CN111970012A - Fan-shaped radio frequency network and radio frequency signal sending device - Google Patents
Fan-shaped radio frequency network and radio frequency signal sending device Download PDFInfo
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- CN111970012A CN111970012A CN202011139870.9A CN202011139870A CN111970012A CN 111970012 A CN111970012 A CN 111970012A CN 202011139870 A CN202011139870 A CN 202011139870A CN 111970012 A CN111970012 A CN 111970012A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0064—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with separate antennas for the more than one band
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Abstract
The application provides a sector radio frequency network and a radio frequency signal sending device, which relate to the technical field of radio frequency feed networks, wherein the sector radio frequency network comprises a driving amplifier, a radio frequency connector, a microstrip line power dividing network and a plurality of radio frequency chips, the microstrip line power dividing network is arranged in a grading way, the driving amplifier is arranged on the microstrip line power dividing network, the input end of the microstrip line power dividing network is connected with the radio frequency connector, each output end of the microstrip line power dividing network is connected with the radio frequency chip, and the radio frequency chips surround a sector; the radio frequency connector is used for receiving a radio frequency signal to be sent; the driving amplifier is used for amplifying the radio frequency signal to be transmitted; the microstrip line power division network is used for carrying out power distribution on the amplified radio frequency signal to be transmitted; and the radio frequency chip is used for carrying out phase and amplitude shifting on the radio frequency signal to be sent after power distribution and outputting the radio frequency signal. The sector radio frequency network and the radio frequency signal sending device have the advantage that the manufacturing cost of the phased array antenna cannot be wasted.
Description
Technical Field
The application relates to the technical field of radio frequency feed networks, in particular to a sector radio frequency network and a radio frequency signal transmitting device.
Background
In recent years, with the rapid development of the civil and commercial high-flux satellite communication industry, higher requirements are put forward on technical indexes such as envelope, caliber and the like of the active phased array antenna. To meet the envelope requirements, a transmit phased array antenna typically needs to be in the form of a circular array. However, if the antenna is directly made into a circular array surface, the conventional PCB (Printed Circuit Board) process cannot realize the processing of the multilayer antenna Board with such a huge size on the premise of meeting the antenna aperture.
In order to meet the requirements of envelope, caliber and process at the same time, the traditional technical scheme is to make the transmitting phased array antenna into a rectangular splicing form, so that several antenna boards can be spliced together, and then the circular array of the antenna units is realized by closing the radio frequency chips corresponding to the edge antenna units.
Therefore, when the phased array antenna manufactured by the method works, the radio frequency chip at the edge is in the closed state, so that the manufacturing cost of the phased array antenna is wasted.
In summary, the phased array antenna in the prior art has the problem of manufacturing cost waste.
Disclosure of Invention
An object of the application is to provide a sector radio frequency network and a radio frequency signal transmitting device, so as to solve the problem that the manufacturing cost of a phased array antenna is wasted in the prior art.
In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:
on one hand, the embodiment of the application provides a sector radio frequency network, which includes a driving amplifier, a radio frequency connector, a microstrip line power division network and a plurality of radio frequency chips, wherein the microstrip line power division network is arranged in a grading manner, the driving amplifier is installed on the microstrip line power division network, the input end of the microstrip line power division network is connected with the radio frequency connector, each output end of the microstrip line power division network is connected with the radio frequency chip, and the radio frequency chips surround a sector; the radio frequency connector is used for receiving a radio frequency signal to be sent; the driving amplifier is used for amplifying the radio frequency signal to be transmitted; the microstrip line power distribution network is used for carrying out power distribution on the amplified radio frequency signal to be sent; and the radio frequency chip is used for carrying out phase and amplitude shifting on the radio frequency signal to be transmitted after power distribution and outputting the radio frequency signal.
Optionally, the radio frequency connector is disposed at a position close to a center of the sector.
Optionally, the microstrip line power division network is a 1:1 equal power division network.
Optionally, the microstrip line power division network includes a main line, a first sub-network, a second sub-network, a third sub-network, and a fourth sub-network, where the first sub-network, the second sub-network, the third sub-network, and the fourth sub-network are all configured to be rectangular, the first sub-network is connected to the main line after being connected to an input end of the second sub-network, and the third sub-network is connected to the main line after being connected to an input end of the fourth sub-network; the first sub-network is transversely arranged at a position close to the center of the sector, the second sub-network is longitudinally arranged at a position close to a first radius of the sector, and the third sub-network and the fourth sub-network are longitudinally arranged side by side at a position close to a second radius of the sector.
Optionally, the second sub-network includes a first main network and a first sub-network, the first main network and the first sub-network are arranged side by side, and the first sub-network is arranged on a side of the first main network far away from the first sub-network; the fourth sub-network comprises a second main network and a second sub-network, and the second sub-network is arranged on one side of the third sub-network far away from the first sub-network.
Optionally, the input terminals of the first, second, third, fourth sub-networks and the main line are all provided with a driver amplifier.
Optionally, the microstrip line power distribution network includes a plurality of microstrip lines, and the plurality of microstrip lines are connected in a stepped manner.
On the other hand, the embodiment of the present application further provides a radio frequency signal transmitting device, where the radio frequency signal transmitting device includes a substrate and the sector radio frequency network, and the sector radio frequency network is installed on a surface layer of the substrate.
Optionally, the number of the sector radio frequency networks includes a plurality of sector radio frequency networks, the sector radio frequency networks are all mounted on the surface layer of the substrate, and the sector radio frequency networks surround a circle.
Optionally, the radio frequency signal transmitting apparatus further includes a power divider, where the power divider is connected to the radio frequency connector in each sector radio frequency network, and the power divider is configured to receive a radio frequency signal to be transmitted and transmit the radio frequency signal to be transmitted to each sector radio frequency network.
Compared with the prior art, the embodiment of the application has the following beneficial effects:
the application provides a sector radio frequency network and a radio frequency signal sending device, wherein the sector radio frequency network comprises a driving amplifier, a radio frequency connector, a microstrip line power distribution network and a plurality of radio frequency chips, the microstrip line power distribution network is distributed in a grading manner, the driving amplifier is installed on the microstrip line power distribution network, the input end of the microstrip line power distribution network is connected with the radio frequency connector, each output end of the microstrip line power distribution network is connected with the radio frequency chip, and the radio frequency chips surround a sector; the radio frequency connector is used for receiving a radio frequency signal to be sent; the driving amplifier is used for amplifying the radio frequency signal to be transmitted; the microstrip line power division network is used for carrying out power distribution on the amplified radio frequency signal to be transmitted; and the radio frequency chip is used for carrying out phase and amplitude shifting on the radio frequency signal to be sent after power distribution and outputting the radio frequency signal. By arranging the mode that the plurality of radio frequency chips enclose a sector, when the phased array antenna is synthesized, a circular network can be spliced by the plurality of sector radio frequency networks, and then the phased array antenna can be directly made into a circular array form. When the phased array antenna works, the radio frequency chips in the sector radio frequency network can completely participate in the work, and the manufacturing cost of the phased array antenna cannot be wasted.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic diagram of a feed network provided in the prior art.
Fig. 2 is a schematic diagram of an array of feed networks provided in the prior art.
Fig. 3 is a block diagram of a sector radio frequency network according to an embodiment of the present application.
Fig. 4 is a schematic diagram of a sector radio frequency network according to an embodiment of the present application.
Fig. 5 is a schematic diagram of an array formed by sector radio frequency networks according to an embodiment of the present application.
In the figure: 100-sector radio frequency network; 110-a radio frequency connector; 120-a driver amplifier; 130-microstrip line power division network; 140-radio frequency chip; 131-a first sub-network; 132-a second sub-network; 133-a third sub-network; 134-a fourth sub-network; 1321 — a first host network; 1322-a first secondary network; 1341-a second host network; 1342-second secondary network.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly, detachably, or integrally connected, mechanically, electrically, directly, or indirectly through intervening media, or as a communication between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
As described in the background art, referring to fig. 1, in order to meet the requirements of envelope, aperture and process at the same time, the transmit phased array antenna is made into a rectangular and spliceable form, so that several antenna boards can be spliced together, and then the radio frequency chips corresponding to the edge antenna units are turned off to realize the circular array of the antenna units.
For example, referring to fig. 2, the phased array antenna is made into a form of 4 spliceable squares, where each square includes a feed network as shown in fig. 1, and then is combined into a large-sized phased array antenna.
However, it is understood that the rf chip in the edge position is not operated at all times. On the one hand, the manufacturing cost is relatively high, but the manufacturing cost is wasted because the manufacturing device is always in a non-working state. On the other hand, the phased-array antenna needs to be used in combination with the substrate, so that the radio-frequency chip at the edge position actually occupies a large area of the substrate, and further the waste of the substrate area is caused.
In view of this, the present application provides a sector radio frequency network, and a mode of setting a plurality of radio frequency chips in the sector radio frequency network to be sector is adopted, so that problems of manufacturing cost and waste of occupied area of a substrate of a phased array antenna in the prior art are solved.
The following is an exemplary illustration of a sector radio frequency network provided by the present application:
referring to fig. 3 and fig. 4, as an implementation manner, the sector rf network 100 includes a driving amplifier 120 (C in fig. 4 is the driving amplifier), an rf connector 110 (a in fig. 4 is the rf connector), a microstrip power dividing network 130 and a plurality of rf chips 140 (B in fig. 4 is the rf chips), the microstrip power dividing network 130 is arranged in a hierarchical manner, the driving amplifier 120 is installed on the microstrip power dividing network 130, the driving amplifier 120 is connected to the microstrip power dividing network 130, an input end of the microstrip power dividing network 130 is connected to the rf connector 110, each output end of the microstrip power dividing network 130 is connected to the rf chip 140, and the plurality of rf chips 140 surround a sector.
The rf connector 110 is used to connect to an rf signal generating device, which can generate an rf signal to be transmitted, and as an implementation manner, the rf signal generating device may be a controller.
When a radio frequency signal needs to be transmitted, the radio frequency connector 110 receives a radio frequency signal to be transmitted, the driver amplifier 120 amplifies the radio frequency signal to be transmitted, the amplified radio frequency signal to be transmitted is subjected to power distribution through the microstrip line power distribution network 130, and the radio frequency signal to be transmitted after power distribution is subjected to phase and amplitude shift and power amplification through the radio frequency chip 140 and then output.
It should be noted that the rf chip 140 described herein may be an SOC (system on chip) chip, where the SOC chip is an integrated circuit chip, and the SOC chip can implement power amplification, phase shift, and attenuation of an rf signal, and is an important component of an rf network.
In addition, it should be further noted that, in actual use, the rf chip 140 is also vertically interconnected with the antenna unit, the rf chip 140 described herein outputs the rf signal to be transmitted after power distribution, and actually, the rf chip 140 transmits the signal to the antenna unit, and then outputs the signal through the antenna unit.
Because the plurality of radio frequency chips 140 in the sector radio frequency network 100 provided by the present application are enclosed into a sector, when the sector radio frequency network 100 is utilized to form a phased array antenna, all the radio frequency chips 140 all participate in the work, and further, the waste of the manufacturing cost and the occupied area is not caused.
Since the radio frequency signal to be transmitted needs to be input to the multiple sector radio frequency networks 100 at the same time after the multiple sector radio frequency networks 100 are used to manufacture the phased array antenna in the circular form, in order to shorten the length of the wires and prevent the wires from being disordered as much as possible, optionally, the radio frequency connector 110 is disposed at a position close to the center of the sector, where the center of the circle corresponding to the sector is the center of the sector. Through the setting mode, after the plurality of fan-shaped radio frequency networks 100 are spliced to form the phased array antenna in the circular form, the input line of the radio frequency signal to be transmitted can be arranged at the position close to the circle center, and then the input line of the radio frequency signal to be transmitted is connected with the radio frequency connectors 110 of the fan-shaped radio frequency networks 100 at the position close to the circle center, so that the wiring layout is more optimal.
Optionally, the microstrip line power distribution network 130 provided in the present application is formed by a plurality of microstrip lines, and the plurality of microstrip lines are connected in a stepped manner, so as to form the microstrip line power distribution network 130. In addition, referring to fig. 1, in the radio frequency network in the prior art, the power division network has an unequal power feed network, which increases the design difficulty and the processing difficulty, and the balance of power distribution is difficult to ensure. For example, in fig. 1, the scalar number is the common-power-division ratio of the power-division network (in fig. 1, when the radio-frequency signal is input from RFIN and passes through the numbers 4 and 5, the radio-frequency signal performs power distribution according to the ratio of 4: 5, meanwhile, when the radio-frequency signal is transmitted to the next branch, i.e., the numbers 3 and 2, the radio-frequency signal performs power distribution again according to the ratio of 3: 2, and when the radio-frequency signal is retransmitted to the next branch, i.e., the numbers 1 and 2, the radio-frequency signal performs power distribution again according to the ratio of 1: 2), it is seen that the unequal-division feed network exists, and the balance of power distribution is difficult to guarantee.
In view of this, the microstrip line power division networks 130 provided in the present application are all equal power division networks of 1:1, that is, in the microstrip line power division network 130, when a radio frequency signal to be transmitted is transmitted from an upper stage to a lower stage, the power of the radio frequency signal to be transmitted is divided into two parts, and the transmission is continued.
For example, referring to fig. 4, the microstrip line power division network 130 includes a plurality of stages, and the number of stages is not limited in this application, for example, the number of stages may be 5, or 6, and may be adjusted according to actual requirements, which is not limited in this application. For each level, when signal transmission is performed, the signal is divided into two parts and then transmitted to the next level, that is, for each level of power division network, the number of the power division network of the next level is two, and the power of the rf signal to be transmitted input by the two power division networks is equal and is half of the power of the signal output by the power division network of the previous level.
By the arrangement mode, the power distribution balance of the sector radio frequency network 100 provided by the application can be better.
It should be noted that, the plurality of rf chips 140 described herein enclose a sector, and the pattern enclosed by the rf chips 140 may be approximately a sector. In one implementation, in order to make the layout of the rf chip 140 more reasonable, the microstrip power dividing network 130 includes a main line, a first sub-network 131, a second sub-network 132, a third sub-network 133, and a fourth sub-network 134, the first sub-network 131, the second sub-network 132, the third sub-network 133, and the fourth sub-network 134 are all rectangular, the first sub-network 131 is connected to the input end of the second sub-network 132 and then connected to the main line, and the third sub-network 133 is connected to the input end of the fourth sub-network 134 and then connected to the main line.
The first sub-network 131 is laterally disposed near the center of the sector, the second sub-network 132 is longitudinally disposed near a first radius of the sector, and the third sub-network 133 and the fourth sub-network 134 are longitudinally disposed side by side near a second radius of the sector.
By the arrangement mode, the figure enclosed by the microstrip line power distribution network 130 is approximate to a fan shape, and further, after the radio frequency chip 140 is connected with the output end of the microstrip line power distribution network 130, the figure enclosed by the radio frequency chip 140 is also approximate to a fan shape.
Optionally, in order to make the pattern enclosed by the rf chip 140 closer to a sector, the second sub-network 132 includes a first main network 1321 and a first sub-network 1322, the first main network 1321 and the first sub-network 1322 are disposed side by side, and the first sub-network 1322 is disposed on a side of the first main network 1321 away from the first sub-network 131.
The fourth sub-network 134 comprises a second main network 1341 and a second sub-network 1342, the second sub-network 1342 being arranged on a side of the third sub-network 133 remote from the first sub-network 131.
With reference to fig. 4, the pattern defined by the rf chip 140 can be more similar to a sector, and the effect is better. Meanwhile, it should be noted that the above is only one implementation manner of the present application, and in some other embodiments, the rf chip 140 may be enclosed into a sector by other manners, which is not limited in this application. Meanwhile, the sector surrounded by the rf chip 140 provided by the present application is 90 °, and in other embodiments, the sector may have other degrees, for example, 60 °.
Meanwhile, in order to achieve the purpose of cost saving in the function of realizing signal amplification, the input terminals and the main line of the first sub-network 131, the second sub-network 132, the third sub-network 133, and the fourth sub-network 134 are provided with the driving amplifier 120. In other words, the number of the driving amplifiers 120 provided by the present application may be 5 on the basis of the above implementation.
Based on the above implementation manner, it can be understood that, after the radio frequency connector 110 receives a radio frequency signal to be transmitted, the radio frequency signal to be transmitted is amplified through the driving amplifier 120 of the main circuit, and then is divided into two paths through the one-to-two power divider for transmission, and at the same time, the two paths of signals respectively pass through the one-to-two power divider, and then are transmitted to the input ends of the first sub-network 131, the second sub-network 132, the third sub-network 133, and the fourth sub-network 134, and are amplified through the driving amplifier 120 connected to the input ends of the first sub-network 131, the second sub-network 132, the third sub-network 133, and the fourth sub-network 134, and the amplified signal continues to be transmitted to the next stage until the radio frequency signal to be transmitted is transmitted to the radio.
In summary, the microstrip line power dividing network 130 in the fan-shaped rf network 100 provided by the present application is simpler to route, and when the radio frequency chip works, all the rf chips 140 participate in the work, so that the waste of the manufacturing cost does not occur, and the balance of the power distribution is better.
Based on the above embodiments, the present application further provides an rf signal transmitting apparatus, which includes a substrate and the fan-shaped rf network 100, where the fan-shaped rf network 100 is mounted on a surface layer of the substrate.
Since the existing feeding network includes microstrip lines and strip lines, as shown in fig. 1, the solid lines represent microstrip lines, and the dotted lines represent strip lines. Due to the limitation of space, the feed network in the prior art needs to run on the surface layer and the intermediate layer, that is, the feed network in the form of microstrip line (located on the surface layer) and strip line (located on the intermediate layer) exist at the same time. On one hand, the introduction of the middle layer needs the buried resistance copper foil to be used as an isolation resistor of the power divider, the buried resistance copper foil is high in cost and large in resistance error range, and the performance of the power divider can be reduced while the cost is increased.
On the other hand, the introduction of the intermediate layer also increases the lamination times of the substrate, and increases the processing difficulty and cost.
In view of this, in the radio frequency signal transmitting apparatus provided in the present application, the fan-shaped radio frequency network 100 is only installed on the surface layer of the substrate, and does not need to use a buried resistance copper foil, so that the number of times of pressing the antenna board is reduced, the processing difficulty is reduced, and the cost is reduced.
Naturally, referring to fig. 5, since the rf signal transmitting device needs to be manufactured as a circular array, the number of the fan-shaped rf networks 100 includes a plurality of fan-shaped rf networks 100, the fan-shaped rf networks 100 are all installed on the surface layer of the substrate, and the fan-shaped rf networks 100 surround a circle. It can be understood that the number of the sector rf networks 100 included in the rf signal transmitting apparatus provided in the present application may be determined according to the angle of the sector surrounded by the rf chips 140 in the sector rf networks 100. For example, when the angle of the sector surrounded by the rf chip 140 is 90 °, the rf signal transmitting apparatus includes 4 sector rf networks 100.
When the angle of the sector surrounded by the rf chip 140 is 60 °, the rf signal transmitter includes 6 sector rf networks 100. Taking the example that the rf signal transmitting apparatus includes 4 fan-shaped rf networks 100, the structures of the 4 fan-shaped rf networks 100 are the same, and after the position of the first fan-shaped rf network 100 is fixed, the position of the second fan-shaped rf network 100 can be obtained by rotating the fan-shaped rf network 100 by 90 ° with the center of the fan-shaped rf network 100 as the starting point.
After the sector rf network 100 is rotated by 180 °, the position of the third sector rf network 100 can be obtained.
After the sector rf network 100 is rotated by 270 °, the position of the fourth sector rf network 100 can be obtained.
Meanwhile, in order to simultaneously transmit the radio frequency signal to be transmitted to the multiple sector radio frequency networks 100, in this application, the radio frequency signal transmitting apparatus further includes a power divider, the power divider is connected to the radio frequency connector 110 in each sector radio frequency network 100, and the power divider is configured to receive the radio frequency signal to be transmitted and transmit the radio frequency signal to be transmitted to each sector radio frequency network 100. For example, when the number of the sector radio frequency networks 100 is 4, the power divider adopts a one-to-four power divider, that is, after a radio frequency signal to be transmitted is transmitted to the power divider, the power divider divides the signal into four and transmits the four to the 4 sector radio frequency networks 100, respectively.
Optionally, the power divider may be installed at a center of a circle surrounded by the plurality of fan-shaped radio frequency networks 100, and since the radio frequency connector 110 of each fan-shaped radio frequency network 100 is disposed at a position close to the center of the circle, the connection between the radio frequency connector 110 and the power divider is more convenient, and the wiring is simpler.
As one implementation mode, the substrate provided by the application uses M6 or IT968 materials with low cost, low loss and high reliability, and is suitable for large-scale mass production of products.
Through the arrangement mode, on one hand, the use number of the radio frequency chips 140 can be reduced, generally speaking, the radio frequency signal transmitting device provided by the application can reduce the number of the radio frequency chips 140 by about 24%, and further can reduce the waste of the production cost. On the other hand, since the redundant rf chip 140 is not disposed on the edge of the substrate, other circuit modules, such as a power module, can be disposed in the area, thereby improving the utilization rate of the substrate.
In summary, the present application provides a sector radio frequency network and a radio frequency signal transmitting apparatus, where the sector radio frequency network includes a driving amplifier, a radio frequency connector, a microstrip line power dividing network and a plurality of radio frequency chips, the microstrip line power dividing network is arranged in a hierarchical manner, the driving amplifier is installed on the microstrip line power dividing network, an input end of the microstrip line power dividing network is connected with the radio frequency connector, each output end of the microstrip line power dividing network is connected with a radio frequency chip, and the plurality of radio frequency chips surround a sector; the radio frequency connector is used for receiving a radio frequency signal to be sent; the driving amplifier is used for amplifying the radio frequency signal to be transmitted; the microstrip line power division network is used for carrying out power distribution on the amplified radio frequency signal to be transmitted; and the radio frequency chip is used for carrying out phase and amplitude shifting on the radio frequency signal to be sent after power distribution and outputting the radio frequency signal. The mode that a plurality of radio frequency chips enclose into a sector is arranged, so that when the phased array antenna is synthesized, a plurality of sector radio frequency networks can be spliced into a circle, and then the form of a circular array can be directly made. When the phased array antenna works, the radio frequency chips in the sector radio frequency network can completely participate in the work, and the manufacturing cost of the phased array antenna cannot be wasted.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A fan-shaped radio frequency network is characterized by comprising a drive amplifier, a radio frequency connector, a microstrip line power distribution network and a plurality of radio frequency chips, wherein the microstrip line power distribution network is arranged in a grading manner, the drive amplifier is installed on the microstrip line power distribution network, the input end of the microstrip line power distribution network is connected with the radio frequency connector, each output end of the microstrip line power distribution network is connected with the radio frequency chip, and the radio frequency chips surround a fan shape;
the radio frequency connector is used for receiving a radio frequency signal to be sent;
the driving amplifier is used for amplifying the radio frequency signal to be transmitted;
the microstrip line power distribution network is used for carrying out power distribution on the amplified radio frequency signal to be sent;
and the radio frequency chip is used for carrying out phase and amplitude shifting on the radio frequency signal to be transmitted after power distribution and outputting the radio frequency signal.
2. The sectorized radio frequency network of claim 1, wherein said radio frequency connector is located near a center of said sector.
3. The sectorial radio frequency network of claim 1, wherein the microstrip line power division network is a 1:1 equal power division network.
4. The sectorial radio frequency network of claim 1, wherein the microstrip power division network comprises a main line, a first sub-network, a second sub-network, a third sub-network and a fourth sub-network, the first sub-network, the second sub-network, the third sub-network and the fourth sub-network are all arranged in a rectangular shape, the first sub-network is connected with the main line after being connected with an input end of the second sub-network, and the third sub-network is connected with the main line after being connected with an input end of the fourth sub-network;
the first sub-network is transversely arranged at a position close to the center of the sector, the second sub-network is longitudinally arranged at a position close to a first radius of the sector, and the third sub-network and the fourth sub-network are longitudinally arranged side by side at a position close to a second radius of the sector.
5. The sectorized radio frequency network as claimed in claim 4, wherein said second sub-network comprises a first main network and a first sub-network, said first main network and said first sub-network are arranged side by side, and said first sub-network is arranged on a side of said first main network far from said first sub-network;
the fourth sub-network comprises a second main network and a second sub-network, and the second sub-network is arranged on one side of the third sub-network far away from the first sub-network.
6. The sectorized radio frequency network of claim 4, wherein the inputs of said first sub-network, said second sub-network, said third sub-network, said fourth sub-network and said main line are provided with drive amplifiers.
7. The sectored radio frequency network of claim 1, wherein the microstrip line power division network comprises a plurality of microstrip lines, the plurality of microstrip lines being connected in a stepwise manner.
8. An rf signal transmitting device, comprising a substrate and the fan-shaped rf network of any one of claims 1 to 7, wherein the fan-shaped rf network is mounted on a surface layer of the substrate.
9. The apparatus according to claim 8, wherein the number of the sector radio frequency networks includes a plurality of sector radio frequency networks, the plurality of sector radio frequency networks are all mounted on the surface layer of the substrate, and the plurality of sector radio frequency networks surround a circle.
10. The rf signal transmitting apparatus according to claim 9, further comprising a power divider, wherein the power divider is connected to the rf connector in each of the sector rf networks, and the power divider is configured to receive an rf signal to be transmitted and transmit the rf signal to be transmitted to each of the sector rf networks.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367093A (en) * | 2021-01-13 | 2021-02-12 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284783A1 (en) * | 2005-01-14 | 2006-12-21 | Farrokh Mohamadi | Phase shifters for beamforming applications |
| US20070080888A1 (en) * | 2005-05-31 | 2007-04-12 | Farrokh Mohamadi | Control of an Integrated Beamforming Array Using Near-Field-Coupled or Far-Field-Coupled Commands |
| CN102110884A (en) * | 2010-12-30 | 2011-06-29 | 中国科学院上海微***与信息技术研究所 | Active phased array antenna adopting passive loading way to control sidelobe level |
| CN103794884A (en) * | 2014-01-17 | 2014-05-14 | 西安空间无线电技术研究所 | Method for achieving reflector antenna beam two-dimensional scanning |
| CN103975483A (en) * | 2011-09-27 | 2014-08-06 | 默克专利股份有限公司 | Electronically steerable planar phased array antenna |
| CN105024143A (en) * | 2015-08-06 | 2015-11-04 | 中国电子科技集团公司第三十八研究所 | Chip-type Ka-frequency band wide-angle scanning satellite communication antenna |
| CN105356051A (en) * | 2015-11-16 | 2016-02-24 | 中国电子科技集团公司第十研究所 | High-power seeker tile type active phased array antenna |
| CN106230465A (en) * | 2016-09-21 | 2016-12-14 | 中国电子科技集团公司第十研究所 | Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit |
| CN206098694U (en) * | 2016-09-14 | 2017-04-12 | 安徽大学 | Microstrip array antenna |
| CN107706512A (en) * | 2016-08-09 | 2018-02-16 | 广东通宇通讯股份有限公司 | Feeding network for extensive mimo antenna |
| CN108987946A (en) * | 2018-07-30 | 2018-12-11 | 北京航空航天大学 | Slot array antenna and its power division network based on substrate integration wave-guide |
-
2020
- 2020-10-22 CN CN202011139870.9A patent/CN111970012B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284783A1 (en) * | 2005-01-14 | 2006-12-21 | Farrokh Mohamadi | Phase shifters for beamforming applications |
| US20070080888A1 (en) * | 2005-05-31 | 2007-04-12 | Farrokh Mohamadi | Control of an Integrated Beamforming Array Using Near-Field-Coupled or Far-Field-Coupled Commands |
| CN102110884A (en) * | 2010-12-30 | 2011-06-29 | 中国科学院上海微***与信息技术研究所 | Active phased array antenna adopting passive loading way to control sidelobe level |
| CN103975483A (en) * | 2011-09-27 | 2014-08-06 | 默克专利股份有限公司 | Electronically steerable planar phased array antenna |
| CN103794884A (en) * | 2014-01-17 | 2014-05-14 | 西安空间无线电技术研究所 | Method for achieving reflector antenna beam two-dimensional scanning |
| CN105024143A (en) * | 2015-08-06 | 2015-11-04 | 中国电子科技集团公司第三十八研究所 | Chip-type Ka-frequency band wide-angle scanning satellite communication antenna |
| CN105356051A (en) * | 2015-11-16 | 2016-02-24 | 中国电子科技集团公司第十研究所 | High-power seeker tile type active phased array antenna |
| CN107706512A (en) * | 2016-08-09 | 2018-02-16 | 广东通宇通讯股份有限公司 | Feeding network for extensive mimo antenna |
| CN206098694U (en) * | 2016-09-14 | 2017-04-12 | 安徽大学 | Microstrip array antenna |
| CN106230465A (en) * | 2016-09-21 | 2016-12-14 | 中国电子科技集团公司第十研究所 | Millimeter wave multichannel transmitting-receiving circuit module and power division network high density integrated circuit |
| CN108987946A (en) * | 2018-07-30 | 2018-12-11 | 北京航空航天大学 | Slot array antenna and its power division network based on substrate integration wave-guide |
Non-Patent Citations (3)
| Title |
|---|
| JINZHU ZHOU ETC.: ""Joint Design and Experimental Tests of Highly Integrated Phased-Array Antenna With Microchannel Heat Sinks"", 《IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS》 * |
| QING-QIANG HE ETC.: ""Research on Structurally Integrated Phased Array for Wireless Communications"", 《IEEE ACCESS》 * |
| 牛娟: ""Ku波段圆极化微带相控阵天线的研究与设计"", 《中国优秀硕士学位论文全文数据库（电子期刊）》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367093A (en) * | 2021-01-13 | 2021-02-12 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
| CN112367093B (en) * | 2021-01-13 | 2021-04-02 | 成都天锐星通科技有限公司 | Phased array receiving radio frequency network and system |
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|---|---|
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