CN111992438A - Semiconductor device point gum machine - Google Patents
Semiconductor device point gum machine Download PDFInfo
- Publication number
- CN111992438A CN111992438A CN202010886809.4A CN202010886809A CN111992438A CN 111992438 A CN111992438 A CN 111992438A CN 202010886809 A CN202010886809 A CN 202010886809A CN 111992438 A CN111992438 A CN 111992438A
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- Prior art keywords
- glue
- block
- semiconductor device
- dispenser
- plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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Abstract
The invention discloses a semiconductor device dispenser, which comprises a body, a dispenser, a conveyor and a control panel, wherein the dispenser is arranged at the center of the top of the front surface of the body, the conveyor is arranged on the top surface of the body, when the dispenser is used for dispensing semiconductor devices, in order to reduce the residual glue on the outer wall of the dispenser, the interior of the dispenser moves up and down along with the glue feeding quantity of the interior of the dispenser through a telescopic pipe, which is favorable for reducing the direct contact of the dispenser and the device surface, keeping the outer wall of the dispenser clean and tidy, reducing the occurrence of glue wire drawing phenomenon, being favorable for increasing the qualification rate of semiconductor device processing, reducing the generation of defective products of processing, easily leaving part of glue on the outer wall of the telescopic pipe to thicken the outer wall of the telescopic pipe, and removing a small amount of glue left on the outer part, the telescopic pipe can freely move up and down in the dispensing pipe, and the dispensing of the semiconductor device can be accelerated.
Description
Technical Field
The invention belongs to the field of semiconductors, and particularly relates to a semiconductor device dispenser.
Background
Because the conductivity of the semiconductor can be controlled, the semiconductor device is widely applied to various fields such as integrated circuits, illumination and the like, and when the semiconductor device is processed, different semiconductor materials are adhered after glue is coated on the surface of the material through a glue dispenser; when a glue dispenser is used for dropping glue on a semiconductor device in the prior art, as part of glue is viscous fluid, when a glue dispensing tube is in contact with a semiconductor material, a small amount of glue is attached to the outside of the glue dispensing tube, the workload of glue dispensing is increased, the glue outside the glue dispensing tube is increased, when the glue dispensing tube moves up and down, the glue is caused to drop downwards under the action of gravity to form a wire drawing phenomenon, the glue is easy to drop at a non-glue dispensing position of the semiconductor device, the use of the semiconductor device is influenced, and the number of semiconductor defective products is increased.
Disclosure of Invention
In order to solve the problem that when a glue dispenser is used for dripping glue on a semiconductor device in the prior art, as part of the glue is in a viscous fluid state, when a glue dispensing tube is in contact with a semiconductor material, a small amount of glue is attached to the outside of the glue dispensing tube, the work load of glue dispensing is increased, the glue outside the glue dispensing tube is increased, and when the glue dispensing tube moves up and down, the glue drops downwards under the action of gravity to form a wire drawing phenomenon, so that the glue is easy to drop at a non-glue dispensing position of the semiconductor device, the use of the semiconductor device is influenced, and the number of semiconductor defective products is increased, the invention provides the glue dispenser.
In order to achieve the purpose, the invention is realized by the following technical scheme: a semiconductor device dispenser structurally comprises a dispenser body, a dispenser, a conveyor and a control panel, wherein the dispenser is installed at the center of the top of the front face of the dispenser body, the conveyor is arranged on the surface of the top of the dispenser body, and the control panel is located on the front face of the dispenser body.
The glue dispenser is equipped with long-pending gluey chamber, push pedal, slide bar, some rubber tubes, inner tube, long-pending gluey chamber is established inside the glue dispenser, the inner wall in the middle part of the glue dispenser is installed respectively to the push pedal, some rubber tubes reciprocate perpendicularly through the slide bar bottom in the glue dispenser, the inner tube is established at the inside of some rubber tubes.
As a further improvement of the invention, the inner tube is provided with a pull rod, a movable plate, a glue inlet, two pressure rods, a telescopic tube and two clamping blocks, the movable plate is arranged inside the inner tube, the top of the movable plate is movably matched with the pull rod, the glue inlet penetrates through the middle of the movable plate, the pressure rods are movably matched with the bottom of the movable plate, the telescopic tube is arranged on the bottom surface of the movable plate and is communicated with the glue inlet, the clamping blocks are fixedly embedded in the middle of the inner tube downwards and are sleeved outside the telescopic tube, the two pull rods are made of rubber materials, and the glue inlet is gradually enlarged in a vertical descending manner from top to bottom.
As a further improvement of the invention, the telescopic pipe is provided with a cutting plate, a supporting block and a moving ring, the cutting plate is arranged in the telescopic pipe, the middle part of the cutting plate is downward, the supporting block is embedded in the inner walls of the two sides of the telescopic pipe, the top of the cutting plate is movably matched with the cutting plate, the moving ring is movably matched with the inner wall of the telescopic pipe and is positioned at the lower side of the supporting block, and the top of the cutting plate is an arc smooth surface.
As a further improvement of the invention, the moving ring is provided with a rubber hole, a dispersing net and a clamping block, the rubber hole penetrates through the upper side and the lower side of the moving ring, the dispersing net is nested in the rubber hole, the clamping block is positioned in the moving ring, and the clamping block is made of spherical rubber.
As a further improvement of the telescopic tube, the clamping block is provided with a clamping groove, an elastic block, a connecting plate and a clearing block, the clamping groove is formed in the outer side of the clamping block, the elastic block is installed on the inner wall of the clamping groove, the clearing block penetrates through the inner side of the clamping block, the clearing block is movably matched with the elastic block through the connecting plate, and the clearing block is provided with five blocks and surrounds the outer portion of the telescopic tube.
As a further improvement of the invention, the cleaning block consists of a brush plate, a groove and a glue accumulation block, the brush plate is fixed on the top of the glue accumulation block, the groove is positioned in the gap between the brush plates, and the surface of the brush plate is an uneven surface.
As a further improvement of the invention, the glue accumulation block is provided with a flow guide rail and a glue inlet hole, the flow guide rail is sunken on the surface of the glue accumulation block, the glue inlet hole penetrates through the top of the glue accumulation block and is communicated with the flow guide rail, and eleven small holes penetrate through the surface of the glue inlet hole.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. when the glue dispenser is used for dispensing semiconductor devices, glue is remained on the outer wall of the glue dispensing pipe in order to reduce the glue residue on the outer wall of the glue dispensing pipe, the glue dispensing pipe is moved up and down inside the glue dispensing pipe along with the glue inlet quantity inside the glue dispensing pipe through the telescopic pipe, so that the direct contact between the glue dispensing pipe and the surfaces of the devices is favorably reduced, the outer wall of the glue dispensing pipe is kept clean and tidy, the glue drawing phenomenon is reduced, the qualified rate of the semiconductor device processing is favorably increased, and.
2. Part glue is easily remained on the outer wall of the telescopic pipe, so that the outer wall of the telescopic pipe is thickened, the telescopic pipe is vertically moved and movably matched with the inside of the clamping block, the cleaning block is used for cleaning a small amount of glue remained outside the telescopic pipe, the telescopic pipe is favorably and freely vertically moved inside the glue dispensing pipe, and the speed of dispensing semiconductor devices is favorably increased.
Drawings
Fig. 1 is a schematic structural diagram of a dispenser for semiconductor devices according to the present invention.
Fig. 2 is a schematic structural view of a front cross-sectional view of a dispenser according to the present invention.
FIG. 3 is a front sectional structural schematic view of an inner tube of the present invention.
Fig. 4 is a schematic structural diagram of an interior front view of a telescopic tube according to the present invention.
Fig. 5 is a front view of a moving ring according to the present invention.
Fig. 6 is a schematic top view of a block according to the present invention.
FIG. 7 is a side view of a cleaning block according to the present invention.
FIG. 8 is a schematic top view of a glue-deposited block according to the present invention.
In the figure: the glue dispensing machine comprises a machine body-1, a glue dispenser-2, a conveyor-3, a control panel-4, a glue accumulation cavity-21, a push plate-22, a slide bar-23, a glue dispensing pipe-24, an inner pipe-25, a pull rod-a 1, a moving plate-a 2, a glue inlet-a 3, a press rod-a 4, a telescopic pipe-a 5, a clamping block-a 6, a cutting plate-a 51, a supporting block-a 52, a moving ring-a 53, a glue hole-s 1, a dispersing net-s 2, a clamping block-s 3, a clamping groove-a 61, an elastic block-a 62, a connecting plate-a 63, a clearing block-a 64, a brush plate-d 1, a groove-d 2, a glue accumulation block-d 3, a flow guide rail-d 31 and a glue inlet-d 32.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 5:
the invention provides a semiconductor device dispenser, which structurally comprises a machine body 1, a dispenser 2, a conveyor 3 and a control panel 4, wherein the dispenser 2 is arranged at the center of the top of the front surface of the machine body 1, the conveyor 3 is arranged on the surface of the top of the machine body 1, and the control panel 4 is positioned on the front surface of the machine body 1.
The glue dispenser 2 is provided with a glue accumulation cavity 21, a push plate 22, a slide rod 23, a glue dispensing pipe 24 and an inner pipe 25, the glue accumulation cavity 21 is arranged inside the glue dispenser 2, the push plate 22 is respectively arranged on the inner wall of the middle part of the glue dispenser 2, the glue dispensing pipe 24 vertically moves up and down at the bottom in the glue dispenser 2 through the slide rod 23, and the inner pipe 25 is arranged inside the glue dispensing pipe 24.
The inner tube 25 is provided with a pull rod a1, a moving plate a2, a glue inlet a3, a press rod a4, an extension tube a5 and a fixture block a6, the moving plate a2 is arranged inside the inner tube 25, the top of the moving plate a2 is movably matched with the pull rod a1, the glue inlet a3 penetrates through the middle of the moving plate a2, the press rod a4 is movably matched with the bottom of the moving plate a2, the extension tube a5 is mounted on the bottom surface of the moving plate a2 and is communicated with the glue inlet a3, the fixture block a6 is embedded and fixed in the inner tube 25, the middle of the inner tube is downward and is sleeved outside the extension tube a5, the pull rod a1 is provided with two rubber moving plates, the moving plates are elastic and beneficial to pulling of a2 to reset, the straight descending of the glue inlet a3 from top to bottom is gradually increased, the stressed area of the top of the moving plate a2 is.
Wherein, flexible pipe a5 is equipped with cutting plate a51, supporting shoe a52, removal circle a53, cutting plate a51 installs the middle part down in flexible pipe a5, supporting shoe a52 inlays the solid at flexible pipe a5 both sides inner wall, and top and cutting plate a51 clearance fit, removal circle a53 and flexible pipe a5 inner wall clearance fit, and be located supporting shoe a52 downside, cutting plate a51 is the arc smooth surface for the top, is favorable to reducing the resistance for glue solution is along cutting plate a51 top landing.
Wherein, removal circle a53 is equipped with gluey hole s1, dispersion net s2, clamp splice s3, gluey hole s1 runs through removal circle a53 upper and lower both sides, dispersion net s2 nestification is inside gluey hole s1, clamp splice s3 is located removal circle a53 inside, clamp splice s3 is globular rubber material, has elasticity, and when glue drips toward removal circle a53 top, be favorable to making clamp splice s3 vibrations drive removal circle a53 shake from top to bottom for glue drips along glue hole s 1.
The specific use mode and function of the embodiment are as follows:
in the invention, a semiconductor device is placed on the top surface of a conveyor 3, a control panel 4 conveys the device to the middle of a machine body 1, a push plate 22 in an adhesive dispenser 2 is opened, glue in an adhesive accumulation cavity 21 drops downwards, the glue enters a glue dispensing tube 24, a sliding rod 23 drives the glue dispensing tube 24 to move up and down to a proper position, when the glue enters the glue dispensing tube 24, the glue enters the inner tube 25 along the top of the inner tube 25, a glue pushing moving plate a2 pulls a pull rod a1 to extend and extrude a pressing rod a4, a pressing rod a4 deformation moving plate a2 continuously moves downwards to drive a telescopic tube a5 to move downwards to move out of the bottom end of the glue dispensing tube 24, when the glue enters the telescopic tube 5 from an adhesive inlet a3, a cutting plate a51 is pushed to extrude a supporting block a52 to open a51, the glue drops to the top of a moving ring a3 along the surface of the cutting plate a51, the glue drops on the surface of the device through a dispersing net s1 and scatters 2, when the glue in the telescopic pipe a5 is gradually reduced, the supporting block a52 is restored to push the cutting plate a51 to return, the cutting plate a61 cuts off the glue, the glue in the inner pipe 25 is reduced, the pull rod a1 and the pressing rod a4 are restored to drive the telescopic pipe a5 to return, the telescopic pipe a5 returns to the inside of the dispensing pipe 24, the telescopic pipe a5 moves up and down along with the glue feeding amount in the dispensing pipe 24, the direct contact between the dispensing pipe 24 and the surface of a device is favorably reduced, the outer wall of the dispensing pipe 24 is kept clean and tidy, the glue drawing phenomenon is reduced, the increase of the processing qualification rate of semiconductor devices is favorably realized, and the generation of processing defective products is reduced.
Example 2:
as shown in fig. 6 to 8:
the clamping block a6 is provided with a clamping groove a61, an elastic block a62, a connecting plate a63 and a clearing block a64, the clamping groove a61 is arranged on the outer side of the clamping block a6, the elastic block a62 is mounted on the inner wall of the clamping groove a61, the clearing block a64 penetrates through the inner side of the clamping block a6, the clearing block a64 is movably matched with the elastic block a62 through the connecting plate a63, and the clearing block a64 is provided with five blocks and surrounds the outer portion of the telescopic pipe a5, so that a small amount of glue remained outside the telescopic pipe a5 can be fully cleared.
The cleaning block a64 is composed of a brush plate d1, a groove d2 and a glue accumulation block d3, the brush plate d1 is fixed to the top of the glue accumulation block d3, the groove d2 is located in a gap between the brush plates d1, the surface of the brush plate d1 is an uneven surface, the contact area between the brush plate d1 and the outer wall of the telescopic pipe a5 is increased, and the cleaning of a small amount of glue remained outside the telescopic pipe a5 is accelerated.
Wherein, it is equipped with water conservancy diversion rail d31, advances gluey hole d32 to amass piece d3, water conservancy diversion rail d31 is sunken on amass piece d3 surface, it runs through amass piece d3 top to advance gluey hole d32, and link up with water conservancy diversion rail d31 mutually, it has ten apertures to advance gluey hole d32 surface to run through, is favorable to accelerating the glue entering of remaining scraping, and reduces the glue refluence.
The specific use mode and function of the embodiment are as follows:
in the invention, when the extension tube a5 moves in the inner tube 25, the elastic block a62 in the clamping block a6 moves in the clamping groove a61, the cleaning block a64 is pushed towards the clamping block a6 through the connecting plate a63, the brush plate d1 on the surface of the cleaning block a64 removes a small amount of glue remaining outside the extension tube a5, the brushed glue drops to the glue accumulation block d3 along the groove d2, the glue enters the glue accumulation block d3 from the small hole of the glue inlet d32 along the flow guide rail d31 on the surface of the glue accumulation block d3 and is collected, the removal block a64 removes a small amount of glue remaining outside the extension tube a64 by moving up and down through the extension tube 5 and movably matching with the clamping block a6, the glue accumulation block a64 thickens inside the glue accumulation block d3, the glue is collected on the outer wall of the extension tube a5, the glue accumulation is reduced, the glue accumulation is accumulated on the outer wall of the extension tube a5, the outer wall of the.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (7)
1. The utility model provides a semiconductor device point gum machine, its structure includes organism (1), some glue ware (2), conveyer (3), control panel (4), some glue ware (2) are installed and are put at organism (1) positive top central point, establish at organism (1) top surface conveyer (3), control panel (4) are located organism (1) openly, its characterized in that:
some glue ware (2) are equipped with long-pending gluey chamber (21), push pedal (22), slide bar (23), some glue pipe (24), inner tube (25), long-pending gluey chamber (21) is established inside some glue ware (2), install respectively at some glue ware (2) middle part inner wall push pedal (22), some glue pipe (24) are through slide bar (23) bottom vertical reciprocating in some glue ware (2), inner tube (25) are established inside some glue pipe (24).
2. The semiconductor device dispenser according to claim 1, wherein: the inner tube (25) is provided with a pull rod (a1), a moving plate (a2), a glue inlet (a3), a pressure rod (a4), an extension tube (a5) and a clamping block (a6), the moving plate (a2) is arranged inside the inner tube (25), the top of the moving plate (a2) is movably matched with the pull rod (a1), the glue inlet (a3) penetrates through the middle of the moving plate (a2), the pressure rod (a4) is movably matched with the bottom of the moving plate (a2), the extension tube (a5) is arranged on the bottom surface of the moving plate (a2) and communicated with the glue inlet (a3), the clamping block (a6) is embedded and fixed in the inner tube (25) with the middle downward, and the extension tube is sleeved outside the inner tube (a 5).
3. The semiconductor device dispenser according to claim 2, wherein: the telescopic pipe (a5) is provided with a cutting plate (a51), a supporting block (a52) and a moving ring (a53), the cutting plate (a51) is installed in the telescopic pipe (a5) and the middle of the cutting plate is downward, the supporting block (a52) is fixedly embedded in the inner walls of two sides of the telescopic pipe (a5), the top of the supporting block is movably matched with the cutting plate (a51), and the moving ring (a53) is movably matched with the inner wall of the telescopic pipe (a5) and is located on the lower side of the supporting block (a 52).
4. The semiconductor device dispenser according to claim 3, wherein: the movable ring (a53) is provided with a glue hole (s1), a dispersion net (s2) and a clamping block (s3), the glue hole (s1) penetrates through the upper side and the lower side of the movable ring (a53), the dispersion net (s2) is embedded in the glue hole (s1), and the clamping block (s3) is located in the movable ring (a 53).
5. The semiconductor device dispenser according to claim 2, wherein: the clamping block (a6) is provided with a clamping groove (a61), an elastic block (a62), a connecting plate (a63) and a clearing block (a64), the clamping groove (a61) is formed in the outer side of the clamping block (a6), the elastic block (a62) is installed on the inner wall of the clamping groove (a61), the clearing block (a64) penetrates through the inner side of the clamping block (a6), and the clearing block (a64) is movably matched with the elastic block (a62) through the connecting plate (a 63).
6. The semiconductor device dispenser according to claim 5, wherein: the clearing block (a64) is composed of a brush plate (d1), a groove (d2) and a glue accumulation block (d3), the brush plate (d1) is fixed to the top of the glue accumulation block (d3), and the groove (d2) is located in a gap between the brush plates (d 1).
7. The semiconductor device dispenser according to claim 6, wherein: the glue accumulation block (d3) is provided with a flow guide rail (d31) and a glue inlet hole (d32), the flow guide rail (d31) is sunken on the surface of the glue accumulation block (d3), and the glue inlet hole (d32) penetrates through the top of the glue accumulation block (d3) and is communicated with the flow guide rail (d 31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010886809.4A CN111992438B (en) | 2020-08-28 | 2020-08-28 | Semiconductor device point gum machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010886809.4A CN111992438B (en) | 2020-08-28 | 2020-08-28 | Semiconductor device point gum machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111992438A true CN111992438A (en) | 2020-11-27 |
| CN111992438B CN111992438B (en) | 2021-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010886809.4A Active CN111992438B (en) | 2020-08-28 | 2020-08-28 | Semiconductor device point gum machine |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112916343A (en) * | 2021-02-24 | 2021-06-08 | 赣州逸豪新材料股份有限公司 | Directional gluing device for aluminum substrate machining and machining method thereof |
| CN112934559A (en) * | 2021-01-26 | 2021-06-11 | 杨丽华 | Shifting head equipment of resistor coating machine |
| CN112974143A (en) * | 2021-02-06 | 2021-06-18 | 广州苏威装饰材料有限公司 | Automatic glue dispenser with PLC (programmable logic controller) |
| CN114042601A (en) * | 2022-01-11 | 2022-02-15 | 江苏卓远半导体有限公司 | Glue dispenser for semiconductor |
| CN114472071A (en) * | 2021-12-27 | 2022-05-13 | 深圳市利拓光电有限公司 | Semiconductor packaging equipment and packaging method thereof |
| CN114871072A (en) * | 2022-06-15 | 2022-08-09 | 左洪琼 | Novel semiconductor dispensing processing method |
| CN115518832A (en) * | 2022-09-29 | 2022-12-27 | 苏州骏创汽车科技股份有限公司 | Dispensing machine for dispensing automobile skylight injection molding |
| CN116759515A (en) * | 2023-08-21 | 2023-09-15 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112916343B (en) * | 2021-02-24 | 2021-11-02 | 赣州逸豪新材料股份有限公司 | Directional gluing device for aluminum substrate machining and machining method thereof |
| CN114472071A (en) * | 2021-12-27 | 2022-05-13 | 深圳市利拓光电有限公司 | Semiconductor packaging equipment and packaging method thereof |
| CN114472071B (en) * | 2021-12-27 | 2023-03-07 | 深圳市利拓光电有限公司 | Semiconductor packaging equipment and packaging method thereof |
| CN114042601A (en) * | 2022-01-11 | 2022-02-15 | 江苏卓远半导体有限公司 | Glue dispenser for semiconductor |
| CN114871072A (en) * | 2022-06-15 | 2022-08-09 | 左洪琼 | Novel semiconductor dispensing processing method |
| CN115518832A (en) * | 2022-09-29 | 2022-12-27 | 苏州骏创汽车科技股份有限公司 | Dispensing machine for dispensing automobile skylight injection molding |
| CN115518832B (en) * | 2022-09-29 | 2023-12-05 | 苏州骏创汽车科技股份有限公司 | Glue dispenser for glue dispensing processing of injection molding part of automobile skylight |
| CN116759515A (en) * | 2023-08-21 | 2023-09-15 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
| CN116759515B (en) * | 2023-08-21 | 2023-10-27 | 山西星心半导体科技有限公司 | Packaging structure of combined LED lamp bead |
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| CN111992438B (en) | 2021-09-21 |
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Effective date of registration: 20210830 Address after: 224000 building 6, No. 20 Keji Road, Kecheng street, Yannan high tech Zone, Yancheng City, Jiangsu Province (CMK) Applicant after: People Baiye Technology Co.,Ltd. Address before: 350000 room 07, floor 7, building 1, Jinfu commercial building, No. 12, Xinquan South Road, Antai street, Gulou District, Fuzhou City, Fujian Province Applicant before: Fuzhou suideluo Trade Co.,Ltd. |
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Denomination of invention: A dispensing machine for semiconductor devices Effective date of registration: 20220715 Granted publication date: 20210921 Pledgee: Yancheng Chengnan New Area big data industry venture capital fund (L.P.) Pledgor: People Baiye Technology Co.,Ltd. Registration number: Y2022980010530 |