CN110137123A - Wafer handling equipment and wafer baiting method - Google Patents
Wafer handling equipment and wafer baiting method Download PDFInfo
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- CN110137123A CN110137123A CN201910466953.XA CN201910466953A CN110137123A CN 110137123 A CN110137123 A CN 110137123A CN 201910466953 A CN201910466953 A CN 201910466953A CN 110137123 A CN110137123 A CN 110137123A
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- station
- film magazine
- wafer
- detection sensor
- positioning seat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to wafer wet cleaning equipment technical field more particularly to a kind of wafer handling equipments and wafer baiting method.Wafer handling equipment includes film magazine transmission device, wafer lifting apparatus and loading and unloading table top；Wherein, the first station, second station and 3rd station are provided on loading and unloading table top, film magazine transmission device is used to transmit film magazine along the first station, second station and 3rd station；Wafer lifting apparatus includes lifting driving part and wafer positioning seat, wafer positioning seat is for lifting wafer, lifting driving part can drive the wafer positioning seat to go up and down, so that the wafer in the film magazine at the second station is lifted to predeterminated position in feeding or held the wafer above the second station in blanking in the film magazine being put at second station by the wafer positioning seat.Wafer baiting method is the control method of wafer handling equipment.Wafer handling equipment and wafer baiting method provided by the invention, save the loading and unloading time, efficiency is higher.
Description
Technical field
The present invention relates under wafer wet cleaning equipment technical field more particularly to a kind of wafer handling equipment and wafer
Material method.
Background technique
Current wafer wet cleaning can be divided into three kinds of multi-groove type cleaning, spin rinse drying and monolithic corrosion cleaning sides
Formula, wherein slot type is cleaned with its efficient working method, is occupied an important position in wet-cleaning.With semi-conductor industry
Development, the critical size of device technology technology constantly reduces, has in per pass processing technology to the cleanliness of wafer higher
Requirement.
However, the wafer handling equipment used during the existing progress slot type cleaning to wafer, in the same time
It is only capable of that there are a film magazines on loading and unloading table top；By taking feeding process as an example, the film magazine equipped with wafer is manually placed on loading and unloading
After on table top, manipulator can take the wafer in film magazine away, then, manually take empty film magazine away and change one equipped with wafer
Film magazine, the box that reloads can waste the regular hour, and efficiency is lower.
To sum up, how to overcome the drawbacks described above of existing slot type cleaning processing equipment is that those skilled in the art are urgently to be resolved
The technical issues of.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer handling equipment and wafer baiting methods, to alleviate in the prior art
Slot type cleaning processing equipment existing for the lower technical problem of efficiency.
Wafer handling equipment provided by the invention, including film magazine transmission device, wafer lifting apparatus and loading and unloading table top；
Wherein, the first station, second station and 3rd station, the film magazine transmission dress are provided on the loading and unloading table top
It sets for transmitting film magazine along first station, the second station and the 3rd station；
The wafer lifting apparatus includes lifting driving part and wafer positioning seat, and the wafer positioning seat is for lifting crystalline substance
Circle, the lifting driving part can drive the wafer positioning seat to go up and down, so that the wafer positioning seat is in feeding by institute
It states the wafer in the film magazine at second station and is lifted to predeterminated position or in blanking by the wafer support above the second station
It is firmly put into the film magazine at the second station.
Preferably, as an embodiment, the wafer handling equipment further includes controller, first station
Place is equipped with the first film magazine detection sensor, and the second film magazine detection sensor and the inspection of the first wafer are equipped at the second station
Survey sensor；It is the film magazine transmission device, the wafer lifting apparatus, the first film magazine detection sensor, second described
Box detection sensor and the first wafer detection sensor are electrically connected with the controller；
The controller is used to detect there is film magazine and institute at first station in the first film magazine detection sensor
When stating the second film magazine detection sensor and detecting at the second station without film magazine, the film magazine transmission device is controlled by described
Film magazine at one station is transmitted to the second station；The controller in the second film magazine detection sensor for detecting
When having film magazine at the second station, controls the wafer lifting apparatus and move up and down once；The controller is used for described
First wafer detection sensor detect in the film magazine in feeding at the second station without wafer or in blanking described in
When having wafer in the film magazine at two stations, control the film magazine transmission device film magazine at the second station is transmitted to it is described
3rd station.
Preferably, as an embodiment, the wafer handling equipment further includes feeding alarm, the third
Third film magazine detection sensor is installed at station, the feeding alarm and the third film magazine detection sensor with it is described
Controller electrical connection；
The controller is used for when the third film magazine detection sensor, which detects, has film magazine at the 3rd station, control
Make the feeding alarm equipment alarm.
Preferably, as an embodiment, the wafer handling equipment further includes abnormal alarm device, and described first
It is also equipped with the second wafer detection sensor at station, the abnormal alarm device and the second wafer detection sensor are and institute
State controller electrical connection；
The controller be used for when the second wafer detection sensor is detected in feeding described at the first station
In film magazine without wafer or in blanking described in when having wafer in film magazine at the first station, control the abnormal alarm device alarm.
Preferably, as an embodiment, the film magazine transmission device includes horizontal transport means, vertical transport unit
Part and film magazine positioning seat；The horizontal transport means are for driving the vertical transfer member in first station, described the
It is moved horizontally between two stations and the 3rd station, the vertical transfer member moves down on the film magazine positioning seat for driving
It is dynamic, so that the film magazine positioning seat lifts film magazine or film magazine is placed on the loading and unloading table top.
Preferably, as an embodiment, temporary station, first work are additionally provided on the loading and unloading table top
Position, the temporary station, the second station and the 3rd station are located at the corner location of rectangle and successively arrange, institute
Horizontal transport means are stated for along temporary station, the second station and the 3rd station transmission sheet described in first station
Box；
The horizontal transport means include the first rodless cylinder and the second rodless cylinder, the length of first rodless cylinder
It is oriented parallel to the arragement direction of first station Yu the temporary station, the length direction of second rodless cylinder is parallel
In the arragement direction of the temporary station and the second station；The cylinder barrel of second rodless cylinder is with described first without bar gas
The piston of cylinder is fixedly connected, and the piston of second rodless cylinder is fixed on the vertical transfer member.
Preferably, as an embodiment, the wafer handling equipment further includes evacuation driving assembly, described to keep away
Allow driving assembly for driving the lifting driving part to move horizontally to avoid the film magazine positioning at the second station
Seat resets the lifting driving part.
The present invention also provides a kind of wafer baiting methods of wafer handling equipment to include the following steps:
When the first film magazine detection sensor detects there is film magazine at first station, and second film magazine detects
When sensor is detected at the second station without film magazine, the controller controls the film magazine transmission device for first work
Film magazine at position is transmitted to the second station；
When the second film magazine detection sensor, which detects, has film magazine at the second station, the controller controls institute
Stating lifting driving part drives the wafer positioning seat to rise to predeterminated position；
After wafer is fallen on the wafer positioning seat, the controller controls the lifting driving part and drives the crystalline substance
Circle positioning seat decline resets；
After the first wafer detection sensor, which detects, has wafer in the film magazine at the second station, the control
Device controls the film magazine transmission device and the film magazine at the second station is transmitted to the 3rd station.
Preferably, as an embodiment, the wafer handling equipment further includes feeding alarm, the third
Third film magazine detection sensor is installed at station, the feeding alarm and the third film magazine detection sensor with it is described
Controller electrical connection；
The controller controls the film magazine transmission device and the film magazine at the second station is transmitted to the third work
After the step of position, the method also includes following steps:
When the third film magazine detection sensor, which detects, has film magazine at the 3rd station, the controller controls institute
State feeding alarm equipment alarm.
Preferably, as an embodiment, the wafer handling equipment further includes abnormal alarm device, and described first
Second wafer detection sensor is installed at station, the second wafer detection sensor and the abnormal alarm device with it is described
Controller electrical connection；
The first film magazine detection sensor detects when having film magazine at first station, described in the controller control
The step of film magazine at first station is transmitted to the second station by film magazine transmission device, specifically comprises the following steps:
When the first film magazine detection sensor detects there is film magazine at first station, and second wafer detects
Sensor detects when having wafer in the film magazine at first station that the controller controls the abnormal alarm device alarm；
Or, when the first film magazine detection sensor detects there is film magazine at first station, and second wafer
When detection sensor is detected in the film magazine at first station without wafer, the controller controls the film magazine transmission device
Film magazine at first station is transmitted to the second station.
Compared with the prior art, the advantages of the present invention are as follows:
Wafer handling equipment provided by the invention is provided with film magazine transmission device, wafer lifting apparatus and loading and unloading platform
Face, is provided with the first station, second station and 3rd station on loading and unloading table top, and film magazine transmission device can be by film magazine along
One station, second station and 3rd station are sequentially transmitted；Wafer lifting apparatus includes lifting driving part and wafer positioning seat, crystalline substance
Circle positioning seat can lift wafer, and lifting driving part can drive wafer positioning seat to go up and down.
When blanking, empty film magazine can be put on the first station, start film magazine transmission device, to utilize film magazine transmission device
Film magazine at first station is transmitted to second station；Then, start wafer lifting apparatus, driven using lifting driving part brilliant
Circle positioning seat rises, so that wafer positioning seat can accept the wafer that the cleaning above second station is completed and by wafer
It holds, later, is declined using lifting driving part driving wafer positioning seat, fallen on so that wafer positioning seat is able to drive wafer
In film magazine at second station；Finally, the film magazine that wafer is housed at second station is transmitted to third by starting film magazine transmission device
Then the film magazine that wafer is housed at 3rd station is manually taken away, that is, completes blanking by station.
When feeding, the film magazine equipped with wafer to be cleaned can be put on the first station, start film magazine transmission device, with benefit
The film magazine at the first station is transmitted to second station with film magazine transmission device；Then, start wafer lifting apparatus, utilize lifting
Driving part drives wafer positioning seat to rise, so that wafer positioning seat can hold up the wafer in the film magazine at second station
It to predeterminated position, takes for manipulator, later, is declined using lifting driving part driving wafer positioning seat, so that wafer is fixed
Position seat resets；Finally, the empty film magazine at second station is transmitted to 3rd station by starting film magazine transmission device, then manually by the
Empty film magazine at three stations is taken away, that is, completes feeding.
Therefore, wafer handling equipment provided by the invention can store two film magazines on loading and unloading table top simultaneously, that is, work as piece
Film magazine (for ease of description, this film magazine can be defined as to previous film magazine) at first station is transmitted to by box transmission device
With rear at two stations, a film magazine can be filled again at the first station (for ease of description, can be defined as the latter for this film magazine
Film magazine) so that previous film magazine is sent to after 3rd station, film magazine transmission device can be returned directly to the first station, and will
The latter film magazine at first station is transmitted at second station, without waiting for more cassette can, saves loading and unloading time, efficiency
It is higher.
The present invention also provides a kind of wafer baiting method applied to wafer handling equipment, the wafer handling equipments
Further include having controller on the basis of above-mentioned wafer handling equipment, the first film magazine detection sensing is installed at the first station
Device is equipped with the second film magazine detection sensor and the first wafer detection sensor, film magazine transmission device, wafer lift at second station
It is electric with controller to rise device, the first film magazine detection sensor, the second film magazine detection sensor and the first wafer detection sensor
Connection.
Above-mentioned wafer baiting method includes the following steps:
Step a, when the first film magazine detection sensor detects there is film magazine at the first station, and the second film magazine detection sensor
When detecting at the second station without film magazine, controller controls film magazine transmission device and the film magazine at the first station is transmitted to the
Two stations；
Step b, when the second film magazine detection sensor, which detects, has film magazine at second station, controller control lifting driving
Component driving wafer positioning seat rises to predeterminated position；
Step c, after wafer is fallen on wafer positioning seat, under controller control lifting driving part driving wafer positioning seat
Drop resets；
Step d, when the first wafer detection sensor, which detects, has wafer in the film magazine at second station, controller control
Film magazine at second station is transmitted to 3rd station by film magazine transmission device.
Therefore, wafer baiting method provided by the invention only need to manually pick and place film magazine, film magazine transmission device and lift
Rise driving part can automatic running, further save manpower, improve efficiency.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the side structure schematic view of wafer handling equipment provided in an embodiment of the present invention；
Fig. 2 is the positive structure diagram of wafer handling equipment provided in an embodiment of the present invention；
Fig. 3 is the overlooking structure diagram of loading and unloading table top provided in an embodiment of the present invention；
Fig. 4 is the shaft side figure of loading and unloading table top provided in an embodiment of the present invention；
Fig. 5 is the shaft side figure of film magazine transmission device provided in an embodiment of the present invention；
Fig. 6 is the shaft side figure of wafer lifting apparatus provided in an embodiment of the present invention.
Icon: 10- film magazine transmission device；20- wafer lifting apparatus；30- loading and unloading table top；The inspection of the first film magazine of 40-
Survey sensor；50- the second film magazine detection sensor；60- the first wafer detection sensor；70- third film magazine detection sensing
Device；80- the second wafer detection sensor；The 4th film magazine detection sensor of 90-；100- avoids driving assembly；110- film magazine；
101- horizontal transport means；The vertical transfer member of 102-；103- film magazine positioning seat；
The first rodless cylinder of 1011-；The second rodless cylinder of 1012-；
201- is lifted driving part；202- wafer positioning seat；
The first station of 301-；302- second station；303- 3rd station；304- keeps in station.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the orientation or position of the instructions such as term "vertical", "horizontal", "inner"
Setting relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot
It is interpreted as limitation of the present invention.In addition, term " first ", " second ", " third " are used for description purposes only, and should not be understood as
Indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be machine
Tool connection, is also possible to be electrically connected；It can be directly connected, two members can also be can be indirectly connected through an intermediary
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in the present invention with concrete condition
Concrete meaning.
The present invention is described in further detail below through specific implementation examples and in conjunction with the accompanying drawings.
Referring to Fig. 1-Fig. 6, a kind of wafer handling equipment is present embodiments provided, is provided with film magazine transmission device 10, crystalline substance
Circle lifting apparatus 20 and loading and unloading table top 30 is provided with the first station 301, second station 302 and the on loading and unloading table top 30
Three stations 303, film magazine transmission device 10 can by film magazine 110 along the first station 301, second station 302 and 3rd station 303 according to
Secondary transmission；Wafer lifting apparatus 20 includes that lifting driving part 201 and wafer positioning seat 202, wafer positioning seat 202 can be lifted
Wafer, lifting driving part 201 can drive wafer positioning seat 202 to go up and down.
When blanking, empty film magazine 110 can be put on the first station 301, start film magazine transmission device 10, to utilize film magazine
Film magazine 110 at first station 301 is transmitted to second station 302 by transmission device 10；Then, start wafer lifting apparatus 20,
Wafer positioning seat 202 is driven to rise using lifting driving part 201, so that wafer positioning seat 202 can be accepted in second
The wafer of the cleaning completion of 302 top of station simultaneously holds wafer, later, drives wafer to position using lifting driving part 201
Seat 202 declines, and falls in the film magazine 110 at second station 302 so that wafer positioning seat 202 is able to drive wafer；Finally, opening
The film magazine 110 that wafer is housed at second station 302 is transmitted to 3rd station 303 by movable plate box transmission device 10, then manually will
Film magazine 110 at 3rd station 303 equipped with wafer is taken away, that is, completes blanking.
When feeding, the film magazine 110 equipped with wafer to be cleaned can be put on the first station 301, starting film magazine transmission dress
10 are set, the film magazine 110 at first station 301 is transmitted to second station 302 using film magazine transmission device 10；Then, start
Wafer lifting apparatus 20 drives wafer positioning seat 202 to rise, so that 202 energy of wafer positioning seat using lifting driving part 201
Enough wafers by the film magazine 110 at second station 302 are held up to predeterminated position, are taken for manipulator, later, are driven using lifting
Dynamic component 201 drives wafer positioning seat 202 to decline, so that wafer positioning seat 202 resets；Finally, starting film magazine transmission device
Empty film magazine 110 at second station 302 is transmitted to 3rd station 303 by 10, then manually by the empty film magazine at 3rd station 303
110 take away, that is, complete feeding.
Therefore, wafer handling equipment provided in this embodiment can store two film magazines on loading and unloading table top 30 simultaneously
110, i.e., when this film magazine (for ease of description, can be defined as by film magazine transmission device 10 by the film magazine 110 at the first station 301
Previous film magazine) it is transmitted at second station 302 with rear, a film magazine 110 can be filled again at the first station 301 (in order to just
In description, this film magazine can be defined as to the latter film magazine) so that previous film magazine 110 is sent to after 3rd station 303,
Film magazine transmission device 10 can be returned directly to the first station 301, and the latter film magazine at the first station 301 is transmitted to the second work
At position 302, without waiting for more cassette can, the loading and unloading time is saved, efficiency is higher.
Preferably, referring to Fig. 3 and Fig. 4, wafer handling equipment provided in this embodiment further includes controller, and first
First film magazine detection sensor 40 is installed at station 301,50 He of the second film magazine detection sensor is installed at second station 302
First wafer detection sensor 60, film magazine transmission device 10, wafer lifting apparatus 20, the first film magazine detection sensor 40, second
Film magazine detection sensor 50 and the first wafer detection sensor 60 are electrically connected with the controller.
It is illustrated by taking the wafer baiting method of above-mentioned wafer handling equipment as an example below, wafer baiting method includes such as
Lower step:
Step a, when the first film magazine detection sensor 40 detects there is film magazine 110 at the first station 301, and the second film magazine is examined
When survey sensor 50 is detected at the second station 302 without film magazine 110, controller controls film magazine transmission device 10 for the first work
Film magazine at position 301 is transmitted to second station 302；
Step b, when the second film magazine detection sensor 50, which detects, has film magazine 110 at second station 302, controller control
Lifting driving part 201 drives wafer positioning seat 202 to rise to predeterminated position；
Step c, after wafer is fallen on wafer positioning seat 202, controller control lifting driving part 201 drives wafer fixed
The position decline of seat 202 resets；
Step d, after the first wafer detection sensor 60, which detects, has wafer in the film magazine 110 at second station 302, control
Film magazine 110 at second station 302 is transmitted to 3rd station 303 by device control film magazine transmission device 10 processed.
Above-mentioned wafer baiting method only needs manually to pick and place film magazine 110, film magazine transmission device 10 and lifting driving portion
Part 201 can automatic running, further save manpower, improve efficiency.
In feeding, step c replaces with step c ', lifts the wafer in film magazine 110 when wafer positioning seat 202 and presets
Behind position, control lifting driving part 201 drives the decline of wafer positioning seat 202 to reset.
Step d replaces with step d ', and when the reset of wafer positioning seat 202 and the first wafer detection sensor 60 detects second
In film magazine 110 at station 302 without wafer after, controller controls film magazine transmission device 10 for the film magazine 110 at second station 302
It is transmitted to 3rd station 303.
Further, with continued reference to Fig. 3 and Fig. 4, feeding alarm can be set in wafer handling equipment, and in third
Third film magazine detection sensor 70 is installed at station 303, by feeding alarm and third film magazine detection sensor 70 with control
Device electrical connection.
After step d, above-mentioned wafer baiting method further includes following steps:
Step e, when third film magazine detection sensor 70, which detects, has film magazine 110 at 3rd station 303, controller control
Feeding alarm equipment alarm.
That is, feeding alarm is arranged in wafer handling equipment, 3rd station 303 can be transmitted in film magazine
When, remind operator to take film magazine 110 away in time using feeding alarm, for next 110 vacating space of film magazine.
In addition, step d concretely following steps:
There are wafer, and third film magazine in the film magazine 110 at second station 302 when the first wafer detection sensor 60 detects
When detection sensor 70 is detected at 3rd station 303 without film magazine 110, controller controls film magazine transmission device 10 for second station
Film magazine 110 at 302 is transmitted to 3rd station 303.
That is, third film magazine detection sensor 70 is arranged at 3rd station 303, operator can be prevented not
In time when taking the film magazine 110 at 3rd station 303 away, film magazine transmission device 10 will film magazine 110 at second station 302 to the
The transmission of three stations 303, and the case where lead to device fails.
Further, with continued reference to Fig. 3 and Fig. 4, exception can be added in wafer handling equipment provided in this embodiment
Alarm, and the second wafer detection sensor 80 is installed at the first station 301, abnormal alarm device and the detection of the second wafer are passed
Sensor 80 is electrically connected with the controller.
The following two kinds situation is specifically included in step a:
The first situation: there are film magazine, and the second wafer at the first station 301 when the first film magazine detection sensor 40 detects
Detection sensor 80 detects when having wafer in the film magazine 110 at the first station 301 that controller controls the alarm of abnormal alarm device；
Second situation has film magazine 110, and second when the first film magazine detection sensor 40 detects at the first station 301
When wafer detection sensor 80 is detected in the film magazine 110 at the first station 301 without wafer, controller controls film magazine transmission device
Film magazine 110 at first station 301 is transmitted to second station 302 by 10.
Wherein, the first situation is in blanking process, and the film magazine 110 equipped with wafer has accidentally been put into first by operator
The case where at station 301, that is to say, that wafer handling equipment provided in this embodiment, it can be in operator's maloperation
Issue alarm signal by abnormal alarm device prevents unit exception from running to remind operator to handle in time.
In feeding process, two kinds of situations in above-mentioned steps a can be replaced following two situation:
The first situation has film magazine 110, and second when the first film magazine detection sensor 40 detects at the first station 301
When wafer detection sensor 80 is detected in the film magazine 110 at the first station 301 without wafer, controller controls abnormal alarm device report
It is alert；
Second situation has film magazine 110, and second when the first film magazine detection sensor 40 detects at the first station 301
Wafer detection sensor 80 detects the film magazine 110 at the first station 301 whether there is or not when wafer, and controller controls film magazine transmission device
Film magazine 110 at first station 301 is transmitted to second station 302 by 10.
Wherein, the first situation is in feeding process, and operator accidentally will be put into first without the film magazine 110 of wafer
The case where at station 301, that is to say, that wafer handling equipment provided in this embodiment, it can be in operator's maloperation
Issue alarm signal by abnormal alarm device prevents unit exception from running to remind operator to handle in time.
Referring to Fig. 5, settable horizontal transport means 101, vertical transport unit in the specific structure of film magazine transmission device 10
Part 102 and film magazine positioning seat 103, wherein horizontal transport means 101 can drive vertical transfer member 102 in the first station
301, it is moved horizontally at second station 302 and 3rd station 303, vertical transfer member 102 can drive film magazine positioning seat 103 to exist
It is moved up and down at first station 301, second station 302 and 3rd station 303.
With in above-mentioned steps a " controller controls film magazine transmission device 10 and the film magazine at first station 301 is transmitted to the
Two stations 302 " specifically comprise the following steps:
Step a1, controller controlled level transfer member 101 drive film magazine positioning seat 103 to be moved to the first station 301
Lower section；
Step a2, when film magazine positioning seat 103 reaches the underface of the first station 301, controller controls vertical transport unit
Part 102 drives film magazine positioning seat 103 to move up, to hold up the film magazine 110 at the first station 301 using film magazine positioning seat 103；
Step a3, after the film magazine 110 at the first station 301 is held up, controller controlled level transfer member 101 is driven
Film magazine positioning seat 103 is moved at second station 302；
Step a4, when film magazine positioning seat 103 reaches second station 302, controller controls vertical transfer member 102 and drives
Film magazine positioning seat 103 moves down reset, so that the film magazine 110 on film magazine positioning seat 103 can fall in second station 302
Place.
Preferably, referring to Fig. 6, evacuation driving assembly 100 can be set in wafer handling equipment, utilize evacuation driving group
The driving lifting driving part 201 of part 100 is moved horizontally to avoid the film magazine positioning seat 103 at second station 302 or drive lifting
Dynamic component 201 resets.
The step b of wafer baiting method specifically comprises the following steps:
Step b1, when the second film magazine detection sensor 50, which detects, has film magazine 110 at second station 302, controller control
Horizontal transport means 101 processed, which drive film magazine positioning seat 103 to remove from second station 302, (can be moved into the first station 301, the
Three stations 303 or temporary station 304, preferably temporary station 304), to avoid wafer positioning seat 202；
Step b2, after film magazine positioning seat 103 leaves from second station 302, controller control evacuation driving assembly 100 is driven
Dynamic lifting driving part 201 is mobile towards second station 302, until wafer positioning seat 202 reach second station 302 just under
Side；
Step b3, after wafer positioning seat 202 reaches the underface of second station 302, controller control lifting driving part
201 driving wafer positioning seats 202 move up, so that wafer positioning seat 202 is inside the film magazine 110 from second station 302
It passes through, and reaches predeterminated position to accept the wafer for being located at 302 top of second station.
The step d of wafer baiting method specifically comprises the following steps:
Step d1 has when the first wafer detection sensor 60 detects in the film magazine 110 at the second station 302
When wafer, the controller control evacuation driving lifting driving part 201 of driving assembly 100 is (practical from 302 moved out from beneath of second station
In order to which wafer positioning seat 202 is from 302 moved out from beneath of second station), to avoid film magazine positioning seat 103；
Step d2 is lifted driving part 201 after 302 moved out from beneath of second station, controller controlled level driving part
Driving film magazine positioning seat 103 is moved to the underface of second station 302；
Step d3, when film magazine positioning seat 103 reaches the underface of second station 302, controller controls vertical transport unit
Part 102 drives film magazine positioning seat 103 to move up, to hold up the film magazine 110 at the first station 301 using film magazine positioning seat 103；
Step d4, after the film magazine 110 at second station 302 lifts up, controller controlled level transfer member 101 is driven
Movable plate box positioning seat 103 is moved to the underface of 3rd station 303；
Step d5, when film magazine positioning seat 103 reaches the underface of 3rd station 303, controller controls vertical transport unit
Part 102 drives film magazine positioning seat 103 to move down reset, so that the film magazine 110 on film magazine positioning seat 103 can fall in third
At station 303.
Referring to Fig. 5, settable first rodless cylinder 1011 and second is without bar in the specific structure of horizontal transport means 101
First rodless cylinder 1011 and the second rodless cylinder 1012 are arranged in a mutually vertical manner by cylinder 1012, and by the second rodless cylinder
1012 cylinder barrel is fixedly connected with the piston of the first rodless cylinder 1011, so that the piston on the first rodless cylinder 1011 is along cylinder
When cylinder is mobile, the second rodless cylinder 1012 (film magazine positioning seat 103) can be moved along the length direction of the first rodless cylinder 1011；
Meanwhile the piston of the second rodless cylinder 1012 being fixed on vertical transfer member 102, so that the second rodless cylinder 1012
When piston is moved along cylinder barrel, vertical transfer member 102 (film magazine positioning seat 103) can be along the length side of the second rodless cylinder 1012
To movement.
Referring to Fig. 3 and Fig. 4, temporary station 304 is set on loading and unloading table top 30, and by the first station 301, temporary station
304, second station 302 and 3rd station 303 are separately positioned on the corner location of rectangle and successively arrange；Meanwhile by the first nothing
The length direction of bar cylinder 1011 is set as parallel with the arragement direction of temporary station 304 with the first station 301, by second without bar
The length direction of cylinder 1012 is set as parallel with the arragement direction of second station 302 with temporary station 304, in this way, may make
Station on loading and unloading table top 30 can be well adapted for the structure of horizontal transport means 101, and operator can be in equipment
The same side fill into film magazine 110 and take film magazine 110, be convenient for topology layout.
Step a3 in wafer baiting method is specifically included:
Step a31, after the film magazine 110 at the first station 301 is held up, controller controls 1011 work of the first rodless cylinder
Make so that the second rodless cylinder of piston driving 1012 of the first rodless cylinder 1011 is along the first station 301 and temporary station 304
Arragement direction is mobile, in turn, the film magazine 110 at the first station 301 is made to be moved to temporary station 304；
Step a32, film magazine 110 reaches at temporary station 304 and the second film magazine detection sensor 50 detects second station
When at 302 without film magazine 110, controller control the second rodless cylinder 1012 work so that the second rodless cylinder 1012 piston driving
Vertical transfer member 102 is moved along temporary station 304 and the arragement direction of second station 302, in turn, is made at temporary station 304
Film magazine 110 be moved to second station 302.
Preferably, the 4th film magazine detection sensor 90 can be installed at temporary station 304, detected and sensed using the 4th film magazine
Device 90 detects the film magazine 110 at temporary station 304, and the 4th film magazine detection sensor 90 is electrically connected with the controller.
It is specifically included in above-mentioned steps a32:
Step a321, the 4th film magazine detection sensor 90, which detects, film magazine 110 at temporary station 304 and the second film magazine is examined
Sensor 50 is surveyed when detecting at second station 302 without film magazine 110, controller controls the second rodless cylinder 1012 and works so that the
The vertical transfer member 102 of the piston driving of two rodless cylinders 1012 is moved along temporary station 304 and the arragement direction of second station 302
It is dynamic, in turn, the film magazine 110 at temporary station 304 is made to be moved to second station 302.
Preferably, the first film magazine detection sensor 40, the second film magazine detection sensor 50, the first wafer detection sensor
60, third film magazine detection sensor 70, the second wafer detection sensor 80 and the 4th film magazine detection sensor 90 may be configured as
Emission sensor.
Particularly, vertically extending cylinder can be set in the specific structure of vertical transfer member 102, to pass through cylinder
Expanding-contracting action drives film magazine positioning seat 103 to move up and down.
Particularly, it may also set up vertically extending cylinder in the specific structure of lifting driving part 201, to pass through cylinder
Expanding-contracting action drive wafer positioning seat 202 move up and down.
Particularly, evacuation driving assembly 100 specific structure in settable motor, guide rail, horizontally disposed screw rod and
With the nut of lead screw cooperation, guide rail is parallel with lead screw, and guide rail is slidably matched with wafer lifting apparatus 20, and nut is fixed on wafer
On lifting apparatus 20, the output shaft of motor is fixedly connected with screw rod, thus, controller can control motor work, to utilize electricity
Machine drives screw rod rotation, and in turn, nut is able to drive wafer lifting apparatus 20 and moves along guide rail, realizes to wafer positioning seat 202
An accurate positioning in the horizontal direction, smoothly to lift wafer at second station 302 and conjunction can be moved to when needing to keep away
Suitable position.
Particularly, PLC or single-chip microcontroller can be selected in controller.
In conclusion which overcome traditional the invention discloses a kind of wafer handling equipment and wafer baiting method
Many technological deficiencies of slot type cleaning processing equipment.Wafer handling equipment and wafer baiting method provided in this embodiment, tool
There is the technical advantage that loading and unloading are high-efficient.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wafer handling equipment, which is characterized in that including film magazine transmission device (10), wafer lifting apparatus (20) and upper
Blanking table top (30)；
Wherein, the first station (301), second station (302) and 3rd station are provided on the loading and unloading table top (30)
(303), the film magazine transmission device (10) is used for along first station (301), the second station (302) and the third
Station (303) transmits film magazine (110)；
The wafer lifting apparatus (20) includes lifting driving part (201) and wafer positioning seat (202), the wafer positioning seat
(202) for lifting wafer, the lifting driving part (201) can drive the wafer positioning seat (202) to go up and down, so that institute
It states wafer positioning seat (202) and the wafer in the film magazine (110) at the second station (302) is lifted to default position in feeding
Set or the wafer above the second station (302) held in blanking the film magazine being put at the second station (302)
(110) in.
2. wafer handling equipment according to claim 1, which is characterized in that it further include controller, first station
(301) the first film magazine detection sensor (40) is installed at, the second film magazine detection sensing is installed at the second station (302)
Device (50) and the first wafer detection sensor (60)；It is the film magazine transmission device (10), the wafer lifting apparatus (20), described
First film magazine detection sensor (40), the second film magazine detection sensor (50) and the first wafer detection sensor (60)
It is electrically connected with the controller；
The controller is used to detect at first station (301) there is film magazine in the first film magazine detection sensor (40)
(110) when and the second film magazine detection sensor (50) detects at the second station (302) without film magazine (110), control
Film magazine (110) at first station (301) is transmitted to the second station (302) by the film magazine transmission device (10)；
The controller is used to detect at the second station (302) there is film magazine in the second film magazine detection sensor (50)
(110) it when, controls the wafer lifting apparatus (20) and moves up and down once；The controller is used to detect in first wafer
Sensor (60) detect in the film magazine (110) in feeding at the second station (302) without wafer or in blanking described in
When having wafer in the film magazine (110) at second station (302), the film magazine transmission device (10) is controlled by the second station
(302) film magazine (110) at is transmitted to the 3rd station (303).
3. wafer handling equipment according to claim 2, which is characterized in that further include feeding alarm, the third
Third film magazine detection sensor (70), the feeding alarm and third film magazine detection sensing are installed at station (303)
Device (70) is electrically connected with the controller；
The controller is used to detect at the 3rd station (303) there is film magazine in the third film magazine detection sensor (70)
(110) when, the feeding alarm equipment alarm is controlled.
4. wafer handling equipment according to claim 2 or 3, which is characterized in that it further include abnormal alarm device, described
The second wafer detection sensor (80), the abnormal alarm device and second wafer detection are also equipped at one station (301)
Sensor (80) is electrically connected with the controller；
The controller be used for when the second wafer detection sensor (80) detects in feeding described in the first station (301)
In the film magazine at place without wafer or in blanking described in when having wafer in film magazine (110) at the first station (301), control described different
Normal alarm equipment alarm.
5. wafer handling equipment according to claim 1-3, which is characterized in that the film magazine transmission device
It (10) include horizontal transport means (101), vertical transfer member (102) and film magazine positioning seat (103)；The horizontal transport means
(101) for driving the vertical transfer member (102) in first station (301), the second station (302) and described
3rd station moves horizontally between (303), and the vertical transfer member (102) is for driving the film magazine positioning seat (103)
Lower movement, so that the film magazine positioning seat (103) lifts film magazine (110) or film magazine (110) is placed on the loading and unloading table top
(30) on.
6. wafer handling equipment according to claim 5, which is characterized in that also set up on the loading and unloading table top (30)
Have temporary station (304), first station (301), the temporary station (304), the second station (302) and described
Three stations (303) are located at the corner location of rectangle and successively arrange, and the horizontal transport means (101) are used for along described the
One station (301), the temporary station (304), the second station (302) and the 3rd station (303) transmit film magazine
(110)；
The horizontal transport means (101) include the first rodless cylinder (1011) and the second rodless cylinder (1012), described first
The length direction of rodless cylinder (1011) is parallel to the arragement direction of first station (301) Yu the temporary station (304),
The length direction of second rodless cylinder (1012) is parallel to the temporary station (304) and the second station (302)
Arragement direction；The cylinder barrel of second rodless cylinder (1012) is fixedly connected with the piston of first rodless cylinder (1011),
The piston of second rodless cylinder (1012) is fixed on the vertical transfer member (102).
7. wafer handling equipment according to claim 5, which is characterized in that further include evacuation driving assembly (100), institute
Evacuation driving assembly (100) is stated for driving the lifting driving part (201) to move horizontally to avoid the second station
(302) the film magazine positioning seat (103) at resets the lifting driving part (201).
8. a kind of wafer baiting method of the described in any item wafer handling equipments of claim 2-4, which is characterized in that packet
Include following steps:
Have film magazine (110) when the first film magazine detection sensor (40) detects at first station (301), and described
When two film magazine detection sensors (50) are detected at the second station (302) without film magazine (110), described in the controller control
Film magazine (110) at first station (301) is transmitted to the second station (302) by film magazine transmission device (10)；
When the second film magazine detection sensor (50), which detects, has film magazine (110) at the second station (302), the control
Device processed controls the lifting driving part (201) and the wafer positioning seat (202) is driven to rise to predeterminated position；
After wafer is fallen on the wafer positioning seat (202), the controller controls lifting driving part (201) driving
Wafer positioning seat (202) decline resets；
When the first wafer detection sensor (60) detects in the film magazine (110) at the second station (302) there is wafer
Afterwards, the controller controls the film magazine transmission device (10) and the film magazine (110) at the second station (302) is transmitted to institute
State 3rd station (303).
9. wafer baiting method according to claim 8, which is characterized in that the wafer handling equipment further includes feeding
Alarm is equipped with third film magazine detection sensor (70), the feeding alarm and described at the 3rd station (303)
Three film magazine detection sensors (70) are electrically connected with the controller；
The controller controls the film magazine transmission device (10) and is transmitted to the film magazine (110) at the second station (302)
After the step of 3rd station (303), the method also includes following steps:
When the third film magazine detection sensor (70), which detects, has film magazine (110) at the 3rd station (303), the control
Device processed controls the feeding alarm equipment alarm.
10. wafer baiting method according to claim 9, which is characterized in that the wafer handling equipment further includes different
Normal alarm is equipped with the second wafer detection sensor (80), the second wafer detection sensing at first station (301)
Device (80) and the abnormal alarm device are electrically connected with the controller；
The first film magazine detection sensor (40) detects when having film magazine (110) at first station (301), the control
Device controls the film magazine transmission device (10) and the film magazine (110) at first station (301) is transmitted to the second station
(302) the step of, specifically comprises the following steps:
Have film magazine (110) when the first film magazine detection sensor (40) detects at first station (301), and described
Two wafer detection sensors (80) detect when having wafer in the film magazine (110) at first station (301), the controller
Control the abnormal alarm device alarm；
Or, when the first film magazine detection sensor (40) detects have film magazine (110) at first station (301), and institute
When stating the second wafer detection sensor (80) and detecting in film magazine (110) at first station (301) without wafer, the control
Device processed controls the film magazine transmission device (10) and the film magazine (110) at first station (301) is transmitted to second work
Position (302).
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| CN201910466953.XA CN110137123B (en) | 2019-05-31 | 2019-05-31 | Wafer loading and unloading device and wafer unloading method |
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|---|---|---|---|
| CN201910466953.XA CN110137123B (en) | 2019-05-31 | 2019-05-31 | Wafer loading and unloading device and wafer unloading method |
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| CN110137123B CN110137123B (en) | 2021-06-15 |
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| CN110524344A (en) * | 2019-08-20 | 2019-12-03 | 青岛高测科技股份有限公司 | It is a kind of for being ground the automation equipment and processing method of silicon rod plane and chamfering |
| CN110993547A (en) * | 2019-11-12 | 2020-04-10 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN111156910A (en) * | 2020-03-09 | 2020-05-15 | 西安电子科技大学 | High-precision online rapid measuring device and method for thickness of aluminum substrate |
| CN111634687A (en) * | 2020-06-04 | 2020-09-08 | 无锡亚电智能装备有限公司 | Feeding mechanism and feeding method of wafer basket cleaning equipment |
| CN111834271A (en) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
| CN111916381A (en) * | 2020-08-24 | 2020-11-10 | 台州市老林装饰有限公司 | Auxiliary material taking mechanism for wafer material placing box |
| CN112820687A (en) * | 2019-11-18 | 2021-05-18 | 上海至纯洁净***科技股份有限公司 | Wafer top-lifting mechanism of wet process equipment |
| WO2022048023A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading/unloading device |
| CN114361096A (en) * | 2022-01-04 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Wafer lifting device and process chamber |
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| CN112820687A (en) * | 2019-11-18 | 2021-05-18 | 上海至纯洁净***科技股份有限公司 | Wafer top-lifting mechanism of wet process equipment |
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| CN111834271B (en) * | 2020-09-15 | 2020-12-11 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
| CN111834271A (en) * | 2020-09-15 | 2020-10-27 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
| CN114361096A (en) * | 2022-01-04 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Wafer lifting device and process chamber |
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