CN112004340A - Laminating method of flexible circuit board - Google Patents
Laminating method of flexible circuit board Download PDFInfo
- Publication number
- CN112004340A CN112004340A CN202010637257.3A CN202010637257A CN112004340A CN 112004340 A CN112004340 A CN 112004340A CN 202010637257 A CN202010637257 A CN 202010637257A CN 112004340 A CN112004340 A CN 112004340A
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- circuit board
- flexible circuit
- outer layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a laminating method of a flexible circuit board, wherein the flexible circuit board comprises an inner-layer flexible circuit board and N outer-layer flexible circuit boards which are sequentially laminated on the inner-layer flexible circuit board, N is a positive integer, and the laminating method comprises the following steps: setting an identification point; building a workbench; the flexible circuit board is added with charges; the inner layer flexible circuit board is aligned with the workbench; and the outer layer flexible circuit board is aligned with the inner layer flexible circuit board. Compared with the prior art, the laminating method of the flexible circuit board adopts the image control system to position, and the inner layer flexible circuit board and the outer layer flexible circuit board are fixed through electrostatic adsorption, so that the alignment precision is greatly improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of flexible circuit boards, in particular to a laminating method of a flexible circuit board.
[ background of the invention ]
With the rapid development of the communication industry, the sizes of a plurality of electronic products are smaller and smaller, and the number of layers of flexible circuit boards inside the electronic products is higher and higher. In the manufacturing process of the multilayer flexible circuit board, the alignment precision among layers is an important parameter, which directly determines the value of the via hole annular ring and plays an important role in the high density of the circuit typesetting. In addition, the alignment precision also directly affects the yield of the multi-layer flexible circuit board.
Adopt tool cover PIN folded sheet before traditional multilayer flexible line way board's multilayer pressfitting, fix a position through the tool hole between PIN nail and the ectonexine, retreat PIN again after the location is accomplished and carry out the pre-compaction.
However, in the above-mentioned over-layer manufacturing of the multilayer flexible wiring board, the PIN is sleeved, which causes deviation; the action of withdrawing the PIN may cause the upper and lower layers to deviate; during mass production, the expansion and shrinkage of the inner layer and the outer layer can be caused by the dynamic wave, so that the expansion and shrinkage of the inner layer and the outer layer and the jig have certain difference, and further the high density of the line is limited.
Therefore, it is necessary to provide a new method for stacking flexible circuit boards to solve the above problems.
[ summary of the invention ]
The invention aims to provide a laminating method of a flexible circuit board with high alignment precision.
In order to achieve the above object, the present invention provides a method for stacking flexible circuit boards, wherein the flexible circuit board includes an inner flexible circuit board and N outer flexible circuit boards sequentially stacked on the inner flexible circuit board, N is a positive integer, the method comprising the steps of:
setting an identification point: respectively arranging inner layer identification points and outer layer identification points for alignment on the inner layer flexible circuit board and the outer layer flexible circuit board according to a preset rule;
building a workbench: building a workbench for bearing the flexible circuit board, and adding charges with specific polarity to the workbench by using an electrostatic generator;
the flexible circuit board is added with electric charges: adding charges to the inner flexible circuit board and the outer flexible circuit board through the electrostatic generator respectively, so that the polarity of the charges added to the inner flexible circuit board is opposite to that of the charges added to the workbench;
the inner layer flexible circuit board is aligned with the workbench: recognizing the inner layer identification points on the inner layer flexible circuit board by adopting a camera control system, carrying the inner layer flexible circuit board to the workbench through a mechanical arm, aligning the inner layer identification points with the specific position of the workbench, and fixing the inner layer flexible circuit board on the workbench through electrostatic adsorption;
the outer layer flexible circuit board is aligned with the inner layer flexible circuit board; the camera shooting control system recognizes the outer identification points on the outer flexible circuit board, the outer flexible circuit board is moved to be stacked on the inner flexible circuit board through a mechanical arm, the outer identification points and the inner identification points are aligned, and the outer flexible circuit board and the inner flexible circuit board are fixed through electrostatic adsorption to form a stacked board of the flexible circuit board.
Preferably, when the outer layer flexible circuit board includes at least two layers, the step of applying a charge to the flexible circuit board further includes: enabling the charge polarities of the two adjacent outer-layer flexible circuit boards which are stacked on the inner-layer flexible circuit board to be opposite;
the step of aligning the inner layer flexible circuit board and the workbench further comprises: the camera shooting control system identifies the outer layer identification points on the outer layer flexible circuit board of the next layer, the outer layer flexible circuit board of the next layer is moved to the outer layer flexible circuit board of the last layer through a mechanical arm, the outer layer identification points of the outer layer flexible circuit board of the next layer and the outer layer identification points of the outer layer flexible circuit board of the last layer are aligned, and the adjacent two layers of the outer layer flexible circuit boards are fixed through electrostatic adsorption to form a laminated board.
Preferably, the side length of the flexible circuit board ranges from 150mm to 200 mm.
Preferably, the inner layer flexible circuit board comprises a first copper layer fixed on the workbench and a first base material layer attached and fixed on one side, far away from the workbench, of the first copper layer; the outer layer flexible circuit board is fixed in including pasting the second substrate layer of first substrate layer and pasting to establish and be fixed in the second substrate layer and keep away from the second copper layer of first substrate layer one side.
Preferably, the inner layer identification point is a through hole penetrating through the inner layer flexible circuit board, the outer layer identification point is a through hole penetrating through the outer layer flexible circuit board, and the aperture of each of the inner layer identification point and the outer layer identification point is 0.5 mm-0.1 mm.
Preferably, the inner layer identification point is a blind hole formed by etching the first copper layer, the outer layer identification point is a blind hole formed by etching the second copper layer, and the pore diameters of the inner layer identification point and the outer layer identification point are both 0.5 mm-0.1 mm.
Preferably, the outer layer flexible circuit board and the inner layer flexible circuit board are both rectangular, the inner layer identification points comprise a first inner layer identification point and a second inner layer identification point, and the horizontal distance between the first inner layer identification point and the second inner layer identification point is 130 mm-180 mm; the outer layer identification points comprise a first outer layer identification point and a second outer layer identification point, and the horizontal distance between the first outer layer identification point and the second outer layer identification point is 130 mm-180 mm.
Preferably, first inlayer identification point with second inlayer identification point all includes two, two first inlayer identification point and two second inlayer identification point all about the central point of inlayer flexible line way board is the symmetry setting, and two first inlayer identification point and two the central point of second inlayer identification point all is located on the diagonal line of inlayer flexible line way board.
Preferably, the first outer layer identification point and the second outer layer identification point comprise two, two the first outer layer identification point and two the second outer layer identification point all about the central point of the outer layer flexible circuit board is symmetrically arranged, and two the central points of the first outer layer identification point and two the second outer layer identification point are all located on the diagonal line of the outer layer flexible circuit board.
Compared with the prior art, the method for laminating the flexible circuit boards adopts an image control system to respectively identify the inner layer identification point of the inner layer flexible circuit board, the outer layer identification point of the outer layer flexible circuit board and the specific position of the workbench, conveys the inner layer flexible circuit board to the workbench through a mechanical arm, and aligns the inner layer identification point and the specific position of the workbench; and then, with the inner layer identification points on the inner layer flexible circuit board as targets, moving the outer layer flexible circuit board to be stacked on the inner layer flexible circuit board through a manipulator, and aligning the outer layer identification points and the inner layer identification points. The method utilizes the image control system to carry out positioning, has high positioning precision and does not have positioning deviation. On the other hand, because the electrostatic action will the inlayer flexible line way board with the fine absorption of outer flexible line way board is in the same place, has avoided the off normal that the correlation technique used deformation hole and PIN nail to combine to cause, has also avoided the off normal that probably causes when moving back PIN, and the counterpoint precision improves by a wide margin to realize the flexible line way board of high accuracy.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a block flow diagram of a method for stacking flexible circuit boards according to the present invention;
FIG. 2 is a schematic structural diagram of each layer of flexible circuit board and workbench according to the present invention;
FIG. 3 is a schematic structural diagram of the marking points of each layer of the flexible circuit board according to the present invention;
fig. 4 is a schematic structural diagram corresponding to each step in the method for laminating the flexible printed circuit board according to the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 4, the present invention provides a method for stacking flexible circuit boards 100, where the flexible circuit board 100 includes an inner layer flexible circuit board 1 and N outer layer flexible circuit boards 2 sequentially stacked on the inner layer flexible circuit board 1, where N is a positive integer, and the method includes the following steps
Step S1, setting identification point 3: an inner layer identification point 31 and an outer layer identification point 32 for alignment are respectively arranged on the inner layer flexible circuit board 1 and the outer layer flexible circuit board 2 according to a preset rule;
step S2, building the workbench 4: a workbench 4 for bearing the flexible circuit board 100 is built, and an electrostatic generator 5 is utilized to add electric charges with specific polarity to the workbench 4
Step S3, the flexible wiring board 100 adds electric charge: and adding charges to the inner layer flexible circuit board 1 and the outer layer flexible circuit board 2 respectively through the static generator 5, so that the polarity of the charges added to the inner layer flexible circuit board 1 is opposite to the polarity of the charges added to the workbench 4.
Step S4, aligning the inner layer flexible circuit board 1 with the workbench 4: adopt camera control system discernment on the inlayer flexible line way board 1 inlayer identification point 31 will through the manipulator inlayer flexible line way board 1 transport extremely workstation 4, and make inlayer identification point 31 with the specific position of workstation 4 counterpoints, just inlayer flexible line way board 1 is fixed in through electrostatic adsorption workstation 4.
Step S5, aligning the outer layer flexible circuit board 2 with the inner layer flexible circuit board 1; use on the flexible circuit board of inlayer 1 inlayer identification point 31 is the target, through camera control system discerns on the outer flexible circuit board 2 outer identification point 32 will through the manipulator outer flexible circuit board 2 moves to overlapping and locates on the flexible circuit board of inlayer 1, and makes outer identification point 32 with inlayer identification point 31 counterpoints, just outer flexible circuit board 2 with inlayer flexible circuit board 1 is fixed in order to form through electrostatic adsorption the lamination of flexible circuit board 100.
In the lamination method of the flexible printed circuit 100, an image control system is adopted to respectively identify the inner layer identification point 31 of the inner layer flexible printed circuit 1, the outer layer identification point 32 of the outer layer flexible printed circuit 2 and the specific position of the workbench 4, the inner layer flexible printed circuit 1 is carried to the workbench 4 through a manipulator, and the inner layer identification point 31 is aligned with the specific position of the workbench 4; and then, with the inner layer identification points 31 on the inner layer flexible circuit board 1 as targets, moving the outer layer flexible circuit board 2 to be stacked on the inner layer flexible circuit board 1 through a manipulator, and aligning the outer layer identification points 32 with the inner layer identification points 31. The method utilizes the image control system to carry out positioning, has high positioning precision and does not have positioning deviation. On the other hand, because the electrostatic interaction will inlayer flexible line way board 1 with the fine absorption of outer flexible line way board 2 is in the same place, has avoided the off normal that the correlation technique used deformation hole and PIN nail to combine to cause, has also avoided the off normal that probably causes when moving back PIN, and the counterpoint precision improves by a wide margin to realize high accuracy flexible line way board 100. Of course, the above sequence of steps is not exclusive, and for example, the sequence of steps S1 and S2 may be interchanged (i.e., the table 4 is charged first, and the flexible circuit board is provided with the identification point), which is all feasible.
It should be noted that, when the outer layer flexible printed circuit 2 includes at least two layers, the step of adding charges to the flexible printed circuit 100 further includes: the charge polarities of the two adjacent outer layer flexible circuit boards 2 which are overlapped on the inner layer flexible circuit board 1 are opposite; the alignment step of the inner layer flexible circuit board 1 and the workbench 4 further comprises: the camera shooting control system identifies the outer layer identification points 32 on the outer layer flexible circuit board 2 of the next layer, the outer layer flexible circuit board of the next layer is moved to the outer layer flexible circuit board of the previous layer through a mechanical arm, the outer layer identification points of the outer layer flexible circuit board of the next layer and the outer layer identification points of the outer layer flexible circuit board of the previous layer are aligned, and the adjacent two layers of the outer layer flexible circuit board 2 are fixed through electrostatic adsorption to form a laminated board.
In this embodiment, the side length of the flexible printed circuit board is in a range of 150mm to 200mm, and the flexible printed circuit board 100 can be applied to a small device due to the size range.
Specifically, the inner-layer flexible circuit board 1 comprises a first copper layer 11 fixed on the workbench 4 and a first base material layer 12 attached and fixed on one side, far away from the workbench 4, of the first copper layer 11; the outer layer flexible circuit board 2 comprises a second base material layer 21 fixed on the first base material layer 12 in an attached mode and a second copper layer 22 fixed on the second base material layer 21 and far away from one side of the first base material layer 12 in an attached mode.
Preferably, in order to enable the image control system to identify the identification point more quickly and accurately, in this embodiment, the inner layer identification point 31 is a through hole penetrating through the inner layer flexible printed circuit board 1, and the outer layer identification point 32 is a through hole penetrating through the outer layer flexible printed circuit board 2. Of course, without being limited thereto, the inner layer identification point 31 may also be a blind hole formed by etching the first copper layer 11, the outer layer identification point 32 may also be a blind hole formed by etching the second copper layer 22, and the aperture of each of the inner layer identification point 31 and the outer layer identification point 32 is 0.5mm to 0.1 mm.
Referring to fig. 3, the outer layer flexible printed circuit 2 and the inner layer flexible printed circuit 1 are both rectangular, the inner layer identification point 31 includes a first inner layer identification point 311 and a second inner layer identification point 312, and the horizontal distance between the first inner layer identification point 311 and the second inner layer identification point 312 is 130mm to 180 mm; the outer layer identification point 32 comprises a first outer layer identification point 321 and a second outer layer identification point 322, and the horizontal distance between the first outer layer identification point 321 and the second outer layer identification point 321 is 130 mm-180 mm.
Further, the first inner layer identification point 311 and the second inner layer identification point 312 all include two, two the first inner layer identification point 311 and two the second inner layer identification point 312 all about the central point of the inner layer flexible printed circuit 1 is symmetrically arranged, and two the first inner layer identification point 311 and two the central point of the second inner layer identification point 312 are all located on the diagonal line of the inner layer flexible printed circuit 1. First outer layer identification point 321 with second outer layer identification point 322 all includes two, two first outer layer identification point 321 and two second outer layer identification point 322 all about the central point of outer flexible line way board 2 is the symmetry setting, and two first outer layer identification point 321 and two the central point of second outer layer identification point 322 all is located on the diagonal of outer flexible line way board 2.
Compared with the prior art, the method for laminating the flexible circuit boards adopts an image control system to respectively identify the inner layer identification point of the inner layer flexible circuit board, the outer layer identification point of the outer layer flexible circuit board and the specific position of the workbench, conveys the inner layer flexible circuit board to the workbench through a mechanical arm, and aligns the inner layer identification point and the specific position of the workbench; and then, with the inner layer identification points on the inner layer flexible circuit board as targets, moving the outer layer flexible circuit board to be stacked on the inner layer flexible circuit board through a manipulator, and aligning the outer layer identification points and the inner layer identification points. The method utilizes the image control system to carry out positioning, has high positioning precision and does not have positioning deviation. On the other hand, because the electrostatic action will the inlayer flexible line way board with the fine absorption of outer flexible line way board is in the same place, has avoided the off normal that the correlation technique used deformation hole and PIN nail to combine to cause, has also avoided the off normal that probably causes when moving back PIN, and the counterpoint precision improves by a wide margin to realize the flexible line way board of high accuracy.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A method for laminating a flexible circuit board comprises the following steps:
setting an identification point: respectively arranging inner layer identification points and outer layer identification points for alignment on the inner layer flexible circuit board and the outer layer flexible circuit board according to a preset rule;
building a workbench: building a workbench for bearing the flexible circuit board, and adding charges with specific polarity to the workbench by using an electrostatic generator;
the flexible circuit board is added with electric charges: adding charges to the inner flexible circuit board and the outer flexible circuit board through the electrostatic generator respectively, so that the polarity of the charges added to the inner flexible circuit board is opposite to that of the charges added to the workbench;
the inner layer flexible circuit board is aligned with the workbench: recognizing the inner layer identification points on the inner layer flexible circuit board by adopting a camera control system, carrying the inner layer flexible circuit board to the workbench through a mechanical arm, aligning the inner layer identification points with the specific position of the workbench, and fixing the inner layer flexible circuit board on the workbench through electrostatic adsorption;
the outer layer flexible circuit board is aligned with the inner layer flexible circuit board; the camera shooting control system recognizes the outer identification points on the outer flexible circuit board, the outer flexible circuit board is moved to be stacked on the inner flexible circuit board through a mechanical arm, the outer identification points and the inner identification points are aligned, and the outer flexible circuit board and the inner flexible circuit board are fixed through electrostatic adsorption to form a stacked board of the flexible circuit board.
2. The method of claim 1, wherein when the outer layer flexible printed circuit includes at least two layers, the step of applying an electric charge to the flexible printed circuit further comprises: enabling the charge polarities of the two adjacent outer-layer flexible circuit boards which are stacked on the inner-layer flexible circuit board to be opposite;
the step of aligning the inner layer flexible circuit board and the workbench further comprises: the camera shooting control system identifies the outer layer identification points on the outer layer flexible circuit board of the next layer, the outer layer flexible circuit board of the next layer is moved to the outer layer flexible circuit board of the last layer through a mechanical arm, the outer layer identification points of the outer layer flexible circuit board of the next layer and the outer layer identification points of the outer layer flexible circuit board of the last layer are aligned, and the adjacent two layers of the outer layer flexible circuit boards are fixed through electrostatic adsorption to form a laminated board.
3. The method of claim 1, wherein the flexible printed circuit board has a side length in a range of 150mm to 200 mm.
4. The method for laminating the flexible circuit board according to claim 3, wherein the inner layer flexible circuit board comprises a first copper layer fixed on the workbench and a first base material layer attached and fixed on one side of the first copper layer away from the workbench; the outer layer flexible circuit board is fixed in including pasting the second substrate layer of first substrate layer and pasting to establish and be fixed in the second substrate layer and keep away from the second copper layer of first substrate layer one side.
5. The method according to claim 4, wherein the inner layer identification point is a through hole penetrating through the inner layer flexible printed circuit, the outer layer identification point is a through hole penetrating through the outer layer flexible printed circuit, and the inner layer identification point and the outer layer identification point both have a hole diameter of 0.5mm to 0.1 mm.
6. The method according to claim 4, wherein the inner layer mark points are blind holes formed by etching the first copper layer, the outer layer mark points are blind holes formed by etching the second copper layer, and the diameters of the inner layer mark points and the outer layer mark points are both 0.5mm to 0.1 mm.
7. The method according to claim 3, wherein the outer layer flexible printed circuit board and the inner layer flexible printed circuit board are rectangular, the inner layer identification points comprise a first inner layer identification point and a second inner layer identification point, and the horizontal distance between the first inner layer identification point and the second inner layer identification point is 130mm to 180 mm; the outer layer identification points comprise a first outer layer identification point and a second outer layer identification point, and the horizontal distance between the first outer layer identification point and the second outer layer identification point is 130 mm-180 mm.
8. The method according to claim 7, wherein the number of the first inner layer identification points and the number of the second inner layer identification points are two, wherein the two first inner layer identification points and the two second inner layer identification points are symmetrically arranged with respect to a center point of the inner layer flexible printed circuit, and center points of the two first inner layer identification points and the two second inner layer identification points are located on diagonal lines of the inner layer flexible printed circuit.
9. The method according to claim 7, wherein the first outer layer identification points and the second outer layer identification points each include two, wherein the two first outer layer identification points and the two second outer layer identification points are symmetrically arranged with respect to a center point of the outer layer flexible printed circuit, and the center points of the two first outer layer identification points and the two second outer layer identification points are located on diagonal lines of the outer layer flexible printed circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010637257.3A CN112004340A (en) | 2020-07-03 | 2020-07-03 | Laminating method of flexible circuit board |
| PCT/CN2020/116280 WO2022000810A1 (en) | 2020-07-03 | 2020-09-18 | Lamination method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010637257.3A CN112004340A (en) | 2020-07-03 | 2020-07-03 | Laminating method of flexible circuit board |
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| CN112004340A true CN112004340A (en) | 2020-11-27 |
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| CN202010637257.3A Pending CN112004340A (en) | 2020-07-03 | 2020-07-03 | Laminating method of flexible circuit board |
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| CN (1) | CN112004340A (en) |
| WO (1) | WO2022000810A1 (en) |
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| JP2014231628A (en) * | 2013-05-29 | 2014-12-11 | 住友金属鉱山株式会社 | Surface treatment apparatus and surface treatment method for long resin film, and roll-to-roll film deposition apparatus with the surface treatment apparatus |
| CN107484359A (en) * | 2017-08-20 | 2017-12-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of strain gauge is buried in printed circuit board |
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| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Method for preparation of multi-layer flexible circuit board |
| US9326373B2 (en) * | 2014-04-09 | 2016-04-26 | Finisar Corporation | Aluminum nitride substrate |
| KR101655928B1 (en) * | 2014-11-24 | 2016-09-09 | 대덕전자 주식회사 | Method of manufacturing a printed circuit board |
| CN106211637A (en) * | 2016-07-21 | 2016-12-07 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI circuit board |
| CN109348624B (en) * | 2018-10-11 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Laser blind hole alignment method |
| CN110072350A (en) * | 2019-04-10 | 2019-07-30 | 深圳市信维通信股份有限公司 | Multilayer circuit board processing method |
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2020
- 2020-07-03 CN CN202010637257.3A patent/CN112004340A/en active Pending
- 2020-09-18 WO PCT/CN2020/116280 patent/WO2022000810A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014231628A (en) * | 2013-05-29 | 2014-12-11 | 住友金属鉱山株式会社 | Surface treatment apparatus and surface treatment method for long resin film, and roll-to-roll film deposition apparatus with the surface treatment apparatus |
| CN108242421A (en) * | 2016-12-27 | 2018-07-03 | 株式会社迪思科 | Electrostatic chuck apparatus and Electrostatic Absorption method |
| CN107484359A (en) * | 2017-08-20 | 2017-12-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of strain gauge is buried in printed circuit board |
| CN110012621A (en) * | 2019-04-10 | 2019-07-12 | 深圳市信维通信股份有限公司 | Multilayer circuit board laminating technology |
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| WO2022000810A1 (en) | 2022-01-06 |
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