CN111873056A - Automatic punching equipment and method applied to PCB - Google Patents
Automatic punching equipment and method applied to PCB Download PDFInfo
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- CN111873056A CN111873056A CN202010625595.5A CN202010625595A CN111873056A CN 111873056 A CN111873056 A CN 111873056A CN 202010625595 A CN202010625595 A CN 202010625595A CN 111873056 A CN111873056 A CN 111873056A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
- B26F1/14—Punching tools; Punching dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0625—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by endless conveyors, e.g. belts
- B26D7/0633—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by endless conveyors, e.g. belts by grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/24—Perforating by needles or pins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
- B26D2007/322—Means for performing other operations combined with cutting for conveying or stacking cut product the cut products being sheets, e.g. sheets of paper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses an automatic punching device and method applied to a PCB, which comprises a pre-alignment module, a transmission module, a second alignment module, a punching die module and a discharge die, wherein the second alignment module is arranged above the middle part of the punching die module, the discharge module is arranged at the right side of the punching die module at the right end of the second alignment module, the transmission module is connected at the left end of the second alignment module, the pre-alignment module is arranged below the transmission module, the pre-alignment module comprises a transmission roller, a center shooting mechanism, a module bottom plate and an alignment module, the center shooting mechanism is arranged on the module bottom plate, a target on the PCB is grabbed by a CCD (charge coupled device), the center distance is measured, whether the expansion and contraction value is within the range of a preset value is controlled, the PCB is moved by the second alignment module, so that the target on the PCB is superposed with a positioning target on the punching die module to complete, and the processing of a plurality of locating holes is once only accomplished with the die, the precision and the efficiency of punching a hole of very big promotion.
Description
Technical Field
The invention belongs to the technical field related to PCB processing, and particularly relates to automatic punching equipment and method applied to a PCB.
Background
With the continuous development of high-end electronics industry and 5G communication, the PCB industry is also developing at a high speed, future PCB circuits are developing in the direction of hyperfine, multilayer and customization, and the difficulty of the manufacturing process is higher and higher. The innovation and development of the PCB process can not avoid the introduction of a new process, the introduction of advanced equipment and the improvement of the automation degree. In the pressfitting process of PCB preparation, based on the continuous increase of PCB board pressfitting number of piles, the digital degree of traditional shooting machine equipment is low, can't do shortcomings such as breathing management and control to the PCB board, is unsuitable for the development trend of multilayer circuit board, and traditional shooting machine has also gradually been replaced to the piercing press, becomes the trend of follow-up development, and automatic piercing press has realized the requirement of high automation, digital industry 4.0, and the production quality also promotes by a wide margin simultaneously, needs to carry out drilling equipment in the PCB board course of working to operate.
The existing punching equipment has the following problems: the punching equipment does not have the function of measuring the center distance of the target on the PCB, so that a plurality of positioning holes cannot be punched at one time in mechanical positioning, the expansion and contraction management and control cannot be performed by a client, and the production efficiency is reduced.
Disclosure of Invention
The invention aims to provide automatic punching equipment and method applied to a PCB (printed circuit board), and aims to solve the problems that the superposition and alignment accuracy of a target on the PCB and a positioning target on a die stamping module set in the background technology is too low, a plurality of positioning holes cannot be machined by using a die once, and the accuracy and the efficiency are low.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic punching device applied to a PCB comprises a pre-alignment module, a transmission module, a second alignment module, a stamping die module and a discharge die, wherein the second alignment module is arranged above the middle part of the stamping die module, the right end of the second alignment module is arranged at the right side of the stamping die module, the left end of the second alignment module is connected with the transmission module, the pre-alignment module is arranged below the transmission module and comprises a transmission roller, a center-beating mechanism, a module bottom plate and an alignment module, the module bottom plate is provided with the center-beating mechanism, the middle part of the center-beating mechanism is provided with the alignment module, one side of the alignment module is provided with the transmission roller, the transmission module comprises an air cylinder, a guide rod, a transmission platform, a transmission rod, a drag chain, a servo motor, an adsorption device and a transmission belt, the transmission platform is provided with the transmission belt, be provided with the transmission pole on the transmission band, be provided with adsorption equipment on the transmission pole, the inboard bottom of transmission band is provided with servo motor, the right-hand member of transmission pole is provided with the tow chain, the left end below of transmission band is provided with the guide arm, the below of guide arm is provided with the cylinder, the die module includes last mould towards needle, counterpoint module motor cabinet, bed die, to module clamp plate, oil hydraulic cylinder, lower bolster, cope match-plate pattern and camera, the top of lower bolster is provided with the cope match-plate pattern, and the below of lower bolster is provided with the oil hydraulic cylinder, be provided with to the module clamp plate in the middle part space of lower bolster and cope match-plate pattern, be provided with the bed die to the top of module clamp plate, be provided with the camera to one side of module clamp plate, one side of camera is provided with the mould towards the needle, be provided with counterpoint module motor, Bottom plate, panel, power cylinder, motor, hold-in range and conveyer, the inboard of bottom plate is provided with power cylinder, the power cylinder outside is provided with the panel, the inboard one end of panel is provided with the cylinder, power cylinder's left end is connected with the hold-in range, one side of hold-in range is provided with conveyer, and conveyer's below is provided with the motor, counterpoint module, transmission module, second counterpoint module, die module and ejection of compact module all with external power source electric connection in advance.
Preferably, the number of the oil hydraulic cylinders is four, and the four oil hydraulic cylinders are respectively installed at four corners of the bottom of the lower template.
Preferably, the power roller is in transmission connection with a synchronous belt.
Preferably, the power roller is supported with the bottom plate through a transmission bracket.
Preferably, the automatic punching method applied to the PCB comprises the following steps:
s1, arranging a pre-alignment module which comprises a transmission roller, a center beating mechanism, a module bottom plate and an alignment module, moving the PCB to a preset position and finishing preliminary alignment;
s2, arranging a transmission module which comprises an air cylinder, a guide rod, a transmission platform, a transmission rod, a drag chain, a servo motor, an adsorption device and a transmission belt, clamping and jacking the PCB and then transmitting the PCB to a second alignment table;
s3, arranging a second alignment module comprising an alignment drive, an alignment table and a PCB clamping mechanism, and moving the PCB to perform accurate alignment;
s4, arranging a punching die set which comprises an upper punching pin, an alignment die set motor base, a lower die, a pair of die set pressing plates, an oil hydraulic cylinder, a lower die plate, an upper die plate and a camera, and completing the punching step after measuring the PCB;
s5, arranging a discharging module, and conveying the punched PCB out by a transmission system;
s6, power-on setting, namely, firstly, inputting the circuit board data into a computer, setting working parameters, and transmitting the PCB to a preset position by the pre-alignment module, and finishing preliminary positioning; the transmission module picks the PCB and then transmits the PCB to the second aligning module, the second aligning module fixes and levels the PCB, the target measuring center distance on the picked PCB is within the range of the set expansion and contraction value, the PCB is not judged to be unqualified within the range, the system directly reports the error or does not punch a hole and transmits the error or temporarily stores the error to the next procedure, the difference data of the target position on the PCB and the positioning target of the punching die module is calculated, the signal is transmitted to the drive of the second aligning module, the mobile circuit board is superposed with the positioning target on the punching die module, the accurate alignment is completed, the punching die module punches a hole on the PCB after the alignment is completed, the PCB is transmitted by the discharging module, and the punching procedure of the PCB is completed.
Compared with the prior art, the invention provides automatic punching equipment and method applied to a PCB, and the automatic punching equipment and method have the following beneficial effects:
according to the invention, the CCD is used for grabbing the target on the PCB, measuring the center distance, controlling whether the expansion and contraction value is within the range of a preset value, and then the PCB is moved by the second alignment module, so that the target on the PCB is superposed with the positioning target on the die stamping module, accurate alignment is completed, and the die stamping is used for completing the processing of a plurality of positioning holes at one time, so that the punching precision and efficiency are greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:
fig. 1 is a schematic structural diagram of an automatic punching apparatus and method applied to a PCB according to the present invention;
FIG. 2 is a schematic diagram of a die set according to the present invention;
FIG. 3 is a schematic structural diagram of a discharging module according to the present invention;
FIG. 4 is a schematic diagram of a transmission module according to the present invention;
FIG. 5 is a schematic diagram of a pre-alignment module according to the present invention;
in the figure: 1. a pre-alignment module; 11. a transfer drum; 12. a centering mechanism; 13. a module base plate; 14. an alignment module; 2. a transmission module; 21. a cylinder; 22. a guide bar; 23. a transport platform; 24. a transmission rod; 25. a drag chain; 26. a servo motor; 27. an adsorption device; 28. a conveyor belt; 3. a second alignment module; 4. a die stamping module; 41. punching a needle on an upper die; 42. an alignment module motor base; 43. a lower die; 44. pressing the die set; 45. an oil hydraulic cylinder; 46. a lower template; 47. mounting a template; 48. a camera; 5. a discharging module; 51. a drum; 52. a base plate; 53. a panel; 54. a powered roller; 55. a motor; 56. a synchronous belt; 57. a conveyor belt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the present invention provides a technical solution:
an automatic punching device applied to a PCB comprises a pre-alignment module 1, a transmission module 2, a second alignment module 3, a stamping die module 4 and a discharge die 5, wherein the second alignment module 3 is arranged above the middle part of the stamping die module 4, the discharge module 5 is arranged at the right side of the stamping die module 4 at the right end of the second alignment module 3, the transmission module 2 is connected with the left end of the second alignment module 3, the pre-alignment module 1 is arranged below the transmission module 2, the pre-alignment module 1 comprises a transmission roller 11, a centering mechanism 12, a module bottom plate 13 and an alignment module 14, the centering mechanism 12 is arranged on the module bottom plate 13, the alignment module 14 is arranged at the middle part of the centering mechanism 12, the transmission roller 11 is arranged at one side of the alignment module 14, the transmission module 2 comprises an air cylinder 21, a guide rod 22, a transmission platform 23, a transmission rod 24, a drag chain 25, a servo motor 26, an adsorption device 27 and a, the conveying platform 23 is provided with a conveying belt 28, the conveying belt 28 is provided with a conveying rod 24, the conveying rod 24 is provided with an adsorption device 27, the bottom of the inner side of the conveying belt 28 is provided with a servo motor 26, the right end of the conveying rod 24 is provided with a drag chain 25, the lower part of the left end of the conveying belt 28 is provided with a guide rod 22, the lower part of the guide rod 22 is provided with a cylinder 21, the stamping die module 4 comprises an upper stamping pin 41, an alignment module motor base 42, a lower die 43, a pair of die pressing plates 44, an oil hydraulic cylinder 45, a lower die 46, an upper die plate 47 and a camera 48, the upper part of the lower die plate 46 is provided with the oil hydraulic cylinder 45, the middle space between the lower die plate 46 and the upper die plate 47 is provided with the pair of die pressing plates 44, the top of the pair of die pressing plates 44 is provided with the lower die 43, one side of, be provided with counterpoint module motor cabinet 42 to the one end of module clamp plate 44, cylinder 51, bottom plate 52, panel 53, power cylinder 54, motor 55, hold-in range 56 and conveyer 57, the inboard of bottom plate 52 is provided with power cylinder 54, power cylinder 54 outside is provided with panel 53, the inboard one end of panel 53 is provided with cylinder 51, power cylinder 54's left end is connected with hold-in range 56, one side of hold-in range 56 is provided with conveyer 57, and conveyer 57's below is provided with motor 55, counterpoint module 1 in advance, transmission module 2, second counterpoint module 3, die module 4 and ejection of compact module 5 all with external power source electric connection.
The automatic punching equipment applied to the PCB comprises four oil hydraulic cylinders 45, wherein the four oil hydraulic cylinders 45 are respectively arranged at the four corners of the bottom of a lower template 46; the power roller 54 is in transmission connection with a synchronous belt 56; the power roller 54 is supported by the drive bracket and the base plate 52.
An automatic punching method applied to a PCB comprises the following steps:
s1, setting a pre-alignment module 1, which comprises a transmission roller 11, a center beating mechanism 12, a module bottom plate 13 and an alignment module 14, moving the PCB to a preset position and completing preliminary alignment;
s2, arranging a transmission module 2 which comprises an air cylinder 21, a guide rod 22, a transmission platform 23, a transmission rod 24, a drag chain 25, a servo motor 26, an adsorption device 27 and a transmission belt 28, clamping and jacking the PCB and then transmitting the PCB to a second alignment table;
s3, arranging a second alignment module 3 which comprises an alignment drive, an alignment table and a PCB clamping mechanism, and moving the PCB to perform accurate alignment;
s4, setting a die stamping module 4 which comprises an upper die stamping pin 41, an alignment module motor base 42, a lower die 43, a pair of module pressing plates 44, an oil hydraulic cylinder 45, a lower die plate 46, an upper die plate 47 and a camera 48, and completing the punching step after measuring the PCB;
s5, arranging a discharging module 5, and conveying the punched PCB out by a transmission system;
s6, power-on setting, namely, firstly, inputting the circuit board data into a computer, setting working parameters, and transmitting the PCB to a preset position by the pre-alignment module 1 to complete preliminary positioning; the transmission module 2 picks the PCB and then transmits the PCB to the second contraposition module 3, the second contraposition module 3 fixes and levels the PCB, pick whether the target measuring center distance on the PCB is in the range of the set expansion and contraction value, the PCB is not judged to be unqualified in the range, the system directly reports the error or does not punch a hole and transmits the error to the next procedure for temporary storage, the difference data of the target position on the PCB and the positioning target of the punching die module 4 is calculated, the signal is sent to the drive of the second contraposition module 3, the mobile circuit board is superposed with the positioning target on the punching die module 4, the accurate contraposition is completed, the punching die module 4 punches a hole on the PCB after the contraposition is completed, the PCB is transmitted by the discharging module 5, and the PCB punching procedure is completed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an automatic punching equipment for PCB board, includes counterpoint module (1), transmission module (2), second counterpoint module (3), die stamping module (4) and ejection of compact mould (5) in advance, its characterized in that: the middle part top of die stamping module (4) is provided with second counterpoint module (3), the right-hand member that the right-hand member of second counterpoint module (3) is located die stamping module (4) is provided with ejection of compact module (5), the left end of second counterpoint module (3) is connected with transmission module (2), the below of transmission module (2) is provided with counterpoint module (1) in advance, counterpoint module (1) in advance is including transmission cylinder (11), clap in mechanism (12), module bottom plate (13) and counterpoint module (14), be provided with on module bottom plate (13) and clap in mechanism (12), the middle part of clapping in mechanism (12) is provided with counterpoint module (14), one side of counterpoint module (14) is provided with transmission cylinder (11), transmission module (2) include cylinder (21), guide arm (22), transmission platform (23), transmission pole (24), Drag chain (25), servo motor (26), adsorption equipment (27) and transmission band (28), be provided with transmission band (28) on transmission platform (23), be provided with transmission pole (24) on transmission band (28), be provided with adsorption equipment (27) on transmission pole (24), the inboard bottom of transmission band (28) is provided with servo motor (26), the right-hand member of transmission pole (24) is provided with drag chain (25), the left end below of transmission band (28) is provided with guide arm (22), the below of guide arm (22) is provided with cylinder (21), die module (4) are including last mould towards needle (41), counterpoint module motor cabinet (42), bed die (43), to module clamp plate (44), oil hydraulic cylinder (45), lower bolster (46), cope match-plate (47) and camera (48), the top of lower bolster (46) is provided with cope match-plate (47), an oil hydraulic cylinder (45) is arranged below the lower template (46), a pair of module pressing plates (44) are arranged in the middle space of the lower template (46) and the upper template (47), a lower die (43) is arranged at the top of the pair of module pressing plates (44), a camera (48) is arranged on one side of the pair of module pressing plates (44), an upper die punching needle (41) is arranged on one side of the camera (48), a contraposition module motor base (42) is arranged at one end of the pair of module pressing plates (44), a roller (51), a bottom plate (52), a panel (53), a power roller (54), a motor (55), a synchronous belt (56) and a conveying belt (57) are arranged on the inner side of the bottom plate (52), a panel (53) is arranged outside the power roller (54), and a roller (51) is arranged at one end of the inner side of the panel (53), the left end of power cylinder (54) is connected with hold-in range (56), one side of hold-in range (56) is provided with conveyer (57), and the below of conveyer (57) is provided with motor (55), counterpoint module (1), transmission module (2), second counterpoint module (3), die stamping module (4) and ejection of compact module (5) all with external power source electric connection in advance.
2. The automatic punching equipment applied to the PCB according to claim 1, wherein: the number of the oil hydraulic cylinders (45) is four, and the four oil hydraulic cylinders (45) are respectively installed at the four corners of the bottom of the lower template (46).
3. The automatic punching equipment applied to the PCB according to claim 1, wherein: the power roller (54) is in transmission connection with the synchronous belt (56).
4. The automatic punching equipment applied to the PCB according to claim 1, wherein: the power roller (54) is supported with the bottom plate (52) through a transmission bracket.
5. The automatic punching method applied to the PCB is characterized by comprising the following steps of: the punching method comprises the following steps:
s1, arranging a pre-alignment module (1) which comprises a transmission roller (11), a centering mechanism (12), a module bottom plate (13) and an alignment module (14), and moving the PCB to a preset position to complete preliminary alignment;
s2, a transmission module (2) is arranged, and the transmission module comprises an air cylinder (21), a guide rod (22), a transmission platform (23), a transmission rod (24), a drag chain (25), a servo motor (26), an adsorption device (27) and a transmission belt (28), and is used for clamping and jacking the PCB and then transmitting the PCB to a second alignment platform;
s3, arranging a second alignment module (3) which comprises an alignment drive, an alignment table and a PCB clamping mechanism, and moving the PCB to perform accurate alignment;
s4, arranging a punching die set (4) which comprises an upper punching needle (41), an alignment die set motor base (42), a lower die (43), a pair of die set pressing plates (44), an oil hydraulic cylinder (45), a lower die plate (46), an upper die plate (47) and a camera (48), and completing the punching step after measuring the PCB;
s5, arranging a discharging module (5), and conveying the punched PCB out by a transmission system;
s6, power-on setting, namely, firstly, inputting the circuit board data into a computer, setting working parameters, and transmitting the PCB to a preset position by the pre-alignment module (1) to finish primary positioning; the PCB is transmitted to the second aligning module (3) after being grabbed by the transmission module (2), the second aligning module (3) fixes and levels the PCB, whether the target measuring center distance on the grabbed PCB is within the range of the set expansion and contraction value or not is grabbed, the PCB is judged to be unqualified without being within the range, the system directly reports the error or does not punch a hole to transmit to the next procedure for temporary storage, the difference data between the target position on the PCB and the positioning target of the punching die module (4) is calculated, the signal is transmitted to the driving of the second aligning module (3), the mobile circuit board is superposed with the positioning target on the punching die module (4) to complete accurate alignment, the punching die module (4) punches a hole on the PCB after the alignment is completed, the PCB is transmitted by the discharging module (5), and the PCB punching procedure is completed.
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CN202010625595.5A CN111873056A (en) | 2020-07-02 | 2020-07-02 | Automatic punching equipment and method applied to PCB |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120100510A (en) * | 2011-03-04 | 2012-09-12 | 전익희 | Pressing apparatus of printed circuit board |
CN105346988A (en) * | 2015-11-23 | 2016-02-24 | 东莞王氏港建机械有限公司 | Automatic board clapping and pre-aligning machine |
CN206136467U (en) * | 2016-10-26 | 2017-04-26 | 东莞王氏港建机械有限公司 | Bloated shrinkage rate's of circuit board mark device |
CN108705604A (en) * | 2018-08-29 | 2018-10-26 | 东莞王氏港建机械有限公司 | A kind of inner plating punching die and perforating press automatically selecting red needle |
CN108724322A (en) * | 2018-07-17 | 2018-11-02 | 东莞王氏港建机械有限公司 | It is a kind of can automatic position adjusting function polyphaser aligning punching machine |
CN208575952U (en) * | 2018-07-10 | 2019-03-05 | 东莞王氏港建机械有限公司 | A kind of regulating device of cooperation CCD camera contraposition punching |
CN109922604A (en) * | 2019-04-30 | 2019-06-21 | 深圳市铭鸿捷技术有限公司 | A kind of pre- aligning structure of circuit inner cord perforating press |
-
2020
- 2020-07-02 CN CN202010625595.5A patent/CN111873056A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120100510A (en) * | 2011-03-04 | 2012-09-12 | 전익희 | Pressing apparatus of printed circuit board |
CN105346988A (en) * | 2015-11-23 | 2016-02-24 | 东莞王氏港建机械有限公司 | Automatic board clapping and pre-aligning machine |
CN206136467U (en) * | 2016-10-26 | 2017-04-26 | 东莞王氏港建机械有限公司 | Bloated shrinkage rate's of circuit board mark device |
CN208575952U (en) * | 2018-07-10 | 2019-03-05 | 东莞王氏港建机械有限公司 | A kind of regulating device of cooperation CCD camera contraposition punching |
CN108724322A (en) * | 2018-07-17 | 2018-11-02 | 东莞王氏港建机械有限公司 | It is a kind of can automatic position adjusting function polyphaser aligning punching machine |
CN108705604A (en) * | 2018-08-29 | 2018-10-26 | 东莞王氏港建机械有限公司 | A kind of inner plating punching die and perforating press automatically selecting red needle |
CN109922604A (en) * | 2019-04-30 | 2019-06-21 | 深圳市铭鸿捷技术有限公司 | A kind of pre- aligning structure of circuit inner cord perforating press |
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Application publication date: 20201103 |