CN111943701B - 提高陶瓷材料致密度的热压烧结工艺 - Google Patents
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Abstract
一种提高陶瓷材料致密度的热压烧结工艺,属于陶瓷制造技术领域。该热压烧结工艺包括以下步骤:S1,将高强度石墨下压块装入石墨套筒模具中,固定好下压块在模具底部的位置;S2,将截面形状尺寸一致的碳纤维布、陶瓷生坯按照碳纤维布、陶瓷生坯、碳纤维布装配顺序依次叠放装入石墨套筒模具中下压块上方;S3,在30‑60MPa压力下,加热至2000‑2400℃,保温保压10‑60min,烧结过程中通过高强石墨上压头下压对陶瓷材料加压,最终将陶瓷生坯热压烧结成防弹陶瓷板。本发明通过碳纤维布的使用提高了热压烧结中陶瓷材料粉体内部气体排出的顺畅性和均匀性,适合防弹陶瓷板的制造,能够增强基于防弹陶瓷板的复合装甲抵御穿甲弹、穿甲***多次打击的能力。
Description
技术领域
本发明涉及的是一种陶瓷制造领域的技术,具体是一种提高陶瓷材料致密度的热压烧结工艺。
背景技术
热压烧结是陶瓷材料制造中一种常用的工艺,由于采用纵向施加压力补充烧结驱动力,因此可在较短烧结时间内实现陶瓷的致密化,并且获得较好致密度的块体陶瓷材料。特别是对于含有共价键难烧结的陶瓷材料,如B4C、SiC、Si3N4,该工艺优势较为明显。
对于热压烧结用模具材料而言,无论是大外套模还是上下压块都采用具有超细颗粒结构、高纯度和高石墨化度的高强石墨材料,其结构致密、表面光洁度高,另外高温下抗氧化性、导电、导热、抗压强度都较高,可多次重复使用,因此是目前最常用的热压烧结用模具材料。
目前的热压烧结工艺,在装模烧结前都是按照石墨垫板、软石墨纸、陶瓷材料生坯、软石墨纸和石墨垫板的装配顺序依次装入石墨模具中,然后采用热压烧结炉对陶瓷材料进行加压烧结。其中在陶瓷生坯上下两侧的软石墨纸作为隔离材料,作用是将烧结的陶瓷材料和石墨垫片隔离开来,避免陶瓷样品在高温烧结过程中粘在模具上造成脱模困难,也避免因此影响高强度石墨垫片的多次重复使用。
对于碳化物、氮化物陶瓷等难烧结材料,采用目前的热压烧结工艺需要设置较高的温度和压力。而且软石墨纸的使用会导致出现烧结组织不均匀的现象,即样品外边沿至中心明显有组织分层,靠近石墨模具处陶瓷材料的致密度高于中心位置处致密度。这种不均匀性导致材料硬度的降低以及材料性能的不稳定,因而不适合防弹陶瓷板的制造。
申请号为201710344144.2的中国发明专利申请公开了一种提高陶瓷材料致密度的热压烧结制备工艺,该方法将高强石墨块切割、粉碎、过筛后替代石墨垫片与石墨纸。然而该方法中切割、粉碎高强石墨难度大,效率低,且高强石墨粉加入石墨套筒模具后粉末厚度均一性差,容易造成陶瓷件的外形发生变化,也不适合防弹陶瓷板的制造。此外该方法每次只能烧结一个陶瓷件,效率不高。
为了解决现有技术存在的上述问题,本发明由此而来。
发明内容
本发明针对现有技术存在的上述不足,提出了一种提高陶瓷材料致密度的热压烧结工艺,适合防弹陶瓷板的制造,能够增强基于防弹陶瓷板的复合装甲抵御穿甲弹、穿甲***多次打击的能力。
本发明包括以下步骤:
S1,将高强度石墨下压块装入石墨套筒模具中,固定好下压块在模具底部的位置,防止出现松动;
S2,将将截面形状尺寸一致的碳纤维布、陶瓷生坯按照碳纤维布、陶瓷生坯、碳纤维布装配顺序依次叠放装入石墨套筒模具中下压块上方;
S3,在30-60MPa压力下,加热至2000-2400℃,保温保压10-60min,烧结过程中通过高强石墨上压头下压对陶瓷材料加压,最终将陶瓷生坯热压烧结成防弹陶瓷板。
优选地,所述碳纤维布厚度为0.05-0.5mm;碳纤维轴向导热系数大于30W/(m·k)、弹性模量大于310GPa。
优选地,在底部碳纤维布与高强度石墨下压块之间和/或顶部碳纤维与高强石墨上压头之间设有石墨垫板,以保护下压块和上压头。
技术效果
与现有技术相比,本发明具有如下技术效果:
1)将热压烧结过程中透气性差的隔离材料软石墨纸,替换为碳纤维布,提高烧结过程中陶瓷材料粉体内部气体排出的顺畅性和均匀性,进而制备出致密度较高的防弹陶瓷材料;
2)因采用了碳纤维布使得烧结得到的防弹陶瓷板表面形成了与碳纤维布纹理一致的、均匀分布的凹凸不平表面,大幅增加了陶瓷板的比表面积,有利于其他材料与防弹陶瓷板的粘结制成防弹装甲;
3)可以同时热压多块陶瓷生坯制成防弹陶瓷板,生产效率高;相邻两块陶瓷生坯之间采用碳纤维布、石墨垫板和碳纤维布分隔,因碳纤维布凹凸不平,增加石墨垫板以保证烧结压力一致性时不会阻碍气体的排出,制得的多块防弹陶瓷板致密度具有较好的一致性。
附图说明
图1为实施例1陶瓷生坯结构示意图;
图2为实施例1热压烧结工艺示意图;
图中:石墨套筒模具1、高强石墨下压块2、高强石墨上压头3、石墨垫板4、碳纤维布5、陶瓷生坯6。
具体实施方式
下面结合附图及具体实施方式对本发明进行详细描述。实施例中未注明具体条件的实验方法,按照常规方法和条件进行。
实施例1
本实施例涉及一种提高防弹陶瓷材料致密度的热压烧结工艺。
在热压烧结前先制备生坯,包括以下过程:
将20kg的B4C粉体(赛福纳米科技)、2kg的纳米碳纤维(苏州第一元素CNTcr)、580g的水溶性酚醛树脂与23kg的高纯水混合均匀,得到陶瓷浆料;再经喷雾干燥,喷雾干燥进风口温度为200℃,出风口温度为100℃,得到复合生料;最后在350MPa压力下冷压成如图1所示、厚度为20mm的陶瓷生坯6。
热压烧结工艺包括以下步骤:
S1,采用内腔与陶瓷生坯形状匹配的石墨套筒模具1,将对应的高强石墨下压块2装入石墨套筒模具1内底部位置,检查防止出现松动;
S2,按照碳纤维布5、陶瓷生坯6、碳纤维布5的叠放顺序将碳纤维布5和陶瓷生坯6装入石墨套筒模具1中高强石墨下压块2上方,如图2所示;可叠放放入多块陶瓷生坯,相邻两块陶瓷生坯以碳纤维布、石墨垫板和碳纤维布分隔,最多可叠放十块陶瓷生坯;石墨垫板、碳纤维布、陶瓷生坯与内腔截面形状尺寸一致;
S3,在50MPa压力下,加热至2200℃,保温保压20min,进行烧结,烧结过程中通过高强石墨上压头下压对陶瓷材料加压,最终得到10mm厚的防弹陶瓷板十块。
对本实施例顶层和底层的陶瓷板进行检测,并与现有技术中采用软石墨纸作为隔离材料制造的防弹陶瓷板进行比较,结果如下表1所示。
表1性能对比表
比较实施例1中顶层陶瓷板(或底层陶瓷板)不同区域,可以发现不同区域的性能较为接近,而比较顶层陶瓷板与底层陶瓷板相同区域,可以发现性能也是一致的,说明了碳纤维布用做隔离材料,有利于热压烧结过程中气体的排出,保证材料致密度;且在烧结多层材料时,基于碳纤维布,石墨垫板的使用也不会影响气体排出。
需要强调的是:以上仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (3)
1.一种提高陶瓷材料致密度的热压烧结工艺,其特征在于,包括以下步骤:
S1,将高强度石墨下压块装入石墨套筒模具中,固定好下压块在模具底部的位置,防止出现松动;
S2,将截面形状尺寸一致的碳纤维布、陶瓷生坯按照碳纤维布、陶瓷生坯、碳纤维布装配顺序依次叠放装入石墨套筒模具中下压块上方;所述陶瓷生坯的叠放数量不少于2块,相邻两块通过依次叠放的碳纤维布、石墨垫板和碳纤维布分隔;
S3,在30-60MPa压力下,加热至2000-2400℃,保温保压10-60min,烧结过程中通过高强石墨上压头下压对陶瓷材料加压,最终将陶瓷生坯热压烧结成防弹陶瓷板。
2.根据权利要求1所述提高陶瓷材料致密度的热压烧结工艺,其特征是,所述碳纤维布厚度为0.05-0.5mm;碳纤维轴向导热系数大于30W/(m·k)、弹性模量大于310GPa。
3.根据权利要求1所述提高陶瓷材料致密度的热压烧结工艺,其特征是,在底部碳纤维布与高强度石墨下压块之间和/或顶部碳纤维与高强石墨上压头之间设有石墨垫板。
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