CN111797582A - Automatic coupling method and system based on logic characteristics - Google Patents
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Abstract
The invention discloses an automatic coupling method and system based on logic characteristics, which comprises the following steps: obtaining element identification information, input and output information and position information of input and output devices to be coupled from a layout design file of a chip; obtaining coordinate data of an input device and an output device of a certain element; moving the input and output coupling ends to positions corresponding to the coordinate data of the input and output devices respectively; performing a coupling test on the input device and the output device; if there are not coupling elements, selecting one element not coupling, obtaining the coordinate data of the input and output devices which have not been coupling tested, and returning to execute the coupling end moving step. The invention can realize automatic coupling of complex or customized chips.
Description
Technical Field
The invention belongs to the technical field of chip coupling test, and particularly relates to an automatic coupling method and system based on logic characteristics.
Background
With the development of photoelectrons, the requirements of optical chip coupling are increasing day by day, and the following parameters are mainly required during optical chip coupling: 1) coordinate information of the element to be coupled, 2) link relation of the element to be coupled, namely information for determining the optical path; the existing coupling method cannot effectively acquire the above parameters of all elements to be coupled at the same time, and usually some methods are adopted to acquire other information to replace the required parameters, but the application range of the replacement is narrow, and automatic coupling can be performed only under some specific conditions.
The existing coupling method mainly aims at coupling the coupled elements under the condition of regular arrangement, extracts relative position information of the elements for coupling, processes coordinate information by utilizing strong regularity of the coordinate information of the elements, and reads out the coordinate information and link relation required by coupling, but has a narrow application range. In the case of complex coupling elements, such as single-input multiple-output elements, or complex design layouts, such as intersections of coordinate ranges of multiple elements, the existing coupling method and apparatus often cannot clearly determine the correspondence between the gratings of the elements to be coupled.
When the existing coupling method faces flexible and changeable design files, only automatic coupling of a part of simple layouts in a chip can be performed, or only the design files with the simple layouts can be coupled, so that the requirement of performing automatic coupling on all the design files cannot be met.
When the existing coupling method faces flexible and changeable design files, part of coupling with complex layout depends on manual operation, manual errors are inevitably introduced, the consistency and reliability of coupling results are also reduced, the labor cost is also high, and the manual coupling time efficiency is lower than that of automatic coupling.
Because the existing coupling method has too large limitation, one method is to select and adjust the design layout to ensure that the designed elements have strong regularity, thus wasting part of layout space, the existing tape-out time period is long, and the tape-out chance each time is precious, and the method is obviously not advisable; in addition, there is another method, which is a current common practice, in the optical coupling, a manual coupling method is adopted for a part which cannot be automatically coupled, and the method has obvious defects and cannot meet the increasing and highly developed optical coupling requirement.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an automatic coupling method and system based on logic characteristics, which can realize automatic coupling of complex or customized chips.
In one aspect of the invention, an automatic coupling method based on logic characteristics comprises the following steps:
a characteristic extraction step: obtaining element identification information, input and output information and position information of an input device and an output device to be coupled from a layout design file of a chip;
a coordinate acquisition step: obtaining coordinate data of an input device and an output device of a certain element according to the element identification information, the input and output information and the position information;
a coupling end moving step: moving an input coupling end and an output coupling end to positions on the chip corresponding to the coordinate data of the input device and the output device respectively;
coupling: performing a coupling test on the input device and the output device;
and (3) automatic coupling judgment: if there are not coupling-completed elements, selecting one coupling-completed element, obtaining the coordinate data of the input device and the output device which have not been subjected to the coupling test, and returning to execute the coupling end moving step.
An optimization scheme, the performing coupling tests on the input device and the output device comprising: the input coupling end and the output coupling end scan the optical power near the position corresponding to the coordinate data and record the coordinate information of the position of the maximum optical power;
before the step of moving the coupling end is executed, the method further comprises the following steps:
a correction coordinate acquisition step: and obtaining coordinate data of the input device and the output device for moving the input coupling end and the output coupling end according to the coordinate data variable quantity of the input device and the output device which are not subjected to the coupling test and the input device and the output device which are coupled last time by taking the maximum optical power position as a reference.
An optimization scheme, the performing coupling tests on the input device and the output device comprising: the input coupling end moves near a position corresponding to the coordinate data of the input device, the output coupling end detects an electrical signal at a position corresponding to the coordinate data of the output device, and the coordinate information of the input device at the optimal electrical signal position is recorded;
before the step of moving the coupling end is executed, the method further comprises the following steps:
a correction coordinate acquisition step: and obtaining coordinate data of the input device for moving the input coupling end according to the coordinate data variation of the input device which is not subjected to the coupling test and the input device which is coupled last time by taking the optimal electrical signal position as a reference.
In an optimized scheme, all input devices face one side of the chip, and all output devices face the other side of the chip.
In an optimization scheme, the component identification information is a characteristic parameter additionally added to a device for marking the component, or identification information of the cell in which all devices of the same component are incorporated into the same cell.
An optimization scheme, prior to the feature extraction step, further comprising:
and adding element identification information and input and output information for all input devices and output devices in a layout design file of the chip.
In another aspect of the present invention, an automatic coupling system includes:
the upper computer is used for obtaining element identification information, input and output information and position information of the input device and the output device to be coupled from the layout design file of the chip; the component recognition module is also used for obtaining the coordinate data of the input device and the output device of a certain component according to the component recognition information, the input and output information and the position information; the system is also used for recording the coordinate information of the maximum optical power position; the coupling test device is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input device and the output device which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling end and the output coupling end to move to positions on the chip corresponding to the coordinate data of the input device and the output device respectively; the input coupling end and the output coupling end are also used for controlling to move near the position corresponding to the coordinate data;
an optical power meter for scanning optical power when the input coupling terminal and the output coupling terminal move in the vicinity of a position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
And the upper computer is also used for obtaining coordinate data of the input device and the output device used for moving the input coupling end and the output coupling end according to the coordinate data variation of the input device and the output device of the element which is not subjected to the coupling test and is coupled with the last time by taking the maximum optical power position as a reference.
An automatic coupling system, comprising:
the upper computer is used for obtaining element identification information, input and output information and position information of the input device and the output device to be coupled from the layout design file of the chip; the component recognition module is also used for obtaining the coordinate data of the input device and the output device of a certain component according to the component recognition information, the input and output information and the position information; the system is also used for recording the coordinate information of the optimal electrical signal position; the coupling test device is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input device and the output device which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling end and the output coupling end to move to positions on the chip corresponding to the coordinate data of the input device and the output device respectively; the input coupling end is also used for controlling the input coupling end to move near the position corresponding to the coordinate data;
electrical signal detection means for detecting an electrical signal when the input coupling terminal moves in the vicinity of a position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
And the upper computer is also used for obtaining the coordinate data of the input device for moving the input coupling end according to the coordinate data variation of the input device which is not subjected to the coupling test and the input device which is coupled last time by taking the optimal electrical signal position as a reference.
Compared with the prior art, the invention has the following beneficial effects:
1. logic characteristic information such as element identification information and input/output information is added in the layout design file, and position information is combined, so that the input/output devices of all elements can be accurately positioned, and automatic coupling of chips with complex layout or customized layout is realized;
2. the next coupling position is corrected by utilizing the maximum optical power position or the optimal electrical signal position, so that the accumulated error caused by the movement of the coupling end in the automatic coupling process can be effectively reduced, and the coupling speed is improved;
3. by enabling the input device to face one side and the output device to face the other side, the problem that certain time is spent to finish exchange due to crossed layout in the prior art can be solved, and the coupling speed is further improved;
4. by adding element identification information and input/output information in the layout design file of the conventional chip, the conventional chip can realize automatic coupling, so that the labor cost is saved, and the coupling efficiency is improved.
Drawings
FIG. 1 is a basic flow diagram of an automatic coupling method based on logic features according to the present invention;
FIG. 2 is a flow chart of one embodiment of a logical characteristic based automatic coupling method of the present invention;
FIG. 3 is a flow chart of another embodiment of a method for automatic coupling based on logic characteristics of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with reference to the specific drawings.
On one hand, an embodiment specifically discloses an automatic coupling method based on logic characteristics, as shown in fig. 1, including the following steps (in this embodiment, both the input device and the output device are gratings):
step 1: a characteristic extraction step: and taking a layout design file (such as a design file in a GDS format) of a chip to be subjected to coupling test, and extracting element identification information, input and output information and position information of the grating to be coupled from the layout design file.
The element identification information can be realized by additionally adding characteristic parameters for marking the element to which each device (such as a grating, a straight waveguide, a beam splitter and the like) in the same element belongs, so as to distinguish which element the different devices belong; the method can also be realized by designing each device in the same element in the same cell and using the identification information of the cell as the element identification information. The input/output information refers to an additionally added characteristic parameter for marking whether a device is an input device or an output device, that is, the device is used for input or output. The position information refers to coordinate data corresponding to each device. The information is extracted from the layout design file, the implementation method is various, and the Labview can be used for extracting the related information. The element identification information and the input and output information can be added at the design stage of the layout design file, and the layout design file which can be used for automatic coupling is directly obtained when the design is finished. The cell is a basic unit for forming a circuit or an optical path in layout design, and can be translated into a basic unit, which belongs to common knowledge in the field.
Step 2: a coordinate acquisition step: and obtaining the coordinate data of the input grating and the output grating of a certain element according to the element identification information, the input and output information and the position information.
Wherein, the corresponding input device and output device in the same element can be found through the element identification information and the input and output information, and the coordinate data used for the coupling end moving step can be obtained by combining the position information of the devices.
And step 3: a coupling end moving step: and respectively moving the input coupling end and the output coupling end to positions corresponding to the coordinate data of the input grating and the output grating.
The input coupling end and the output coupling end may be optical fibers respectively used for coupling with the input grating and the output grating, and may be generally represented by an input side optical fiber and an output side optical fiber, and the light source, the input side optical fiber, the chip, the output side optical fiber, and the optical power meter may form an optical path during coupling. And respectively moving the two coupled optical fibers to positions corresponding to the coordinate data of the input grating and the output grating through the coupling end clamping device.
And 4, step 4: coupling: and performing coupling test on the input device and the output device. Specifically, the input coupling terminal and the output coupling terminal may scan optical power in the vicinity of a position corresponding to the coordinate data, and coordinate information of a position of maximum optical power may be recorded.
Wherein, the maximum optical power position refers to the maximum value of the optical power that can be obtained by the element at the position. Specifically, the input coupling end can move near the position corresponding to the input grating and scan the optical power, and the coordinate information of the position with the maximum optical power is recorded; the output coupling end can move near the corresponding position of the output grating and scan the optical power, and the coordinate information of the position of the maximum optical power is recorded. The movement near the corresponding position of the grating can be realized by a coupling end clamping device, and the maximum optical power is measured by an optical power meter.
And 5: and (3) automatic coupling judgment: judging whether there are any elements which are not coupled: if yes, selecting an element which is not coupled, obtaining coordinate data of the input grating and the output grating which are not subjected to the coupling test, and returning to execute the coupling end moving step; if not, the method is ended.
The element which is not subjected to the coupling test means that the element comprises a group of input gratings and output gratings which need to be subjected to the coupling test but are not subjected to the coupling test. Generally, the input grating and the output grating in one element may be coupled before the other element is decoupled, but the coupling test is not limited thereto if all the input gratings and the output gratings to be coupled can be completed. Since the element identification information, the input/output information, and the position information of the input grating and the output grating in all the elements to be coupled are already obtained in step 1, the coordinate data of the input grating and the output grating which are not coupled can be directly determined, and thus the automatic coupling is realized. That is, the automatic coupling is not affected regardless of the positional relationship between the next coupled element and the certain element. Compared with the prior art, the technical problem that automatic coupling test cannot be carried out on the customized or complex layout is solved.
As a further optimized solution, as shown in fig. 2, in the step 5 (automatic coupling judgment step), after obtaining coordinate data of the input grating and the output grating, before returning to the step of executing the coupling end moving, the method further includes:
step 51: a correction coordinate acquisition step: and obtaining coordinate data of the input grating and the output grating for moving the input coupling end and the output coupling end according to the coordinate data variable quantity of the input grating and the output grating which are not subjected to the coupling test and the input grating and the output grating which are coupled last time by taking the maximum optical power position as a reference.
The obtaining of the correction coordinate, that is, obtaining coordinate data used as a moving target of the input and output coupling ends, may be coordinate data of the maximum optical power position, and calculating to obtain a coordinate data variation according to coordinate data of the last coupled input grating and output grating and the un-coupled input grating and output grating, and adding the coordinate data variation and the output grating.
The input and output coupling ends can move by taking the position of the last maximum optical power value as a reference during each movement and moving through the relative coordinate position between the two couplings, so that the optical power optimal value position of the next pair of coupling points (namely the coupling positions of the input and output coupling ends) can be more accurately found. The scanning of the nearby area after the input-output coupling end moves to the next pair of coupling points can be only performed in a small range, so that the coupling speed can be effectively improved, and then the steps are repeated to complete the coupling of the rest devices. The embodiment can effectively reduce the accumulated error caused by the movement of the coupling optical fiber in the automatic coupling process and improve the coupling speed.
As a further optimized scheme, the input gratings face one side of the chip, and the output gratings face the other side of the chip.
The input grating faces one side and the output grating faces the other side, and specifically, it can be stated that all the input gratings on a chip are always closer to the same side of the chip than the output gratings in the same element, whereas all the output gratings are always closer to the other side of the chip than the input gratings in the same element. If two elements with similar positions are provided, wherein one of the two elements is provided with an input at the left and an output at the right, and the other element is provided with an input at the right and an output at the left, since the coupling fiber connected with the light source and the coupling fiber connected with the power meter are usually fixed during actual coupling, although automatic coupling can still be realized by exchanging the connecting fibers of the light source and the power meter, the cross arrangement takes a certain time to complete the exchange, and has a certain influence on the coupling speed. Therefore, in the whole layout, the frequent crossing of the input and output positions in the horizontal direction should be avoided as much as possible.
As a further optimized solution, before the step of feature extraction, the method further includes:
a characteristic adding step: and adding element identification information and input and output information for all the gratings in a layout design file of the chip. In particular, the component identification information may be a characteristic parameter for marking the component to which the component belongs, and the input/output information may be a characteristic parameter for marking input or output.
In addition to the situation that the layout design file which can be used for automatic coupling is directly obtained by adding the element identification information and the input/output information into the design file in the design stage, the layout design file of the existing chip in the prior art does not include the element identification information and the input/output information, and the chip cannot be automatically coupled by using the automatic coupling method based on the logic characteristics in the application. Therefore, the file identification information and the input and output information can be added to the raster in the existing layout design file, so that the chips which cannot be automatically coupled before can also realize automatic coupling.
Another embodiment further discloses an automatic coupling method based on logic characteristics, as shown in fig. 1, including the following steps (in this embodiment, the input device is a grating, and the output device is an electrical pad):
step 1: a characteristic extraction step: a layout design file (such as a design file in a GDS format) of a chip to be subjected to coupling test is taken, and element identification information, input and output information and position information of a device to be coupled are extracted from the layout design file.
Step 2: a coordinate acquisition step: and obtaining the coordinate data of the input grating and the output electric pad of a certain element according to the element identification information, the input and output information and the position information.
The corresponding input grating and the corresponding output electric pad in the same element can be found through the element identification information and the input and output information, and coordinate data used for the coupling end moving step can be obtained by combining the position information of the input grating and the output electric pad.
And step 3: a coupling end moving step: and moving the input coupling end and the output coupling end to positions corresponding to the coordinate data of the input grating and the output electric pad respectively.
Wherein the input coupling end can be an optical fiber for coupling with the input grating, and the output coupling end can be a probe for connecting with the output electrical pad. And moving the coupling optical fiber and the probe to positions corresponding to the coordinate data of the input grating and the output grating respectively through the coupling end clamping device.
And 4, step 4: coupling: and performing coupling test on the input device and the output device. Specifically, the input coupling terminal may move near a position corresponding to the coordinate data of the input grating, and the output coupling terminal may detect an electrical signal at a position corresponding to the output electrical pad coordinate data, and record input device coordinate information of an optimal electrical signal position.
Wherein, the optimal electrical signal position refers to the position where the element can obtain the optimal value of the electrical signal. The electrical signal may be a current or voltage signal or the like. Specifically, the output coupling end (probe) can be contacted with the output electric pad at a corresponding position, and the input coupling end (optical fiber) can move near the corresponding position of the input grating to record the coordinate information of the optimal electric signal position. The movement near the corresponding position of the input grating can be realized by a coupling end clamping device, and the optimal electrical signal is detected by an electrical signal detection device. For example, the electrical signal detection device may be an ammeter or a voltmeter.
And 5: and (3) automatic coupling judgment: judging whether there are any elements which are not coupled: if yes, selecting an element which is not coupled, obtaining coordinate data of the input grating and the output electric pad which are not subjected to the coupling test, and returning to execute the coupling end moving step; if not, the method is ended.
The device that has not been subjected to the coupling test includes a set of input gratings and output electrical pads that need to be subjected to the coupling test but have not yet been subjected to the coupling test. Generally, the input grating and the output electrical pad in one element may be coupled before the other element is decoupled, but the coupling test is not limited thereto if all the input grating and the output electrical pad to be coupled can be completed. Since the element identification information, the input/output information, and the position information of the input grating and the output electric pad in all the elements to be coupled are already obtained in step 1, the coordinate data of the input grating and the output electric pad which are not coupled can be directly determined, and thus automatic coupling is realized. That is, the automatic coupling is not affected regardless of the positional relationship between the next coupled element and the certain element. Compared with the prior art, the technical problem that automatic coupling test cannot be carried out on the customized or complex layout is solved.
As a further optimized solution, as shown in fig. 3, in the step 5 (automatic coupling judgment step), after obtaining coordinate data of the input grating and the output electrical pad, before returning to the step of executing the coupling end moving, the method further includes:
step 51: a correction coordinate acquisition step: and obtaining coordinate data of the input grating for moving the input coupling end according to the coordinate data variation of the input grating which is not subjected to the coupling test and the input grating coupled last time by taking the optimal electrical signal position as a reference. The coordinate data of the output electrical pad for moving the output coupling terminal may be initially read coordinate data of the output electrical pad, or may be determined by newly obtained coordinate data of the input grating for moving the input coupling terminal (for example, the coordinate data of the output electrical pad for moving the output coupling terminal is obtained according to a variation of the coordinate data of the input grating and the output electrical pad that have not undergone the coupling test with reference to the newly obtained coordinate data of the input grating).
The obtaining of the correction coordinate, that is, the obtaining of the coordinate data used as the moving target of the input and output coupling ends, may be the coordinate data of the optimal electrical signal position, and the coordinate data variation is calculated according to the coordinate data of the last coupled input grating and output grating and the coordinate data of the input grating and output grating which are not coupled, and the coordinate data variation is obtained by adding the two coordinate data.
The input coupling end can take the position of the last optimal value of the electrical signal as a reference when moving each time, and the position of the optimal value of the electrical signal of the next pair of coupling points (namely the coupling positions of the input coupling end and the output coupling end) can be more accurately found by moving the relative coordinate position between the two couplings. The scanning of the nearby area after the input and output coupling ends move to the next pair of coupling points can be only performed in a small range, so that the coupling speed can be effectively improved, and then the steps are repeated to complete the coupling of the rest devices. The embodiment can effectively reduce the accumulated error caused by the movement of the coupling optical fiber in the automatic coupling process and improve the coupling speed.
As a further optimized scheme, the input gratings face one side of the chip, and the output electrical pads face the other side of the chip.
The input device faces one side and the output device faces the other side, and specifically, it can be stated that all input gratings on a chip are always closer to the same side of the chip than output gratings in the same element, whereas all output gratings are always closer to the other side of the chip than input gratings in the same element. If two elements are located close to each other, one of them is input on the left and the output is on the right, and the other is input on the right and the output is on the left, the cross layout will take a certain time to complete the switching, which will have a certain effect on the coupling speed. Therefore, in the whole layout, the frequent crossing of the input and output positions in the horizontal direction should be avoided as much as possible.
As a further optimized solution, before the step of feature extraction, the method further includes:
a characteristic adding step: and adding element identification information and input/output information for all devices in a layout design file of the chip. In particular, the component identification information may be a characteristic parameter for marking the component to which the component belongs, and the input/output information may be a characteristic parameter for marking input or output.
It should be noted that, an automatic coupling method based on logic characteristics in the present application is not limited to the two embodiments described above, and may also be a mixed scheme of the two embodiments, for example, when a device to be coupled includes an input grating, an output grating, and an output electrical pad at the same time, it is necessary to couple both the input grating and the output grating, and couple the input grating and the output electrical pad. Further, it is possible to couple two gratings and an electrical pad at the same time, for example, when the coupling is optimized to the optical power (corresponding to the previous embodiment), add an electrical signal, and test the received optical signal (not the optical power, but the test signal). In general, however, no changes are made without departing from the inventive concept and spirit of the present application, that is, by setting logic features (such as component identification information, input/output information, etc.) in a layout design file and using the logic features to implement automatic coupling.
In another aspect of the present invention, an embodiment discloses an automatic coupling system, including:
the upper computer is used for obtaining element identification information, input and output information and position information of the grating to be coupled from a layout design file of the chip; the system is also used for acquiring the coordinate data of the input grating and the output grating of a certain element according to the element identification information, the input and output information and the position information; the system is also used for recording the coordinate information of the maximum optical power position; the coupling test system is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input grating and the output grating which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling optical fiber and the output coupling optical fiber to respectively move to the positions corresponding to the coordinate data of the input grating and the output grating on the chip; the input and output coupling optical fibers are also used for controlling the movement of the input and output coupling optical fibers near the position corresponding to the coordinate data;
an optical power meter for scanning optical power when the input and output coupling optical fibers move in the vicinity of the position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
The coupling end clamping device can comprise a left motor, a right motor, a clamping carrying platform and the like, can be communicated with an upper computer, and controls the movement of the coupling optical fiber according to an instruction sent by the upper computer. The optical power meter is used for scanning the optical power value when the coupling optical fibers on the two sides move to the corresponding positions.
And the upper computer is further used for obtaining coordinate data for moving the input grating and the output grating of the input and output coupling optical fiber according to the coordinate data variable quantity of the input grating and the output grating of the last coupling element which are not subjected to the coupling test and the coordinate data variable quantity of the input grating and the output grating of the last coupling element by taking the maximum optical power position as a reference.
Another embodiment further discloses an automatic coupling system, including:
the upper computer is used for obtaining element identification information, input and output information and position information of the input device and the output device to be coupled from the layout design file of the chip; the component recognition module is also used for obtaining the coordinate data of the input device and the output device of a certain component according to the component recognition information, the input and output information and the position information; the system is also used for recording the coordinate information of the optimal electrical signal position; the coupling test device is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input device and the output device which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling end and the output coupling end to move to positions on the chip corresponding to the coordinate data of the input device and the output device respectively; the input coupling end is also used for controlling the input coupling end to move near the position corresponding to the coordinate data;
electrical signal detection means for detecting an electrical signal when the input coupling terminal moves in the vicinity of a position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
The coupling end clamping device can comprise a left motor, a right motor, a clamping carrying platform and the like, can be communicated with an upper computer, and controls the movement of the coupling optical fiber and the probe according to an instruction sent by the upper computer. The electrical signal detection apparatus is used for testing electrical signals when the input device (optical fiber) and the output device (probe) are moved to corresponding positions.
And as a further optimized scheme, the upper computer is further used for obtaining coordinate data of the input device for moving the input coupling end according to the coordinate data variation of the input device which is not subjected to the coupling test and the input device which is coupled last time by taking the optimal electrical signal position as a reference.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment, and all technical solutions belonging to the principle of the present invention belong to the protection scope of the present invention. Modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.
Claims (10)
1. An automatic coupling method based on logic characteristics, comprising:
a characteristic extraction step: obtaining element identification information, input and output information and position information of an input device and an output device to be coupled from a layout design file of a chip;
a coordinate acquisition step: obtaining coordinate data of an input device and an output device of a certain element according to the element identification information, the input and output information and the position information;
a coupling end moving step: moving an input coupling end and an output coupling end to positions on the chip corresponding to the coordinate data of the input device and the output device respectively;
coupling: performing a coupling test on the input device and the output device;
and (3) automatic coupling judgment: if there are not coupling-completed elements, selecting one coupling-completed element, obtaining the coordinate data of the input device and the output device which have not been subjected to the coupling test, and returning to execute the coupling end moving step.
2. The method of claim 1, wherein the performing the coupling test on the input device and the output device comprises: the input coupling end and the output coupling end scan the optical power near the position corresponding to the coordinate data and record the coordinate information of the position of the maximum optical power;
before the step of moving the coupling end is executed, the method further comprises the following steps:
a correction coordinate acquisition step: and obtaining coordinate data of the input device and the output device for moving the input coupling end and the output coupling end according to the coordinate data variable quantity of the input device and the output device which are not subjected to the coupling test and the input device and the output device which are coupled last time by taking the maximum optical power position as a reference.
3. The method of claim 1, wherein the performing the coupling test on the input device and the output device comprises: the input coupling end moves near a position corresponding to the coordinate data of the input device, the output coupling end detects an electrical signal at a position corresponding to the coordinate data of the output device, and the coordinate information of the input device at the optimal electrical signal position is recorded;
before the step of moving the coupling end is executed, the method further comprises the following steps:
a correction coordinate acquisition step: and obtaining coordinate data of the input device for moving the input coupling end according to the coordinate data variation of the input device which is not subjected to the coupling test and the input device which is coupled last time by taking the optimal electrical signal position as a reference.
4. A method of automatic coupling based on logical characteristics according to claim 1, characterized in that:
all input devices face one side of the chip and all output devices face the other side of the chip.
5. A method of automatic coupling based on logical characteristics according to claim 1, characterized in that:
the component identification information is a characteristic parameter that is additionally added to a device and used for marking the component, or identification information of the cell that incorporates all devices of the same component into the same cell.
6. The method of claim 1, further comprising, before the step of extracting the features:
and adding element identification information and input and output information for all input devices and output devices in a layout design file of the chip.
7. An automatic coupling system, comprising:
the upper computer is used for obtaining element identification information, input and output information and position information of the input device and the output device to be coupled from the layout design file of the chip; the component recognition module is also used for obtaining the coordinate data of the input device and the output device of a certain component according to the component recognition information, the input and output information and the position information; the system is also used for recording the coordinate information of the maximum optical power position; the coupling test device is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input device and the output device which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling end and the output coupling end to move to positions on the chip corresponding to the coordinate data of the input device and the output device respectively; the input coupling end and the output coupling end are also used for controlling to move near the position corresponding to the coordinate data;
an optical power meter for scanning optical power when the input coupling terminal and the output coupling terminal move in the vicinity of a position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
8. An automatic coupling system according to claim 7, wherein:
and the upper computer is also used for obtaining coordinate data of the input device and the output device for moving the input coupling end and the output coupling end according to the coordinate data variable quantity of the input device and the output device of the element which is not subjected to the coupling test and is coupled with the last time by taking the maximum optical power position as a reference.
9. An automatic coupling system, comprising:
the upper computer is used for obtaining element identification information, input and output information and position information of the input device and the output device to be coupled from the layout design file of the chip; the component recognition module is also used for obtaining the coordinate data of the input device and the output device of a certain component according to the component recognition information, the input and output information and the position information; the system is also used for recording the coordinate information of the optimal electrical signal position; the coupling test device is also used for selecting one unfinished coupling element when the unfinished coupling element still exists, and obtaining the coordinate data of the input device and the output device which are not subjected to the coupling test;
the coupling end clamping device is used for controlling the input coupling end and the output coupling end to move to positions on the chip corresponding to the coordinate data of the input device and the output device respectively; the input coupling end is also used for controlling the input coupling end to move near the position corresponding to the coordinate data;
electrical signal detection means for detecting an electrical signal when the input coupling terminal moves in the vicinity of a position corresponding to the coordinate data;
the upper computer is in communication connection with the coupling end clamping device.
10. An automatic coupling system according to claim 9, wherein:
and the upper computer is also used for obtaining the coordinate data of the input device for moving the input coupling end according to the coordinate data variation of the input device which is not subjected to the coupling test and the input device which is coupled last time by taking the optimal electrical signal position as a reference.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113237640A (en) * | 2021-07-12 | 2021-08-10 | 南京光智元科技有限公司 | Optical coupling test method and device, electronic equipment and storage medium |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63124438A (en) * | 1986-11-13 | 1988-05-27 | Nippon Telegr & Teleph Corp <Ntt> | Integrated circuit tester |
US20030121012A1 (en) * | 2001-12-21 | 2003-06-26 | Mitsubishi Denki Kabushiki Kaisha | Crosstalk verifying device |
CN1486506A (en) * | 2000-12-01 | 2004-03-31 | 株式会社日立制作所 | Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
US7073148B1 (en) * | 2003-09-11 | 2006-07-04 | Xilinx, Inc. | Antenna violation correction in high-density integrated circuits |
CN107211564A (en) * | 2015-02-16 | 2017-09-26 | 富士机械制造株式会社 | Reading device |
CN108871307A (en) * | 2018-04-25 | 2018-11-23 | 北京航空航天大学 | The automatic direct-coupling device of Y waveguide chip based on image recognition and optical power feedback |
CN110187454A (en) * | 2019-02-27 | 2019-08-30 | 联合微电子中心有限责任公司 | The method and system of test are optically coupled to silicon optical chip based on design layout |
US20200050727A1 (en) * | 2018-08-13 | 2020-02-13 | Faro Technologies, Inc. | System and method of automatic re-localization and automatic alignment of existing non-digital floor plans |
-
2020
- 2020-07-15 CN CN202010682075.8A patent/CN111797582B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63124438A (en) * | 1986-11-13 | 1988-05-27 | Nippon Telegr & Teleph Corp <Ntt> | Integrated circuit tester |
CN1486506A (en) * | 2000-12-01 | 2004-03-31 | 株式会社日立制作所 | Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
US20030121012A1 (en) * | 2001-12-21 | 2003-06-26 | Mitsubishi Denki Kabushiki Kaisha | Crosstalk verifying device |
US7073148B1 (en) * | 2003-09-11 | 2006-07-04 | Xilinx, Inc. | Antenna violation correction in high-density integrated circuits |
CN107211564A (en) * | 2015-02-16 | 2017-09-26 | 富士机械制造株式会社 | Reading device |
CN108871307A (en) * | 2018-04-25 | 2018-11-23 | 北京航空航天大学 | The automatic direct-coupling device of Y waveguide chip based on image recognition and optical power feedback |
US20200050727A1 (en) * | 2018-08-13 | 2020-02-13 | Faro Technologies, Inc. | System and method of automatic re-localization and automatic alignment of existing non-digital floor plans |
CN110187454A (en) * | 2019-02-27 | 2019-08-30 | 联合微电子中心有限责任公司 | The method and system of test are optically coupled to silicon optical chip based on design layout |
Non-Patent Citations (1)
Title |
---|
李伟;: "基于Modbus控制网络的灯具配光性能检测方法研究", 仪表技术与传感器, no. 07, pages 84 - 87 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113237640A (en) * | 2021-07-12 | 2021-08-10 | 南京光智元科技有限公司 | Optical coupling test method and device, electronic equipment and storage medium |
CN113237640B (en) * | 2021-07-12 | 2022-03-01 | 南京光智元科技有限公司 | Optical coupling test method and device, electronic equipment and storage medium |
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