component 10. Fig. 2 shows a top view of the opposite second surface O100b of the substrate 100 of the multilayer structural element 10. The multilayer component 10 can be embodied, for example, as a capacitor, for example, as a ceramic, galvanic barrier capacitor (Ultrabar).
The multilayer structure element 10 comprises a base body 100 having first and second internal electrodes 110, 120 which are electrically insulated from one another and are arranged alternately in the interior of the base body 100. The substrate 100 has, in particular, a piezoelectric material 130, which exhibits an expansion when a voltage is applied. The first and second internal electrodes 110 and 120 are alternately arranged along the stacking direction S in the piezoelectric material 130. The piezoelectric material 130 is in particular arranged between one of the first internal electrodes 110 and one of the second internal electrodes 120, respectively.
The multilayer structure element 10 has an outer contact 200 for making external contact to the inner electrodes 110 and 120. The outer contact 200 includes at least two strip-shaped first conductor lines 210 arranged on the first surface O100a of the base body 100. The first conductor lines 210 are electrically connected to one of the first inner electrodes 110, respectively. The first conductor line 210 is mechanically disconnected from the second inner electrode 120. Furthermore, the outer contact 200 comprises at least two strip-shaped second conductor lines 220, which are arranged on the second surface O100b of the base body 100, as shown in fig. 2. The second conductor lines 220 are electrically connected to one of the second inner electrodes 120, respectively. The second conductor line 220 is mechanically disconnected from the first inner electrode 110.
As shown in fig. 1, the first conductor lines 210 are arranged on the first surface O100a of the base body 100 in a strip-like manner and spaced apart from one another. Fig. 2 shows second conductor tracks 220 which are arranged in strip form and spaced apart from one another on the second surface O100b of the base body 100. By means of such a strip-shaped arrangement of the first and second conductor lines 210, 220 on the first and second surfaces of the base body 100, in particular, length variations of the base body in the direction of the width B of the base body 100 can be compensated without damage occurring at the outer contact 200 in such an expansion of the base body.
The base body 100 of the multilayer component can comprise a ceramic material, for example PLZT ceramic. The ceramic base (ceramic stopper) may have a depth of 7 mm, a height of 27 mm and a width of 80 mm. According to one possible advantageous embodiment, the plurality of strip-shaped conductor lines 210 and 220 each have a width of between 6 mm and 8 mm, preferably approximately 7 mm.
Fig. 3A shows a cross-section of a portion of the multilayer structural element 10 with a portion of an external contact 200 arranged on the first surface O100a of the substrate 100. Fig. 3B shows a portion of the multilayer structure element 10 with a portion of the external contact 200 arranged on the second surface O100B of the substrate 100.
In one embodiment of the multilayer component, the first conductor lines 210 each have a first surface section 211 which is attached to the first surface O100a of the base body 100. Furthermore, the first conductor lines 210 each have a second surface section 212 arranged at a distance from the first surface O100a of the base body 100. The second conductor tracks 220 also each have a first surface section 221, which is fastened to the second surface O100b of the base body 100, in each case in a manner corresponding to the first conductor tracks. The second conductor tracks 220 furthermore each have a second surface portion 222 which is arranged at a distance from the second surface O100b of the main body 100.
As shown in fig. 3A, the first surface sections 211 of the first conductor lines 210 are each arranged parallel to the first surface O100a of the base body 100. The second surface sections 212 of the first conductor lines 210 each have a stamped or curved portion 213 oriented away from the first surface O100a of the base body 100.
As shown in fig. 3B, the first surface sections 221 of the second conductor tracks 220 are each arranged parallel to the second surface O200B of the main body 100. The second surface sections 222 of the second conductor lines 220 each have a punch or a curvature 223 oriented away from the second surface O100b of the base body 100.
According to one possible embodiment of the multilayer component, the region B210 of the first conductor track 210, which region B210 contains one of the first surface sections 211 and one of the second surface sections 212, is designed such that the first surface section 211 comprises approximately two thirds of the length of the region B210 of the first conductor track 210 and the second surface section 212 comprises approximately one third of the length of the region B210 of the first conductor track 210.
Referring to fig. 3B, the region B220 of the second conductor track 220, which region B includes one of the first surface sections 221 and one of the second surface sections 222, may be designed accordingly such that the first surface section 221 comprises approximately two thirds of the length of the region B220 of the second conductor track 220 and the second surface section 222 comprises approximately one third of the length of the region B220 of the second conductor track 220.
As can be seen from fig. 3A and 3B, the first surface section 211 of the first conductor line 210, which is fastened to the first surface O100a of the base body 100, or the first surface section 221 of the second conductor line 220, which is fastened to the second surface O100B of the base body 100, each have a length of 2 mm. The second surface portion 212 of the stamped or bent-out portion 213 of the first conductor line 210, which is respectively formed so as to be oriented away from the first surface O100a of the base body 100, or the second surface portion 222 of the stamped or bent-out portion 223 of the second conductor line 220, which is respectively formed so as to be oriented away from the second surface O100b of the base body 100, has a length of 1 mm, for example. The punch/ camber 213, 223 of the second surface section 212, 222 of the first and second conductor line 210, 220 may have a depth of about 1 mm, for example.
According to one possible embodiment, the stamped parts 213 of the strip-shaped first conductor lines 210 are arranged offset from one another in adjacent regions of the first conductor lines 210. As can be seen in fig. 3A, the stamped portions 213 on adjacent strips of the first conductor line 210 are arranged, for example, with a deviation of 1.5 mm from one another.
The stamped-out parts 223 of the strip-shaped second conductor lines 220 may be arranged offset from one another in adjacent regions of the second conductor lines 220. Fig. 3B shows an offset of the punch-outs 223 in the strip-shaped second conductor lines 220 arranged side by side. As can be seen in fig. 3B, the stamped parts 223 are arranged on adjacent strips of the second conductor track 220, for example with a deviation of 1.5 mm from one another.
By arranging the first conductor lines 210 arranged side by side offset from each other and by arranging the second conductor lines 220 arranged side by side offset from each other, all the internal electrodes of the multilayer structure element can be reliably contacted.
By fixing about two thirds of the length of the conductor lines, for example 2 mm of the length of the strip-shaped conductor lines 210, 220, at each strip-shaped conductor line at the first or second surface O100a, O100b of the base body 100 and by having a stamped-out 213, 223 of only one third of the length of the strip-shaped conductor lines 210, 220, it is possible to expand the strip-shaped conductor lines in the stacking direction S shown in fig. 1 without damage occurring at the outer contact 200 in the case of expansion of the piezoelectric base body 100 when a voltage is applied to the inner electrode.
As can be seen in fig. 3A, each second surface section 212 of the first conductor line 210 is arranged between two first surface sections 211 of the first conductor line 210. Each first surface section 211 of the first conductor line 210 is arranged between two second surface sections 212 of the first conductor line 210. Each second surface portion 222 of the second conductor track 220 is arranged between two first surface portions 221 of the second conductor track 220. Each first surface section 221 of the second conductor track 220 is arranged between two second surface sections 222 of the second conductor track 220.
According to one possible embodiment, which is shown in fig. 3A and 3B, the first conductor track 210 and the second conductor track 220 are each formed as a composite sheet made of a first layer 231 made of copper and a second layer 232 made of copper. A third layer 233 of invar is arranged between the first and second layers 231, 232. The composite panel may for example have a thickness ratio of 20/60/20, that is to say a thickness ratio of 20% first layer 231 of copper, 60% third layer 233 of invar and 20% second layer 232 of copper.
By means of such a copper/invar/copper (CIC) composite sheet, a high current-carrying capacity of the outer contact, which can be several hundred amperes, for example, is ensured. Furthermore, in this construction with a composite sheet having a thickness ratio of 20/60/20 of the first layer 231 made of copper, the third layer 233 made of invar and the second layer 232 made of copper, the coefficient of thermal expansion in the transverse direction of the CIC composite sheet is well matched to that of the base body 100, for example of PLZT ceramic. In the embodiment shown in fig. 3A and 3B, the first or second conductor track 210, 220 has a total thickness of, for example, 0.7 mm, wherein the third layer 233 of invar has a thickness of 0.42 mm.
According to one possible embodiment, a porous layer of silver (sintered silver) can be provided as a connecting layer 300 between the base body 100 and the first conductor track 210 or the second conductor track 220. The high temperature resistance of outer contact 200 at base body 100 is ensured by such a connection layer, since porous connection layer 300 is extremely flexible due to its sponge-like structure when different expansions of base body 100 and outer contact 200 are involved.
In order to connect the outer contact 200, that is to say the strip-shaped first and second conductor tracks 210, 220, to the first surface O100a or the second surface O100b of the base body 100, a thin layer of metallization may be applied to the first surface O100a or the second surface O100b of the base body 100. The metallized thin layer can be, for example, a layer structure made of chromium-nickel-silver. For example, a thin layer of chromium, for example a chromium layer having a thickness of 0.3 μm, is applied as an adhesion promoter directly to the piezoceramic of the base body 100. On which a layer of nickel is applied, for example, also with a thickness of about 0.3 μm, as a diffusion barrier. Subsequently, a silver layer, for example, with a thickness of 0.5 μm, is applied to the nickel layer. The layer structure made of chromium-nickel-silver can be applied as a sprayed layer to the first surface O100a or to the second surface O100b of the base body.
A silver layer can be applied, for example, galvanically to the bottom side of the first conductor track 210 or the second conductor track 220, in particular to the bottom side of the respective CIC composite sheet. On the bottom side of the respective CIC composite sheet of the first and second conductor tracks, the silver and silver layers of the chromium-nickel-silver layer structure are subsequently sintered into a porous silver layer in a sintering process. This porous silver layer forms the tie layer 300. A porous silver sponge is thus produced between the nickel layer, the chromium-nickel-silver layer structure and the copper layer 231 of the first and second conductor tracks 210, 220, which silver sponge has good electrical conductivity and is not damaged on account of its flexibility in the piezoelectric expansion of the main body 100 or on account of different thermal expansion properties between the main body 100 and the outer contact 200. Even after a long temperature cycle, the degradation effect can hardly be determined.
Fig. 4 shows a cross section of the multilayer structure element 10. Each first conductor line 210 has a contact section 214 for contacting the respective first conductor line 210. Each second conductor track 220 likewise has a contact section 224 for contacting the respective second conductor track 220. Contact sections 214 and 224 are also shown in fig. 1 and 2.
In the embodiment of the multilayer component 10 shown in the figures, the contact section 214 of the first conductor line 210 and the contact section 224 of the second conductor line 220 are bent in such a way that the contact sections 214 and 224 of the first and second conductor lines 210 and 220 lie in one plane. This allows a flush fastening of the contact sections 214, 224 to the flat connection contact. In order to screw the outer contact 200 to the connecting contact, a contact hole 215 is provided in the contact section 214 of the conductor line 210 and a contact hole 225 is provided in the contact section 224 of the conductor line 220.
In the embodiment of the multilayer component 10 shown in fig. 4, the contact sections 214 and 224 are arranged, for example, centrally with respect to the main body 100. The tightening point is centrally aligned with the stop/base 100. In order to achieve a flush fastening on the flat contact, the direction of the indentation for one of the first and second conductor lines must be partially rotated. Instead of the central arrangement of the contact sections 214 and 224 shown in fig. 4, the contact sections can be offset laterally with respect to the center of the base body in another possible embodiment of the multilayer structure element.
List of reference numerals
10. Multilayer structure element
100. Substrate
110. A first internal electrode
120. Second inner electrode
130. Piezoelectric material
200. External contact
210. First conductor line
220. Second conductor line
211. 221 first face section
212. 222 second face section
213. 223 stamping part
214. 224 contact section
215. 225 contact hole
300. And (7) connecting the layers.

Claims (11)

1. Multilayer structural element with external contacts, comprising:
a base body (100) having first and second internal electrodes (110, 120) which are arranged alternately and electrically insulated from one another in the interior of the base body,
an outer contact (200) for making external contact to the inner electrode (110, 120),
-wherein the outer contact (200) comprises at least two strip-shaped first conductor lines (210) arranged on a first surface (O100 a) of the base body (100),
-wherein the first conductor lines (210) are each electrically connected to one of the first inner electrodes (110),
-wherein the outer contact (200) comprises at least two strip-shaped second conductor lines (220) arranged on a second surface (O100 b) of the base body (100),
-wherein the second conductor lines (220) are electrically connected with one of the second inner electrodes (120), respectively,
-wherein the first conductor line and the second conductor line have stamped parts (213, 223) which are arranged offset to one another in adjacent regions of the first conductor line (210) or the second conductor line (220),
-wherein the first conductor lines (210) each have a first surface section (211) which is fixed in a direct contact manner at a first surface (O100 a) of the base body (100),
-wherein the first conductor lines (210) each have a second surface section (212) arranged spaced apart from the first surface (O100 a) of the base body (100),
-wherein the second conductor lines (220) each have a first surface section (221) which is fixed in a direct contact manner at a second surface (O100 b) of the base body (100),
-wherein the second conductor lines (220) each have a second surface section (222) arranged spaced apart from the second surface (O100 b) of the base body (100);
wherein the first conductor track (210) and the second conductor track (220) are each designed as a composite sheet consisting of a first and a second layer (231, 232) of copper, between which a third layer (233) of invar is arranged;
wherein, the composite board has the following thickness proportion: a first and a second layer (231, 232) of 20% copper and a third layer (233) of 60% invar;
wherein a porous layer made of silver is arranged as a connection layer (300) between the base body (100) and the first and second conductor lines (210, 220).
2. The multilayer structural element according to claim 1,
-wherein the first conductor line (210) is mechanically decoupled from the second inner electrode (120),
-wherein the second conductor line (220) is mechanically decoupled from the first inner electrode (110).
3. The multilayer structural element according to any one of claims 1 or 2,
-wherein the first conductor lines (210) are arranged spaced apart from each other on a first surface (O100 a) of the base body (100),
-wherein the second conductor lines (220) are arranged spaced apart from each other on a second surface (O100 b) of the substrate (100).
4. The multilayer structural element according to claim 1,
-wherein the first face sections (211) of the first conductor lines (210) are each arranged parallel to a first surface (O100 a) of the base body (100),
-wherein the first face sections (221) of the second conductor lines (220) are each arranged parallel to the second surface (O100 b) of the base body (100),
-wherein the second face sections (212) of the first conductor lines (210) each have a stamped part (213) oriented away from the first surface (O100 a) of the base body (100),
-wherein the second surface sections (222) of the second conductor lines (220) each have a stamped portion (223) oriented away from the second surface (O100 b) of the base body (100).
5. The multilayer structural element according to claim 3,
wherein each second surface section (212, 222) of the first and second conductor lines (210, 220) is arranged between two first surface sections (211, 221) of the first and second conductor lines (210, 220).
6. The multilayer structural element according to claim 2,
-wherein a region (B210, B220) of the first and second conductor lines (210, 220) comprising one of the first face sections (211, 221) and one of the second face sections (212, 222) is configured such that one of the first face sections (211, 221) comprises two thirds of the length of the region (B210, B220) of the first and second conductor lines (210, 220) and such that one of the second face sections (212, 222) comprises one third of the length of the region (B210, B220) of the first and second conductor lines (210, 220).
7. The multilayer structural element according to claim 4,
-wherein the stamped parts (213) are arranged offset to each other in adjacent regions of the first conductor line (210),
-wherein the stamped parts (223) are arranged offset to each other in adjacent regions of the second conductor line (220).
8. The multilayer structural element according to claim 1 or 2,
-wherein the matrix (100) has a piezoelectric material (130),
-wherein the first and second inner electrodes (110, 120) are arranged alternately in a stacking direction (S) in the piezoelectric material (130), wherein the piezoelectric material (130) is arranged between one of the first inner electrodes (110) and one of the second inner electrodes (120), respectively.
9. The multilayer structural element according to claim 8,
-wherein the first conductor line (210) is arranged on the first surface (O100 a) of the base body (100) such that a respective longitudinal direction of the first conductor line (210) is arranged along the stacking direction (S),
-wherein the second conductor line (220) is arranged on the second surface (O100 b) of the base body (100) such that a respective longitudinal direction of the second conductor line (220) is arranged along the stacking direction (S).
10. Multilayer structural element according to claim 1 or 2,
wherein each first conductor line (210) has a contact section (214) for contacting the respective first conductor line (210),
wherein each second conductor line (220) has a contact section (224) for contacting the respective second conductor line (220),
-wherein the contact section (214) of the first conductor line (210) and the contact section (224) of the second conductor line (220) are bent such that the contact sections (214, 224) of the first and second conductor lines (210, 220) lie in one plane.
11. The multilayer structural element according to claim 1 or 2,
wherein the multilayer structure element (10) is configured as a capacitor.
CN201980028624.5A 2018-02-27 2019-02-15 Multilayer structure element with external contact Active CN112005326B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018104459.3 2018-02-27
DE102018104459.3A DE102018104459A1 (en) 2018-02-27 2018-02-27 Multi-layer component with external contacting
PCT/EP2019/053838 WO2019166242A1 (en) 2018-02-27 2019-02-15 Multilayer component with external contact

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Publication Number Publication Date
CN112005326A CN112005326A (en) 2020-11-27
CN112005326B true CN112005326B (en) 2023-04-04

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