CN111804673A

CN111804673A - Plasma degumming machine

Info

Publication number: CN111804673A
Application number: CN202010712952.1A
Authority: CN
Inventors: 彭香玲; 连立亭
Original assignee: Wuxi Aoweiying Technology Co ltd
Current assignee: Wuxi Aoweiying Technology Co ltd
Priority date: 2020-07-22
Filing date: 2020-07-22
Publication date: 2020-10-23
Anticipated expiration: 2040-07-22
Also published as: CN111804673B

Abstract

The invention relates to the technical field of plasma degumming machine equipment, in particular to a plasma degumming machine, which comprises a case, wherein a radio frequency power supply, a heating plate, a placing assembly and an ionization assembly are sequentially arranged in the case from bottom to top; the invention provides a plasma degumming machine, which is characterized in that a vacuumizing assembly for vacuumizing the inside of a machine case is arranged on the left side wall of the machine case, a filtering circulation assembly for circulating hot air flow generated in the machine case is arranged on the right side wall of the machine case, and an air supply assembly for supplying air to the inside of an ionization assembly is arranged on the top of the machine case.

Description

Plasma degumming machine

Technical Field

The invention relates to the technical field of plasma degumming machine equipment, in particular to a plasma degumming machine.

Background

The plasma degumming machine can be used for single-chip degumming of 2-6 inch semiconductor wafers, and the degumming is completed by generating low-pressure and low-temperature plasma glow discharge to perform rapid chemical reaction and physical impact with the surfaces of the wafers. And the wafer is prevented from being damaged by high-energy ions in an up-down plasma photoresist removing mode.

Plasma degumming machine among the prior art is carrying out the use of degumming to the disk, and on the one hand the uneven heating can lead to the effect of degumming poor, and on the other hand produces a large amount of high energy active particles because the ionization in-process can cause and harm the disk surface, and then has reduced plasma degumming machine's practicality.

Therefore, it is desirable to develop a plasma photoresist stripper to solve the above problems.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a plasma photoresist remover, and through the design and the use of a series of structures, the problems that the photoresist removing effect is poor due to uneven heating and the surface of a wafer is damaged due to a large number of high-energy active particles generated in the ionization process are solved in the using process of the plasma photoresist remover, so that the practicability of the plasma photoresist remover is improved.

The invention is realized by the following technical scheme:

a plasma degumming machine comprises a machine case, wherein a radio frequency power supply, a heating plate, a placing assembly and an ionization assembly are sequentially arranged in the machine case from bottom to top; the left side wall of the case is provided with a vacuumizing assembly for vacuumizing the inside of the case, the right side wall of the case is provided with a filtering circulation assembly for circulating hot air flow generated in the case, and the top of the case is provided with an air supply assembly for supplying air to the inside of the ionization assembly;

the ionization subassembly includes quartz chamber, the positive pole of radio frequency, negative pole, insulated column, insulating ring and quartz plate, the inner chamber upper portion of machine case inlays and is equipped with the quartz chamber, the inner chamber upper portion interval in quartz chamber inlays and is equipped with two sets ofly the insulating ring, upside the inner wall circumference of insulating ring evenly is equipped with the positive pole of radio frequency, downside the inner wall circumference of insulating ring evenly is equipped with the negative pole, just the positive pole of radio frequency with the medial extremity of negative pole all inlays and is equipped with the insulating column, the inner chamber lower part interval in quartz chamber is equipped with two sets ofly the quartz plate, and both sides from top to bottom the through-hole of seting up on the quartz plate is the setting of staggered structure.

Preferably, four corners of the top of the case are symmetrically provided with shock-absorbing components, and the shock-absorbing components are anti-skid rubber shock-absorbing discs.

Preferably, the radio frequency power supply is arranged at the bottom of the inner cavity of the case, the heating plate is a thermocouple far infrared heating plate which is arranged on the heat insulation plate and is provided with a temperature measurement function, and the heat insulation plate is embedded in the case above the radio frequency power supply.

Preferably, the placing component is a heat-conducting aluminum plate embedded in the case, and the heat-conducting aluminum plate is arranged in a perforated structure.

Preferably, the vacuum pumping assembly comprises a vacuum tube and a vacuum butterfly valve, the vacuum tube is communicated with the inside of the case, the vacuum tube is provided with the vacuum butterfly valve for adjusting or closing the flow, and the outer side end of the vacuum tube is communicated with an external vacuum pumping pump.

Preferably, the filtering cycle component comprises a circulating pipe, ventilation air and a filter cartridge, the upper end and the lower end of the circulating pipe are respectively communicated with the inner cavity of the case, which is positioned on the upper side and the lower side of the component, and the circulating pipe is sequentially provided with the exhaust fan and the filter cartridge from top to bottom.

Preferably, the inside of cartridge filter from top to bottom inlays in proper order and is equipped with activated carbon fiber filter screen and cold catalyst filter screen.

Preferably, the gas supply assembly comprises a gas supply pipe, the lower end of the gas supply pipe is communicated with the quartz cavity, and the upper end of the gas supply pipe is communicated with an external gas supply device.

Preferably, the middle part of the front side wall of the case is provided with a visual observation sealing door for observing the degumming result, and the upper part of the front side wall of the case is provided with a control panel.

The invention has the beneficial effects that:

by adopting the structure and the design, the problem that the photoresist removing effect is poor due to uneven heating and the surface of a wafer is damaged due to a large amount of high-energy active particles generated in the ionization process is solved, so that the practicability of the plasma photoresist remover is improved;

the invention has novel structure, reasonable design, convenient use and stronger practicability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a left side view of the present invention;

FIG. 2 is a right side view of the present invention;

FIG. 3 is a front cross-sectional view of the present invention;

FIG. 4 is a bottom cross-sectional view of the present invention;

fig. 5 is a right side cross-sectional view of the present invention.

In the figure: 1-case, 2-radio frequency power supply, 3-heating plate, 4-placing component, 5-ionization component, 51-quartz cavity, 52-radio frequency anode, 53-cathode, 54-insulating column, 55-insulating ring, 56-quartz disk, 6-vacuumizing component, 61-vacuum tube, 62-vacuum butterfly valve, 7-filtering circulation component, 71-circulation tube, 72-induced draft air, 73-filter cartridge, 8-air supply component, 9-damping component, 10-heat insulation plate, 11-visual observation sealing door and 12-control panel.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A plasma degumming machine comprises a case 1, wherein a radio frequency power supply 2, a heating plate 3, a placing component 4 and an ionization component 5 are sequentially arranged in the case 1 from bottom to top; a vacuumizing assembly 6 for vacuumizing the interior of the case 1 is arranged on the left side wall of the case 1, a filtering circulation assembly 7 for circulating hot air flow generated in the case 1 is arranged on the right side wall of the case 1, and an air supply assembly 8 for supplying air to the interior of the ionization assembly 5 is arranged at the top of the case 1;

the ionization component 5 comprises a quartz cavity 51, a radio frequency anode 52, a cathode 53, an insulating column 54, an insulating ring 55 and a quartz disc 56, the quartz cavity 51 is embedded in the upper portion of the inner cavity of the case 1, two groups of insulating rings 55 are embedded in the upper portion of the inner cavity of the quartz cavity 51 at intervals, the radio frequency anode 52 is uniformly arranged on the circumferential direction of the inner wall of the upper insulating ring 55, the cathode 53 is uniformly arranged on the circumferential direction of the inner wall of the lower insulating ring 55, the insulating column 54 is embedded in the inner side ends of the radio frequency anode 52 and the cathode 53, two groups of quartz discs 56 are arranged on the lower portion of the inner cavity of the quartz cavity 51 at intervals, and through holes formed in the quartz discs 56.

Specifically, damping components 9 are symmetrically arranged at four corners of the top of the case 1, and the damping components 9 are anti-slip rubber damping discs.

Specifically, the radio frequency power supply 2 is arranged at the bottom of an inner cavity of the case 1, the heating plate 3 is a thermocouple far infrared heating plate 3 which is arranged on the heat insulation plate 10 and is provided with a temperature measurement function, and the heat insulation plate 10 is embedded in the case 1 above the radio frequency power supply 2.

Specifically, place subassembly 4 for inlaying the heat conduction aluminum plate of locating quick-witted case 1 inside, and heat conduction aluminum plate sets up for the perforation structure.

Specifically, the vacuum pumping assembly 6 comprises a vacuum tube 61 and a vacuum butterfly valve 62, the vacuum tube 61 is communicated with the inside of the case 1, the vacuum butterfly valve 62 for adjusting or closing the flow rate is arranged on the vacuum tube 61, and the outer end of the vacuum tube 61 is communicated with an external vacuum pumping pump.

Specifically, the filtering circulation assembly 7 comprises a circulation pipe 71, an exhaust fan 72 and a filter cartridge 73, wherein the upper end and the lower end of the circulation pipe 71 are respectively communicated with the inner cavities of the chassis 1 positioned at the upper side and the lower side of the placing assembly 4, and the exhaust fan and the filter cartridge 73 are sequentially arranged on the circulation pipe 71 from top to bottom.

Specifically, an activated carbon fiber filter screen and a cold catalyst filter screen are sequentially embedded in the filter cartridge 73 from top to bottom.

Specifically, the gas supply assembly 8 includes a gas supply pipe, a lower end of the gas supply pipe is communicated with the quartz chamber 51, and an upper end of the gas supply pipe is communicated with an external gas supply device.

Specifically, the middle part of the front side wall of the case 1 is provided with a visual observation sealing door 11 for observing the degumming result, and the upper part of the front side wall of the case 1 is provided with a control panel 12.

The working principle is as follows: when the device is used, the visual observation sealing door 11 is opened, firstly, a wafer to be subjected to photoresist removal is placed on the placing component 4, then the visual observation sealing door 11 is closed, and the interior of the case 1 is vacuumized through the cooperation of the external vacuum-pumping pump and the vacuumizing component 6;

then synchronously controlling the heating plate 3, the filtering circulation component 7, the radio frequency power supply 2 and an external air supply device to work, wherein the heating plate 3 heats the air inside the case 1, and the filtering circulation component 7 drives hot air to be conveyed to the heating plate 3 through the circulation pipe 71 to be reheated by controlling the exhaust fan to work when working, so that on one hand, the purpose of uniformly diffusing the hot air inside the case 1 can be achieved, and on the other hand, when being conveyed through the circulation pipe 71, the harmful gas or powder dust generated in the degumming process inside the case 1 can be filtered and adsorbed through the filtering effect of the filter drum 73;

when the radio frequency power supply 2 works, the radio frequency anode 52 is electrified and ionized into ions and electrons under the action of the radio frequency anode 52 and the cathode 53, and the ions are accelerated to move downwards under the action of an electric field because the radio frequency anode 52 is positive, so that the photoresist on the surface of a wafer on the placement component 4 is bombarded to achieve the purpose of cleaning, and meanwhile, the cavity is accompanied with purple glow;

moreover, the high-energy active particles generated in the ionization process are eliminated by gas phase recombination in the process of the two groups of quartz disks 56, low-energy free radicals and neutral particles which can oxidize the photoresist are sent to the surface of the wafer to finish the purpose of photoresist removal and cleaning, so that the surface protection effect on the wafer is further achieved, and damage is avoided;

moreover, the through holes arranged on the quartz disks 56 at the upper side and the lower side are arranged in a staggered structure, so that the path of high-energy active particles passing through the two groups of quartz disks 56 can be prolonged, and the elimination effect of gas phase recombination is further improved;

moreover, the damping components 9 are symmetrically arranged at four corners of the top of the case 1, and the damping components 9 are anti-skid rubber damping discs, so that the aim of damping and buffering the vibration generated during the operation of the degumming machine can be fulfilled;

the heating plate 3 is a thermocouple far infrared heating plate 3 which is arranged on the heat insulation plate 10 and has a temperature measurement function, so that the purpose of conveniently controlling the temperature during heating can be achieved, and the heating efficiency is further improved;

the placing component 4 is a heat-conducting aluminum plate embedded in the case 1, and the heat-conducting aluminum plate is arranged in a perforation structure, so that the heating and heat-conducting effect can be further improved, and the uniformity of the wafer during heating can be further improved;

the activated carbon fiber filter screen and the cold catalyst filter screen are sequentially embedded in the filter cylinder 73 from top to bottom, so that the filtering and adsorbing effects can be further improved;

further, under the design and use of the structure, the problem that the photoresist removing effect is poor due to uneven heating and the problem that the surface of a wafer is damaged due to a large number of high-energy active particles generated in the ionization process are solved in the using process of the plasma photoresist remover, so that the practicability of the plasma photoresist remover is improved;

the control mode of the electrical components such as the radio frequency power supply 2, the heating plate 3, the external vacuum pump, the exhaust fan, the external air supply device and the like is controlled by the control panel 12 matched with the control circuit, the type of the control panel 12 is PLC, the control circuit can be realized by simple programming of technicians in the field, the control circuit belongs to the common knowledge in the field, is only used without improvement, and is mainly used for protecting mechanical devices, so the control mode and the circuit connection are not described in detail in the invention.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a plasma degumming machine, includes quick-witted case (1), its characterized in that: the radio frequency power supply (2), the heating plate (3), the placing component (4) and the ionization component (5) are sequentially arranged in the case (1) from bottom to top; a vacuumizing assembly (6) for vacuumizing the interior of the case (1) is arranged on the left side wall of the case (1), a filtering circulation assembly (7) for circulating hot air flow generated in the case (1) is arranged on the right side wall of the case (1), and an air supply assembly (8) for supplying air to the interior of the ionization assembly (5) is arranged at the top of the case (1);

ionization subassembly (5) are including quartz chamber (51), the anodal (52) of radio frequency, negative pole (53), insulated column (54), insulating ring (55) and quartz plate (56), the inner chamber upper portion of machine case (1) inlays and is equipped with quartz chamber (51), the inner chamber upper portion interval of quartz chamber (51) is inlayed and is equipped with two sets ofly insulating ring (55), upside the inner wall circumference of insulating ring (55) evenly is equipped with the anodal (52) of radio frequency, downside the inner wall circumference of insulating ring (55) evenly is equipped with negative pole (53), just the anodal (52) of radio frequency with the medial extremity of negative pole (53) all inlays and is equipped with insulating column (54), the inner chamber lower part interval of quartz chamber (51) is equipped with two sets ofly quartz plate (56), and upper and lower both sides the through-hole of seting on quartz plate (56) is the setting of staggered structure.

2. The plasma photoresist remover according to claim 1, wherein: shock-absorbing components (9) are symmetrically arranged at four corners of the top of the case (1), and the shock-absorbing components (9) are anti-skidding rubber shock-absorbing discs.

3. The plasma photoresist remover according to claim 1, wherein: the radio frequency power supply (2) is arranged at the bottom of an inner cavity of the case (1), the heating plate (3) is a thermocouple far infrared heating plate (3) which is arranged on the heat insulation plate (10) and is used for measuring temperature, and the heat insulation plate (10) is embedded in the case (1) above the radio frequency power supply (2).

4. The plasma photoresist remover according to claim 1, wherein: the placing component (4) is a heat-conducting aluminum plate embedded in the case (1), and the heat-conducting aluminum plate is arranged in a perforation structure.

5. The plasma photoresist remover according to claim 1, wherein: the vacuum pumping assembly (6) comprises a vacuum tube (61) and a vacuum butterfly valve (62), the vacuum tube (61) is communicated with the inside of the case (1), the vacuum butterfly valve (62) used for adjusting or closing the flow is arranged on the vacuum tube (61), and the outer side end of the vacuum tube (61) is communicated with an external vacuum pumping pump.

6. The plasma photoresist remover according to claim 1, wherein: filter circulation subassembly (7) and include circulating pipe (71), convulsions wind (72) and cartridge filter (73), the upper and lower end of circulating pipe (71) respectively with be located place both sides about subassembly (4) machine case (1) inner chamber is linked together, just be equipped with from top to bottom in proper order on circulating pipe (71) the air exhauster with cartridge filter (73).

7. The plasma resist remover according to claim 6, wherein: the inside of cartridge filter (73) from top to bottom inlays in proper order and is equipped with activated carbon fiber filter screen and cold catalyst filter screen.

8. The plasma photoresist remover according to claim 1, wherein: the gas supply assembly (8) comprises a gas supply pipe, the lower end of the gas supply pipe is communicated with the quartz cavity (51), and the upper end of the gas supply pipe is communicated with an external gas supply device.

9. The plasma photoresist remover according to claim 1, wherein: the middle part of the front side wall of the case (1) is provided with a visual observation sealing door (11) for observing the degumming result, and the upper part of the front side wall of the case (1) is provided with a control panel (12).