CN111717886B - Microstructure preparation device and method - Google Patents

Abstract

The application provides a microstructure preparation device and a microstructure preparation method, and relates to the technical field of microstructure array manufacturing processes. The method comprises the following steps: the device comprises a pressure controller, a sealed container, a first grid and a solidifying device, wherein the first grid and the solidifying device are arranged in the sealed container, and the pressure controller is communicated with the sealed container; the first mesh is for suspending a solution from a mesh of the first mesh based on a liquid property; the pressure controller is configured to adjust a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property; the solidifying device is used for solidifying the solution when the suspension state of the solution on the mesh forms a designated microstructure array shape so as to obtain the flexible substrate with a designated microstructure. The microstructure array prepared by the device and the method is regular, orderly and controllable, and is formed at one time, and has simple process and low cost.

Description

Microstructure preparation device and method

Technical Field

The application relates to the field of microstructure array manufacturing processes, in particular to a microstructure preparation device and a microstructure preparation method.

Background

With the rapid development of micro-nano processing technology, surface micro-structuring becomes an important means for improving material wettability, antifriction and wear resistance, specific surface area ratio and biocompatibility. As the application of surface micro-structuring is becoming more and more widespread, various methods of processing micro-structures have been proposed and applied in succession in production. The conventional microstructure array processing technology commonly used at present comprises a precision machining method, a laser etching method, an electron beam etching method, a physical/chemical etching method, an electrochemical method, a 3D printing method, a template method (plant template) and the like, and has the problems of non-disposable molding, high power consumption, high cost and complex process implementation process.

Disclosure of Invention

In view of the above, an object of the embodiments of the present application is to provide a microstructure preparation apparatus and method, so as to solve the problems of non-disposable molding, high power consumption, high cost, and complex process implementation in the prior art.

The embodiment of the application provides a microstructure preparation device, which comprises a pressure controller, a sealed container, a first grid and a solidifying device, wherein the first grid and the solidifying device are arranged in the sealed container, and the pressure controller is communicated with the sealed container; the first mesh is for suspending a solution from a mesh of the first mesh based on a liquid property; the pressure controller is configured to adjust a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property; the solidifying device is used for solidifying the solution when the suspension state of the solution on the mesh forms a designated microstructure array shape so as to obtain the flexible substrate with a designated microstructure.

In the implementation manner, the characteristics of the mixed solution, such as viscosity and surface tension, are utilized, and the microstructure preparation with low cost and low process complexity is realized under the action of multiple physical fields, especially under the action of gravity at normal temperature and normal pressure. Meanwhile, the suspension form of the liquid is flexibly and conveniently adjusted through the pressure device, so that the form of the finally prepared flexible substrate with the specified microstructure is controllable, and the forming accuracy of the microstructure array is ensured. In addition, in the preparation process of the flexible substrate with the microstructure, no extra chemical solvent is needed except the raw material solution for forming the microstructure array, so that the environmental protection performance of the preparation of the microstructure array is improved.

Optionally, the mesh of the first grid has a regular polygon, a diamond, a sector, a heart and/or a circle.

In the implementation manner, the shape of the grid is changed to change the shape characteristics of the microarray structure formed by the solution, so that the structural flexibility of the flexible substrate obtained by preparing the microarray structure is improved.

Optionally, the device further comprises a second grid arranged in the sealed container, wherein the second grid is used for being attached to one surface of the first grid, which is opposite to the solution hanging direction, and then separated from the first grid by a preset distance, so that the solution forms a plurality of upright posts in the first grid, which is opposite to the solution hanging direction.

In the implementation manner, the solution is shaped through the second grid matched with the first grid, so that the solution can form suspension liquid on two sides of the first grid, and the double-sided microstructure flexible substrate is realized.

Optionally, the pressure controller comprises a positive pressure device and a negative pressure device, wherein the communication port of the positive pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction, and the communication port of the negative pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction.

In the implementation mode, the positive pressure device and the negative pressure device are matched to be used as the pressure device to adjust the pressure in the sealed container so as to adjust the shape characteristics of the hanging liquid, so that the shape of the hanging liquid can be adjusted more flexibly and finely, the accuracy of microstructure preparation is improved, and meanwhile, the flexibility of microstructure preparation is also enhanced.

Optionally, the positive pressure device is a mechanical laminator or an air pressure device, and the negative pressure device is an air extractor.

In the implementation mode, the air pressure device or the mechanical lamination device is adopted as the positive pressure device and the air extractor is adopted as the negative pressure device, so that the cost is low, the operation is simple and convenient, the shape of the microstructure array can be adjusted based on the physical principle, a new chemical solution is not required to be introduced, and the environment-friendly type micro-structure array has better environment-friendly type and applicability.

Optionally, the positive pressure device is the air pressure device, each mesh in the first grid is provided with an independent air inlet channel and an independent air outlet channel, and the air pressure device and the air extractor are respectively communicated with each air inlet channel and each air outlet channel, so that the air pressure device and the air extractor respectively control the pressure of the solution at each mesh.

In the implementation manner, the air inlet channel and the air outlet channel are independently arranged for each grid in the first grid, and each grid is communicated with the independent pressure controller, so that the form of the suspension liquid formed by the solution at each grid can be accurately regulated, and the flexibility and the accuracy of microstructure preparation are improved.

Optionally, the curing device is a temperature curing device and/or a photo curing device.

In the implementation mode, the temperature curing device or the photo-curing device is used for curing and shaping the suspension solution, the specific type of the curing device can be selected according to the type of the solution, and the applicability of the microstructure preparation method is improved.

Optionally, the temperature curing device is a heating tube, an ultrasonic heater or an infrared heater.

In the above implementation, the heating pipe, the ultrasonic heater or the infrared heater is adopted as the curing device, so that the cost of the whole device can be reduced when the solution can be cured by the temperature curing device.

Optionally, the device further comprises a microneedle for inserting a cell corresponding to any one of the meshes in the microarray structure formed by the overhang state of the solution on the mesh to perform liquid morphology adjustment.

In the implementation mode, besides the pressure controller is used for adjusting the morphology of the suspension liquid so as to realize the morphology adjustment of the micro-structure array, the micro-solution at each mesh is also introduced for adjustment, so that the flexibility and the accuracy of the preparation of the micro-array structure are further improved on the basis of pressure control.

The embodiment of the application also provides a microstructure preparation method which is applied to the microstructure preparation device, and the method comprises the following steps: applying a solution to the first mesh such that the solution depends from the mesh of the first mesh based on the liquid characteristics; adjusting, by the pressure controller, a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property; and curing the solution when the suspension state of the solution on the mesh forms a designated microstructure array morphology by the curing device so as to obtain the flexible substrate with the designated microstructure.

In the implementation manner, the characteristics of the mixed solution, such as viscosity and surface tension, are utilized, and the microstructure preparation with low cost and low process complexity is realized under the action of multiple physical fields, especially under the action of gravity at normal temperature and normal pressure. Meanwhile, the suspension form of the liquid is flexibly and conveniently adjusted through the pressure device, so that the form of the finally prepared flexible substrate with the specified microstructure is controllable, and the forming accuracy of the microstructure array is ensured. In addition, in the preparation process of the flexible substrate with the microstructure, no extra chemical solvent is needed except the raw material solution for forming the microstructure array, so that the environmental protection performance of the preparation of the microstructure array is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a microstructure preparation apparatus according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a first grid according to an embodiment of the present application.

Fig. 3 is a schematic flow chart of a microstructure preparation method according to an embodiment of the present application.

Icon: 10-a microstructure preparation device; 11-sealing the container; 12-a first grid; 13-a pressure controller; 131-positive pressure vessel; 132-a negative pressure device; 14-a curing device; 15-mould.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In recent years, flexible electron microscopic integration technology has become an emerging field of attention, so as to realize technical improvements in aspects of lightness, thinness, impact resistance, high performance, portability and the like of electronic equipment and photoelectric devices. The flexible electron microscopic integration technology combines the micro-nano technology and the flexible technology, and has extremely important practical value in the aspects of artificial skin, flexible batteries, flexible display screens, head-mounted displays, visual intelligent glasses, artificial intelligent robots, micro-aircrafts and the like. The flexible electron microscopic integration technology has good industrialization prospect, but a bottleneck still exists at present. For example, the service life of the organic material, the performance stability of the nano material, etc. are still further improved. In order to obtain a flexible electronic integrated system with lighter materials, smaller size, lower energy consumption and stronger performance, the method needs to be improved in several aspects of obtaining functional materials on a flexible substrate, developing micro-nano scale functional materials, combining substrates with the functional materials, ensuring the performance of the functional materials, and the like, only considering the selection of the substrate materials, the water-oxygen blocking capability of a water-oxygen blocking layer, the flatness and conductivity of a conductive anode, the patterning process of the anode, the efficiency and color of the manufactured element, the packaging effect after the element is good or bad, and finally the length of the service life of the element, the mechanical stress which can be born, such as the rolling degree, the number of times, and the like, from the aspect of manufacturing the flexible display device, the most basic condition for meeting the requirements is the improvement of the microstructure array of the flexible substrate.

The flexible substrate mainly plays a role of supporting and improving thin film characteristics, and in the case of a flexible display device, the flexible substrate is a technology for developing a flexible display. According to the research progress of the flexible display substrates at home and abroad at present, the flexible display substrates are specifically divided into five types: plastic, metal foil, ultra-thin glass, paper substrate, bio-composite film substrate, etc. The above substrate provides device performance similar to conventional glass substrates.

The technical basis of the flexible substrate is microstructure preparation, wherein the microstructure refers to various heterogeneous structural phenomena in a crystal structure, such as various lattice defects, domain structures, fine dissolution phenomena, structural bicrystals, modulation structures and the like, which can be observed by means of an optical microscope or an electron microscope.

The research of the inventor finds that the traditional substrate microstructure preparation process generally comprises a precision machining method, a laser etching method, an electron beam etching method, a physical/chemical etching method, an electrochemical method, a 3D printing method, a template method (plant template) and the like, and the traditional substrate microstructure preparation process is non-disposable in molding, high in power consumption, high in cost and complex in process implementation process.

After the microstructure is processed on the hard die, the microstructure is transferred by other materials (such as resin) or the hard microstructure substrate is dissolved by chemical solvent, so that the flexible microstructure array is formed. In some ways, inspiration is obtained from natural plants, and plant leaves or pollen are provided with microstructures, and then are processed to be made into templates, so that a microstructure array is obtained, or the microstructure array is obtained by covering the surfaces of the plant leaves or pollen with a layer of flexible material and then performing turnover transfer printing in a soft photoetching way. In summary, the existing preparation method of the microstructure array has the following defects: the process is complex, the parameters to be controlled are particularly large, and the template manufacturing process is complex after the transfer printing of the turnover mould; the energy consumption is high, and extra chemical solvent is introduced in the preparation process, so that environmental pollution (such as solvent type) is caused; the high cost, the strong dependence on manufacturing equipment, the complexity of the process and the high energy consumption determine the high cost.

In order to solve the above-described problems of the prior art, an embodiment of the present application provides a microstructure preparation apparatus 10. Referring to fig. 1, fig. 1 is a schematic structural diagram of a microstructure preparation apparatus according to an embodiment of the application.

The microstructure preparation apparatus 10 includes a sealed container 11, a first mesh 12, a pressure controller 13, and a solidifying unit 14. The first mesh 12 and the solidifying means 14 are provided in the sealed container 11, and the pressure controller 13 is in communication with the sealed container 11.

The sealed container 11 may be made of glass, plastic, metal or alloy, and it should be noted that the sealed container 11 is selected according to the characteristics of the desired solution of the flexible substrate for preparing the microstructure array, and the material that does not chemically react with the desired solution is selected.

Further, the sealed container 11 is used for the fabrication of flexible substrates, most of which are in the form of square or circular films, so that the sealed container 11 may be flat and one of the sides or one of the two sides having the largest area may be opened and closed to take out or put the mixed solution, the first grid 12, etc. into the sealed container 11.

In order to secure the sealing effect of the sealing container 11, sealing rubber may be provided at the joint of the sealing container 11 when one of the side surfaces or one of the two surfaces having the largest area of the sealing container 11 can be opened and closed.

Alternatively, the solution used for manufacturing the flexible substrate in this embodiment may be a pre-formulated mixed solution with a certain viscosity and concentration, such as a pulp solution, an organic solution, a rubber solution, etc., and the mixed solution needs to be pre-mixed uniformly before use and remove larger impurity particles. Solutions commonly used for flexible substrate fabrication may include ethylene glycol diformate (PET) solutions, polyethylene naphthalate (PEN) solutions, polyimide (PI) solutions, polydimethylsiloxane (PDMS) solutions, pulp solutions, and the like.

Alternatively, the solution in this embodiment may be applied to the first grid 12 and then placed in the sealed container 11, or the mold 15 for placing the solution in the sealed container 11 may be placed in the sealed container 11, and the mold 15 should also be flat and have a shape matching the shape of the first grid 12, so that the first grid 12 applies the solution in the mold 15.

Next, referring to fig. 2, fig. 2 is a schematic structural diagram of a first grid according to an embodiment of the present application.

The first mesh 12 is a high mesh, which is matched with the shape of the sealed container 11, and may be flat in this embodiment, and two opposite surfaces with the largest area may be provided with a hole array structure, i.e. a mesh. The first mesh 12 may be made of glass, plastic, metal or alloy, etc., and it should be noted that the first mesh 12 is selected according to the characteristics of the desired solution of the flexible substrate for preparing the microstructure array, and that the material is selected so as not to chemically react with the desired solution.

As an alternative embodiment, the microstructure preparation device 10 in this embodiment may further include a second mesh disposed in the sealed container 11, the second mesh being disposed to be attached to a side of the first mesh 12 facing away from the solution hanging direction.

Alternatively, the number of grids in the first grid 12 and the second grid, and the size of each grid, may be set according to the specific topography requirements of the microarray structure, e.g., any size of 40 nm, 55 nm, etc.

The grid manufacturing process and the arrangement mode of the first grid 12 and the second grid can be realized by a weaving and inserting process technology, and sub-nanometer meshes can be realized. In other embodiments, other process technologies besides weaving and inserting can be realized by adopting transverse and vertical arrangement and the like.

It should be noted that the mesh shapes, numbers and arrangements of the first mesh 12 and the second mesh are the same, and the mesh shapes of the first mesh 12 and the second mesh should be selected based on the specific microarray structure to be prepared, such as regular polygons, diamonds, sectors, hearts, and/or circles, etc., and the first mesh 12 and the second mesh of the above type can be simply customized or purchased directly, at low cost, and can be reused.

When manufacturing the microarray structure, the first grid 12 is placed in the mold 15 in advance, a required mixed solution with a certain viscosity and concentration can be added in the mold 15, or the mixed solution can be added on the first grid 12 after the first grid 12 is placed in the mold, then the first grid 12 is removed from the mixed solution, and the solution can naturally hang in the removal process due to the characteristics of the solution, such as specific concentration, viscosity, surface tension and the like, and the action of a gravity field, but the solution cannot fall from the meshes of the first grid 12. Since the solution hangs on the mesh openings of the first mesh 12 due to its own weight, solution viscosity and surface tension, a microstructure having microprotrusions is formed, and natural hanging of the solution can be achieved by adjusting parameters of the solute solvent material, as well as solution concentration, viscosity and mesh opening size of the mesh.

In the process of naturally suspending the solution, the microprotrusion structure formed by naturally suspending the solution is not particularly obvious due to the material characteristics and the action of the gravity field, so that the pressure controller 13 can be assisted as required to form a pressure difference on the top surface and the bottom surface of the first grid 12 in a pressurizing or vacuumizing mode, the mixed solution on the grid can suspend to a greater extent under the combined action of the gravity field in the pressure occasion, and the microstructure with a preset depth is achieved.

Alternatively, in this embodiment, the mixed solution may be placed on the first mesh 12 of the bottom layer, then another second mesh is placed on the mixed solution, the first mesh 12 and the second mesh of the upper layer and the lower layer are pressed to be slowly close, and due to the mechanical lamination effect of the mixed solution, the mixed solution may ooze out from both ends of the mesh of the first mesh 12 by the pressure controller 13 of the upper surface and the lower surface, and then be subjected to the subsequent treatment by the curing device 14, so that the flexible substrate having the specified microstructure array on both surfaces may be obtained.

On the other hand, in this embodiment, the solution may be oozed out from the outward surfaces of the first mesh 12 and the second mesh by compression and extrusion between the first mesh 12 and the second mesh, and at this time, the temperature is controlled so that the solution forms a microarray structure in a manner similar to that of opal and is cured and molded by using the curing device 14.

The pressure controller 13 in this embodiment may include a positive pressure device 131 and a negative pressure device 132, wherein the communication port between the positive pressure device 131 and the sealed container 11 is located at a side of the sealed container 11 facing away from the solution hanging direction, and the communication port between the negative pressure device 132 and the sealed container 11 is located at a side of the sealed container 11 facing the solution hanging direction.

Alternatively, the positive pressure 131 may be a mechanical laminator or an air press, and the negative pressure may be an air extractor.

Mechanical laminators are mechanical devices that compress multiple layers of material, typically by applying pressure to the surface of an object through a planar laminate, and in this embodiment the mechanical laminators may use a single laminate to compress the upper surface of the first web 12.

The air pressure device can be regarded as a booster, and the negative pressure device can be an air pump, so the air pressure device and the air pump can be air pumps, or other devices capable of increasing air pressure or exhausting air, and the devices are communicated with the sealed container 11 through the communication channels.

Further, the air pressure difference control method in this embodiment may be realized by bottom vacuumizing or applying a specific air pressure, the air may be inert gas, nitrogen, or other gas that does not react with the solution, and the pressurization may be performed by air blowing or air expansion.

As an alternative implementation manner, in order to control the microstructure corresponding to each mesh, each mesh in the first mesh 12 in this embodiment may be provided with an independent air inlet channel and an air outlet channel, and each air inlet channel and each air outlet channel are connected with a respective air pressure device and an air extractor, so that the independent air pressure device and the air extractor corresponding to each mesh perform pressure control on the solution at the mesh, thereby improving the preparation precision of the microstructure array.

In addition, in order to make finer adjustment of the liquid suspension form corresponding to each mesh in the present embodiment, a microneedle may be provided in the sealed container 11, and the microneedle may be used to make liquid form adjustment by inserting a cell corresponding to any one of the meshes in the microarray structure constituted by the suspension state of the solution on the mesh of the first mesh 12 or the second mesh. When the microneedles are inserted into the overhang liquid corresponding to the specified meshes, the depth parameters in the microarray units can be adjusted, the speed of the overhang liquid for exhausting gas in the liquid is guided to adjust the appearance of the overhang liquid, and after the appearance of the microstructure array reaches the set parameters, the solution film is solidified through the solidifying device 14.

The curing device 14 is used for curing the solution, and a temperature curing device, a photo-curing device and the like can be selected according to the specific curing requirement of the solution. The solidifying device 14 may be provided in the sealed container 11, or may be provided outside the sealed container 11 but in communication with the sealed container 11.

Wherein the temperature curing device can be a heating tube, an ultrasonic heater or an infrared heater. Photocuring (photo curing) refers to a curing process of a monomer, oligomer or polymer matrix under light induction, and is generally used in a film forming process, and the Photocuring device in this embodiment may be an ultraviolet Photocuring device or the like.

Optionally, in other embodiments, a curing agent may be introduced to cure the solution. Curing agents, also known as hardeners, curing agents or setting agents, are a class of substances or mixtures that enhance or control the curing reaction. For example, the resin is cured by a chemical reaction such as condensation, ring closure, addition or catalysis, the thermosetting resin is irreversibly changed, and the curing is performed by adding a curing (crosslinking) agent. The curing agent is an indispensable additive, and is added into adhesives, coatings and casting materials, or the epoxy resin cannot be cured.

The solidifying device 14 is capable of obtaining a flexible substrate having a specified microstructure after solidifying the solution while the suspended state of the solution is in a desired morphology.

In order to prepare a flexible substrate having a specified microstructure using the above-described microstructure preparation apparatus 10, an embodiment of the present application also provides a microstructure preparation method applied to the above-described microstructure preparation apparatus 10. Referring to fig. 3, fig. 3 is a flow chart of a microstructure preparation method according to an embodiment of the application. The specific steps of the microstructure preparation method can be as follows:

step S21: the solution is coated on the first mesh such that the solution depends from the mesh of the first mesh based on the liquid characteristics.

It should be understood that the solution may be applied to the first mesh 12 directly, or the first mesh 12 may be placed in the mold 15 and then removed.

In addition, the microstructure preparation method may further include the step of using a second mesh: the second grid is attached to the side of the first grid 12 facing away from the solution hanging direction and then separated from the first grid 12 by a preset distance, so that the solution forms a plurality of upright posts on the first grid 12 facing away from the solution hanging direction.

The preset distance can be adjusted according to specific requirements of microstructure preparation and is generally the same as the depth required by the microstructure units.

Step S22: the pressure in the sealed vessel is regulated by a pressure controller to adjust the suspension state of the solution based on the pressure and the liquid characteristics.

Alternatively, when the pressure controller 13 is capable of pressurizing and depressurizing from both sides, only pressurizing or depressurizing may be performed at the same time, or pressurizing and depressurizing operations may be performed simultaneously.

Step S23: the solution is cured by a curing device while the overhang state of the solution on the mesh constitutes the designated microstructure array topography to obtain a flexible substrate having the designated microstructure.

When the suspended state of the solution is configured to have a predetermined microstructure array morphology, the liquid morphology (depth) can be adjusted by inserting the microneedle into a cell corresponding to any one of the meshes of the microstructure array constituted by the suspended state of the solution on the mesh of the first mesh 12 or the second mesh.

In summary, the embodiments of the present application provide a microstructure preparation apparatus and method, where the apparatus includes a pressure controller, a sealed container, a first grid, and a solidifying device, where the first grid and the solidifying device are disposed in the sealed container, and the pressure controller is communicated with the sealed container; the first mesh is for suspending a solution from a mesh of the first mesh based on a liquid property; the pressure controller is configured to adjust a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property; the solidifying device is used for solidifying the solution when the suspension state of the solution on the mesh forms a designated microstructure array shape so as to obtain the flexible substrate with a designated microstructure.

In the implementation manner, the characteristics of the mixed solution, such as viscosity and surface tension, are utilized, and the microstructure preparation with low cost and low process complexity is realized under the action of multiple physical fields, especially under the action of gravity at normal temperature and normal pressure. Meanwhile, the suspension form of the liquid is flexibly and conveniently adjusted through the pressure device, so that the form of the finally prepared flexible substrate with the specified microstructure is controllable, and the forming accuracy of the microstructure array is ensured. In addition, in the preparation process of the flexible substrate with the microstructure, no extra chemical solvent is needed except the raw material solution for forming the microstructure array, so that the environmental protection performance of the preparation of the microstructure array is improved.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. The apparatus embodiments described above are merely illustrative, for example, block diagrams in the figures illustrate the architecture, functionality, connection, and/or operation of possible implementations of devices according to various embodiments of the present application. It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.

In addition, the modules in the embodiments of the present application may be integrated together to form a single part, or the modules may exist alone, or two or more modules may be integrated to form a single part.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

Claims (7)

1. A microstructure preparation device, which is characterized by comprising a pressure controller, a sealed container, a first grid and a solidifying device, wherein the first grid and the solidifying device are arranged in the sealed container, and the pressure controller is communicated with the sealed container;

the first mesh is for suspending a solution from a mesh of the first mesh based on a liquid property;

the pressure controller is configured to adjust a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property;

the solidifying device is used for solidifying the solution when the suspension state of the solution on the mesh forms a designated microstructure array morphology so as to obtain a flexible substrate with a designated microstructure;

the device also comprises a second grid arranged in the sealed container, wherein the second grid is used for being attached to one surface of the first grid, which is opposite to the solution hanging direction, and then separated from the first grid by a preset distance so that the solution forms a plurality of stand columns in the first grid, which is opposite to the solution hanging direction;

the pressure controller comprises a positive pressure device and a negative pressure device, wherein the communication port of the positive pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction, and the communication port of the negative pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction;

the device also comprises a microneedle which is used for being inserted into a unit corresponding to any mesh in the microarray structure formed by the suspension state of the solution on the mesh to carry out liquid form adjustment.

2. The device according to claim 1, wherein the mesh openings of the first mesh are regular polygons, diamond shapes, sectors, hearts and/or circles in shape.

3. The apparatus of claim 1, wherein the positive pressure device is a mechanical laminator or an air pressure device and the negative pressure device is an air ejector.

4. A device according to claim 3, wherein the positive pressure device is the air pressure device, each mesh in the first grid is provided with an independent air inlet channel and an air outlet channel, and the air pressure device and the air exhaust device are respectively communicated with each air inlet channel and each air outlet channel, so that the air pressure device and the air exhaust device respectively control the pressure of the solution at each mesh.

5. The apparatus according to any one of claims 1-4, wherein the curing device is a temperature curing device and/or a light curing device.

6. The apparatus of claim 5, wherein the temperature curing device is a heating tube, an ultrasonic heater, or an infrared heater.

7. A microstructure preparation method, characterized by being applied to the microstructure preparation apparatus as claimed in any one of claims 1 to 6, the method comprising:

applying a solution to the first mesh such that the solution depends from the mesh of the first mesh based on the liquid characteristics;

adjusting, by the pressure controller, a pressure in the sealed container to adjust a hanging state of the solution based on the pressure and the liquid property;

solidifying the solution on the meshes by the solidifying device when the suspension state of the solution on the meshes forms a designated microstructure array morphology so as to obtain a flexible substrate with a designated microstructure;

attaching a second grid to one surface of the first grid, which is opposite to the solution hanging direction, and separating the second grid from the first grid by a preset distance so that the solution forms a plurality of upright posts in the first grid, which is opposite to the solution hanging direction;

the pressure controller comprises a positive pressure device and a negative pressure device, wherein the communication port of the positive pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction, and the communication port of the negative pressure device and the sealing container is positioned at one side of the sealing container opposite to the solution hanging direction;

the liquid form is adjusted by inserting the micro needle into the unit corresponding to any mesh in the micro array structure formed by the suspension state of the solution on the mesh.