CN111843622B - Grinding method and grinding machine - Google Patents
Grinding method and grinding machine Download PDFInfo
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- CN111843622B CN111843622B CN202010321065.1A CN202010321065A CN111843622B CN 111843622 B CN111843622 B CN 111843622B CN 202010321065 A CN202010321065 A CN 202010321065A CN 111843622 B CN111843622 B CN 111843622B
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 239000004575 stone Substances 0.000 claims abstract description 20
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 238000007670 refining Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007730 finishing process Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/35—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/37—Single-purpose machines or devices for grinding rolls, e.g. barrel-shaped rolls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The grinding method of the workpiece comprises the following steps: rotating a grinding wheel having an elastic grinding layer provided on the outer periphery of a core, and bringing the grinding wheel into contact with the workpiece. The grinding method further comprises the following steps: detecting the thickness of the grinding stone layer, calculating the deformation amount of the grinding stone layer when a predetermined stress is applied to the workpiece based on the thickness detected by the detection, and grinding the workpiece so that the grinding wheel cuts into the deformation amount relative to the workpiece. The present disclosure provides a grinding method capable of performing high-precision grinding by eliminating the influence of thickness variation of a grinding layer of a grinding wheel.
Description
Technical Field
The present disclosure relates to a grinding method and a grinding machine.
Background
Conventionally, in a grinding machine, a workpiece is transversely polished by applying cutting while rotating a grinding wheel having a grinding stone layer made of an elastic grinding stone provided on the outer periphery of a core (for example, refer to japanese patent application laid-open No. 2010-139032). The elastic grindstone is a grinding wheel in which the binder is composed of an elastic material. Accordingly, the grinding wheel is cut into the workpiece to deform the grindstone layer, and the workpiece is polished by traversing the deformed grindstone layer while stress is applied to the workpiece.
However, if grinding is repeatedly performed using a grinding wheel, the grinding stone layer wears and the thickness gradually decreases. Therefore, when the workpiece is cut by the same amount, the stress acting on the workpiece increases with a decrease in the thickness of the diamond layer. Therefore, in the case of using a grinding wheel in which the grindstone layer is hardly worn and in the case of using a grinding wheel in which the grindstone layer is worn to a considerable extent, a difference occurs in the magnitude of stress acting from the grindstone layer on the workpiece in finish grinding. Further, when the magnitudes of stresses acting on the respective workpieces are different at the time of finish grinding, there is a problem that variations occur in surface roughness. That is, there is a problem that when the stress applied to the workpiece is too small, the desired surface roughness cannot be obtained, whereas when the stress is too large, the feed mark is noticeable on the surface of the workpiece.
Disclosure of Invention
The present disclosure provides a grinding method and a grinding machine capable of performing high-precision grinding by eliminating the influence of thickness variation of a grinding layer of a grinding wheel.
According to one aspect of the present disclosure, a method of grinding a workpiece includes: rotating a grinding wheel having an elastic grinding layer provided on the outer periphery of a core; and contacting the grinding wheel with the workpiece.
The grinding method according to the above aspect further includes: detecting the thickness of the grinding layer; calculating a deformation amount of the stone layer when a predetermined stress is applied to the workpiece based on the thickness detected by the detection; and grinding the workpiece so that the grinding wheel cuts the workpiece into the deformation.
According to this method, the deformation amount of the grindstone layer when a predetermined stress is applied to the workpiece is calculated based on the thickness of the grindstone layer, and the workpiece is ground by the amount of the cutting deformation amount by the grinding wheel, thereby achieving an effect of enabling grinding with high accuracy at a required predetermined stress.
According to another aspect of the present disclosure, a grinding machine includes a grinding wheel having an elastic grinding layer provided on an outer periphery of a core, and the grinding machine is configured to grind a workpiece by bringing the grinding wheel into contact with the workpiece while rotating the grinding wheel.
The grinding machine according to the above aspect further includes a thickness detection unit, a deformation amount calculation unit, and a grinding control unit. The thickness detecting section is configured to detect a thickness of the diamond layer, the deformation calculating section is configured to calculate a deformation of the diamond layer when a predetermined stress is applied to the workpiece based on the thickness detected by the thickness detecting section, and the grinding control section is configured to grind the workpiece so that the grinding wheel cuts into the workpiece by a magnitude of the deformation.
According to this configuration, since the deformation amount of the grindstone layer when a predetermined stress is applied to the workpiece is calculated based on the thickness of the grindstone layer, and the workpiece is ground by the amount of the cutting deformation amount by the grinding wheel, there is an effect that grinding with high accuracy can be performed at a required predetermined pressure.
Drawings
Fig. 1 is a plan view showing an overall configuration of a grinding machine according to an embodiment.
Fig. 2 is a flowchart showing an overall flow of the grinding method according to the embodiment.
Fig. 3 is a flowchart showing a flow of a process of detecting the thickness of the abrasive layer.
Fig. 4 is a plan view schematically showing a case of detecting contact of the grinding wheel with the workpiece.
Fig. 5 is a plan view schematically showing the amount of deformation of the grinding wheel into the grinding stone layer with respect to the workpiece.
Fig. 6 is a plan view schematically showing the case of performing finish grinding by cutting the grinding wheel into the size of deformation of the grinding stone layer.
Fig. 7 is a plan view schematically showing a case where the cutting amount of the grinding wheel is corrected according to the deflection amount of the workpiece and the cutting is performed in the modification.
Detailed Description
Hereinafter, embodiments of a grinding method and a grinding machine for grinding a workpiece W (the diameter of the workpiece W is not reduced) according to the present disclosure will be described with reference to the accompanying drawings. Before this grinding, the diameter-reduced grinding of the workpiece W is performed in another grinding machine, and at the end of the grinding, the workpiece W is conveyed to the grinding machine to grind the diameter of the workpiece W.
(1. Integral Structure of grinding machine)
The overall structure of an embodiment of a grinding machine 1 that performs the grinding method of the present disclosure will be described with reference to fig. 1. Fig. 1 is a plan view showing the overall structure of the grinding machine 1. The grinding machine 1 is a cylindrical grinding machine, and is a machine tool that performs grinding by relatively moving a grinding wheel 11 with respect to a workpiece W supported by a bed 2. The grinding machine 1 includes a grinding wheel table 10, a Z-axis feeding device 50, a workpiece supporting device 20, an X-axis feeding device 60, and a control device 40.
The grinding wheel stand 10 has a grinding wheel 11 and a grinding wheel shaft 12. The grinding wheel table 10 is provided with a grinding wheel rotation driving device 15 for driving the grinding wheel 11 for grinding the workpiece W to rotate. The grinding wheel shaft 12 is a rotation shaft of the grinding wheel 11 rotatably supported by the grinding wheel table 10 via a bearing and rotated at a predetermined rotation speed by the grinding wheel rotation driving device 15. An AE sensor 13 electrically connected to the control device 40 is mounted inside the front end portion of the grinding wheel table 10 near the grinding wheel shaft 12. The AE sensor 13 is a sensor that detects a characteristic acoustic emission (hereinafter referred to as "AE") such as an acoustic wave generated when the workpiece W contacts the grinding wheel 11.
The grinding wheel 11 is composed of a core 111 and a grindstone layer 112. In the present embodiment, the core 111 is a metal core such as iron formed in a disk shape, and is detachably coupled to the grinding wheel shaft 12 by a bolt or the like. The grinding layer 112 is a portion of the outer periphery of the grinding surface 112a that is formed to contact the workpiece W during grinding, and is made of an elastic grinding stone for superfinishing, which is made of an elastic material as a binder. The abrasive layer 112 is configured by bonding abrasive grains of diamond, CBN, or the like to the outer periphery of the core 111 with a binder (bond) such as a thermosetting resin, for example. For example, the abrasive layer 112 may have an elastic modulus of 3000MPa and an outer diameterAbrasive grains having a thickness of 10mm to 32mm and a particle size of # 1000. The binder may be a two-part curable resin.
The grinding wheel table 10 is disposed on the upper surface of the bed 2, and is guided and supported by a rail, not shown, extending in a direction orthogonal to the central axis AW of the grinding wheel 11. The grinding wheel 11 is moved in the Z-axis direction (up-down direction in fig. 1) which is the radial direction of the workpiece W and is parallel to the upper surface of the bed 2 by a Z-axis feeding device 50 composed of a Z-axis motor 51 and a Z-axis ball screw (not shown). The Z-axis motor 51 and the grinding wheel rotation driving device 15 are controlled by the control device 40 to move the grinding wheel 11 in the Z-axis direction and to rotate the grinding wheel 11.
The workpiece support device 20 rotatably supports both ends of the workpiece W about a central axis of the cylindrical workpiece W. The workpiece support device 20 includes a table 21, a headstock 22, a tailstock 23, a chuck 24, and a center 25. The table 21 is disposed on the upper surface of the bed 2 of the grinding machine 1, and is guided and supported by a rail, not shown, extending in the direction of the central axis AW of the grinding wheel 11. The table 21 is moved in the X-axis direction (left-right direction in fig. 1) which is the axial direction of the workpiece W and is parallel to the upper surface of the bed 2 by an X-axis feeding device 60 composed of an X-axis motor 61 and an X-axis ball screw (not shown).
The headstock 22 and the tailstock 23 are disposed to face the upper surface of the table 21, and support one end or the other end of the workpiece W. The headstock 22 is configured to include a spindle 27 driven to rotate by a spindle rotation driving device 26, and to rotate the workpiece W by driving the spindle 27 to rotate. The spindle rotation driving device 26 is controlled by the control device 40 to control the rotational speed, rotational phase, and the like of the spindle 27. The spindle 27 is provided with a chuck 24 for holding one end of the workpiece W, and the tailstock 23 is provided with a center 25 for supporting the other end of the workpiece W. Thus, both ends of the workpiece W are supported by the chuck 24 and the center 25 so that the workpiece W can rotate about an axis parallel to the moving direction (X-axis direction) of the table 21, and the workpiece W is driven to rotate by the spindle rotation driving device 26.
The control device 40 is a CNC control device configured by a computer having CPU, ROM, RAM, a hard disk, and the like, and is capable of performing numerical control by executing a machining program to perform grinding machining on the workpiece W. The control device 40 is connected to the X-axis feeding device 60, the Z-axis feeding device 50, the grinding wheel rotation driving device 15 that drives the grinding wheel shaft 12 to rotate, and the spindle rotation driving device 26 that drives the spindle 27 to rotate, and is connected to various sensors such as the AE sensor 13, processes signals from the sensors, and controls the respective units. The control device 40 further includes an input unit for inputting a machining program and the like, and an output unit (not shown) for outputting processing contents, processing conditions and the like.
(2. Flow of grinding method)
Next, a grinding method according to the present embodiment will be described with reference to fig. 2 to 6. Fig. 2 is a flowchart showing the overall flow of the grinding method. Fig. 3 is a flowchart showing a flow of a process of detecting the thickness of the abrasive layer 112. Fig. 4 is a plan view schematically showing a case where contact of the grinding wheel 11 with the workpiece W is detected. Fig. 5 is a plan view schematically showing the magnitude of deformation of the grinding wheel 11 with respect to the workpiece W into the grinding stone layer 112. The broken line in fig. 5 shows the outer shape of the grinding wheel 11 at the contact position before cutting. Fig. 6 is a plan view schematically showing a case of performing vertical grinding by cutting the grinding wheel 11 into the size of deformation of the grinding stone layer 112 with respect to the workpiece W.
The grinding method according to the present embodiment is a method of performing superfinishing on a workpiece W using a grinding machine 1, and includes a thickness detection step S1 (S represents a step, and the same applies to other steps), a first deformation amount calculation step S2, a first finish grinding step S3, a second deformation amount calculation step S4, and a second finish grinding step S5, as shown in the flowchart of fig. 2. Before the thickness detection step S1, the workpiece W and the grinding wheel 11 are rotated at a predetermined rotational speed. The first deformation amount calculating step S2 and the second deformation amount calculating step S4 correspond to the deformation amount calculating step of the present disclosure, the first finish grinding step S3 corresponds to the grinding step and the first grinding step, and the second finish grinding step S5 corresponds to the grinding step and the second grinding step. The control device 40 functions as a thickness detection unit by executing the thickness detection step S1, functions as a deformation calculation unit by executing the first deformation amount calculation step S2 and the second deformation amount calculation step S4, and functions as a grinding control unit by executing the first grinding step S3 and the second grinding step S5.
The thickness detection step S1 is a step of detecting the thickness of the grindstone layer 112 of the grinding wheel 11. Specifically, the thickness detection step S1 is performed according to the flow shown in the flowchart of fig. 3. First, in S11, while the table 21 is stopped at a position where the workpiece W faces the grinding wheel 11, the grinding wheel table 10 on which the grinding wheel 11 is mounted is moved forward from a predetermined retracted position in the Z-axis direction toward the workpiece W at a predetermined speed. In S12, it is determined whether AE is detected, and the forward movement of S11 is continued until AE is detected (S12: NO).
When AE is detected in S12 (S12: yes), the advancing movement of the grinding wheel table 10 is stopped, and in S13, the mechanical coordinates M at that time are obtained from a Z-axis encoder incorporated in the Z-axis motor 51. The mechanical coordinates M are current position coordinates in the Z-axis direction of the grinding wheel table 10 sent from the Z-axis encoder to the control device 40 and managed by the control device 40. When the position coordinate in the Z-axis direction of the central axis of the workpiece W is set to 0, the current position coordinate in the Z-axis direction of the grinding wheel table 10 is a value indicating the distance from the central axis of the workpiece W to the central axis AW of the grinding wheel 11. That is, by detecting AE generated by contact of the workpiece W with the grinding wheel 11 by the AE sensor 13, the position at which contact with the workpiece W is started can be determined as the current position of the grinding wheel 11. The AE sensor 13 is provided on the grinding wheel table 10 side, particularly, at a position close to the grinding wheel 11, so the AE sensor 13 can detect AE with high accuracy. After S13, the grinding wheel table 10 is retracted by a predetermined amount.
Next, in S14, the thickness iota of the stone layer 112 is calculated. The relationship between the thickness iota of the grindstone layer 112 and these parameters is shown in fig. 4, where M is the mechanical coordinate in the Z-axis direction, D1 is the workpiece diameter (the radius of the workpiece W) (which is the final diameter of the workpiece W ground by another grinder is input), and D2 is the core diameter (the radius of the core 111 of the grinding wheel 11). That is, the thickness iota of the diamond layer 112 is obtained by subtracting the core diameter D2 and the work diameter D1 from the mechanical coordinates M. Thus, the thickness iota of the abrasive layer 112 is calculated as iota=m-D2-D1.
Next, in the first deformation amount calculating step of S2, the deformation amount λ1 of the grindstone layer 112 when the grinding wheel 11 applies a predetermined first stress to the workpiece W is calculated based on the thickness iota detected in the thickness detecting step S1. The first stress σ1 is a stress value for finish grinding for reducing variations in surface roughness between the plurality of workpieces W, and is a value set by being input to the control device 40. Here, when the young's modulus of the diamond layer 112 is denoted by e=σ/ε, and the stress is denoted by σ, and the deformation ratio is denoted by ε. When the deformation amount is λ and the thickness of the diamond layer 112 is iota, the deformation ratio ε is represented by ε=λ/iota. Also, according to these two formulas, expressed as e=σ/(λ/iota). Thus, the first deformation λ1 is calculated by λ1= (σ1/E) ×iota using the first stress σ1, the thickness iota of the grindstone layer 112, and the young's modulus E.
Next, in the first grinding step of S3, the workpiece W is subjected to vertical grinding by cutting in the first deformation λ1 calculated in the first deformation amount calculating step S2 as the cutting amount of the grinding wheel 11. That is, after S13, the grinding wheel 11 is temporarily retracted to a predetermined position, and then advanced in the Z-axis direction at a predetermined finishing cutting speed to cut the workpiece W by the deformation λ1 (see fig. 5), and the table 21 is traversed in the X-axis direction to perform the first finish grinding between the first end P1 and the second end P2 of the workpiece W (see fig. 6). In the first finish grinding step S3, the longitudinal grinding is performed at a predetermined first stress σ1, thereby reducing the variation in the surface roughness of the workpiece W. After S3, the grinding wheel table 10 is moved backward by a predetermined amount, the table 21 is traversed in the X-axis direction, and the first end P1 of the workpiece W is brought into correspondence with the left end (left end face) of the grinding wheel 11. In this case, the longitudinal grinding is performed only once. The grinding is performed during the forward travel of the table, and the grinding is not performed during the return travel.
Next, in the second deformation amount calculating step of S4, the deformation amount λ2 of the grindstone layer 112 when the grinding wheel 11 applies a predetermined second stress to the workpiece W is calculated based on the thickness iota detected in the thickness detecting step S1. The second stress σ2 is a stress value for fine grinding for reducing the feed mark, and is a value set by being input to the control device 40. The second stress σ2 is set to a value smaller than the first stress. The second deformation λ2 is calculated by λ2= (σ2/E) ×i using the second stress σ2, the thickness iota of the grindstone layer 112, and the young's modulus, E. Since the first stress σ1 and the second stress σ2 are in a relationship of σ2< σ1, the first deformation λ1 and the second deformation λ2 are in a relationship of λ2< λ1.
Next, in the second grinding step of S5, the workpiece W is subjected to vertical grinding by cutting in the second deformation λ2 calculated in the second deformation calculation step S4 as the cut amount of the grinding wheel 11. That is, in a state in which the grinding wheel 11 is advanced in the Z-axis direction at a predetermined finishing cutting speed to cut the workpiece W by the deformation λ2 (see fig. 5), the table 21 is traversed in the X-axis direction to perform the second finish grinding between the first end P1 and the second end P2 of the workpiece W (see fig. 6). In the second finish grinding step S5, the longitudinal grinding is performed at the predetermined second stress σ2, whereby the feed mark on the surface of the workpiece W can be reduced. In this case, the longitudinal grinding is performed only once. The grinding is performed during the forward travel of the table, and the grinding is not performed during the return travel.
(3. Summarizing)
As described above, according to the present embodiment, the deformation amount λ of the stone layer 112 when a predetermined stress is applied to the workpiece W is calculated based on the thickness iota of the stone layer 112, and the grinding wheel 11 is made to cut into the deformation amount λ (λ1 or λ2) with respect to the workpiece W to perform the finish grinding, so that the effect of performing the finish grinding with high accuracy at a required predetermined pressure is obtained.
In addition, the present embodiment includes: a first deformation amount calculation step S2 of calculating a first deformation amount λ1 of the grindstone layer 112 when a first stress σ1 capable of reducing variation in surface roughness is applied to the workpiece W, and a second deformation amount calculation step S4 of calculating a second deformation amount λ2 of the grindstone layer 112 when a second stress σ2 smaller than the first stress σ1 and capable of reducing a feed mark is applied to the workpiece W. Further comprises: a first grinding step S3 of grinding the grinding wheel 11 by cutting into the workpiece W by the first deformation amount λ1, and a second grinding step S5 of grinding the grinding wheel 11 by cutting into the workpiece W by the second deformation amount λ2 after the first grinding step S3.
According to this method, by performing the first finishing process S3, the variation in the surface roughness of the workpiece W can be reduced, and by performing the second finishing process S5 after the first finishing process S3, the feed mark can be reduced.
In the present embodiment, the thickness detection step S1 includes: the polishing method includes contact detection steps S11 to S12 of relatively moving at least one of the grinding wheel 11 and the workpiece W in a direction approaching each other and detecting contact between the grinding wheel 11 and the workpiece W by the AE sensor 13, a contact position acquisition step S13 of acquiring mechanical coordinates M as contact position information indicating a relative position between the grinding wheel 11 and the workpiece W when contact is detected in the contact detection steps S11 to S12, and a thickness calculation step S14 of calculating a thickness iota of the abrasive layer 112 based on the contact position information (mechanical coordinates M), diameter information of the workpiece W (workpiece diameter D1), and diameter information of the core 111 (core diameter D2).
According to this method, with the conventional structure of the grinding machine 1, the thickness iota of the grinding stone layer 112 can be accurately calculated based on the mechanical coordinates M acquired by the control device 40 when the grinding wheel 11 is brought into contact with the workpiece W, and the workpiece diameter D1 and the core diameter D2 managed by the control device 40.
(4. Modification)
The present disclosure is not limited to the above embodiments, and various modifications may be made without departing from the spirit of the present disclosure. In the above embodiment, the first refining step S3 is performed after the first deformation amount calculating step S2, and the second deformation amount calculating step S4 is performed after that, but the present invention is not limited thereto. After the first deformation amount calculation step S2 and the second deformation amount calculation step S4 are performed, the first refining step S3 and the second refining step S5 may be performed.
In the above embodiment, the refining step is performed in two stages, i.e., the first refining step S3 and the second refining step S5, but the present invention is not limited thereto. The finish grinding may be performed in only one of the first finish grinding step S3 and the second finish grinding step S5, or the stress applied to the workpiece in each finish grinding step may be changed and set according to the purpose. Further, if necessary, the polishing step may be performed by adding another polishing step in which the stress applied to the workpiece is different.
In the case where the workpiece W is a long cylindrical body such as a roll, and the grinding wheel 11 is deflected in the axial direction due to the cutting-in, the cutting-in amount of the grinding wheel 11 may be corrected in the finish grinding step (the first finish grinding step S3 and the second finish grinding step S5) according to the deflection amount t of the workpiece W. Fig. 7 is a plan view schematically showing a case where the cutting amount of the grinding wheel 11 is corrected according to the deflection amount of the workpiece W in the modification. As shown in fig. 7, a value λ+t (λ1+t or λ 2+t) obtained by adding the deflection t of the workpiece W to the deflection λ (λ1 or λ2) of the grinding wheel 11 is used as a cutting amount to perform cutting in the Z-axis direction to perform vertical grinding, whereby a smoother surface of the workpiece W can be obtained. In this case, the deflection t of the workpiece W is a value calculated in advance based on the elastic modulus, length, diameter, and longitudinal position of the stress application of the workpiece W.
In the above embodiment, the contact between the grinding wheel 11 and the workpiece W is detected by the AE sensor 13, but the contact detection may be performed by a detection means other than the AE sensor 13. For example, the contact detection may be performed by detecting a change in the driving force of the grinding wheel rotation driving device 15 for driving the grinding wheel shaft 12 to rotate by using a galvanometer. Alternatively, the contact detection may be performed by detecting a change in the driving force of the spindle rotation driving device 26 for driving the spindle 27 to rotate by using a galvanometer.
In the above embodiment, the cylinder lapping for grinding the outer periphery of the workpiece W by rotating the workpiece W has been described, but the disclosure may be applied to a plane lapping for conveying a flat plate-like workpiece W in the horizontal direction by rotating a disk-like grinding wheel around the horizontal axis.
Claims (6)
1. A grinding method is a grinding method of a workpiece, and comprises the following steps:
Rotating a grinding wheel having a grinding stone layer at an outer periphery of a core, wherein the grinding stone layer has elasticity; and
Bringing the grinding wheel into contact with the workpiece,
The grinding method is characterized in that,
The grinding method further comprises the following steps:
detecting the thickness of the grindstone layer;
Calculating a deformation amount of the grindstone layer when a predetermined stress is applied to the workpiece, based on the thickness detected by the detection; and
The workpiece is ground such that the grinding wheel cuts into the workpiece by the amount of deformation.
2. A grinding method according to claim 1, characterized in that,
The calculation of the deformation amount includes:
Calculating a first deformation of the abrasive layer when a first stress is applied to the workpiece; and
Calculating a second deformation of the stone layer when a second stress smaller than the first stress is applied to the workpiece,
The grinding includes:
Performing a first grinding operation such that the grinding wheel cuts into the workpiece by the first deformation amount; and
After the first grinding, a second grinding is performed such that the grinding wheel cuts into the workpiece by the second deformation amount.
3. A grinding method according to claim 1, characterized in that,
The detecting of the thickness includes:
detecting contact between the grinding wheel and the workpiece by relatively moving at least one of the grinding wheel and the workpiece in a direction in which the grinding wheel and the workpiece approach each other;
Acquiring contact position information indicating a relative position between the grinding wheel and the workpiece when the contact is detected by the detection of the contact; and
The thickness of the abrasive layer is calculated based on the contact position information, the diameter information of the workpiece, and the diameter information of the core.
4. A grinding method according to claim 2, characterized in that,
The detecting of the thickness includes:
detecting contact between the grinding wheel and the workpiece by relatively moving at least one of the grinding wheel and the workpiece in a direction in which the grinding wheel and the workpiece approach each other;
Acquiring contact position information indicating a relative position between the grinding wheel and the workpiece when the contact is detected by the detection of the contact; and
The thickness of the abrasive layer is calculated based on the contact position information, the diameter information of the workpiece, and the diameter information of the core.
5. A grinding method according to any one of claims 1 to 4, characterized in that,
The grinding includes modifying a plunge of the grinding wheel based on a deflection of the workpiece.
6. A grinding machine is characterized by comprising:
A grinding wheel having a grinding stone layer at an outer circumference of a core, wherein the grinding stone layer has elasticity;
a thickness detection unit;
A deformation amount calculation unit; and
A grinding control part, which is used for controlling the grinding,
The grinding machine is configured to grind a workpiece by bringing the grinding wheel into contact with the workpiece while rotating the grinding wheel,
The thickness detecting section is configured to detect a thickness of the grindstone layer,
The deformation amount calculating unit is configured to calculate the deformation amount of the diamond layer when a predetermined stress is applied to the workpiece based on the thickness detected by the thickness detecting unit,
The grinding control unit is configured to grind the workpiece such that the grinding wheel cuts the workpiece into the deformation amount.
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| JP2019081826A JP7326843B2 (en) | 2019-04-23 | 2019-04-23 | Grinding method and grinder |
| JP2019-081826 | 2019-04-23 |
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| CN (1) | CN111843622B (en) |
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| CN113752105B (en) * | 2021-09-26 | 2022-08-05 | 大连理工大学 | Outer cylindrical surface polishing device and using method |
| CN114473658A (en) * | 2021-12-24 | 2022-05-13 | 大连德迈仕精密科技股份有限公司 | Rotor shaft polishing device and polishing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117749B1 (en) * | 1970-12-29 | 1976-06-04 | ||
| JPH05162069A (en) * | 1991-12-11 | 1993-06-29 | Matsushita Electric Ind Co Ltd | Grinding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2552537B2 (en) * | 1987-12-01 | 1996-11-13 | セイコー精機 株式会社 | Control method for grinding machine equipped with spindle device with bending detection means |
| JPH07256542A (en) * | 1994-03-18 | 1995-10-09 | Nisshin Steel Co Ltd | Polishing device for workpiece having circular section |
| JP4159672B2 (en) * | 1998-09-18 | 2008-10-01 | 株式会社シンク・ラボラトリー | Grinding wheel grinding method for cylindrical body and grinding wheel replacement time detection method |
| JP5441398B2 (en) * | 2008-12-15 | 2014-03-12 | Ｎｔｎ株式会社 | Machine part and its super finishing method |
| CN105690209B (en) * | 2016-02-03 | 2017-09-29 | 河北工业大学 | A kind of large-scale curved grinding self-adaptation control method |
| JP6972555B2 (en) * | 2017-01-06 | 2021-11-24 | 株式会社ジェイテクト | Grinding equipment and grinding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117749B1 (en) * | 1970-12-29 | 1976-06-04 | ||
| JPH05162069A (en) * | 1991-12-11 | 1993-06-29 | Matsushita Electric Ind Co Ltd | Grinding device |
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| CN111843622A (en) | 2020-10-30 |
| JP2020179432A (en) | 2020-11-05 |
| JP7326843B2 (en) | 2023-08-16 |
| DE102020110763A1 (en) | 2020-10-29 |
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