CN111785603B - Microwave plasma cleaning machine - Google Patents
Microwave plasma cleaning machine Download PDFInfo
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- CN111785603B CN111785603B CN202010696231.6A CN202010696231A CN111785603B CN 111785603 B CN111785603 B CN 111785603B CN 202010696231 A CN202010696231 A CN 202010696231A CN 111785603 B CN111785603 B CN 111785603B
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- microwave
- cavity
- plasma cleaning
- quartz cavity
- electromagnetic door
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32908—Utilities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a microwave plasma cleaning machine, which comprises a feeding device and a plasma cleaning body, wherein the feeding device comprises a door handle, an electromagnetic door, an observation window, a product bracket, a carrying plate, a vacuum chuck and a guide rail, the plasma cleaning body comprises a shell, a microwave shielding plate, a microwave shielding cover, a quartz cavity, a microwave body, a microwave cavity, a power supply, a PLC (programmable logic controller), a gas flow controller, a three-way piping, a vacuum gauge, an electric fan, a microwave switch, an electromagnetic door switch, a control panel, a base and a quartz cavity. And the product to be cleaned is placed on the product frame and is sent into the quartz cavity, so that the electronic product is cleaned, and the cleaning efficiency is high.
Description
Technical Field
The invention relates to the technical field of cleaning devices, in particular to a microwave plasma cleaning machine.
Background
With the improvement of the integration degree of electronic circuits, the feature size of chips becomes smaller, new materials are developed and used, the requirements on surface treatment and cleaning are also higher and higher, and a plasma surface cleaning process becomes an important means for improving the reliability and the yield of products and is an indispensable step in the production process. In the vacuum cavity, high-energy disordered plasma is generated under a certain pressure by a radio frequency power supply, and the surface of the cleaned product is bombarded by the plasma so as to achieve the cleaning purpose. The plasma cleaning is a brand new high-tech technology, and the electronic products which are difficult to clean by the conventional cleaning method can be cleaned by utilizing the plasma, and the novel process requirements of no damage and corrosion inhibition can be met. At present, plasma cleaning equipment is divided into three types of low-frequency, radio-frequency (medium-frequency) and microwave plasma cleaning machines according to different excitation frequencies. The microwave has the highest discharge frequency, the highest gas ionization degree, the minimum self-bias voltage, the small ion impact, the small damage to the device and no ultraviolet radiation. Microwave plasma is not an alternative in some processes due to the above advantages. The existing microwave plasma cleaning machine has the defects of high manufacturing cost of sealing bodies, uneven filling of process gas, ineffective fixation of products and the like.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a microwave plasma cleaning machine, which solves the problems of higher manufacturing cost of a sealing body, uneven filling of process gas and unstable product fixation.
The object of the invention is achieved by:
the invention discloses a microwave plasma cleaning machine, which comprises a feeding device and a plasma cleaning body, wherein the feeding device comprises a door handle, an electromagnetic door, an observation window, a product bracket, a carrying plate, a vacuum chuck and a guide rail, the plasma cleaning body comprises a shell, a microwave shielding plate, a microwave shielding cover, a quartz cavity, a microwave body, a microwave cavity, a power supply, a PLC (programmable logic controller), a gas flow controller, a three-way piping, a vacuum gauge, an electric fan, a microwave switch, an electromagnetic door switch, a control panel, a base and a quartz cavity.
Further, the carrying plate is composed of a rectangular thin plate, round small holes are distributed on the carrying plate, a vacuum chuck is arranged on the lower portion of the carrying plate, and after a product to be cleaned is placed on the product support, the vacuum chuck starts to act to fix the product.
Further, the air inlet is positioned at the upper part of the air inlet flange, the air inlet is connected with the air homogenizing structure, and the air homogenizing structure can enable process gas to be more uniform when being filled.
Furthermore, cylindrical heating pipes are fixed outside the quartz cavity, and the heating pipes are symmetrically distributed, so that the ionization process of the process gas can be accelerated.
Furthermore, the guide rail is fixed at the bottom of the electromagnetic door and matched with the circular through hole of the base, and after a product to be cleaned is placed on the product rack, the electromagnetic door can be simply and quickly closed by pushing the door handle by hands.
Furthermore, the electromagnetic door is provided with a plurality of circular plates at the matched position with the quartz cavity, which are distributed in a step manner and matched with the circular cavities distributed in a step manner on the front shielding plate, so that the sealing performance can be effectively enhanced, the microwave leakage is prevented, and the vacuum is kept.
Further, the electric fan is fixed at the rear part of the base, so that heat generated in the plasma cleaning machine can be timely and effectively removed, and a proper working environment temperature is maintained.
Compared with the prior art, the invention has the following beneficial effects: the sealing device of the microwave plasma cleaning machine is simple and effective, has strong operability, can effectively fix the product by the vacuum sucker after the electronic product to be cleaned is placed on the product frame, and the circular plates distributed in steps on the electromagnetic door are matched with the circular cavities distributed in steps on the front shielding plate, so that the sealing performance is enhanced, the microwave leakage is prevented, and the vacuum is kept. The porous structure at the end part of the three-way piping is utilized to accelerate the vacuumizing process and make the process gas filled more uniform.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a view showing an internal structure of a microwave plasma cleaning machine according to the present invention;
FIG. 3 is a diagram of a loading device of the present invention;
FIG. 4 is a view showing a construction of a portion of a quartz cavity according to the present invention;
FIG. 5 is a diagram of a gas distribution structure; in the figure: 1. the plasma cleaning device comprises a plasma cleaning body 10, a microwave body 11, a microwave shielding cover 12, a vacuum gauge 13, three-way pipes 14, a gas flow controller 15, an electric fan 16, a microwave shielding plate 17, a PLC (programmable logic controller), 18, a fixing plate 19, a power supply 101, a microwave cavity 102, a shell 103, a base 104, a control panel 2, a feeding device 21, an electromagnetic door 22, an observation window 23, a door handle 24, a product bracket 25, a guide rail 26, a carrying plate 27, a circular plate 28, a vacuum chuck 3, a microwave switch 4, an electromagnetic door switch 5, a quartz cavity 6, an air inlet flange 61, an air homogenizing structure 62, a heating pipe 7, an air inlet hole 8 and an air outlet flange.
Detailed Description
Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The invention discloses a microwave plasma cleaning machine, which comprises a feeding device 2 and a plasma cleaning body 1, wherein the feeding device 2 comprises a door handle 23, an electromagnetic door 21, an observation window 22, a product bracket 24, a carrying plate 26, a vacuum chuck 28 and a guide rail 25, the plasma cleaning body 1 comprises a shell 102, a microwave shielding plate 16, a microwave shielding cover 11, a quartz cavity 5, a microwave body 10, a microwave cavity 101, a power supply 19, a PLC17, a gas flow controller 14, a three-way piping 13, a vacuum gauge 12, an electric fan 15, a microwave switch 3 and an electromagnetic door switch 4, a control panel 104, a base 103, wherein the quartz cavity 5 is arranged in the microwave shielding cover 11, the microwave cavity 101 is fixed on the microwave shielding plate 16, the microwave body 10 is arranged at the upper part of the microwave cavity 101, the three-way piping 13 is fixed on an air outlet flange 8 and communicated with the quartz cavity 5, the vacuum gauge 12 is fixed at the upper part of the three-way piping 13, and the gas flow controller 14 is fixed on the base 103 through a fixing plate 18.
The carrying plate 26 is composed of a rectangular thin plate, round holes are distributed on the upper surface of the carrying plate, the vacuum chuck 28 is arranged on the lower portion of the carrying plate, and after a product to be cleaned is placed on the carrying plate 26, the vacuum chuck 28 starts to act to fix the product.
The air inlet hole 7 is positioned at the upper part of the air inlet flange 6, the air inlet hole 7 is connected with the air homogenizing structure 61, and the air homogenizing structure 61 can make process gas more uniform when being filled.
The guide rail 25 is fixed at the bottom of the electromagnetic door 21 and is matched with the circular through hole of the base 103, and after a product to be cleaned is placed on the product rack, the electromagnetic door 21 can be simply and quickly closed by pushing the door handle 23 by hand.
The electromagnetic door 21 is provided with a plurality of circular plates 27 at the matched position with the quartz cavity 5, which are distributed in a step shape and matched with the circular cavities distributed in a step shape on the front shielding plate, so that the sealing performance can be effectively enhanced, the microwave leakage can be prevented, and the vacuum can be kept.
The electric fan 15 is fixed at the rear part of the base 103, so that heat generated in the plasma cleaning machine can be timely and effectively removed, and a proper working environment temperature can be maintained.
When the product is cleaned, the product is firstly placed on the carrying plate 26, the vacuum chuck 28 starts to act to fix the product, the door handle 23 is pushed by hands, the electromagnetic door 21 is closed, the electromagnetic door switch 4 is pressed, the electromagnetic door 21 is started to keep the tightness of the quartz cavity 5, the three-way piping 13 is externally connected with the vacuum pump to vacuumize the interior of the quartz cavity 5, the air inlet hole 7 on the air inlet flange 6 is externally connected with the air supply device, process gas is filled, the gas enters the quartz cavity 5 through the air homogenizing structure 61, then the microwave switch 3 is pressed, the microwave body generates microwaves, the process gas is ionized, and meanwhile the heating pipe 62 heats the quartz cavity 5 to accelerate the ionization speed, so that the aim of rapidly cleaning the product is achieved.
While the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the inventive concept of the present invention, which fall within the scope of the present invention.
Claims (3)
1. The microwave plasma cleaning machine is characterized by comprising a feeding device and a plasma cleaning body, wherein the feeding device comprises a door handle, an electromagnetic door, an observation window, a product bracket, a carrying plate, a vacuum chuck and a guide rail, the plasma cleaning body comprises a shell, a microwave shielding plate, a microwave shielding cover, a quartz cavity, a microwave body, a microwave cavity, a power supply, a PLC (programmable logic controller), a gas flow controller, a three-way piping, a vacuum gauge, an electric fan, a microwave switch, an electromagnetic door switch, a control panel and a base, the quartz cavity is arranged in the microwave shielding cover, the microwave cavity is fixed on the microwave shielding plate, the microwave body is arranged at the upper part of the microwave cavity, the three-way piping is fixed on an air outlet flange and communicated with the quartz cavity, the vacuum gauge is fixed at the upper part of the three-way piping, and the gas flow controller is fixed on the base through a fixing plate;
the carrying plate consists of a rectangular thin plate, round small holes are distributed on the carrying plate, and a vacuum chuck is arranged on the lower part of the carrying plate;
a plurality of cylindrical heating pipes are fixed outside the quartz cavity and symmetrically distributed relative to the quartz cavity;
the electromagnetic door is matched with the quartz cavity, a plurality of circular plates are arranged at the matched position of the electromagnetic door and the quartz cavity and are distributed in a step mode and matched with the circular cavities which are distributed in a step mode on the front shielding plate.
2. The microwave plasma cleaning machine according to claim 1, wherein the air inlet hole is positioned at the upper part of the air inlet flange, and the air inlet hole is connected with the air homogenizing structure.
3. The microwave plasma cleaning machine according to claim 1, wherein the guide rail is fixed at the bottom of the electromagnetic door and is matched with the circular through hole of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010696231.6A CN111785603B (en) | 2020-07-20 | 2020-07-20 | Microwave plasma cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010696231.6A CN111785603B (en) | 2020-07-20 | 2020-07-20 | Microwave plasma cleaning machine |
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| Publication Number | Publication Date |
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| CN111785603A CN111785603A (en) | 2020-10-16 |
| CN111785603B true CN111785603B (en) | 2023-06-13 |
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| CN202010696231.6A Active CN111785603B (en) | 2020-07-20 | 2020-07-20 | Microwave plasma cleaning machine |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113070288B (en) * | 2021-03-26 | 2022-11-22 | 中国计量大学 | Microwave plasma equipment of removing glue |
| CN116550689B (en) * | 2023-04-27 | 2024-02-09 | 东莞市晟鼎精密仪器有限公司 | Process for removing silicon nitride coating of graphite boat by dry method |
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2020
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