CN111736427B - Display substrate, preparation method thereof and exposure alignment method - Google Patents

Display substrate, preparation method thereof and exposure alignment method Download PDF

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Publication number
CN111736427B
CN111736427B CN202010618823.6A CN202010618823A CN111736427B CN 111736427 B CN111736427 B CN 111736427B CN 202010618823 A CN202010618823 A CN 202010618823A CN 111736427 B CN111736427 B CN 111736427B
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substrate
crystal
pyramid
low
film layer
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CN111736427A (en
Inventor
周毅
张立震
徐胜
何伟
吴慧利
赵雪飞
贺芳
李士佩
顾仁权
黎午升
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)

Abstract

The display substrate comprises a substrate and a low-reflection film layer arranged on the substrate, the low-reflection film layer comprises a crystal base arranged on the substrate and a plurality of pyramid microstructures formed on the crystal base, and a plurality of micropores are formed on the outer surface of each pyramid microstructure.

Description

Display substrate, preparation method thereof and exposure alignment method
Technical Field
The invention relates to the technical field of display, in particular to a display substrate and a preparation method and an exposure alignment method thereof.
Background
The color film substrate is a key material for realizing color display, and the cost of the color film substrate in the display screen is extremely high. The color film substrate affects optical characteristics such as brightness and contrast besides color. The color film substrate mainly comprises a substrate, a Black Matrix (BM), a color layer (RGB), a protective layer, a conductive film layer, a spacer column and the like. The black matrix has the basic functions of shading, and aims to improve the contrast, avoid color mixing of connected color layers, reduce external light reflection, prevent external light from irradiating the thin film transistor to increase leakage current, and effectively block light leakage among sub-pixels by using the black matrix. In the G2.5 generation line, the alignment mark on the front layer cannot be identified after the black matrix is coated, automatic alignment on an exposure machine cannot be realized, manual correspondence is needed, and the yield and the efficiency are reduced.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a display substrate, a preparation method thereof and an exposure alignment method, so that automatic alignment on an exposure machine is realized, and the production efficiency is improved.
In order to solve the above technical problem, an embodiment of the present invention provides a display substrate, including a substrate and a low reflection film layer disposed on the substrate, where the low reflection film layer includes a crystal base disposed on the substrate and a plurality of pyramid microstructures formed on the crystal base, and a plurality of micropores are formed on an outer surface of each pyramid microstructure.
In some possible implementations, the micro-holes are arranged in a spiral shape on the outer surface of the pyramid microstructure.
In some possible implementations, the pyramidal microstructures differ in height.
In some possible implementations, the low reflection film layer is made of a polysilicon material.
In some possible implementations, the display device further includes a light emitting driving circuit disposed over the substrate, the light emitting driving circuit being located between the substrate and the low reflection film layer.
In some possible implementation manners, the light-emitting device further comprises a conductive film layer arranged on the low-reflection film layer, a via hole communicated with the light-emitting driving circuit is arranged in the low-reflection film layer, and the conductive film layer is connected with the light-emitting driving circuit through the via hole.
In some possible implementation manners, the light-emitting device further comprises a retaining wall arranged on the substrate, and the retaining wall surrounds the periphery of the low-reflection film layer.
The embodiment of the invention also provides a preparation method of the display substrate, which comprises the following steps:
depositing a crystalline thin film on a substrate;
etching the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramidal microstructures;
embedding the metal particles into the pyramid microstructure by an etching process;
and removing the metal particles on the pyramid microstructure to form a plurality of micropores on the outer surface of the pyramid microstructure, wherein the crystal substrate and the pyramid microstructure form a low-reflection film layer.
In some possible implementations, forming a plurality of metal particles on the pyramidal microstructures includes:
depositing a metal film on the pyramid microstructure;
and carrying out an annealing process on the metal film, so that the metal film forms a plurality of metal particles on the pyramid microstructure.
The embodiment of the invention also provides an exposure alignment method, which comprises the following steps:
depositing a passivation layer on the substrate;
forming an alignment mark on the passivation layer;
depositing a crystal film covering the alignment mark on the passivation layer;
exposing light rays through the crystal thin film and the alignment mark to carry out automatic exposure alignment;
etching the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramid microstructure;
embedding the metal particles into the pyramid microstructure by an etching process;
and removing the metal particles on the pyramid microstructure to form a plurality of micropores on the pyramid microstructure, wherein the crystal substrate and the pyramid microstructure form a low-reflection film layer.
The invention provides a display substrate, a preparation method thereof and an exposure alignment method. And the low-reflection film layer has certain light transmittance before the pyramid microstructure is formed, so that light rays emitted by the exposure machine can pass through the low-reflection film layer, and automatic exposure alignment is realized. And the thickness of the display substrate is reduced to a great extent, the risk that a subsequent conductive film layer or a metal wire is easily broken is reduced, and the thickness of the lamination is effectively reduced.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely illustrative of the principles of the invention.
FIG. 1 is a schematic view showing a substrate after a crystalline thin film is formed thereon according to an exemplary embodiment of the present invention;
FIG. 2 is a schematic diagram showing a substrate after forming a pyramid microstructure according to an exemplary embodiment of the invention;
FIG. 3 is a schematic diagram illustrating a substrate after metal particles are formed thereon according to an exemplary embodiment of the present invention;
FIG. 4 is a schematic diagram showing a substrate with metal particles embedded in a pyramid microstructure according to an exemplary embodiment of the invention;
FIG. 5 is a schematic diagram showing a substrate after pyramid microstructures form micropores in the substrate in accordance with an exemplary embodiment of the present invention;
FIG. 6 is a top view of a substrate showing pyramid microstructures forming micro-holes in the substrate in accordance with an exemplary embodiment of the present invention;
FIG. 7 is a schematic view of a display substrate according to an exemplary embodiment of the present invention;
fig. 8 is a schematic structural view illustrating a substrate after forming a dam and a low reflection film layer according to an exemplary embodiment of the invention.
Detailed Description
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The invention provides a display substrate which comprises a substrate and a low-reflection film layer arranged on the substrate, wherein the low-reflection film layer comprises a crystal base arranged on the substrate and a plurality of pyramid microstructures formed on the crystal base, and a plurality of micropores are formed on the outer surface of each pyramid microstructure. Thereby realizing the automatic alignment of the display substrate on the exposure machine.
The following further illustrates the technical solution of this embodiment by the manufacturing process of the display substrate of this embodiment. The "patterning process" in this embodiment includes processes such as depositing a film layer, coating a photoresist, mask exposure, development, etching, and stripping a photoresist, the "photolithography process" in this embodiment includes processes such as coating a film layer, mask exposure, and development, and the evaporation, deposition, coating, and coating described in this embodiment are all well-established preparation processes in the related art.
FIGS. 1 to 7 are schematic views illustrating a manufacturing process of the display substrate of this embodiment. The preparation process of the display substrate comprises the following steps:
(1) a substrate, a light-emitting drive circuit, and a crystal film are formed. In one exemplary embodiment, forming the substrate, the light emission driving circuit, and the crystal thin film includes: a layer of flexible material is coated on a glass carrier, and is cured to form a film, so as to form a substrate 10, and then a light-emitting driving circuit 11 is formed on the substrate 10. Then, depositing a passivation film on the light emitting driving circuit 11 to form a first passivation layer 12 covering the entire substrate 10; and forming an alignment mark for exposure alignment on the first passivation layer 12; finally, a crystalline thin film 13 is deposited on the first passivation layer 12, as shown in fig. 1. Wherein, the thickness of the crystal film 13 is hundreds of nanometers; the crystal thin film 13 has light transmittance and can be penetrated by exposure light emitted by an exposure machine, so that the exposure light and the alignment mark on the first passivation layer 12 are exposed and aligned, and automatic alignment is realized.
In some possible implementations, the material of the crystal thin film 13 may be a polysilicon material, such as a P-Si material. The polysilicon material has different crystal faces, and the reaction rates of corrosion of the different crystal faces are different; therefore, after the polycrystalline silicon material is etched, pyramid microstructures with different heights can be formed.
In some possible implementations, the light emission driving circuit 11 may include a Thin Film Transistor (TFT) film for controlling and driving light emission.
(2) Forming a pyramidal microstructure. In one exemplary embodiment, forming the pyramidal microstructures comprises: on the substrate 10 on which the pattern is formed, the crystal thin film is etched with an etching solution. The crystal film has different crystal faces, and the reaction speeds of the different crystal faces are different. The etched crystal thin film is formed into a crystal substrate 132 disposed on the first passivation layer 12 and a plurality of pyramid microstructures 131 formed on the crystal substrate 132, as shown in fig. 2. The plurality of pyramid microstructures 131 have uneven height, have a good absorption effect on multi-band light, can achieve a specific optical path difference, realize phase difference, and achieve anti-reflection, namely a reflection reduction effect. The etchant may be potassium hydroxide or a mixture of potassium hydroxide and dimethyl carbinol (IPA).
(3) Forming metal particles. In one exemplary embodiment, forming the metal particles includes: depositing a metal film on the pyramid microstructure 131 by magnetron sputtering, evaporation or other methods on the substrate 10 on which the pattern is formed; the annealing process is performed on the metal film, so that the metal film forms a plurality of metal particles 14 on the pyramid microstructure 131. For example, the metal film is first heated to a certain temperature, such as 300 ℃, and then naturally cooled in a certain gas atmosphere, such as nitrogen, to form the metal particles 14, as shown in fig. 3. The metal thin film may be made of a metal material such as silver or copper. The metal particles 14 may be formed in a non-uniform spherical shape, a non-uniform elliptical shape, or the like.
(4) The metal particles are embedded in a pyramidal microstructure. In one exemplary embodiment, embedding metal particles into a pyramidal microstructure comprises: on the substrate 10 with the pattern, etching liquid is used to wet etch the pyramid microstructure 131. During wet etching, the metal particles 14 on the pyramid microstructure 131 have a catalytic effect, the etching speed of the pyramid microstructure 131 at the metal particles 14 is high, and as the reaction proceeds, the metal particles 14 are embedded into the pyramid microstructure 131, as shown in fig. 4. The metal particles 14 have different sizes and irregular shapes, the etching liquid is insufficient in the region of the pyramid microstructure 131, and the metal particles 14 are spirally arranged on the pyramid microstructure 131. Hydrofluoric acid and hydrogen peroxide can be used as the etching liquid.
(5) And forming the pyramid microstructure into micropores. In one exemplary embodiment, forming the pyramidal microstructure into micro-holes comprises: on the substrate 10 with the aforementioned pattern, the metal particles 14 on the pyramid microstructure 131 are removed by acid cleaning, the pyramid microstructure 131 forms micropores 15 at the removed portions of the metal particles 14, and the micropores 15 are spirally arranged on the outer surface of the pyramid microstructure 131, as shown in fig. 5 and 6. The micropores 15 on the pyramid microstructure 131 are arranged in a spiral shape, so that the light absorption effect is better, and the light can be reflected and refracted for many times when passing through, so that the surface reflection can be effectively reduced. Increasing the light absorption of the pyramidal microstructures 131 with microholes 15. Wherein the crystal base 132 and the pyramid microstructures 131 form the low reflection film layer 13. In terms of antireflection, the micro-holes 15 and the pyramid microstructures 131 supplement each other, so that the low-reflection film layer has excellent antireflection performance.
(6) And forming a conductive film layer. In one exemplary embodiment, forming the conductive film layer includes: depositing a passivation film on the low-reflection film layer 13 on the substrate 10 with the patterns to form a second passivation layer 16 covering the whole substrate 10; through holes communicated with the light-emitting driving circuit 11 are formed in the low-reflection film layer 13, the second passivation layer 16 and the first passivation layer 12; subsequently, a metal film is deposited on the second passivation layer 16, so that the metal film forms a conductive film layer 17 covering the second passivation layer 16, and the conductive film layer 17 is connected to the light emitting driving circuit 11 through a via hole, as shown in fig. 7.
According to the embodiment of the invention, the low reflection film layer in the display substrate is subjected to numerical simulation, the reflectivity of visible light passing through the low reflection film layer can be reduced to 1%, and the low reflection film layer can be used for the reflectivity of specific wavelength by changing the size and the shape.
The embodiment of the invention displays that the thickness of the low-reflection film layer in the substrate is hundreds of nanometers, so that the risk of wire breakage of the conductive film layer or the metal wire can be reduced, and the thickness of the lamination can be effectively reduced.
Fig. 8 is a schematic structural view illustrating a substrate after forming retaining walls and a low reflection film layer according to an exemplary embodiment of the invention. In an exemplary embodiment, as shown in fig. 8, the display substrate according to an embodiment of the present invention further includes a retaining wall 18 disposed on the substrate 10, the retaining wall 18 encloses the substrate 10 into a defined region, and the low-reflection film layer 13 is formed in the defined region, so as to prevent the low-reflection film layer 13 from affecting the peripheral region during the formation process.
The embodiment of the invention also provides a preparation method of the display substrate, which comprises the following steps:
depositing a crystal film on a substrate;
etching the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramidal microstructures;
embedding the metal particles into the pyramid microstructure by an etching process;
and removing the metal particles on the pyramid microstructure to form a plurality of micropores on the outer surface of the pyramid microstructure, wherein the crystal substrate and the pyramid microstructure form a low-reflection film layer.
In an exemplary embodiment, forming a plurality of metal particles on the pyramid microstructure includes:
depositing a metal film on the pyramid microstructure;
and carrying out an annealing process on the metal film, so that the metal film forms a plurality of metal particles on the pyramid microstructure.
The embodiment of the invention also provides an exposure alignment method, which comprises the following steps:
depositing a passivation layer on the substrate;
forming an alignment mark on the passivation layer;
depositing a crystal film covering the alignment mark on the passivation layer;
exposing light rays penetrate through the crystal thin film and the alignment mark to carry out automatic exposure alignment;
etching the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramidal microstructures;
embedding the metal particles into the pyramid microstructure by an etching process;
and removing the metal particles on the pyramid microstructure to form a plurality of micropores on the pyramid microstructure, wherein the crystal substrate and the pyramid microstructure form a low-reflection film layer.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "mounted," "connected" and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected or integrally connected unless otherwise explicitly stated or limited; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. The display substrate is characterized by comprising a substrate, a passivation layer arranged on the substrate and a low-reflection film layer arranged on the passivation layer, wherein alignment marks are arranged on the passivation layer, the low-reflection film layer covers the alignment marks and is used for enabling a crystal film forming the low-reflection film layer to be penetrated through by exposure light emitted by an exposure machine, the exposure light penetrating through the crystal film and the alignment marks are subjected to exposure and alignment, the low-reflection film layer is configured to absorb the light, the low-reflection film layer comprises a crystal base arranged on the substrate and a plurality of pyramid micro-structures formed on the crystal base, a plurality of micropores are formed in the outer surface of each pyramid micro-structure, and the micropores are spirally arranged on the outer surface of each pyramid micro-structure.
2. The display substrate of claim 1 wherein the plurality of pyramidal microstructures differ in height.
3. The display substrate of claim 1, wherein the low-reflection film layer is made of polysilicon.
4. The display substrate of claim 1, further comprising a light emitting driving circuit disposed over the substrate, the light emitting driving circuit being located between the substrate and the passivation layer.
5. The display substrate according to claim 4, further comprising a conductive film layer disposed on the low reflection film layer, wherein a via hole communicating with the light emission driving circuit is disposed in the low reflection film layer, and the conductive film layer is connected to the light emission driving circuit through the via hole.
6. The display substrate of claim 1, further comprising a retaining wall disposed above the substrate, wherein the retaining wall surrounds the periphery of the low reflection film layer.
7. A method of manufacturing a display substrate according to any one of claims 1 to 3, comprising:
forming a passivation layer on a substrate, and forming a contraposition mark on the passivation layer;
depositing a crystal thin film on the passivation layer to enable the crystal thin film to cover the alignment mark; the crystal film can be penetrated by exposure light emitted by an exposure machine, and the exposure light penetrating through the crystal film and the alignment mark are subjected to exposure alignment;
corroding the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramid microstructure;
embedding the metal particles into the pyramid microstructure by an etching process;
removing the metal particles on the pyramid microstructure to form a plurality of micropores on the outer surface of the pyramid microstructure, wherein the micropores are spirally arranged on the outer surface of the pyramid microstructure, the crystal substrate and the pyramid microstructure form a low-reflection film layer, and the low-reflection film layer is configured to absorb light rays.
8. The method of claim 7, wherein forming a plurality of metal particles on the pyramidal microstructure comprises:
depositing a metal film on the pyramid microstructure;
and carrying out an annealing process on the metal film, so that the metal film forms a plurality of metal particles on the pyramid microstructure.
9. An exposure alignment method for a display substrate according to any one of claims 1 to 3, comprising:
depositing a passivation layer on the substrate;
forming an alignment mark on the passivation layer;
depositing a crystal film covering the alignment mark on the passivation layer;
the crystal film can be penetrated by exposure light emitted by an exposure machine, and the exposure light penetrating through the crystal film and the alignment mark are subjected to exposure alignment;
corroding the crystal thin film to enable the crystal thin film to form a crystal substrate and a plurality of pyramid microstructures formed on the crystal substrate;
forming a plurality of metal particles on the pyramidal microstructures;
embedding the metal particles into the pyramid microstructure by an etching process;
removing the metal particles on the pyramid microstructure to form a plurality of micropores on the pyramid microstructure, wherein the micropores are spirally arranged on the outer surface of the pyramid microstructure, and the crystal substrate and the pyramid microstructure form a low-reflection film layer which is configured to absorb light rays.
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KR101941445B1 (en) * 2011-12-27 2019-04-15 엘지디스플레이 주식회사 Position guiding apparatus for needle for ultrasonic operation
CN105070792B (en) * 2015-08-31 2018-06-05 南京航空航天大学 A kind of preparation method of the polycrystalline solar cell based on solwution method
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CN108321312B (en) * 2018-03-19 2020-02-14 京东方科技集团股份有限公司 Display substrate, manufacturing method thereof and display device
CN108831936A (en) * 2018-05-29 2018-11-16 华侨大学 Light trapping structure glue and smooth flannelette crystalline silicon composite battery and its processing method
CN110928037B (en) * 2019-12-27 2022-05-17 上海天马微电子有限公司 Display substrate, manufacturing method thereof and display device

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