CN111834271A - Wafer batch conveying mechanism - Google Patents
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- CN111834271A CN111834271A CN202010964829.9A CN202010964829A CN111834271A CN 111834271 A CN111834271 A CN 111834271A CN 202010964829 A CN202010964829 A CN 202010964829A CN 111834271 A CN111834271 A CN 111834271A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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Abstract
The embodiment of the invention provides a wafer batch conveying mechanism which comprises a machine base, a wafer box discharging device and a wafer carrying device, wherein a first placing position for placing a wafer box and a second placing position for placing a wafer are arranged on the machine base; the wafer box discharging device is arranged on the base corresponding to the first placing position and used for taking out wafers from the wafer box; the wafer carrying device is arranged on the base corresponding to the wafer box discharging device and used for carrying the wafer taken out by the wafer box discharging device to the second placing position. The wafer batch transmission mechanism provided by the embodiment of the invention can take out the wafers from the wafer box in batch through the wafer box taking-out device and can transmit the wafers in batch through the wafer carrying device, thereby improving the transmission efficiency of the wafers.
Description
Technical Field
The invention relates to the technical field of semiconductor auxiliary equipment, in particular to a wafer batch conveying mechanism.
Background
In the semiconductor industry, batch processing of wafers is required in processes such as cleaning, and equipment capable of batch cassette unloading and conveying of wafers is required, however, the automation degree of the existing mechanism for cassette unloading and conveying of wafers is low, and the conveying efficiency of wafers is low.
Disclosure of Invention
The embodiment of the invention provides a wafer batch conveying mechanism, and aims to design a mechanism capable of carrying out batch box discharging and conveying on wafers so as to improve the conveying efficiency of the wafers.
The embodiment of the invention provides a wafer batch conveying mechanism, which comprises:
the wafer cassette comprises a machine base, wherein a first placing position for placing a wafer cassette and a second placing position for placing a wafer are arranged on the machine base;
the wafer box discharging device is arranged on the base corresponding to the first placing position and used for taking out wafers from the wafer box; and the number of the first and second groups,
and the wafer carrying device is arranged on the base corresponding to the wafer box discharging device and is used for carrying the wafer taken out by the wafer box discharging device to the second placing position.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, the first placing position is used for placing the wafer box with the large port upwards;
the wafer box discharging device comprises a wafer lifting unit and a lifting driving unit;
the wafer lifting unit is arranged on the machine base in a vertically moving mode, and the lifting driving unit is used for driving the wafer lifting unit to vertically move;
the wafer lifting unit is arranged corresponding to the first placing position and used for lifting the wafer in the wafer box from the bottom when the wafer lifting unit moves upwards and lifting the wafer out of the box.
According to one embodiment of the invention, the wafer batch transfer mechanism comprises a lifting drive unit and a first linear module.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, a plurality of lifting clamping grooves which are matched with the shape of the wafer and have upward notches are formed at the top of the wafer lifting unit at intervals, and the plurality of lifting clamping grooves are used for clamping and limiting the bottoms of a plurality of wafers in the wafer box respectively.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, two parallel bosses extending along the interval direction of a plurality of lifting clamping grooves are convexly arranged at the top of the wafer lifting unit, and the two bosses are arranged at intervals in the direction vertical to the extension direction of the bosses; each lift draw-in groove is including setting up respectively in two half grooves on the boss.
According to the wafer batch-transferring mechanism of one embodiment of the present invention, a first mounting seat is disposed on the base, the top of the first mounting seat forms the first placement position, and the wafer discharging device is disposed on the first mounting seat, wherein:
the first mounting seat is rotationally arranged on the base along an up-down axis, and a rotation driving unit for driving the first mounting seat to rotate is arranged on the base; and/or the presence of a gas in the gas,
the wafer carrying device is horizontally arranged on the machine base in a moving mode, a plurality of first installation bases are arranged on the machine base along the horizontal moving direction of the wafer carrying device, and each first installation base is provided with the wafer box discharging device.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, the wafer carrying device is horizontally movably arranged on the base along the first direction, and a carrying driving unit for driving the wafer carrying device to horizontally move is arranged on the base;
the first placing position and the second placing position are both used for placing the wafer towards the first direction;
the wafer carrying device comprises a clamping driving unit and two clamping units, wherein the two clamping units are arranged in a manner of moving horizontally in a direction vertical to the first direction, and the clamping driving unit is used for driving the two clamping units to move horizontally in a relative manner so as to clamp a plurality of wafers from two sides in the direction vertical to the first direction when the two clamping units are mutually closed.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, the carrying driving unit comprises a second linear module; and/or the presence of a gas in the gas,
the clamping driving unit comprises a third linear module; and/or the presence of a gas in the gas,
the two clamping units are provided with inner side surfaces which are close to each other, the inner side surface of the bottom of each clamping unit is provided with a plurality of clamping grooves which are matched with the shape of the wafer and have inward notches, and the plurality of clamping grooves on each clamping unit are used for clamping and limiting corresponding side ends of the bottoms of the wafers respectively; and/or the presence of a gas in the gas,
wafer handling device still includes first slide and two second slides, first slide with the frame passes through transport drive unit connects, is used for the drive first slide is in follow on the frame first direction horizontal migration, two the second slide with first slide passes through press from both sides tight drive unit and connect, be used for the drive two the second slide is in first slide last edge with the relative horizontal migration of first direction vertically direction, two the centre gripping unit sets up respectively in two on the second slide.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, the machine base is provided with the wafer placing seat capable of moving up and down and the lifting driving unit for driving the wafer placing seat to move up and down, and the top of the wafer placing seat forms the second placing position.
According to the wafer batch conveying mechanism provided by the embodiment of the invention, the bottom of the wafer placing seat is connected with the lifting driving unit through the third sliding seat; and/or the presence of a gas in the gas,
the lifting driving unit comprises a fourth linear module; and/or the presence of a gas in the gas,
the top interval of the wafer placing seat is provided with a plurality of placing clamping grooves which are matched with the shape of the wafer and have upward notches, and the placing clamping grooves are used for clamping and limiting the bottoms of the wafers which are positioned at the second placing position respectively.
The wafer batch transmission mechanism provided by the embodiment of the invention can take out the wafers from the wafer box in batch through the wafer box taking-out device and can transmit the wafers in batch through the wafer carrying device, thereby improving the transmission efficiency of the wafers.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer batch transfer mechanism according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure at the stand of FIG. 1;
FIG. 3 is a schematic view of the wafer out-of-box apparatus shown in FIG. 1;
FIG. 4 is a schematic view of the wafer handling apparatus of FIG. 1;
fig. 5 is a schematic structural view of the wafer seat in fig. 1.
Reference numerals:
100: a wafer batch transfer mechanism; 1: a machine base; 11: a first mounting seat; 12: a rotation driving unit; 13: a conveyance drive unit; 14: a wafer placing seat; 141: placing a clamping groove; 15: a lifting drive unit; 16: a third slide carriage; 2: a wafer out-box device; 21: a wafer lifting unit; 211: lifting the clamping groove; 212: a boss; 22: a lift drive unit; 23: a lifting slide seat; 3: a wafer handling device; 31: a clamping drive unit; 32: a clamping unit; 321: clamping the clamping groove; 33: a first slider; 34: a second slide carriage; 200: a wafer cassette; 300: and (5) a wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the invention provides a wafer batch transferring mechanism, as shown in fig. 1, the wafer batch transferring mechanism 100 includes a base 1, a wafer cassette discharging device 2, and a wafer carrying device 3.
As shown in fig. 1, a first placing position for placing a wafer cassette 200 and a second placing position for placing a wafer 300 are provided on a base 1. The wafer box 200 is generally a straight cylinder with two open ends, one end of the wafer box 200 is larger than the other end, and the wafer 300 can be accessed from the large end of the wafer box 200. The inner sidewall of the wafer box 200 is generally provided with a plurality of slots adapted to the shape of the wafers 300, so as to clamp and limit the wafers 300 in the wafer box 200, and the orientation of the wafers 300 in the wafer box 200 is consistent, and the orientation of the wafers 300 in the wafer box 200 is generally perpendicular to the direction from the large port to the small port of the wafer box 200.
The first placing position is a structural component for carrying the wafer cassette 200, which is disposed on the base 1, for example, as shown in fig. 1 and 3, in the present embodiment, a first mounting seat 11 is disposed on the base 1, and the top of the first mounting seat 11 forms a first placing position, i.e., the wafer cassette 200 can be placed on the top of the first mounting seat 11. Also, as shown in fig. 1 to 3, in the present embodiment, the first mounting seat 11 is rotatably disposed on the machine base 1 along an axis in the vertical direction, and the machine base 1 is provided with a rotation driving unit 12 for driving the first mounting seat 11 to rotate; before taking out the wafer 300 in the wafer cassette 200, the first mounting seat 11 may be rotated by a predetermined angle according to the requirement, for example, the first mounting seat 11 is rotated by 180 ° to enable the wafer 300 in the wafer cassette 200 to be turned.
The second placing position is a structural component provided on the base 1 for carrying the plurality of wafers 300 taken out from the wafer cassette 200, for example, as shown in fig. 1 and 5, in the present embodiment, the base 1 is provided with the wafer placing seat 14, and the top of the wafer placing seat 14 forms a second placing position where the plurality of wafers 300 taken out from the wafer cassette 200 can be placed on the top of the wafer placing seat 14. Furthermore, a plurality of wafer holders 14 may be provided according to production needs, or one wafer holder 14 may hold a plurality of cassettes of wafers 300.
As shown in fig. 1 and 3, the wafer discharging device 2 is disposed on the base 1 corresponding to the first placing position, and the wafer discharging device 2 is used for taking out the wafer 300 from the wafer box 200. The wafer discharging apparatus 2 can separate the wafer cassette 200 from the plurality of wafers 300 in the wafer cassette 200, thereby taking out the wafers 300 in batch from the wafer cassette 200.
The specific arrangement of the wafer cassette ejection apparatus 2 is related to the ejection of the wafer 300, for example, as shown in fig. 1 and 3, in the present embodiment, the first placement position is used to place the wafer cassette 200 with the large port of the wafer cassette 200 facing upward; the wafer box discharging device 2 comprises a wafer lifting unit 21 and a lifting driving unit 22; the wafer lifting unit 21 is arranged on the machine base 1 in a vertically moving mode, and the lifting driving unit 22 is used for driving the wafer lifting unit 21 to move vertically; the wafer lift unit 21 is disposed corresponding to the first placement position, and is used for lifting the wafer 300 in the wafer cassette 200 from the bottom when the wafer lift unit 21 moves upward, and lifting the wafer 300 out of the cassette. The size of the wafer lift unit 21 is smaller than the size of the small port of the wafer cassette 200, and the wafer lift unit 21 can enter the wafer cassette 200 from the small port of the wafer cassette 200, lift the wafers 300 in the wafer cassette 200 from the bottom, and lift the wafers 300 out of the cassette 200 from the large port. The lifting and lowering of the wafer lifting unit 21 and the lifting and lowering of the wafer 300 are completed by the lifting and driving unit 22, and the lifting and driving unit 22 may be a linear module, for example, in this embodiment, the lifting and driving unit 22 includes a first linear module. And, the wafer cassette discharging device 2 further comprises a lifting slide 23, the lifting slide 23 is connected with the first mounting base 11 through a lifting driving unit 22, and is used for driving the lifting slide 23 to move up and down on the first mounting base 11, and the wafer lifting unit 21 is arranged at the top of the lifting slide 23.
As shown in fig. 3, in the present embodiment, a plurality of lifting clamp grooves 211 adapted to the shape of the wafer 300 and having upward notches are disposed at intervals on the top of the wafer lifting unit 21, and the plurality of lifting clamp grooves 211 are used for respectively clamping and limiting the bottoms of the plurality of wafers 300 in the wafer cassette 200. The arrangement of the plurality of lift slots 211 is beneficial for the wafer lift unit 21 to better lift the plurality of wafers 300 in the wafer cassette 200. The size and number of lift pockets 211 generally correspond to the location and number of full cassette wafers 300 in the wafer cassette 200.
Further, as shown in fig. 3, in the present embodiment, two parallel bosses 212 extending along the spacing direction of the plurality of lift slots 211 are protruded from the top of the wafer lift unit 21, and the two bosses 212 are spaced apart from each other in the direction perpendicular to the extending direction of the bosses 212; each lift tab slot 211 includes two half slots disposed on the two bosses 212, respectively. The lifting clamping groove 211 is formed by two discontinuous half grooves, so that the matching precision of the lifting clamping groove 211 and the wafer 300 can be reduced.
As described above, the top of the first mounting base 11 forms the first placement position, so in this embodiment, the wafer discharging device 2 is disposed on the first mounting base 11. Moreover, a plurality of first mounting seats 11 and a plurality of wafer ejecting devices 2 may be arranged in a one-to-one correspondence manner according to production needs, as shown in fig. 2, in this embodiment, the wafer transporting device 3 is horizontally arranged on the machine base 1, a plurality of first mounting seats 11 are arranged on the machine base 1 along the horizontal moving direction of the wafer transporting device 3, and each first mounting seat 11 is provided with a wafer ejecting device 2. For example, the wafer carrying device 3 is capable of moving along a first direction, two first mounting seats 11 are arranged along the first direction, a wafer ejecting device 2 is arranged on each first mounting seat 11, and the two first mounting seats 11 are located within the moving stroke of the wafer carrying device 3, so that the wafers 300 at the two first mounting seats 11 can be carried by one wafer carrying device 3.
As shown in fig. 1, the wafer transfer device 3 is disposed on the base 1 corresponding to the wafer unloading device 2, and the wafer transfer device 3 is used for transferring the wafer 300 taken out by the wafer unloading device 2 to the second placement position. Specifically, as shown in fig. 1 and 4, in the present embodiment, the wafer carrier device 3 is horizontally movably disposed on the base 1 along a first direction, and the base 1 is disposed with a carrier driving unit 13 for driving the wafer carrier device 3 to horizontally move; the first placing position and the second placing position are both used for placing the wafer 300 towards a first direction; the wafer carrying device 3 includes a clamping driving unit 31 and two clamping units 32, the two clamping units 32 are disposed to be capable of moving horizontally relatively in a direction perpendicular to the first direction, and the clamping driving unit 31 is configured to drive the two clamping units 32 to move horizontally relatively so as to clamp the plurality of wafers 300 from both sides in the direction perpendicular to the first direction when the two clamping units 32 are closed to each other. First, after the wafer transfer device 3 is driven to the first placement position by the transfer driving unit 13, the clamping driving unit 31 drives the two clamping units 32 to move closer to each other, so as to clamp the plurality of wafers 300 taken out of the cassette device 2 by the wafer take-out device 2; then, after the wafer transporting device 3 is driven to the second placing position by the transporting driving unit 13, the clamping driving unit 31 drives the two clamping units 32 to separate from each other, so as to loosen the plurality of wafers 300 and place the plurality of wafers 300 at the second placing position, wherein the transporting driving unit 13 and the two clamping units 32 may also be linear modules, for example, in this embodiment, the transporting driving unit 13 includes the second linear module; the clamping drive unit 31 comprises a third linear module. The wafer carrying device 3 further includes a first slide 33 and two second slides 34, the first slide 33 is connected to the base 1 through a carrying driving unit 13 for driving the first slide 33 to move horizontally on the base 1 along a first direction, the two second slides 34 are connected to the first slide 33 through a clamping driving unit 31 for driving the two second slides 34 to move horizontally on the first slide 33 along a direction perpendicular to the first direction, and the two clamping units 32 are respectively disposed on the two second slides 34.
As shown in fig. 4, in the present embodiment, the two clamping units 32 have inner side surfaces close to each other, the inner side surface of the bottom of each clamping unit 32 is provided with a plurality of clamping slots 321 adapted to the shape of the wafer 300 and having inward notches, and the plurality of clamping slots 321 on each clamping unit 32 are used for respectively clamping and limiting corresponding side ends of the bottoms of the plurality of wafers 300. By the arrangement of the clamping slots 321, when the two clamping units 32 clamp a plurality of wafers 300, the wafers 300 can be prevented from falling off from the two clamping units 32. The size and number of the clamping slots 321 on the two clamping units 32 also generally correspond to the position and number of the full cassette wafers 300 in the wafer cassette 200.
The wafer batch-transferring mechanism 100 according to the embodiment of the present invention can take out the wafers 300 from the wafer cassette 200 in batch through the wafer cassette taking-out device 2, and can transfer the wafers 300 in batch through the wafer carrying device 3, thereby improving the transfer efficiency of the wafers 300.
As described above, the top of the wafer seat 14 forms the second placing position, and specifically, as shown in fig. 1 and 5, in the present embodiment, the wafer seat 14 is disposed to be movable up and down, and the base 1 is further provided with the lift driving unit 15 for driving the wafer seat 14 to move up and down. The elevation driving unit 15 drives the wafer seat 14 to complete the elevation operation, and the elevation driving unit 15 may be a linear module, for example, in the embodiment, the elevation driving unit 15 includes a fourth linear module. The bottom of the round placement base 14 is connected to the elevation drive unit 15 via a third slider 16.
As shown in fig. 5, in the present embodiment, a plurality of placing slots 141 are disposed at intervals on the top of the wafer placing seat 14, the placing slots 141 are adapted to the shape of the wafer 300 and have upward notches, the placing slots 141 are used for respectively clamping and limiting the bottoms of the wafers 300 located at the second placing position, and the placing slots 141 are disposed to facilitate the wafers 300 to be firmly and stably placed on the wafer placing seat 14. The size of the placing slots 141 on the wafer seat 14 also corresponds to the position of the full cassette wafers 300 in the wafer cassette 200, and the number of the placing slots 141 on the wafer seat 14 may be an integral multiple of the number of the full cassette wafers 300, so that one wafer seat 14 can simultaneously place the wafers 300 in the multi-cassette cassettes 200.
The operation of the bulk wafer transfer mechanism 100 will be described with reference to the specific structure of the bulk wafer transfer mechanism 100 in this embodiment:
the wafer lifting unit 21 of the wafer cassette discharging device 2 is lifted to lift the wafer 300 in the wafer cassette 200 out of the cassette, the two clamping units 32 of the wafer conveying device 3 are opened, the wafer conveying device 3 moves to the position of the wafer 300 discharged from the cassette, the two clamping units 32 are closed, the wafer lifting unit 21 is lowered, the wafer 300 is fixed between the two clamping units 32, the wafer conveying device 3 transfers the wafer 300 to the upper part of the wafer placing seat 14, the wafer placing seat 14 is lifted to fix the wafer 300 at the placing clamping groove 141 of the wafer placing seat 14, the two clamping units 32 are opened, the wafer placing seat 14 is lowered, and the cassette discharging and conveying process of the whole cassette wafer 300 is completed. Before the wafer 300 is taken out of the cassette, the first mounting base 11 may be rotated by 180 ° as required to turn the wafer 300 in the wafer cassette 200.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A wafer batch transfer mechanism, comprising:
the wafer cassette comprises a machine base, wherein a first placing position for placing a wafer cassette and a second placing position for placing a wafer are arranged on the machine base;
the wafer box discharging device is arranged on the base corresponding to the first placing position and used for taking out wafers from the wafer box; and the number of the first and second groups,
and the wafer carrying device is arranged on the base corresponding to the wafer box discharging device and is used for carrying the wafer taken out by the wafer box discharging device to the second placing position.
2. The wafer batch transfer mechanism of claim 1, wherein the first placing position is for placing the wafer cassette with its large port facing upward;
the wafer box discharging device comprises a wafer lifting unit and a lifting driving unit;
the wafer lifting unit is arranged on the machine base in a vertically moving mode, and the lifting driving unit is used for driving the wafer lifting unit to vertically move;
the wafer lifting unit is arranged corresponding to the first placing position and used for lifting the wafer in the wafer box from the bottom when the wafer lifting unit moves upwards and lifting the wafer out of the box.
3. The wafer batch transfer mechanism of claim 2, wherein the lift drive unit comprises a first linear module.
4. The wafer batch conveying mechanism according to claim 2, wherein a plurality of lifting clamping grooves which are matched with the shape of the wafer and have upward notches are arranged at intervals on the top of the wafer lifting unit, and the plurality of lifting clamping grooves are used for clamping and limiting the bottoms of the wafers in the wafer box respectively.
5. The wafer batch delivery mechanism of claim 4, wherein two parallel bosses extending along the spacing direction of the plurality of lift slots are protruded from the top of the wafer lift unit, and the two bosses are spaced apart from each other in a direction perpendicular to the extending direction of the bosses; each lift draw-in groove is including setting up respectively in two half grooves on the boss.
6. The wafer batch transfer mechanism according to claim 2, wherein a first mounting seat is disposed on the frame, a top of the first mounting seat forms the first placement position, and the wafer discharging device is disposed on the first mounting seat, wherein:
the first mounting seat is rotationally arranged on the base along an up-down axis, and a rotation driving unit for driving the first mounting seat to rotate is arranged on the base; and/or the presence of a gas in the gas,
the wafer carrying device is horizontally arranged on the machine base in a moving mode, a plurality of first installation bases are arranged on the machine base along the horizontal moving direction of the wafer carrying device, and each first installation base is provided with the wafer box discharging device.
7. The wafer batch transfer mechanism according to any one of claims 1 to 6, wherein the wafer handling device is horizontally movably disposed on the base in a first direction, and a handling driving unit for driving the wafer handling device to move horizontally is disposed on the base;
the first placing position and the second placing position are both used for placing the wafer towards the first direction;
the wafer carrying device comprises a clamping driving unit and two clamping units, wherein the two clamping units are arranged in a manner of moving horizontally in a direction vertical to the first direction, and the clamping driving unit is used for driving the two clamping units to move horizontally in a relative manner so as to clamp a plurality of wafers from two sides in the direction vertical to the first direction when the two clamping units are mutually closed.
8. The wafer bulk transfer mechanism of claim 7, wherein the carrier drive unit comprises a second linear module; and/or the presence of a gas in the gas,
the clamping driving unit comprises a third linear module; and/or the presence of a gas in the gas,
the two clamping units are provided with inner side surfaces which are close to each other, the inner side surface of the bottom of each clamping unit is provided with a plurality of clamping grooves which are matched with the shape of the wafer and have inward notches, and the plurality of clamping grooves on each clamping unit are used for clamping and limiting corresponding side ends of the bottoms of the wafers respectively; and/or the presence of a gas in the gas,
wafer handling device still includes first slide and two second slides, first slide with the frame passes through transport drive unit connects, is used for the drive first slide is in follow on the frame first direction horizontal migration, two the second slide with first slide passes through press from both sides tight drive unit and connect, be used for the drive two the second slide is in first slide last edge with the relative horizontal migration of first direction vertically direction, two the centre gripping unit sets up respectively in two on the second slide.
9. The wafer batch transfer mechanism according to any one of claims 1 to 6, wherein a wafer placing seat capable of moving up and down and a lifting driving unit for driving the wafer placing seat to move up and down are provided on the machine base, and the top of the wafer placing seat forms the second placing position.
10. The wafer batch transfer mechanism of claim 9, wherein the bottom of the wafer seat is connected to the lift drive unit via a third slide; and/or the presence of a gas in the gas,
the lifting driving unit comprises a fourth linear module; and/or the presence of a gas in the gas,
the top interval of the wafer placing seat is provided with a plurality of placing clamping grooves which are matched with the shape of the wafer and have upward notches, and the placing clamping grooves are used for clamping and limiting the bottoms of the wafers which are positioned at the second placing position respectively.
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| CN202010964829.9A CN111834271B (en) | 2020-09-15 | 2020-09-15 | Wafer batch conveying mechanism |
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| CN202010964829.9A CN111834271B (en) | 2020-09-15 | 2020-09-15 | Wafer batch conveying mechanism |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299586A (en) * | 2021-07-28 | 2021-08-24 | 四川通妙科技有限公司 | Chip wafer temporary storage device and chip wafer temporary storage and pickup method |
| CN115050677A (en) * | 2022-06-20 | 2022-09-13 | 上海福赛特机器人有限公司 | Wafer transmission device and method |
| CN116435246A (en) * | 2023-06-15 | 2023-07-14 | 上海果纳半导体技术有限公司 | Wafer box clamping device |
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| CN113299586A (en) * | 2021-07-28 | 2021-08-24 | 四川通妙科技有限公司 | Chip wafer temporary storage device and chip wafer temporary storage and pickup method |
| CN113299586B (en) * | 2021-07-28 | 2021-10-19 | 四川通妙科技有限公司 | Chip wafer temporary storage device and chip wafer temporary storage and pickup method |
| CN115050677A (en) * | 2022-06-20 | 2022-09-13 | 上海福赛特机器人有限公司 | Wafer transmission device and method |
| CN116435246A (en) * | 2023-06-15 | 2023-07-14 | 上海果纳半导体技术有限公司 | Wafer box clamping device |
| CN116435246B (en) * | 2023-06-15 | 2023-09-08 | 上海果纳半导体技术有限公司 | Wafer box clamping device |
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