CN111808453A

CN111808453A - High-conductivity self-bonding graphene low-pressure heating slurry and preparation method and application thereof

Info

Publication number: CN111808453A
Application number: CN202010745404.9A
Authority: CN
Inventors: 常海欣; 李刚辉; 郭辉
Original assignee: Wuhan Lianwei New Materials Technology Co ltd
Current assignee: Wuhan Lianwei New Materials Technology Co ltd
Priority date: 2020-07-29
Filing date: 2020-07-29
Publication date: 2020-10-23

Abstract

The invention discloses high-conductivity self-bonding graphene low-pressure heating slurry and a preparation method and application thereof, and belongs to the technical field of heating materials. The high-conductivity self-bonding graphene low-pressure heating slurry disclosed by the invention comprises the following raw materials in parts by mass: 20-40 parts of graphene, 30-50 parts of heating carbon paste, 1-5 parts of resin, 5-15 parts of solvent A, 10-20 parts of dispersing agent, 5-10 parts of water-based crosslinking coupling agent, 2-6 parts of defoaming agent and 3-5 parts of anti-settling agent; wherein: the graphene is prepared by a shear peeling method. According to the invention, the graphite raw material is directly subjected to high-speed shearing treatment by adopting a shearing and stripping method, so that graphite sheets are stripped and fall off to form graphene, and the prepared graphene has low number of layers and few defects. In addition, the graphene low-pressure heating slurry prepared by the invention only needs low pressure less than 36v, and has the advantages of higher low-voltage safety, good heating stability, high thermal conversion efficiency, longer service life, safety and environmental protection.

Description

High-conductivity self-bonding graphene low-pressure heating slurry and preparation method and application thereof

Technical Field

The invention belongs to the technical field of heating materials, particularly relates to graphene conductive heating slurry, and more particularly relates to high-conductivity self-bonding graphene low-pressure heating slurry as well as a preparation method and application thereof.

Background

The traditional electric heating materials such as metal resistance wires, nickel-chromium alloy and the like have high temperature rise speed, but have high density, heavy mass, high cost and complex processing technology. For a large number of used metal wire heating bodies, due to the oxidation effect of the metal wires at high temperature, the metal wires are easy to be oxidized and corroded, the energy consumption is high, the service life is short, the electric-heat conversion efficiency is low, and potential safety hazards such as electric leakage and combustion exist in the household use process.

In order to meet the demand of high-quality heating materials, it is urgently needed to develop a novel heating material which can stably generate heat at high temperature and has long service life. Graphene as a new material has excellent performances in the aspects of light, electricity, heat, force and the like, has great application potential, and has good prospects in new energy, electronic information, intelligent sensing, aerospace, military equipment and the like. The graphene conductive heating paste is favored by more and more researchers with unique advantages. However, a large amount of resin is generally required to be used as a binder for preparing the existing graphene conductive heating slurry, a special structure of graphene is damaged in the preparation process to form a large-area defect, and the electrical conductivity, the thermal conductivity, the mechanical property and other aspects of the graphene are greatly affected, so that the comprehensive performance of the graphene slurry cannot be improved.

Disclosure of Invention

Aiming at the problems or defects in the prior art, the invention provides a high-conductivity self-bonding graphene low-pressure heating slurry and a preparation method and application thereof. The high-conductivity self-bonding graphene low-pressure heating slurry is prepared by a shearing and stripping method, and overcomes the defects that the existing graphene heating slurry needs to be added with a large amount of resin as a binder, and has low electric and heat conductivity and other performance deficiencies.

In order to achieve the first object of the present invention, the present invention adopts the following technical solutions:

the high-conductivity self-bonding graphene low-pressure heating slurry comprises the following raw materials in parts by mass: 20-40 parts of graphene, 30-50 parts of heating carbon paste, 1-5 parts of resin, 5-15 parts of solvent A, 10-20 parts of dispersant, 5-10 parts of water-based crosslinking coupling agent, 2-6 parts of defoaming agent and 3-5 parts of anti-settling agent; wherein: the graphene is prepared by a shear peeling method.

Further, in the above-described aspect, the resin mainly functions as a binder in the present invention, and the purpose is to adhere the heat-generating paste to the surface of the substrate. The resin is one or more of polyurethane, epoxy resin, phenolic resin and acrylic resin.

Further, in the technical scheme, the solvent A is one or more of ethanol, 2-propanol and 1-butanol.

Further, in the technical scheme, the dispersing agent is one or more of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate and polyvinylpyrrolidone.

Further, in the above technical solution, the aqueous crosslinking coupling agent is propyleneimine.

Further, in the above technical means, the defoaming agent functions to suppress the generation of foam or eliminate foam already generated by reducing the surface tension. The defoaming agent is an organic silicon defoaming agent. For example, the defoamer can be BYK024, TEGOAirex902W, and the like.

Further, according to the technical scheme, the anti-settling agent is an amino acid ester copolymer.

The above dispersing agent, defoaming agent and anti-settling agent are conventional agents in the art, and are not particularly limited, and agents having similar functions are within the scope of the present invention.

The second purpose of the present invention is to provide a preparation method of the high conductivity self-bonding graphene low-pressure heating slurry, which specifically includes the following steps:

(1) preparing graphene: completely dispersing graphite and expanded graphite in a solvent B, adding a surfactant, uniformly mixing, placing the obtained mixture in a high-speed emulsifying machine, shearing at a shearing rotating speed of 12000-18000 rmp for 2-4 h, carrying out vacuum filtration, and centrifuging to obtain graphene;

(2) adding resin into the solvent A according to a ratio, stirring until the resin is completely dissolved, then sequentially adding the graphene prepared in the step 1, the heating carbon slurry, the dispersing agent, the water-based crosslinking coupling agent, the defoaming agent and the anti-settling agent according to the ratio, and ultrasonically dispersing the obtained mixture for 30-45 min under a stirring condition; and then ball-milling and grinding the mixture obtained by ultrasonic dispersion to form uniform slurry, namely the high-conductivity self-bonding graphene low-pressure heating slurry.

Further, in the above technical solution, the solvent B in the step (1) is preferably methyl pyrrolidone.

Further, in the above technical solution, the amount of the solvent B used in the step (1) is not particularly limited as long as the graphite and the expanded graphite are uniformly dispersed. For example, the ratio of the total mass of the graphite and the expanded graphite to the amount of the solvent B is (10-100) parts by mass: 1000 parts by volume; more preferably (25 to 30) parts by mass: 1000 parts by volume; wherein: the mass portion and the volume portion are as follows: mL was used as a reference. Further, in the above technical solution, the mass ratio of the graphite to the expanded graphite in the step (1) is 1: 5-5: 1.

further, according to the technical scheme, the mass of the surfactant in the step (1) is 0.5-2% of the total mass of the graphite and the expanded graphite.

Further, in the above technical scheme, the surfactant in the step (1) is preferably polyethylene glycol, the molecular weight of the polyethylene glycol is 200-8000, and for example, the surfactant may be polyethylene glycol-2000 or polyethylene glycol-4000.

Further, in the above technical solution, the shearing process in step (1) is preferably as follows: the shearing rotation speed is 15000rmp, and the shearing time is 3 h.

Further, according to the technical scheme, the vacuum filtration in the step (1) is specifically performed in a filtration machine, and the number of times of the vacuum filtration can be 1-10 times, and preferably 3-5 times.

Further, according to the technical scheme, the centrifugal rotating speed in the step (1) is 5000-10000 rpm.

Further, in the above technical scheme, the ball milling process in the step (2) is specifically as follows:

and (3) loading the mixture obtained by ultrasonic dispersion into a zirconia ball milling tank, and then placing the zirconia ball milling tank into a planetary ball mill, wherein the rotating speed of the ball mill is set to be 100-300 rpm, and the ball milling time is 2-5 h.

Further, in the above technical solution, the grinding in the step (2) is preferably carried out by a three-roll grinder for more than 3 times, so that the materials are fully mixed to form a uniform slurry.

The third purpose of the invention is to provide the application of the high-conductivity self-bonding graphene low-pressure heating slurry, which can be used for preparing a graphene heating film.

The utility model provides a graphite alkene membrane that generates heat, includes the base film, the graphite alkene rete that generates heat that set gradually and sets up the conductive electrode at graphite alkene rete both ends that generate heat from supreme down, wherein: the graphene heating film layer is formed by coating the high-conductivity self-bonding graphene low-pressure heating slurry on the surface of a base film and then drying the coating.

Further, according to the technical scheme, the thickness of the graphene heating film layer can be adjusted according to the heating effect required to be achieved by heating. For example, the thickness of the graphene heating film layer may be 10 to 500 μm, and more preferably 60 to 70 μm.

Further, according to the technical scheme, the coating mode can be any one of spraying, rolling, dipping and brushing. The invention has no special requirements on the specific implementation modes of spraying, rolling, dipping and brushing, and the technology known by the technical personnel in the field is adopted to realize the uniform distribution of the high-conductivity self-bonding graphene low-pressure heating slurry on the surface of the base film.

Compared with the prior art, the invention has the following beneficial effects:

(1) according to the method, a shearing and stripping method is adopted, and an emulsifying machine is utilized to directly carry out high-speed shearing treatment on a graphite raw material in a solution, so that a graphite sheet layer is stripped and falls off to form graphene; the graphene prepared by the method has lower number of graphene layers and fewer defects, and the efficiency of the dispersed preparation of the graphene is greatly improved.

(2) The graphene prepared by the invention can improve the comprehensive performance of the heating slurry, has the advantages of strong binding power, elasticity, difficult fracture of a coating and the like, is moderate in resistance and high in heating power, and can effectively enhance the conductivity of the heating slurry.

(3) According to the invention, by utilizing the excellent electrical conductivity and thermal conductivity of the graphene, a compact and ordered internal structure is still kept between microscopic layer materials in the process of repeatedly heating the heating material, so that the resistance stability of the conductive material is ensured, and the reduction of power is further controlled.

(4) The high-conductivity self-bonding graphene low-pressure heating slurry prepared by the invention can effectively solve the problems that the heating carbon slurry in the prior art has short service life in a long period of a heating film and is easy to generate power attenuation in use.

(5) The graphene low-pressure heating slurry prepared by the invention only needs low pressure less than 36v, and has the advantages of higher low-voltage safety, good heating stability, high thermal conversion efficiency, longer service life, safety and environmental protection.

(6) The invention adopts carbon-based heat conduction materials, is non-toxic and environment-friendly, and has convenient and easily obtained materials.

(7) The preparation method is simple, convenient to operate and control, high in production efficiency, low in cost and capable of realizing large-scale production.

(8) The graphene slurry prepared by the invention can be self-bonded, so that a large amount of binders are not used in the process of preparing the heating slurry, the cost is saved, and the environment is protected.

Drawings

Fig. 1 is an infrared imaging diagram of a heating film prepared by using the high-conductivity self-bonding graphene low-pressure heating paste of embodiment 2 of the invention;

fig. 2 is an infrared imaging diagram of a heating film prepared by using the high-conductivity self-bonding graphene low-pressure heating paste of embodiment 3 of the present invention.

Detailed Description

The present invention will be described in further detail below with reference to examples. The present invention is implemented on the premise of the technology of the present invention, and the detailed embodiments and specific procedures are given to illustrate the inventive aspects of the present invention, but the scope of the present invention is not limited to the following embodiments.

Various modifications to the precise description of the invention will be readily apparent to those skilled in the art from the information contained herein without departing from the spirit and scope of the appended claims. It is to be understood that the scope of the invention is not limited to the procedures, properties, or components defined, as these embodiments, as well as others described, are intended to be merely illustrative of particular aspects of the invention. Indeed, various modifications of the embodiments of the invention which are obvious to those skilled in the art or related fields are intended to be covered by the scope of the appended claims.

For a better understanding of the invention, and not as a limitation on the scope thereof, all numbers expressing quantities, percentages, and other numerical values used in this application are to be understood as being modified in all instances by the term "about". At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.

The test methods used in the following examples are all conventional methods unless otherwise specified; the raw materials and reagents used are, unless otherwise specified, those commercially available from ordinary commercial sources.

Example 1

The high-conductivity self-bonding graphene low-pressure heating slurry is prepared from the following raw materials in parts by mass:

20g of graphene, 35g of heating carbon slurry, 2g of epoxy resin, 5g of ethanol, 10g of sodium dodecyl benzene sulfonate, 5g of propylene imine, 2g of BYK024 defoaming agent and 3g of amino acid ester copolymer; wherein: the graphene is prepared by a shear peeling method.

The high-conductivity self-bonding graphene low-pressure heating slurry is prepared by the following method, and the method comprises the following steps:

(1) preparing graphene: 5g of graphite and 25g of expanded graphite were dissolved in 1000mL of methyl pyrrolidone (NMP) in this order, 0.15g of surfactant polyethylene glycol-2000 was then added, and the resulting mixture was placed in a high-speed emulsifying machine and subjected to shearing treatment for 3 hours at a shearing speed of 15000 rmp. And then placing the mixture obtained after shearing in a suction filter for vacuum suction filtration, and repeatedly performing suction filtration for 5 times to remove the methyl pyrrolidone. And finally, placing the product obtained after suction filtration in a centrifuge, centrifuging for 5 times at 6000rpm, and finally removing the supernatant to obtain the graphene.

(2) Dissolving 2g of epoxy resin in 5g of ethanol, stirring at a high speed by a stirrer, adding 20g of graphene prepared in the step (1), 35g of heating carbon slurry, 10g of sodium dodecyl benzene sulfonate, 5g of propylene imine, 2g of organosilicon defoamer BYK024 and 3g of amino acid ester copolymer into the stirrer after the epoxy resin is completely dissolved, and ultrasonically dispersing for 30min while stirring at a high speed; then putting the mixture obtained by ultrasonic dispersion into a zirconia ball milling tank, putting the zirconia ball milling tank into a planetary ball mill, setting the rotating speed at 100rpm, and timing for 2 hours; and finally, grinding the ball-milled product for 5 times by using a three-roll grinder to fully mix the materials to form uniform slurry, namely the high-conductivity self-bonding graphene low-pressure heating slurry.

Example 2

40g of graphene, 45g of heating carbon slurry, 5g of phenolic resin, 15g of 2-propanol, 20g of sodium dodecyl sulfate, 10g of propylene imine, 6g of BYK024 defoaming agent and 4g of amino acid ester copolymer; wherein: the graphene is prepared by a shear peeling method.

(1) preparing graphene: 30g of graphite and 20g of expanded graphite were dissolved in 2000mL of methyl pyrrolidone (NMP), 0.5g of surfactant polyethylene glycol-4000 was added, and the resulting mixture was placed in a high-speed emulsifying machine and subjected to shearing treatment for 3 hours at a shearing rotation speed of 15000 rmp. And (4) placing the mixture obtained after shearing in a suction filter for vacuum suction filtration, and repeatedly performing suction filtration for 5 times to remove the methyl pyrrolidone. And finally, centrifuging the product obtained after suction filtration for 5 times under the condition of 10000rpm, and removing the supernatant to obtain the graphene.

(2) Dissolving 5g of phenolic resin in 15g of 2-propanol, stirring at a high speed by a stirrer, adding 40g of graphene prepared in the step (1), 45g of heating carbon slurry, 20g of sodium dodecyl sulfate, 10g of propylene imine, 6g of organosilicon defoamer BYK024 and 4g of amino acid ester copolymer into the stirrer after the phenolic resin is completely dissolved, and ultrasonically dispersing for 35min while stirring at a high speed; then, putting the mixture obtained by ultrasonic dispersion into a zirconia ball milling tank, putting the zirconia ball milling tank into a planetary ball mill, setting the rotating speed to be 200rmp, and timing for 4 hours; and finally, grinding the ball-milled product for 4 times by using a three-roll grinder to fully mix the materials to form uniform slurry, namely the high-conductivity self-bonding graphene low-pressure heating slurry.

Example 3

35g of graphene, 50g of heating carbon paste, 4g of acrylic resin, 10g of 1-butanol, 15g of polyvinylpyrrolidone, 8g of propylene imine, 5g of BYK024 defoaming agent and 5g of amino acid ester copolymer; wherein: the graphene is prepared by a shear peeling method.

(1) preparing graphene: 50g of graphite and 10g of expanded graphite were dissolved in 2000mL of methyl pyrrolidone (NMP), 1.2g of surfactant polyethylene glycol-2000 was then added, and the resulting mixture was placed in a high-speed emulsifying machine and subjected to shearing treatment for 3 hours at a shearing speed of 15000 rmp. And (4) placing the mixture obtained after the shearing treatment in a suction filter for vacuum suction filtration, and repeatedly performing suction filtration for 5 times to remove the methyl pyrrolidone. And finally, centrifuging the product obtained after suction filtration for 5 times under the condition of 5000rpm, and removing the supernatant to obtain the graphene.

(2) Dissolving 4g of acrylic resin in 10g of 1-butanol, stirring at a high speed by a stirrer, adding 35g of graphene prepared in the step (1), 50g of heating carbon slurry, 15g of polyvinylpyrrolidone, 8g of propylene imine, 5g of organosilicon defoamer BYK024 and 5g of amino acid ester copolymer into the stirrer after the acrylic resin is completely dissolved, and ultrasonically dispersing for 40min while stirring at a high speed; then, putting the mixture obtained by ultrasonic dispersion into a zirconia ball milling tank, putting the zirconia ball milling tank into a planetary ball mill, setting the rotating speed to be 300rmp, and timing for 5 hours; and finally, grinding the ball-milled product for 5 times by using a three-roll grinder to fully mix the materials to form uniform slurry, namely the high-conductivity self-bonding graphene low-pressure heating slurry.

Example 4

25g of graphene, 40g of heating carbon paste, 2g of acrylic resin, 10g of 2-propanol, 10g of polyvinylpyrrolidone, 8g of propylene imine, 4g of BYK024 defoaming agent and 4g of amino acid ester copolymer; wherein: the graphene is prepared by a shear peeling method.

(1) preparing graphene: 10g of graphite and 15g of expanded graphite were dissolved in 1000mL of methyl pyrrolidone (NMP), 0.25g of surfactant polyethylene glycol-2000 was added, and the mixture was subjected to shear treatment at 12000rmp for 3 hours in a laboratory high-speed emulsifying machine. And (4) placing the mixture obtained after shearing in a suction filter for vacuum suction filtration, and repeatedly performing suction filtration for 5 times to remove the methyl pyrrolidone. And finally, centrifuging the product obtained after suction filtration for 5 times at 8000rpm, and removing supernatant to obtain the graphene.

(2) Dissolving 2g of acrylic resin in 10g of 2-propanol, stirring at a high speed by a stirrer, adding 25g of graphene prepared in the step (1), 40g of heating carbon slurry, 10g of polyvinylpyrrolidone, 8g of propylene imine, 4g of organosilicon defoamer BYK024 and 4g of amino acid ester copolymer into the stirrer after the acrylic resin is completely dissolved, and ultrasonically dispersing for 40min while stirring at a high speed; then the mixture obtained by ultrasonic dispersion is put into a zirconia ball milling tank and put into a planetary ball mill, the rotation speed is set to be 200 r/min, and the time is set to be 3 h; and finally, grinding the ball-milled product for 5 times by using a three-roll grinder to fully mix the materials to form uniform slurry, namely obtaining the high-conductivity self-bonding graphene low-pressure heating slurry.

Example 5

25g of graphene, 30g of heating carbon slurry, 1g of polyurethane, 10g of 2-propanol, 10g of polyvinylpyrrolidone, 8g of propylene imine, 6g of TEGO Airex902W defoaming agent and 5g of amino acid ester copolymer; wherein: the graphene is prepared by a shear peeling method.

(1) preparing graphene: 10g of graphite and 15g of expanded graphite were dissolved in 1000mL of methyl pyrrolidone (NMP), 0.25g of surfactant polyethylene glycol-2000 was added, and the mixture was subjected to shear treatment at 12000rmp for 4 hours in a laboratory high-speed emulsifying machine. And (4) placing the mixture obtained after shearing in a suction filter for vacuum suction filtration, and repeatedly performing suction filtration for 5 times to remove the methyl pyrrolidone. And finally, centrifuging the product obtained after suction filtration for 5 times at 8000rpm, and removing supernatant to obtain the graphene.

(2) Dissolving 1g of polyurethane in 10g of 2-propanol, stirring at a high speed by a stirrer, adding 25g of graphene prepared in the step (1), 30g of heating carbon slurry, 10g of polyvinylpyrrolidone, 8g of propylene imine, 6g of organic silicon defoamer TEGO Airex902W and 5g of amino acid ester copolymer into the stirrer after acrylic resin is completely dissolved, and ultrasonically dispersing for 40min while stirring at a high speed; then the mixture obtained by ultrasonic dispersion is put into a zirconia ball milling tank and put into a planetary ball mill, the rotation speed is set to be 250 r/min, and the time is set to be 4 hours; and finally, grinding the ball-milled product for 5 times by using a three-roll grinder to fully mix the materials to form uniform slurry, namely obtaining the high-conductivity self-bonding graphene low-pressure heating slurry.

The high-conductivity self-bonding graphene low-pressure heating slurry prepared in the above embodiments 2 and 3 of the present invention is sprayed on the surface of the PET base film, and then dried to obtain the graphene heating film with a thickness of 60 μm. And carrying out infrared imaging test on the graphene heating film. Fig. 1 is an infrared imaging diagram, and it can be seen that a heating film prepared from the graphene low-pressure heating slurry disclosed by the invention is uniform in heating and has no abnormal heating points.

Application example 1

Coating the high-conductivity self-bonding graphene low-pressure heating slurry obtained in the embodiment 1 of the invention on the surface of a PET (polyethylene terephthalate) base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Application example 2

Coating the high-conductivity self-bonding graphene low-pressure heating slurry obtained in the embodiment 2 of the invention on the surface of a PET (polyethylene terephthalate) base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Application example 3

Coating the high-conductivity self-bonding graphene low-pressure heating slurry obtained in the embodiment 3 of the invention on the surface of a PET (polyethylene terephthalate) base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Application example 4

Coating the high-conductivity self-bonding graphene low-pressure heating slurry obtained in the embodiment 4 of the invention on the surface of a PET (polyethylene terephthalate) base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Application example 5

Coating the high-conductivity self-bonding graphene low-pressure heating slurry obtained in the embodiment 5 of the invention on the surface of a PET (polyethylene terephthalate) base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Comparative example 1

Coating commercial graphene heating slurry sold in the market on the surface of a PET base film by using a coating machine, and then drying to form a graphene heating film with the thickness of 60 mu m; and connecting copper sheet electrodes at two ends of the graphene heating film layer to obtain the graphene heating film.

Table 1 is a table comparing performance parameters of the graphene heating films obtained in the application examples 1 to 5 with those of the graphene heating film obtained in the comparative example 1. As can be seen from table 1, the graphene heating film of application examples 1 to 5 of the present invention can rapidly heat within 5min, the maximum electrothermal radiation conversion efficiency can reach 80.94%, and the heating performance is significantly better than that of the commercial graphene heating film.

Table 1 table for comparing performance parameters of the graphene heating films of application examples 1 to 5 with those of comparative example 1

Claims

1. The utility model provides a high conductivity self-bonding graphite alkene low pressure thick liquids that generate heat which characterized in that: the formula of the raw materials by mass is as follows: 20-40 parts of graphene, 30-50 parts of heating carbon paste, 1-5 parts of resin, 5-15 parts of solvent A, 10-20 parts of dispersant, 5-10 parts of water-based crosslinking coupling agent, 2-6 parts of defoaming agent and 3-5 parts of anti-settling agent; wherein: the graphene is prepared by a shear peeling method.

2. The high-conductivity self-bonding graphene low-pressure heating slurry according to claim 1, characterized in that: the resin is one or more of polyurethane, epoxy resin, phenolic resin and acrylic resin.

3. The high-conductivity self-bonding graphene low-pressure heating slurry according to claim 1, characterized in that: the solvent A is one or more of ethanol, 2-propanol and 1-butanol.

4. The high-conductivity self-bonding graphene low-pressure heating slurry according to claim 1, characterized in that: the dispersing agent is one or more of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate and polyvinylpyrrolidone.

5. The high-conductivity self-bonding graphene low-pressure heating slurry according to claim 1, characterized in that: the water-based crosslinking coupling agent is propylene imine.

6. The high-conductivity self-bonding graphene low-pressure heating slurry according to claim 1, characterized in that: the defoaming agent is a silicone defoaming agent, and the anti-settling agent is an amino acid ester copolymer.

7. The preparation method of the high-conductivity self-bonding graphene low-pressure heating slurry as claimed in claim 1, is characterized in that: the method specifically comprises the following steps:

8. The preparation method of the high-conductivity self-bonding graphene low-pressure heating slurry according to claim 7, characterized by comprising the following steps: in the step (1), the mass of the surfactant is 0.5-2% of the total mass of the graphite and the expanded graphite.

9. The high-conductivity self-bonding graphene low-pressure heating slurry as claimed in claims 1 to 6 or the high-conductivity self-bonding graphene low-pressure heating slurry prepared by the method as claimed in claims 7 to 8 is applied to preparation of a graphene heating film.

10. The utility model provides a graphite alkene membrane that generates heat, includes the supreme base film, the graphite alkene rete that generates heat that set gradually and sets up the conductive electrode at graphite alkene rete both ends that generate heat down, its characterized in that: the graphene heating film layer is formed by coating the high-conductivity self-bonding graphene low-pressure heating slurry disclosed by claims 1-6 or the high-conductivity self-bonding graphene low-pressure heating slurry prepared by the method disclosed by claims 7-8 on the surface of a base film and then drying the base film.