CN111781481A - Clamp adapter for high-temperature anti-deflection test cabinet - Google Patents
Clamp adapter for high-temperature anti-deflection test cabinet Download PDFInfo
- Publication number
- CN111781481A CN111781481A CN202010490874.5A CN202010490874A CN111781481A CN 111781481 A CN111781481 A CN 111781481A CN 202010490874 A CN202010490874 A CN 202010490874A CN 111781481 A CN111781481 A CN 111781481A
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- China
- Prior art keywords
- adapter
- heating body
- frame
- test cabinet
- heating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
- G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention relates to a clamp adapter for a high-temperature reverse-deviation test cabinet, which comprises a frame, a pressing mechanism and a bearing mechanism, wherein the pressing mechanism is arranged on the frame; the pressing mechanism comprises an air cylinder and an adapter, the air cylinder is arranged on the outer side of the top wall of the frame, the movable end of the air cylinder extends into the frame and is connected with the adapter, a plurality of electrode interfaces for connecting voltage are arranged on the side wall of the adapter, and a probe and a pressing rod are arranged at the bottom of the adapter; the supporting mechanism comprises a heating body and a heat radiation body, the heat radiation body is installed on the inner side of the bottom wall of the frame, meanwhile, the heating body is installed at the top of the frame, a plurality of heating holes used for placing heating rods are formed in the side wall of the heating body, temperature measuring holes used for installing temperature measuring thermocouples are formed in the top wall of the heating body, the clamp structure of the application adopts a pneumatic connection adapter, the adapter of the clamp is automatically compressed and automatically connected with a conductive electrode through a test device when the adapter of the pneumatic switch ascends and descends, the automation of the function is realized, the efficiency is improved, and the accuracy of the adapter is.
Description
Technical Field
The invention belongs to the technical field of electrical element testing, and particularly relates to a clamp adapter for a high-temperature reverse-bias test cabinet.
Background
The anchor clamps structure among the current IGBT high temperature reverse bias test cabinet is mostly manual bolt fastening and the electrically conductive electrode of manual connection, troublesome poeration, the staff's that increases intensity of labour to because the uncertainty of personnel's operation causes the influence to the result easily, make the error bigger than normal.
Disclosure of Invention
The clamp structure adopts the pneumatic connection adapter, realizes the automatic compaction of the adapter of the clamp and a testing device and the automatic connection of the conductive electrode through the ascending and descending of the pneumatic switch, and realizes the automation of the function, thereby improving the efficiency and the accuracy.
In order to solve the problems in the background art, the invention is realized by the following technical scheme:
a clamp adapter for a high-temperature reverse-bias test cabinet comprises a frame, a pressing mechanism and a bearing mechanism;
the pressing mechanism comprises an air cylinder and an adapter, the air cylinder is installed on the outer side of the top wall of the frame, the movable end of the air cylinder extends into the frame and is connected with the adapter, a plurality of electrode interfaces used for connecting voltage are formed in the side wall of the adapter, a probe and a pressing rod are installed at the bottom of the adapter, and the probe and the pressing rod are perpendicular to the bottom wall of the adapter;
the supporting mechanism comprises a heating body and a heating body, the heating body is arranged on the inner side of the bottom wall of the frame, the heating body is arranged at the top of the heating body, a plurality of heating holes used for placing heating rods are formed in the side wall of the heating body, and temperature measuring holes used for installing temperature measuring thermocouples are formed in the top wall of the heating body.
As a further description of the invention: the horizontal cross sections of the heating body and the heat radiation body are the same in size and shape.
As a further description of the invention: the radiator is arranged in a grid shape.
As a further description of the invention: the length of the pressing rod is larger than that of the probe, and a concave hole matched with the pressing rod is formed in the top wall of the heating body.
As a further description of the invention: the adapter with the cylinder is for dismantling the grafting setting.
Compared with the prior art, the invention has the following beneficial technical effects:
1. when testing, at first place the IGBT original paper on the heating member, place the completion back, insert the electrode respectively in the electrode interface of adapter, then when control cylinder action is tight with the IGBT original paper clamp, insert the IGBT component with voltage through the probe, predetermine the temperature and heat according to the regulation, it is invariable to make it after predetermineeing the temperature to heat, it is experimental again to add high pressure, the staff only needs to carry out placing of IGBT component and the connection of electrode, need not manually to fix the IGBT component and manually carry out the connection of electrode in turn, thereby its work efficiency and degree of accuracy have been promoted.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Description of the reference numerals
1. A frame; 2. a cylinder; 3. an adapter; 4. an electrode interface; 5. a probe; 6. a hold down bar; 7. a heating body; 8. a heat sink; 9. heating the hole; 10. and (4) temperature measuring holes.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a detailed description of the present invention will be given below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, a fixture adapter 3 for a high temperature back-bias test cabinet comprises a frame 1, a pressing mechanism and a receiving mechanism.
Specifically, the pressing mechanism comprises a cylinder 2 and an adapter 3, the cylinder 2 is installed on the outer side of the top wall of the frame 1, the movable end of the cylinder 2 extends into the frame 1 and is connected with the adapter 3, a plurality of electrode interfaces 4 used for connecting voltage are formed in the side wall of the adapter 3, a probe 5 and a pressing rod 6 are installed at the bottom of the adapter 3, the probe 5 and the pressing rod 6 are both perpendicular to the bottom wall of the adapter 3, and the length of the pressing rod 6 is larger than that of the probe 5;
meanwhile, the carrying mechanism comprises a heating body 7 and a heating body 8, the heating body 8 is installed on the inner side of the bottom wall of the frame 1, the heating body 7 is installed at the top of the heating body, a plurality of heating holes 9 used for placing heating rods are formed in the side wall of the heating body 7, temperature measuring holes 10 used for installing temperature measuring thermocouples are formed in the top wall of the heating body, and concave holes matched with the pressing rods 6 are formed in the top wall of the heating body 7.
In order to ensure the stability and the heat dissipation efficiency of the bearing mechanism, the horizontal cross sections of the heating body 7 and the heat dissipation body 8 are arranged in the same size and shape, and the heat dissipation body is arranged in a grid shape.
In order to promote experimental accuracy and convenience, become insulating setting with adapter 3, probe 5 is connected with electrode interface 4 in its inside to with being surveyed IGBT electrode one-to-one setting, and adapter 3 and cylinder 2 are for dismantling the grafting setting, can change according to the different needs of IGBT component.
The embodiments given above are preferable examples for implementing the present invention, and the present invention is not limited to the above-described embodiments. Any non-essential addition and replacement made by the technical characteristics of the technical scheme of the invention by a person skilled in the art belong to the protection scope of the invention.
Claims (6)
1. The utility model provides a high temperature is anchor clamps adapter for anti-inclined to one side test cabinet which characterized in that: comprises a frame, a pressing mechanism and a bearing mechanism;
the pressing mechanism comprises an air cylinder and an adapter, the air cylinder is installed on the outer side of the top wall of the frame, the movable end of the air cylinder extends into the frame and is connected with the adapter, a plurality of electrode interfaces used for connecting voltage are formed in the side wall of the adapter, a probe and a pressing rod are installed at the bottom of the adapter, and the probe and the pressing rod are perpendicular to the bottom wall of the adapter;
the supporting mechanism comprises a heating body and a heating body, the heating body is arranged on the inner side of the bottom wall of the frame, the heating body is arranged at the top of the heating body, a plurality of heating holes used for placing heating rods are formed in the side wall of the heating body, and temperature measuring holes used for installing temperature measuring thermocouples are formed in the top wall of the heating body.
2. The clamp adapter for the high-temperature reverse-bias test cabinet according to claim 1, characterized in that: the adapter is arranged in an insulating mode, and the probe is connected with the electrode interface inside the adapter and is arranged in one-to-one correspondence with the IGBT electrode to be tested.
3. The clamp adapter for the high-temperature reverse-bias test cabinet according to claim 1, characterized in that: the horizontal cross sections of the heating body and the heat radiation body are the same in size and shape.
4. The clamp adapter for the high-temperature reverse-bias test cabinet according to claim 1, characterized in that: the radiator is arranged in a grid shape.
5. The clamp adapter for the high-temperature reverse-bias test cabinet according to claim 1, characterized in that: the length of the pressing rod is larger than that of the probe, and a concave hole matched with the pressing rod is formed in the top wall of the heating body.
6. The clamp adapter for the high-temperature reverse-bias test cabinet according to claim 1, characterized in that: the adapter with the cylinder is for dismantling the grafting setting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010490874.5A CN111781481A (en) | 2020-06-02 | 2020-06-02 | Clamp adapter for high-temperature anti-deflection test cabinet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010490874.5A CN111781481A (en) | 2020-06-02 | 2020-06-02 | Clamp adapter for high-temperature anti-deflection test cabinet |
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CN111781481A true CN111781481A (en) | 2020-10-16 |
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CN202010490874.5A Pending CN111781481A (en) | 2020-06-02 | 2020-06-02 | Clamp adapter for high-temperature anti-deflection test cabinet |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112858867A (en) * | 2021-01-22 | 2021-05-28 | 杭州高坤电子科技有限公司 | IGBT module high temperature reverse bias experimental system |
Citations (8)
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---|---|---|---|---|
CN201340434Y (en) * | 2009-01-22 | 2009-11-04 | 无锡天和电子有限公司 | Test jig used in mounting type packaged semiconductor power device |
CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
CN103078146A (en) * | 2012-12-28 | 2013-05-01 | 上海素朴智能设备制造有限公司 | Slot-in device and method for automatic short-circuit detection after cast welding of storage battery |
CN105116178A (en) * | 2015-09-18 | 2015-12-02 | 江苏中科君芯科技有限公司 | Test clamp for heavy-current IGBT chip |
CN107861041A (en) * | 2017-09-21 | 2018-03-30 | 全球能源互联网研究院有限公司 | A kind of high temperature reverse bias test system and method |
CN208384079U (en) * | 2018-08-03 | 2019-01-15 | 广东珠江智联信息科技股份有限公司 | A kind of energization testing tool of Internet of Things communication module group mainboard |
CN209014626U (en) * | 2018-09-17 | 2019-06-21 | 温州市坤顺数控科技有限公司 | A kind of rotating probe contact mould group |
CN209215534U (en) * | 2018-09-07 | 2019-08-06 | 浙江艾罗网络能源技术有限公司 | PCBA test device |
-
2020
- 2020-06-02 CN CN202010490874.5A patent/CN111781481A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201340434Y (en) * | 2009-01-22 | 2009-11-04 | 无锡天和电子有限公司 | Test jig used in mounting type packaged semiconductor power device |
CN102944706A (en) * | 2012-11-29 | 2013-02-27 | 西安电力电子技术研究所 | Adaptive power semiconductor module reliability test testing clamp |
CN103078146A (en) * | 2012-12-28 | 2013-05-01 | 上海素朴智能设备制造有限公司 | Slot-in device and method for automatic short-circuit detection after cast welding of storage battery |
CN105116178A (en) * | 2015-09-18 | 2015-12-02 | 江苏中科君芯科技有限公司 | Test clamp for heavy-current IGBT chip |
CN107861041A (en) * | 2017-09-21 | 2018-03-30 | 全球能源互联网研究院有限公司 | A kind of high temperature reverse bias test system and method |
CN208384079U (en) * | 2018-08-03 | 2019-01-15 | 广东珠江智联信息科技股份有限公司 | A kind of energization testing tool of Internet of Things communication module group mainboard |
CN209215534U (en) * | 2018-09-07 | 2019-08-06 | 浙江艾罗网络能源技术有限公司 | PCBA test device |
CN209014626U (en) * | 2018-09-17 | 2019-06-21 | 温州市坤顺数控科技有限公司 | A kind of rotating probe contact mould group |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112858867A (en) * | 2021-01-22 | 2021-05-28 | 杭州高坤电子科技有限公司 | IGBT module high temperature reverse bias experimental system |
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Application publication date: 20201016 |
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