CN111988906A - Printed circuit board and light emitting diode module board - Google Patents

Printed circuit board and light emitting diode module board Download PDF

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Publication number
CN111988906A
CN111988906A CN201910431375.6A CN201910431375A CN111988906A CN 111988906 A CN111988906 A CN 111988906A CN 201910431375 A CN201910431375 A CN 201910431375A CN 111988906 A CN111988906 A CN 111988906A
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China
Prior art keywords
printed circuit
circuit board
metal layer
chamfer
pad
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Granted
Application number
CN201910431375.6A
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Chinese (zh)
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CN111988906B (en
Inventor
郑凯
张立辉
叶峰
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Zhejiang Uniview Technologies Co Ltd
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Zhejiang Uniview Technologies Co Ltd
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Priority to CN201910431375.6A priority Critical patent/CN111988906B/en
Publication of CN111988906A publication Critical patent/CN111988906A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The embodiment of the invention provides a printed circuit board and a light emitting diode module board, wherein the printed circuit board comprises: a first surface and a second surface arranged oppositely; the first surface is provided with a plurality of bonding pads arranged in a matrix manner and a plurality of first signal leads; two adjacent and diagonally arranged bonding pads are respectively a first bonding pad and a second bonding pad; the edge of the first bonding pad facing the second bonding pad is provided with a chamfer, and/or the edge of the second bonding pad facing the first bonding pad is provided with a chamfer; at least two first signal leads are arranged between the first bonding pad and the second bonding pad. The embodiment of the invention provides a printed circuit board and a light emitting diode module board, which aim to reduce the manufacturing cost of the printed circuit board.

Description

Printed circuit board and light emitting diode module board
Technical Field
The embodiment of the invention relates to the technology of printed circuit boards, in particular to a printed circuit board and a light emitting diode module board.
Background
With the severe requirements of people on the aspects of image quality, definition, visual angle and the like of a display screen, an LED matrix splicing screen becomes a popular configuration in the field of video display, and a small-distance LED matrix module becomes a pursuit target of various manufacturers under the dual promotion of requirements and technologies.
In the high-density LED display module with the spacing below P1.4 (the distance between the centers of two adjacent light-emitting diodes is 1.4mm) which is the mainstream in the market, because the spacing between two adjacent LEDs (light-emitting diodes) is small, more light-emitting diodes are arranged in the unit length, the wiring of signal leads connected with the light-emitting diodes is dense. Because the line width can not be infinitely reduced, in the prior art, for a high-density LED display module, a second-order HDI (high-density interconnection) is generally adopted for outgoing lines, the second-order HDI requires two laser shots, and the number of plate manufacturing processes is large, which results in a high price of a printed circuit board.
Disclosure of Invention
The embodiment of the invention provides a printed circuit board and a light emitting diode module board, which aim to reduce the manufacturing cost of the printed circuit board.
In a first aspect, an embodiment of the present invention provides a printed circuit board, including:
a first surface and a second surface arranged oppositely;
the first surface is provided with a plurality of bonding pads arranged in a matrix manner and a plurality of first signal leads;
two adjacent and diagonally arranged bonding pads are respectively a first bonding pad and a second bonding pad; the edge of the first bonding pad facing the second bonding pad is provided with a chamfer, and/or the edge of the second bonding pad facing the first bonding pad is provided with a chamfer;
At least two first signal leads are arranged between the first bonding pad and the second bonding pad.
Optionally, a vertical projection of the pad on the first surface is square, and the chamfer is located at a corner of the rectangle of the pad;
the side length of the welding disc provided with the chamfer is smaller than that of the welding disc not provided with the chamfer.
Optionally, the side length of the pad provided with the chamfer is a, and the side length of the pad not provided with the chamfer is b; 0.9 < a/b < 1.
Optionally, the chamfer is an arc chamfer or a straight chamfer.
Optionally, the printed circuit board further comprises a plurality of second signal leads;
the second signal lead and the first signal lead are arranged in different layers; the plurality of second signal leads are located between the first surface and the second surface;
at least a portion of the pad is electrically connected to the second signal lead by a via.
Optionally, the number of the pads electrically connected with the second signal lead through the via is smaller than the number of the pads electrically connected with the first signal lead.
Optionally, the printed circuit board includes at least a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer and a sixth metal layer in a direction from the first surface to the second surface; the first metal layer comprises the plurality of first signal leads;
At least one of the second metal layer, the third metal layer, the fourth metal layer, and the fifth metal layer includes the second signal lead;
the first metal level with the second metal level is connected through first blind hole electricity, the fifth metal level with the sixth metal level is connected through second blind hole electricity, the second metal level the third metal level the fourth metal level and adjacent two-layer through burying the hole electricity in the fifth metal level and connecting, first blind hole with the second blind hole passes through the radium-shine formation of laser, it forms through mechanical drilling to bury the hole.
Optionally, a gap between two adjacent and diagonally disposed pads is greater than 18 mils.
Optionally, the first surface includes a plurality of diode arrangement regions, each of the diode arrangement regions is used for placing a light emitting diode, and pins of the light emitting diodes are electrically connected with the plurality of pads in the diode arrangement regions in a one-to-one correspondence manner;
each diode arrangement region comprises 4 or 8 bonding pads.
In a second aspect, an embodiment of the present invention provides a light emitting diode module board, including:
a plurality of light emitting diodes;
And the printed circuit board of the first aspect;
and the pins of the light-emitting diodes are electrically connected with the bonding pads of the printed circuit board in a one-to-one correspondence manner.
In a high-density LED display module in the prior art (a display module in which the distance between the centers of two adjacent light emitting diodes is less than or equal to 1.4mm is a high-density LED display module), usually only one first signal lead can be arranged between two pads that are arranged adjacently and diagonally, and only one first signal lead can be arranged on a first surface in one wiring period (a plurality of pads 10 that electrically connect a plurality of pins in the same light emitting diode are electrically connected with a plurality of signal leads respectively, and a wiring period is formed according to the row direction or the column direction of the matrix arrangement of the light emitting diodes). Fewer signal leads are provided on the first surface of the printed circuit board and more signal leads can be provided only to the inner metal layer of the printed circuit board, so that second-order HDI (high density interconnect) is used for the outgoing line. In the embodiment of the invention, at least one of the two adjacent and diagonally arranged bonding pads is provided with the chamfer, and the chamfer is adjacent to the first signal lead, so that the distance between the two adjacent and diagonally arranged bonding pads is increased, the arrangement space of the first signal lead on the first surface of the printed circuit board is increased, and at least two first signal leads are arranged between the two adjacent and diagonally arranged bonding pads. More signal leads are disposed on the first surface of the printed circuit board and fewer signal leads are disposed on the inner metal layer of the printed circuit board, so that first-order HDI can be used for outgoing. Compared with second-order HDI, the first-order HDI only needs one laser, the plate manufacturing process is less, and the manufacturing cost of the printed circuit board is reduced.
Drawings
Fig. 1 is a schematic top view of a printed circuit board according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a printed circuit board according to an embodiment of the present invention;
fig. 3 is a schematic top view of another printed circuit board according to an embodiment of the present invention;
fig. 4 is a schematic top view of another printed circuit board according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a second signal lead layout in a printed circuit board according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the invention;
fig. 8 is a schematic top view of another pcb according to an embodiment of the present invention;
fig. 9 is a schematic top view of another printed circuit board according to an embodiment of the present invention;
fig. 10 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the invention;
fig. 11 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the invention;
fig. 12 is a schematic cross-sectional structure view of a light emitting diode module board according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic top view of a printed circuit board according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view of the printed circuit board according to the embodiment of the present invention, and referring to fig. 1 and fig. 2, the printed circuit board includes a first surface 101 and a second surface 102 that are oppositely disposed. The first surface 101 is provided with a plurality of pads 10 arranged in a matrix, and a plurality of first signal leads 21. Two pads 10 disposed adjacently and diagonally are a first pad 11 and a second pad 12, respectively. The edge of the first pad 11 facing the second pad 12 and the edge of the second pad 12 facing the first pad 11 have a chamfer. In other embodiments, the edge of the first pad 11 facing the second pad 12 may have a chamfer, and the edge of the second pad 12 facing the first pad 11 may not have a chamfer; alternatively, the edge of the first pad 11 facing the second pad 12 may not have a chamfer, and the edge of the second pad 12 facing the first pad 11 may have a chamfer. At least two first signal leads 21 are disposed between the first pad 11 and the second pad 12.
In a high-density LED display module in the prior art (a display module in which the distance between the centers of two adjacent light emitting diodes is less than or equal to 1.4mm is a high-density LED display module), usually only one first signal lead can be arranged between two pads that are arranged adjacently and diagonally, and only one first signal lead can be arranged on a first surface in one wiring period (a plurality of pads 10 that electrically connect a plurality of pins in the same light emitting diode are electrically connected with a plurality of signal leads respectively, and a wiring period is formed according to the row direction or the column direction of the matrix arrangement of the light emitting diodes). Fewer signal leads are provided on the first surface of the printed circuit board and more signal leads can be provided only to the inner metal layer of the printed circuit board, so that second-order HDI (high density interconnect) is used for the outgoing line. In the embodiment of the invention, at least one of the two adjacent and diagonally arranged bonding pads is provided with the chamfer, and the chamfer is adjacent to the first signal lead, so that the distance between the two adjacent and diagonally arranged bonding pads is increased, the arrangement space of the first signal lead on the first surface of the printed circuit board is increased, and at least two first signal leads are arranged between the two adjacent and diagonally arranged bonding pads. More signal leads are disposed on the first surface of the printed circuit board and fewer signal leads are disposed on the inner metal layer of the printed circuit board, so that first-order HDI can be used for outgoing. Compared with second-order HDI, the first-order HDI only needs one laser, the plate manufacturing process is less, and the manufacturing cost of the printed circuit board is reduced.
Exemplarily, referring to fig. 1 and 2, the first pad 11 and the third pad 13 may be electrically connected through the first signal lead 21 located at the first surface 101. The first bonding pad 11 and the third bonding pad 13 can be electrically connected with the first signal lead 21 without passing through holes, so that the manufacturing cost of the printed circuit board is reduced.
Alternatively, referring to fig. 1, the edge of the first pad 11 facing the second pad 12 has a chamfer, and/or the edge of the second pad 12 facing the first pad 11 has a chamfer. The gap G between two adjacent and diagonally arranged pads 10 is larger than 18 mil. The gap G between the two pads 10 is the shortest distance between any two points on the edges of the two pads 10. mil is the unit of length, 1mil 1/1000inch 0.0254 mm. Illustratively, no chamfer is provided on any two adjacent and diagonally arranged bonding pads 10, and the gap between two adjacent and diagonally arranged bonding pads 10 is 15.09mil, which is insufficient for providing two first signal leads 21, and only one first signal lead 21 can be provided within the range of 15.09 mil. In the embodiment of the invention, by setting the gap G between two adjacent and diagonally arranged bonding pads 10 to be larger than 18mil, at least two first signal leads 21 can be arranged between two adjacent and diagonally arranged bonding pads 10, so that a first-order HDI (high density interconnect) can be used for outgoing lines, and the manufacturing cost of the printed circuit board is reduced.
Fig. 3 is a schematic top view of another printed circuit board according to an embodiment of the present invention, and referring to fig. 3, a vertical projection of the pad 10 on the first surface 101 is square, and the chamfer is located at a corner of the rectangular pad 10. It should be noted that, since the chamfer is made on the basis of the pad 10 having a square shape in a vertical projection of the first surface 101, and the chamfer occupies a small area of the pad 10, the shape of the pad 10 provided with the chamfer is also referred to as a square shape in the embodiment of the present invention. The side length of the pad 10 provided with the chamfer is smaller than the side length of the pad 10 not provided with the chamfer. The side length of the pad 10 refers to the longest vertical distance of the opposite two sides of the pad 10. In the embodiment of the present invention, the side length of the pad 10 provided with the chamfer is smaller than the side length of the pad 10 not provided with the chamfer, and on the basis of the chamfer provided on the pad 10, further, the side length of the pad 10 provided with the chamfer is reduced, so that the distance between two adjacent pads 10 arranged diagonally is further increased, and the arrangement space of the first signal lead 21 on the first surface 101 of the printed circuit board is increased.
Alternatively, referring to fig. 3, the side length of the pad 10 provided with the chamfer is a, the side length of the pad 10 not provided with the chamfer is b, 0.9 < a/b < 1. The smaller the ratio of the side length of the pad 10 provided with the chamfer to the side length of the pad 10 not provided with the chamfer is, the larger the distance between two adjacent pads 10 arranged diagonally is, the larger the area difference between the pad 10 provided with the chamfer and the led pin correspondingly attached thereto is, and the higher the probability of electrical connection failure between the pad 10 provided with the chamfer and the led pin correspondingly attached thereto is; the larger the ratio of the side length of the pad 10 provided with the chamfer to the side length of the pad 10 not provided with the chamfer is, the smaller the distance between two adjacent pads 10 arranged diagonally is, the smaller the difference in area between the pad 10 provided with the chamfer and the led pin correspondingly attached thereto is, and the lower the probability of electrical connection failure between the pad 10 provided with the chamfer and the led pin correspondingly attached thereto is. In the embodiment of the invention, the a/b is more than 0.9 and less than 1, so that the distance between two adjacent pads 10 arranged diagonally is increased, and the electric connection between the pad 10 provided with the chamfer and the LED pin correspondingly attached to the pad is not influenced, thereby improving the welding reliability and yield of the printed circuit board.
Alternatively, referring to fig. 1 and 3, the chamfer is an arc chamfer. The arcuate chamfer may be a rounded corner, for example. An arc-shaped chamfer is arranged, and a small area of the bonding pad material is removed on the basis of the bonding pad 10 with a square vertical projection of the first surface 101, namely the degree of disc cutting is light. The area of the pad 10 provided with the arc-shaped chamfer is close to that of the pad 10 before chamfering, so that the probability of electrical connection faults of the pad 10 provided with the arc-shaped chamfer and the LED pins correspondingly attached to the pad is reduced, and the welding reliability and the yield of the printed circuit board are improved.
Fig. 4 is a schematic top view of another printed circuit board according to an embodiment of the present invention, and referring to fig. 4, the chamfer is a straight chamfer. The pad 10 provided with the straight chamfer removes a triangular region from the pad 10 before chamfering thereof, thereby increasing the interval between two adjacent and diagonally arranged pads 10.
Fig. 5 is a schematic diagram illustrating an arrangement of second signal leads in a printed circuit board according to an embodiment of the present invention, fig. 6 is a schematic diagram illustrating a cross-sectional structure of another printed circuit board according to an embodiment of the present invention, and referring to fig. 5 and 6, the printed circuit board further includes a plurality of second signal leads 22. The second signal lead 22 is disposed in a different layer from the first signal lead 21. The first signal lead 21 and the second signal lead 22 may be formed using different metal layers. A plurality of second signal leads 22 are located between the first surface 101 and the second surface 102. The second signal lead 22 is located in an internal metal layer of the printed circuit board. At least a portion of the pad 10 is electrically connected to the second signal lead 22 by a via 30.
Exemplarily, referring to fig. 2 and 6, the printed circuit board includes at least a first metal layer 110, a second metal layer 120, a third metal layer 130, a fourth metal layer 140, a fifth metal layer 150, and a sixth metal layer 160 in a direction from the first surface 101 toward the second surface 102. The first metal layer 110 includes a plurality of first signal leads 21. The second metal layer 120 includes a plurality of second signal leads 22. The first signal lead 21 and the second signal lead 22 are disposed in different layers. The plurality of pads 10 on the first surface 101 may be electrically connected to the same second signal lead 22 on the second metal layer 120 through vias 30. For example, the second pad 12 and the fourth pad 14 may be electrically connected through the second signal lead 22 located at the second metal layer 120. It is understood that at least one of the second, third, fourth and fifth metal layers 120, 130, 140 and 150 may include the second signal lead 22, as long as the second signal lead 22 is disposed at an inner metal layer of the printed circuit board.
Fig. 7 is a schematic cross-sectional view of another printed circuit board according to an embodiment of the present invention, and referring to fig. 7, the first metal layer 110 includes a plurality of first signal leads 21. The third metal layer 130 includes a plurality of second signal leads 22. The plurality of pads 10 on the first surface 101 may be electrically connected to the same second signal lead 22 on the third metal layer 130 through vias 30. The plurality of pads 10 on the first surface 101 are electrically connected to one end of the via connection line 220 on the second metal layer 120 through vias 30 penetrating the insulating layer between the first metal layer 110 and the second metal layer 120. The other end of the via connection line 220 is electrically connected to the second signal lead 22 located in the third metal layer 130 through a via 30 penetrating through the insulating layer between the second metal layer 120 and the third metal layer 130. For example, the second pad 12 and the fourth pad 14 may be electrically connected through the second signal lead 22 located at the third metal layer 130.
Alternatively, referring to fig. 1, 2, 5, 6 and 7, the number of pads 10 electrically connected to the second signal leads 22 through the vias 30 is smaller than the number of pads 10 electrically connected to the first signal leads 21. Since at least one of the two pads 10 disposed adjacent and diagonally is provided with a chamfer adjacent to the first signal lead 21, the pitch between the two pads 10 disposed adjacent and diagonally is increased so that at least two first signal leads 21 are disposed between the two pads 10 disposed adjacent and diagonally. Therefore, the pads 10 where the vias 30 are not provided may have a greater number, and the pads 10 where the vias 30 are provided may have a smaller number. That is, the pads 10 electrically connected to the first signal leads 21 may have a greater number, and the pads 10 electrically connected to the second signal leads 22 may have a smaller number. In the embodiment of the invention, the number of the bonding pads 10 electrically connected with the second signal leads 22 through the through holes 30 is less than that of the bonding pads 10 electrically connected with the first signal leads 21, so that the number of the through holes 30 is reduced, and the manufacturing cost of the printed circuit board is reduced.
Fig. 8 is a schematic top view of another printed circuit board according to an embodiment of the present invention, and referring to fig. 8, the first surface 101 includes a plurality of diode-disposing regions 100, each of the diode-disposing regions 100 is used for disposing a light emitting diode, and the leads of the light emitting diodes are electrically connected to the pads 10 in the diode-disposing regions 100 in a one-to-one correspondence manner. Each diode arrangement region 100 includes 4 pads 10.
Exemplarily, referring to fig. 8, each diode arrangement region 100 includes 4 pads 10, and the 4 pads 10 are electrically connected to 4 pins of the light emitting diode in a one-to-one correspondence manner. The 4 pins of the light emitting diode are, for example, a common pin, a red color control pin, a green color control pin, and a blue color control pin, respectively. Of the 4 pads 10 in each diode arrangement region 100, 1 pad 10 is electrically connected to the second signal lead 22 through the via 30, and 3 pads 10 are electrically connected to the first signal lead 21, and 3 first signal leads 21 may be arranged on the first surface 101 in one wiring period.
Fig. 9 is a schematic top view of another printed circuit board according to an embodiment of the present invention, and referring to fig. 9, the first surface 101 includes a plurality of diode-disposing regions 100, each of the diode-disposing regions 100 is used for disposing a light emitting diode, and the leads of the light emitting diodes are electrically connected to the plurality of pads 10 in the diode-disposing region 100 in a one-to-one correspondence manner. Each diode arrangement region 100 includes 8 pads 10.
Exemplarily, referring to fig. 9, each diode arrangement region 100 includes 8 pads 10, and the 8 pads 10 are electrically connected to 8 pins of the light emitting diode in a one-to-one correspondence manner. The 8 pins of the light emitting diode are, for example, a first common pin, a second common pin, a first red color control pin, a second red color control pin, a first green color control pin, a second green color control pin, a first blue color control pin, and a second blue color control pin, respectively. Of the 8 pads 10 in each diode arrangement region 100, 3 pads 10 are electrically connected to the second signal lead 22 through the via 30, 5 pads 10 are electrically connected to the first signal lead 21, and 5 first signal leads 21 may be arranged on the first surface 101 in one wiring period.
Fig. 10 is a schematic cross-sectional structure view of another printed circuit board according to an embodiment of the present invention, referring to fig. 10, the printed circuit board at least includes a first metal layer 110, a second metal layer 120, a third metal layer 130, a fourth metal layer 140, a fifth metal layer 150, and a sixth metal layer 160 along a direction from a first surface 101 to a second surface 102. The printed circuit board of fig. 10 is illustrated with 6 metal layers and is not intended to limit embodiments of the present invention. The first metal layer 110 is a metal layer closest to the first surface 101 in the printed circuit board, the second metal layer 120 is a metal layer closest to the first metal layer 110 in the printed circuit board, the sixth metal layer 160 is a metal layer closest to the second surface 102 in the printed circuit board, and the fifth metal layer 150 is a metal layer closest to the sixth metal layer 160 in the printed circuit board. The first metal layer 110 is electrically connected with the second metal layer 120 through the first blind hole 31, the fifth metal layer 150 is electrically connected with the sixth metal layer 160 through the second blind hole 32, two adjacent layers of the second metal layer 120, the third metal layer 130, the fourth metal layer 140 and the fifth metal layer 150 are electrically connected through the buried hole 33, the first blind hole 31 and the second blind hole 32 are formed through laser, and the buried hole 33 is formed through mechanical drilling. In the embodiment of the invention, the first blind hole 31 is formed only on one side adjacent to the first surface 101 by laser, the second blind hole 32 is formed only on one side adjacent to the second surface 102 by laser, and buried holes formed in the printed circuit board are formed by adopting a mechanical drilling mode, which belongs to a first-order HDI manufacturing mode, so that the manufacturing cost of the printed circuit board is reduced. The first blind hole 31, the second blind hole 32, and the buried hole 33 are collectively referred to as a through hole 30.
Fig. 11 is a schematic cross-sectional structure diagram of another printed circuit board according to an embodiment of the present invention, and referring to fig. 11, the printed circuit board includes 8 metal layers, and further includes a seventh metal layer 170 and an eighth metal layer 180, where the seventh metal layer 170 and the eighth metal layer 180 are located between the second metal layer 120 and the fifth metal layer 150. Specifically, the seventh metal layer 170 is located between the fourth metal layer 140 and the eighth metal layer 180. Adjacent two of second metal layer 120, third metal layer 130, fourth metal layer 140, seventh metal layer 170, eighth metal layer 180, and fifth metal layer 150 are electrically connected by buried hole 33, and buried hole 33 is formed by mechanical drilling.
Fig. 12 is a schematic cross-sectional structure view of a light emitting diode module board according to an embodiment of the present invention, and referring to fig. 12, the light emitting diode module board includes a plurality of light emitting diodes 300 (only one light emitting diode 300 is illustrated in fig. 12) and the printed circuit board 200 in any of the embodiments. The leads of the plurality of light emitting diodes 300 are electrically connected to the pads 10 of the printed circuit board 200 in a one-to-one correspondence. The led 300 may have 4 or 8 pins, for example, and the number of the pins of the led 300 is not limited in the embodiment of the present invention.
Alternatively, referring to fig. 12, the led module board may further include an led driving circuit 400, and the led driving circuit 400 may be formed on the second surface 102 of the printed circuit board 200. The pins of the led driving circuit 400 may be electrically connected to pads on the second surface 102 and electrically connected to the plurality of leds 300 on the first surface 101 through vias, for driving the plurality of leds 300 to emit light. Furthermore, a plurality of light emitting diode module plates can be spliced and assembled into an LED display screen for displaying images.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. A printed circuit board, comprising:
a first surface and a second surface arranged oppositely;
the first surface is provided with a plurality of bonding pads arranged in a matrix manner and a plurality of first signal leads;
two adjacent and diagonally arranged bonding pads are respectively a first bonding pad and a second bonding pad; the edge of the first bonding pad facing the second bonding pad is provided with a chamfer, and/or the edge of the second bonding pad facing the first bonding pad is provided with a chamfer;
at least two first signal leads are arranged between the first bonding pad and the second bonding pad.
2. The printed circuit board of claim 1, wherein the perpendicular projection of the pad on the first surface is square, and the chamfer is located at a rectangular corner of the pad;
the side length of the welding disc provided with the chamfer is smaller than that of the welding disc not provided with the chamfer.
3. The printed circuit board according to claim 2, wherein a side length of the pad provided with the chamfer is a, and a side length of the pad not provided with the chamfer is b; 0.9 < a/b < 1.
4. The printed circuit board of claim 1, wherein the chamfer is an arcuate chamfer or a straight chamfer.
5. The printed circuit board of claim 1, further comprising a second plurality of signal leads;
the second signal lead and the first signal lead are arranged in different layers; the plurality of second signal leads are located between the first surface and the second surface;
at least a portion of the pad is electrically connected to the second signal lead by a via.
6. The printed circuit board of claim 5, wherein the number of pads electrically connected to the second signal leads by vias is less than the number of pads electrically connected to the first signal leads.
7. The printed circuit board of claim 5, wherein the printed circuit board comprises at least a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer, and a sixth metal layer in a direction from the first surface toward the second surface; the first metal layer comprises the plurality of first signal leads;
at least one of the second metal layer, the third metal layer, the fourth metal layer, and the fifth metal layer includes the second signal lead;
The first metal level with the second metal level is connected through first blind hole electricity, the fifth metal level with the sixth metal level is connected through second blind hole electricity, the second metal level the third metal level the fourth metal level and adjacent two-layer through burying the hole electricity in the fifth metal level and connecting, first blind hole with the second blind hole passes through the radium-shine formation of laser, it forms through mechanical drilling to bury the hole.
8. The printed circuit board of claim 1, wherein a gap between two adjacent and diagonally disposed pads is greater than 18 mils.
9. The printed circuit board of claim 1, wherein the first surface comprises a plurality of diode arrangement regions, each of the diode arrangement regions is used for placing a light emitting diode, and the pins of the light emitting diodes are electrically connected with a plurality of the bonding pads in the diode arrangement regions in a one-to-one correspondence;
each diode arrangement region comprises 4 or 8 bonding pads.
10. A light emitting diode module board, comprising:
a plurality of light emitting diodes;
and a printed circuit board according to any one of claims 1 to 9;
And the pins of the light-emitting diodes are electrically connected with the bonding pads of the printed circuit board in a one-to-one correspondence manner.
CN201910431375.6A 2019-05-22 2019-05-22 Printed circuit board and light emitting diode module board Active CN111988906B (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959706A (en) * 1988-05-23 1990-09-25 United Technologies Corporation Integrated circuit having an improved bond pad
JPH04364051A (en) * 1991-06-11 1992-12-16 Rohm Co Ltd Semiconductor device
JPH1074790A (en) * 1996-08-29 1998-03-17 Nec Ic Microcomput Syst Ltd Bonding pad arrangement of semiconductor chip and its optimization method
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
CN1574262A (en) * 2003-05-28 2005-02-02 恩益禧电子股份有限公司 Integrated circuit device and wiring board
CN101068453A (en) * 2007-06-26 2007-11-07 福建星网锐捷网络有限公司 Welding pad design method, pad structure, printing circuit board and equipment
CN203368919U (en) * 2012-12-07 2013-12-25 上海斐讯数据通信技术有限公司 Printed circuit board (PCB) pad and ball grid array (BGA) packaging PCB
CN107734842A (en) * 2017-09-22 2018-02-23 郑州云海信息技术有限公司 A kind of method for lifting high density hole printed circuit board (PCB) reliability

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959706A (en) * 1988-05-23 1990-09-25 United Technologies Corporation Integrated circuit having an improved bond pad
JPH04364051A (en) * 1991-06-11 1992-12-16 Rohm Co Ltd Semiconductor device
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
JPH1074790A (en) * 1996-08-29 1998-03-17 Nec Ic Microcomput Syst Ltd Bonding pad arrangement of semiconductor chip and its optimization method
CN1574262A (en) * 2003-05-28 2005-02-02 恩益禧电子股份有限公司 Integrated circuit device and wiring board
CN101068453A (en) * 2007-06-26 2007-11-07 福建星网锐捷网络有限公司 Welding pad design method, pad structure, printing circuit board and equipment
CN203368919U (en) * 2012-12-07 2013-12-25 上海斐讯数据通信技术有限公司 Printed circuit board (PCB) pad and ball grid array (BGA) packaging PCB
CN107734842A (en) * 2017-09-22 2018-02-23 郑州云海信息技术有限公司 A kind of method for lifting high density hole printed circuit board (PCB) reliability

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