CN111809184A - 再生子液回用方法 - Google Patents
再生子液回用方法 Download PDFInfo
- Publication number
- CN111809184A CN111809184A CN202010685284.8A CN202010685284A CN111809184A CN 111809184 A CN111809184 A CN 111809184A CN 202010685284 A CN202010685284 A CN 202010685284A CN 111809184 A CN111809184 A CN 111809184A
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- CN
- China
- Prior art keywords
- solution
- copper
- working
- liquid
- regenerated
- Prior art date
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- 239000007788 liquid Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004064 recycling Methods 0.000 title claims abstract description 28
- 239000012224 working solution Substances 0.000 claims abstract description 137
- 239000000243 solution Substances 0.000 claims abstract description 134
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 118
- 238000005530 etching Methods 0.000 claims abstract description 95
- 230000005484 gravity Effects 0.000 claims abstract description 41
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 77
- 239000010949 copper Substances 0.000 claims description 57
- 239000002699 waste material Substances 0.000 claims description 48
- 229910052802 copper Inorganic materials 0.000 claims description 47
- 230000008929 regeneration Effects 0.000 claims description 41
- 238000011069 regeneration method Methods 0.000 claims description 41
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 28
- 229910001431 copper ion Inorganic materials 0.000 claims description 28
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 23
- -1 hydrogen ions Chemical class 0.000 claims description 20
- 239000000460 chlorine Substances 0.000 claims description 18
- 230000033116 oxidation-reduction process Effects 0.000 claims description 18
- 150000003863 ammonium salts Chemical class 0.000 claims description 17
- 150000002500 ions Chemical class 0.000 claims description 17
- 150000003841 chloride salts Chemical class 0.000 claims description 15
- 239000012492 regenerant Substances 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical group [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 4
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims description 4
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims description 4
- 239000001099 ammonium carbonate Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 16
- 238000001556 precipitation Methods 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 description 32
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 15
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 12
- 229940045803 cuprous chloride Drugs 0.000 description 10
- 239000012530 fluid Substances 0.000 description 8
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN202010685284.8A CN111809184B (zh) | 2020-07-15 | 2020-07-15 | 再生子液回用方法 |
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CN202010685284.8A CN111809184B (zh) | 2020-07-15 | 2020-07-15 | 再生子液回用方法 |
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CN111809184A true CN111809184A (zh) | 2020-10-23 |
CN111809184B CN111809184B (zh) | 2022-03-04 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113636672A (zh) * | 2021-06-30 | 2021-11-12 | 深圳市祺鑫环保科技有限公司 | 含镍废水的回收方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2306445A1 (de) * | 1972-02-09 | 1973-08-23 | Shipley Co | Kontinuierliches verfahren zum aetzen von kupfer unter regenerierung der dafuer verwendeten aetzloesung |
US4265722A (en) * | 1978-11-22 | 1981-05-05 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Method of processing the surface of workpieces including particularly the etching of surfaces containing copper or copper alloys |
JPH07173648A (ja) * | 1993-12-20 | 1995-07-11 | Fujitsu Ltd | エッチング液の再生方法 |
CN102206823A (zh) * | 2011-05-16 | 2011-10-05 | 东莞市绿瀚环保设备科技有限公司 | 蚀刻废液直接电解提铜工艺 |
CN202945326U (zh) * | 2012-07-19 | 2013-05-22 | 湖南万容科技股份有限公司 | 酸性蚀刻废液的再生回收*** |
CN103290415A (zh) * | 2013-06-09 | 2013-09-11 | 赣州聚环科技有限公司 | 酸性蚀刻液的处理工艺及*** |
CN103628064A (zh) * | 2012-08-24 | 2014-03-12 | 成都虹华环保科技有限公司 | 酸性蚀刻液循环再生*** |
US20150101935A1 (en) * | 2013-10-14 | 2015-04-16 | United Technologies Corporation | Apparatus and method for ionic liquid electroplating |
CN104762620A (zh) * | 2014-06-13 | 2015-07-08 | 叶涛 | 高效高质型酸性氯化铜线路板蚀刻液 |
CN107815687A (zh) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | 氯化铜腐蚀液再生装置 |
CN108893742A (zh) * | 2018-07-17 | 2018-11-27 | 深圳市祺鑫天正环保科技有限公司 | 酸性蚀刻废液处理及回用*** |
RU2715836C1 (ru) * | 2019-07-23 | 2020-03-03 | Тураев Дмитрий Юрьевич | Реагентно-электролизный метод регенерации солянокислых медно-хлоридных растворов травления меди |
-
2020
- 2020-07-15 CN CN202010685284.8A patent/CN111809184B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2306445A1 (de) * | 1972-02-09 | 1973-08-23 | Shipley Co | Kontinuierliches verfahren zum aetzen von kupfer unter regenerierung der dafuer verwendeten aetzloesung |
US4265722A (en) * | 1978-11-22 | 1981-05-05 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Method of processing the surface of workpieces including particularly the etching of surfaces containing copper or copper alloys |
JPH07173648A (ja) * | 1993-12-20 | 1995-07-11 | Fujitsu Ltd | エッチング液の再生方法 |
CN102206823A (zh) * | 2011-05-16 | 2011-10-05 | 东莞市绿瀚环保设备科技有限公司 | 蚀刻废液直接电解提铜工艺 |
CN202945326U (zh) * | 2012-07-19 | 2013-05-22 | 湖南万容科技股份有限公司 | 酸性蚀刻废液的再生回收*** |
CN103628064A (zh) * | 2012-08-24 | 2014-03-12 | 成都虹华环保科技有限公司 | 酸性蚀刻液循环再生*** |
CN103290415A (zh) * | 2013-06-09 | 2013-09-11 | 赣州聚环科技有限公司 | 酸性蚀刻液的处理工艺及*** |
US20150101935A1 (en) * | 2013-10-14 | 2015-04-16 | United Technologies Corporation | Apparatus and method for ionic liquid electroplating |
CN104762620A (zh) * | 2014-06-13 | 2015-07-08 | 叶涛 | 高效高质型酸性氯化铜线路板蚀刻液 |
CN107815687A (zh) * | 2017-10-17 | 2018-03-20 | 江苏沪运制版有限公司 | 氯化铜腐蚀液再生装置 |
CN108893742A (zh) * | 2018-07-17 | 2018-11-27 | 深圳市祺鑫天正环保科技有限公司 | 酸性蚀刻废液处理及回用*** |
RU2715836C1 (ru) * | 2019-07-23 | 2020-03-03 | Тураев Дмитрий Юрьевич | Реагентно-электролизный метод регенерации солянокислых медно-хлоридных растворов травления меди |
Non-Patent Citations (3)
Title |
---|
"酸、碱性蚀刻液再生循环利用及铜回收设备", 《资源再生》 * |
王红华等: "酸性氯化铜液蚀刻化学及蚀刻液再生方法评述", 《印制电路信息》 * |
金梁云: "线路板蚀刻废液资源化综合利用及废水零排放技术的浅析", 《广东化工》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113636672A (zh) * | 2021-06-30 | 2021-11-12 | 深圳市祺鑫环保科技有限公司 | 含镍废水的回收方法 |
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Denomination of invention: Recycling method of regenerant solution Effective date of registration: 20220629 Granted publication date: 20220304 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: Shenzhen Qixin Environmental Protection Technology Co.,Ltd. Registration number: Y2022340000016 |
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Denomination of invention: Recycling method of regenerant solution Effective date of registration: 20220719 Granted publication date: 20220304 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: Shenzhen Qixin Environmental Protection Technology Co.,Ltd. Registration number: Y2022980010704 |
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Denomination of invention: Recycling method of regenerated sub liquid Effective date of registration: 20230809 Granted publication date: 20220304 Pledgee: Bank of Communications Limited Shenzhen Branch Pledgor: Shenzhen Qixin Environmental Protection Technology Co.,Ltd. Registration number: Y2023980051421 |