CN111809816A - Directional heat transfer integrated plate and preparation method thereof - Google Patents

Directional heat transfer integrated plate and preparation method thereof Download PDF

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Publication number
CN111809816A
CN111809816A CN201910284454.9A CN201910284454A CN111809816A CN 111809816 A CN111809816 A CN 111809816A CN 201910284454 A CN201910284454 A CN 201910284454A CN 111809816 A CN111809816 A CN 111809816A
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China
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layer
heat transfer
integrated plate
electrothermal conversion
directional
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CN111809816B (en
Inventor
张伟
杨敏
李永武
路亚辉
张亚飞
张冷
闫龙
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Guangzhi Technology Ningbo Co ltd
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Guangzhi Technology Beijing Co ltd
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Priority to PCT/CN2019/106675 priority patent/WO2020057599A1/en
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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F13/00—Coverings or linings, e.g. for walls or ceilings
    • E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
    • E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
    • E04F13/0875—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements having a basic insulating layer and at least one covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
    • F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
    • F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2200/00—Heat sources or energy sources
    • F24D2200/08—Electric heater
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/20—Heat consumers
    • F24D2220/2009—Radiators
    • F24D2220/2036—Electric radiators

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Surface Heating Bodies (AREA)

Abstract

The invention provides a directional heat transfer integrated plate, which comprises a surface layer, a conductive belt, an electrothermal conversion layer, a heat insulation reflecting layer, a first sealing layer and a second sealing layer, wherein the surface layer, the first sealing layer, the electrothermal conversion layer, the heat insulation reflecting layer and the second sealing layer are sequentially laminated, and the transmittance of the surface layer to infrared rays with the wavelength of 5-18 microns is not less than 20%; the total thickness of the electrothermal conversion layer, the heat insulation reflecting layer and the sealing layer is 10-800 microns. The invention also provides a preparation method of the directional heat transfer integrated plate, and the heating plate capable of conducting heat in a directional manner, which is prepared by the invention, can release heat energy to a specified space in a centralized manner, so that the heating efficiency is greatly improved; and due to the directional heat transfer, the function of the infrared ray with the directional radiation wavelength of 5-15 microns is endowed to common building materials.

Description

Directional heat transfer integrated plate and preparation method thereof
Technical Field
The invention belongs to the field of heating, and particularly relates to an integrated plate for directionally carrying out radiation heat transfer through far infrared rays and a preparation method thereof.
Background
At present, the main heating modes at home and abroad are central heating, air conditioning and electric heating.
The central heating is a heating mode that hot water with the temperature not higher than 60 ℃ is used as a heating medium, the hot water circularly flows in a heating pipe to heat a floor, and heat is supplied to the indoor through the ground in a radiation and convection conduction mode, but the central heating consumes disposable energy such as coal, natural gas and the like, and the central heating gradually changes to new energy in some areas, such as changing coal into electricity and the like.
The air conditioner generally adopts electric drive, and during the heating, gaseous freon is pressurized by the compressor, becomes high temperature high pressure gas, gets into the heat exchanger of indoor set (being the condenser this moment), and the condensation liquefaction is exothermic, becomes liquid, heats indoor air simultaneously to reach the purpose that improves indoor temperature, because the air conditioner directly blows off hot-blast through mechanical power, has very obvious blowing sense during the use, can make indoor air drier, and is unfavorable to human health.
Electric heating is an environmental protection mode, and electric energy is converted into heat energy and infrared rays through an electric heating element. However, in the current electric heating mode in the market, because heat exchange is conducted to the periphery, the energy utilization rate is low, and the electric power is consumed very much, a heating product which is environment-friendly and energy-saving is urgently needed.
Disclosure of Invention
The invention provides a directional heat transfer integrated plate for directional heat conduction and infrared radiation, which is used for converting common building decoration materials (floors, tiles, wallpaper and the like) into integrated building materials capable of directionally radiating infrared and a small amount of heat sources outwards, and does not change the appearance and the texture of the original building materials.
The invention firstly provides a directional heat transfer integrated plate, which comprises a surface layer, a conductive belt, an electrothermal conversion layer, a heat insulation reflecting layer, a first sealing layer and a second sealing layer, wherein the surface layer, the first sealing layer, the electrothermal conversion layer, the heat insulation reflecting layer and the second sealing layer are sequentially laminated, and the transmittance of the surface layer to infrared rays with the wavelength of 5-18 microns is not less than 20%;
the total thickness of the electrothermal conversion layer, the heat insulation reflecting layer and the sealing layer is 10-800 microns.
In some embodiments of the invention, the top layer is infrared glass, infrared transmitting polycarbonate, polymethyl methacrylate, or infrared transmitting resin having a transmittance of not less than 20%.
The directional heat transfer integrated plate comprises a base material, wherein the base material can be selected from common building materials sold in the market, such as floor, ceramic tile, wallpaper, wood boards and the like.
Typically, the substrate should be treated so that it is suitable for the preparation of a directionally heat-transferring integrated plate. In one practice of the invention, the substrate is treated as follows: and grinding and polishing the base material. Sanding and polishing are conventional operations in the field, and generally the following technical effects can be achieved: the surface roughness is not more than 0.8 micron.
As a better choice of the directional heat transfer integrated plate, the directional heat transfer integrated plate at least comprises a waterproof layer, and the waterproof layer is positioned between the substrate and the electric-heat conversion layer; or the sealing layer has a water resistance rating greater than IP 67. In a scenario with high humidity, it is usually necessary to provide a waterproof layer to ensure the proper operation of the directional heat transfer integrated plate. In one embodiment of the present invention, the directional heat transfer integrated plate contains a water-repellent layer between the substrate and the low-resistance carbon microcrystal film. In a scenario where the conformable side may be subject to water attack, a water barrier should be provided to ensure proper operation of the integrated plate for directional heat transfer. In one practice of the invention, the directional heat transfer integral plate contains a water-proof layer which is in direct contact with the sealing layer.
The waterproof layer is made of a high polymer film or paint, the selected material comprises Polyethylene (PE), polyethylene terephthalate (PET), Polyimide (PI), ethylene-tetrafluoroethylene copolymer (ETFE), inorganic nano ceramic paint, diamond paint and Polytetrafluoroethylene (PTFE), and the thickness of the material can be selected to be 0.001-0.8 mm.
In one embodiment of the invention, the thickness of the water barrier layer is 1 to 30 microns.
In one embodiment of the invention, the thickness of the water barrier layer is 30-100 microns.
In one embodiment of the present invention, the thickness of the water barrier layer is 100 and 200 microns.
In one embodiment of the present invention, the thickness of the water barrier layer is 200 and 800 microns.
In a scenario where the directional heat transfer integrated plate may fail due to external force, a wear resistant layer should be provided to provide protection for the heat generating components.
The material of the wear-resistant layer is paint or a film, the selectable material comprises inorganic nano ceramic paint, diamond paint, wear-resistant paper, polyurethane paint, epoxy resin and alumina paint, and the thickness of the formed film can be selected to be 0.001-0.8 mm.
In one embodiment of the invention, the wear resistant layer has a thickness of 1-30 microns.
In one embodiment of the invention, the wear layer has a thickness of 30-100 microns.
In one example of the invention, the wear layer has a thickness of 100 and 200 microns.
In one embodiment of the invention, the wear layer has a thickness of 200 and 800 microns.
In one embodiment of the invention, at least 90% of the input power is in the 5-20 micron wavelength infrared radiation, based on the power supply input power.
In an embodiment of the invention, the raw material for preparing the electrothermal conversion layer comprises one or more of low-resistance carbon microcrystals with the resistance value of 10-300 omega/□, medium-resistance carbon microcrystals with the resistance value of 300-1000 omega/□ and high-resistance carbon microcrystals with the resistance value of more than 1000 omega/□.
In one embodiment of the invention, the raw material for preparing the electrothermal conversion film comprises low-resistance carbon microcrystals with the resistance value of 10-300 omega/□, and the raw material for preparing the carbon microcrystalline film further comprises one or more of medium-resistance carbon microcrystals with the resistance value of 300-1000 omega/□ and high-resistance carbon microcrystals with the resistance value of more than 1000 omega/□.
When the central line is defined as two electrodes or the middle of two conductive strips, in one example of the invention, the sheet resistance of the electrothermal conversion layer gradually increases or gradiently increases along the direction far away from the conductive strips and close to the central line.
When the midline is defined between two electrodes or two conductive strips, in one example of the invention, the thickness of the electrothermal conversion layer gradually increases or gradiently increases along the direction far away from the conductive strips and close to the midline.
As a preferred alternative to the directionally heat transferring integral plate, x is defined as the ratio of the distance from one electrode to the distance between two electrodes or conducting strips, RxR of carbon microcrystalline film at corresponding position of resistance0Is 0.01-30 omega/□, R0.1Is 50-500 omega/□, R0.2Is 200-600 omega/□, R0.3Is 300-800 omega/□, R0.4Is 600-1000 omega/□.
As a preferred option of the directional heat transfer integrated plate, the directional heat transfer integrated plate comprises an insulating reflecting layer, the insulating reflecting layer contains a metal film layer, and the thickness of the metal film layer is 0.05-100 μm. In one embodiment of the present invention, the plate is a PET film with an aluminum film, the PET is an insulating material, and the aluminum film can reflect infrared rays.
The heat insulation layer can be a heat resistance film with the heat conductivity coefficient lower than 0.2W/(m.K), and the thickness of the heat resistance film is 0.5 mm.
In one embodiment of the invention, the thickness of the thermal barrier layer is 1-50 microns.
In one embodiment of the invention, the thickness of the thermal barrier layer is 50-100 microns.
In one example of the invention, the thickness of the thermal barrier layer is 100 and 200 microns.
In one example of the invention, the thickness of the thermal barrier layer is 200 and 500 microns.
The sealing layer can be waterproof paint, AB glue, ceramic paint and the like, and the thickness of the sealing layer is 1-50 microns.
In one embodiment of the invention, the sealing layer has a thickness of 1 to 10 microns.
In one embodiment of the invention, the sealing layer has a thickness of 10-20 microns.
In one embodiment of the invention, the sealing layer has a thickness of 20 to 36 microns.
In one embodiment of the invention, the sealing layer has a thickness of 36-50 microns.
The invention also provides a preparation method for preparing the directional heat transfer integrated plate, which comprises the following steps:
1) providing a base material with one polished surface as a base, and modifying the base;
2) constructing or stacking an insulating reflecting layer and an electrothermal conversion film on the modified substrate, arranging a conductive belt on the electrothermal conversion layer, and then stacking or constructing a second sealing layer and a surface layer on the conductive belt; or a heat insulation reflecting layer, an insulating layer and an electrothermal conversion film are constructed or stacked on the modified substrate, a conductive belt is arranged on the electrothermal conversion layer, and then a second sealing layer and a surface layer are stacked or constructed on the conductive belt.
In one embodiment of the present invention, the directional heat transfer integrated plate is prepared as follows:
1) providing a substrate with one polished surface as a base;
2) and sequentially stacking or constructing a sealing layer, an adiabatic reflecting layer, an insulating layer and an electrothermal conversion film on the substrate, arranging a conductive band on the electrothermal conversion film, and then stacking or constructing an insulating sealing layer and a surface layer on the conductive band.
The step 1) may include a step of forming a waterproof layer on the substrate.
In the step 2), a step of forming a waterproof layer on the outermost side may be optionally included.
In the step 2), the insulating reflective layer is prepared by depositing a metal dielectric reflective film on PET by a magnetron sputtering method.
In another embodiment of the present invention, the directional heat transfer integrated plate is prepared as follows:
providing a treated substrate, laminating a waterproof layer, an insulating layer and a carbon material layer on the substrate in sequence, leading out a lead, and laminating an insulating reflecting layer, a heat insulating layer, a sealing layer, a second waterproof layer and a wear-resistant layer.
In another embodiment of the present invention, the directional heat transfer integrated plate is prepared as follows:
the nano carbon microcrystal is coated on the insulating layer through a screen printing method, the thickness of the carbon microcrystal film layer is gradually reduced from outside to inside, the resistance at two ends is the minimum, conductive copper strips are implanted into the two ends to serve as leads, then the nano carbon microcrystal material with medium and high resistance is prepared, and the heat-insulating reflecting layer, the insulating layer and the surface layer are sequentially prepared through the same method. Finally, the oriented heat conduction integrated plate with the radiation heating accounting for 92 percent is prepared. When the directional heat conduction integrated board is powered on, radiation heating is used as a main part in the whole heating process, the proportion is 92%, conduction and convection heating are used as auxiliary parts, a current introduction point is arranged on the heating material body, and the heating material body is embedded into the directional heat conduction integrated board through an electric connector.
The invention can select common building materials sold in the market, the back (non-decorative surface) is polished and polished, then a waterproof layer and an insulating layer are sequentially prepared, then a low-resistance nano carbon microcrystal layer is prepared, the thickness of the low-resistance carbon microcrystal film layer is gradually reduced from outside to inside, the resistance at two ends is minimum, wires are implanted into two ends, then low-resistance carbon microcrystals are prepared, after solidification, medium-resistance and high-resistance nano carbon microcrystal materials are sequentially prepared, and an insulating anti-infrared layer (prepared by depositing a metal dielectric reflection film on PET by a magnetron sputtering method), a heat insulation layer, a sealing waterproof layer and a wear-resistant layer are sequentially prepared. Finally, the integrated plate with the radiant heat accounting for 90 percent is prepared. The whole heating process is mainly radiation heating, the occupation ratio is higher than 90%, conduction and convection heating are used as assistance, the occupation ratio is not higher than 10%, and the edge of the heating material is provided with a plurality of pairs of current introduction points which are embedded into the integrated plate through the electric connector.
According to the invention, the metal dielectric is deposited by magnetron sputtering to obtain the high-reflection infrared film, and the heating plate capable of conducting heat in a directional manner is prepared so as to release heat energy to a specified space in a centralized manner (the infrared band is 5-15 microns, and the resonance frequency of water molecules is corresponding to the resonance frequency of the water molecules, so that the water molecules can resonate and convert into heat energy), and the heating efficiency is greatly improved; and due to the directional heat conduction, the function of the common building materials that the directional radiation wavelength is 5-15 microns infrared rays is endowed.
Drawings
FIG. 1 is a schematic diagram of a structure of a directional heat transfer integrated plate obtained in example 1 of the present invention;
FIG. 2 is a schematic diagram of a structure of a directional heat transfer integrated plate obtained in embodiment 2 of the present invention;
FIG. 3 is a schematic diagram of a structure of a directional heat transfer integrated plate obtained in embodiment 3 of the present invention;
the attached drawings are as follows:
1. a substrate; 2. a waterproof layer; 3. an insulating layer; 4. an electrothermal conversion layer (composed of three carbon microcrystal layers with different resistances); 5. an insulating reflective layer; 6. a thermal insulation layer; 7. a sealing layer; 8. a second waterproof layer; 9. a wear layer; 10. and (4) conducting wires.
Detailed Description
The following are examples of the present invention, which are intended to be illustrative of the invention only and not limiting.
The invention provides a preparation method for preparing the directional heat transfer integrated plate, which comprises the following steps:
the carbon microcrystal used for constructing the carbon microcrystal film is commercially available; for further characterization see CN106084989A, CN107949081A, CN 208241914U.
The conductive belt can be made of copper wire/belt, copper foil, aluminum foil and the like.
The test for the corresponding performance was performed with reference to the JGT 286-.
Example 1
The method for preparing the directional heat transfer integrated plate comprises the following steps:
taking a board with the thickness of 12mm, grinding and polishing the back (non-decorative surface) to ensure that the surface roughness is 0.7 micron, taking waterproof paint PI to be coated on the back of the ceramic tile to uniformly prepare a first waterproof layer with the thickness of 1 micron after curing, covering the first waterproof layer with a self-adhesive PET film after curing to form a weather-resistant insulating layer with the thickness of 1 micron, then coating low-resistance nano carbon microcrystal (with the resistance value of 10-300 omega/□) on the insulating layer with the thickness of 220 micron by a screen printing method, then implanting a conductive copper strip, drying at 120 ℃ to remove a solvent, preparing the nano carbon microcrystal material (with the resistance value of 300-300 omega/□ and the thickness of 150 micron) of the medium resistor layer by layer on the basis, then drying to remove the solvent, preparing the nano carbon microcrystal material (with the resistance value of more than 1000 omega/□) of the medium resistor layer by layer on the basis, thickness of 110 microns), drying to remove the solvent, roasting at 180 ℃ to form a carbon microcrystalline layer, covering a PET layer on the carbon microcrystalline layer, depositing an aluminum film on the PET by a magnetron sputtering method, wherein the thickness of the aluminum film is 0.8 microns, and forming a sealing waterproof layer (the material is PI, the thickness of the aluminum film is 1 micron) and a wear-resistant layer (the material is alumina, the thickness of the aluminum film is 0.1mm) on the PET microcrystalline layer. Finally, the oriented heat conduction integrated plate with the surface layer radiation heating accounting for 92 percent is prepared. The whole heating process is mainly radiation heating, accounts for 92%, is assisted by conduction and convection heating, and is provided with a current introduction point on the heating material body, and the carbon microcrystalline film is electrically connected through a conductive band.
Referring to fig. 1, a heating panel prepared by the method of example 1 is shown, which includes a substrate 1, a waterproof layer 2, an insulating layer 3, an electrothermal conversion layer 4, an insulating reflective layer 5, a heat insulating layer 6, a sealing layer 7, a second waterproof layer 8, an abrasion resistant layer 9, and a lead wire 10.
Example 2
The method for preparing the directional heat transfer integrated plate comprises the following steps:
1) taking a rock state plate with the thickness of 10mm as a substrate, and carrying out grinding, polishing and cleaning treatment on the surface to ensure that the surface roughness is 0.8 microns;
2) preparing a first waterproof layer on a polished surface of a substrate by using a PET self-adhesive film, wherein the thickness of the first waterproof layer is 75 microns;
3) preparing a metal dielectric reflecting film on the first PET waterproof layer to form a heat-insulating reflecting layer with the thickness of 30 microns;
4) preparing an insulating layer with a thickness of 10 microns on the heat-insulating reflecting layer;
5) coating low-resistance nano carbon microcrystal (with resistance value of 10-300 omega/□) on the insulating layer by a screen printing method, wherein the thickness of the low-resistance nano carbon microcrystal is 100 micrometers, and drying at 120 ℃ to remove a solvent to obtain a low-resistance carbon microcrystal layer;
6) implanting a conductive aluminum strip;
7) preparing a nano carbon microcrystalline material (the resistance value is 300-1000 omega/□, the thickness is 200 microns) of the middle resistor, and then drying to remove the solvent;
8) preparing a high-resistance nano carbon microcrystal material (the resistance is more than 1000 omega/□, the thickness is 200 micrometers), drying to remove a solvent, and roasting at 180 ℃ to form a carbon microcrystal layer;
9) and forming a sealing waterproof layer (the material is PET, the thickness is 10 microns) and a surface layer (the material is silicon oxide, and the thickness is 0.1 mm). Finally, the oriented heat conduction integrated plate with the surface layer radiation heat transfer accounting for 92 percent is prepared. In the whole heating process, radiation heating is mainly used, the proportion is 92%, conduction and convection heating are used as assistance, and a current introduction point is arranged on the heating material body and is electrically connected with the carbon microcrystal layer through a conductive belt.
Referring to fig. 2, a heating panel prepared by the method of example 1 is shown, which includes a substrate 1, a first waterproof sealing layer 2, a heat-insulating reflective layer 3, an insulating layer 4, an electrothermal conversion layer 5, a second waterproof sealing layer 6, a top layer 7, and lead wires 8.
Example 3
The method for preparing the directional heat transfer integrated plate comprises the following steps:
1) taking a rock wall plate with the thickness of 11mm as a substrate, and carrying out grinding, polishing and cleaning treatment on the surface to ensure that the surface roughness is 0.8 microns;
2) preparing a first waterproof layer on a polished surface of a substrate by using a PET self-adhesive film, wherein the thickness of the first waterproof layer is 75 microns;
3) preparing a metal dielectric reflecting film on the first PET waterproof layer to form a heat-insulating reflecting layer with the thickness of 30 microns;
4) preparing an insulating layer with a thickness of 10 microns on the heat-insulating reflecting layer;
5) coating low-resistance nano carbon microcrystal (with resistance value of 10-300 omega/□) on the insulating layer by a screen printing method, wherein the thickness of the low-resistance nano carbon microcrystal is 220 micrometers, and drying at 120 ℃ to remove a solvent to obtain a low-resistance carbon microcrystal layer;
6) implanting a conductive aluminum strip;
7) preparing a nano carbon microcrystalline material (the resistance value is 300-1000 omega/□, the thickness is 180 microns) of the middle resistor, and then drying to remove the solvent;
8) preparing a high-resistance nano carbon microcrystal material (the resistance is more than 1000 omega/□, the thickness is 150 microns), drying to remove a solvent, and roasting at 180 ℃ to form a carbon microcrystal layer;
9) forming a sealing waterproof layer (the material is PET, the thickness is 10 microns) and a surface layer (the material is infrared ceramic, the thickness is 0.1 mm). Finally, the oriented heat conduction integrated plate with 90% of the surface layer radiation heat transfer is prepared. In the whole heating process, radiation heating is taken as the main part, the proportion is 90%, conduction and convection heating are taken as the auxiliary parts, and a current introduction point is arranged on the heating material body and is electrically connected with the carbon microcrystal layer through a conductive band.
Referring to fig. 3, a heating panel prepared by the method of example 1 is shown, which includes a substrate 1, a first waterproof sealing layer 2, a heat-insulating reflective layer 3, an insulating layer 4, an electrothermal conversion layer 5, a second waterproof sealing layer 6, a top layer 7, and lead wires 8.
Example 4
The method for preparing the directional heat transfer integrated plate comprises the following steps:
1) taking a rock wall plate with the thickness of 10mm as a substrate, and carrying out grinding, polishing and cleaning treatment on the surface to ensure that the surface roughness is 0.8 microns;
2) coating a first waterproof coating on the polished surface of the substrate in a blade mode, wherein the thickness of the first waterproof coating is 30 micrometers after the first waterproof coating is cured;
3) preparing a metal dielectric reflecting film on the first PET waterproof layer to form a heat-insulating reflecting layer with the thickness of 3 microns;
4) preparing an insulating layer with a thickness of 9 microns on the heat-insulating reflecting layer;
5) coating low-resistance nano carbon microcrystal (with resistance value of 10-300 omega/□) on the insulating layer by a screen printing method, wherein the thickness of the low-resistance nano carbon microcrystal is 200 micrometers, and drying at 120 ℃ to remove a solvent to obtain a low-resistance carbon microcrystal layer;
6) implanting a conductive aluminum strip;
7) preparing a nano carbon microcrystalline material (the resistance value is 300-1000 omega/□, the thickness is 200 microns) of the middle resistor, and then drying to remove the solvent;
8) preparing a high-resistance nano carbon microcrystal material (the resistance is more than 1000 omega/□, the thickness is 200 micrometers), drying to remove a solvent, and roasting at 180 ℃ to form a carbon microcrystal layer;
9) forming a sealing waterproof layer (the material is PET, the thickness is 10 microns) and a surface layer (the material is infrared ceramic, the thickness is 0.1 mm). Finally, the directional heat conduction integrated plate with the proportion of surface layer radiation heat transfer accounting for 89% is prepared. In the whole heating process, radiation heating is mainly used, the proportion is 89%, conduction and convection heating are used as assistance, and a current introduction point is arranged on the heating material body and is electrically connected with the carbon microcrystal layer through a conductive band.
Referring to fig. 3, a heating panel prepared by the method of example 1 is shown, which includes a substrate 1, a first waterproof sealing layer 2, a heat-insulating reflective layer 3, an insulating layer 4, an electrothermal conversion layer 5, a second waterproof sealing layer 6, a top layer 7, and lead wires 8.
Finally, it is also noted that the above-mentioned lists merely illustrate a few specific embodiments of the invention. It is obvious that the invention is not limited to the above embodiments, but that many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the present invention are to be considered within the scope of the invention.

Claims (11)

1. A directionally heat transferring integrated plate, comprising: the directional heat transfer integrated plate comprises a surface layer, a conductive belt, an electrothermal conversion layer, a heat insulation reflection layer, a first sealing layer and a second sealing layer, wherein the surface layer, the first sealing layer, the electrothermal conversion layer, the heat insulation reflection layer and the second sealing layer are sequentially laminated, and the transmittance of the surface layer to infrared rays with the wavelength of 5-18 microns is not less than 20%;
the total thickness of the electrothermal conversion layer, the heat insulation reflecting layer and the sealing layer is 10-800 microns.
2. The directional heat transfer integrated plate according to claim 1, wherein the directional heat transfer integrated plate comprises a base material having a surface roughness of not more than 0.8 μm.
3. The integrated plate for directional heat transfer according to claim 1, wherein the integrated plate for directional heat transfer comprises at least a waterproof layer, and the waterproof layer is located between the substrate and the electrothermal conversion layer; or the sealing layer has a water resistance rating greater than IP 67.
4. The directional heat transfer integrated plate according to claim 1 or 3, wherein the directional heat transfer integrated plate comprises an insulating layer laminated on the electrothermal conversion layer; or the resistance of the sealing layer is greater than 20M omega.
5. The integrated plate for directional heat transfer according to claim 1, wherein the raw material for preparing the electrothermal conversion layer comprises one or more of low-resistance carbon microcrystals with resistance value of 10-300 Ω/□, medium-resistance carbon microcrystals with resistance value of 300-1000 Ω/□, and high-resistance carbon microcrystals with resistance value of 1000 Ω/□ or more.
6. A directional heat transfer integrated plate according to claim 5, wherein the low-resistance carbon microcrystals having a resistance value of 10 to 300 Ω/□ are prepared in the raw material for the electrothermal conversion layer in a mass ratio of not less than 30%.
7. The integrated plate for directional heat transfer according to claim 1, wherein the sheet resistance of the electrothermal conversion layer gradually increases or increases in a gradient in a direction away from the conductive tape toward the center line.
8. The integrated plate for directional heat transfer according to claim 1, wherein the heat-insulating reflective layer comprises a metal and a dielectric film layer, and the metal film layer has a thickness of 0.05 μm to 100 μm.
9. The integrated directional heat transfer plate of claim 1, wherein at least 55% of the input power, based on the power input, is output from the facing layer as infrared radiation having a wavelength of 5-20 microns.
10. A method of making the integral directed heat transfer plate of any of claims 1-9, comprising:
1) providing a base material with one polished surface as a base, and modifying the base;
2) constructing or stacking an insulating reflecting layer and an electrothermal conversion film on the modified substrate, arranging a conductive belt on the electrothermal conversion layer, and then stacking or constructing a second sealing layer and a surface layer on the conductive belt; or a heat insulation reflecting layer, an insulating layer and an electrothermal conversion film are constructed or stacked on the modified substrate, a conductive belt is arranged on the electrothermal conversion layer, and then a second sealing layer and a surface layer are stacked or constructed on the conductive belt.
11. The method of claim 9, wherein the thermally-insulating reflective layer is prepared by depositing a metal dielectric reflective film on PET by magnetron sputtering.
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