CN111705238A - High-strength high-conductivity heat-resistant copper alloy material - Google Patents
High-strength high-conductivity heat-resistant copper alloy material Download PDFInfo
- Publication number
- CN111705238A CN111705238A CN202010700627.3A CN202010700627A CN111705238A CN 111705238 A CN111705238 A CN 111705238A CN 202010700627 A CN202010700627 A CN 202010700627A CN 111705238 A CN111705238 A CN 111705238A
- Authority
- CN
- China
- Prior art keywords
- percent
- alloy material
- copper alloy
- conductivity heat
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a high-strength high-conductivity heat-resistant copper alloy material which comprises the following raw materials in percentage by weight: 3.5 to 4.5 percent of Si, 1.5 to 1.7 percent of Ni, 0.2 to 0.4 percent of Mn, 0.3 to 0.5 percent of Cr, 0.1 to 0.4 percent of Zr, 0.02 to 0.04 percent of rare earth element, 1.2 to 1.4 percent of medium regulating powder, 3.5 to 4.5 percent of leveling agent and the balance of copper. According to the invention, multiple metal additives are adopted to prepare the performance of the alloy material, in order to increase the alloy strength and the heat conduction performance in a coordinated manner, the leveling agent added in the preparation adopts the boron nitride nanosheet as the substrate, the boron nitride nanosheet is known to have high strength and stable performance, the graphene is introduced to improve the heat conduction performance of the material as the technical difficulty of the invention, and the improvement is carried out through research.
Description
Technical Field
The invention relates to the technical field of copper alloy materials, in particular to a high-strength high-conductivity heat-resistant copper alloy material.
Background
The copper alloy is an alloy formed by adding one or more other elements into pure copper serving as a matrix. Pure copper is purple red, also known as red copper. The pure copper has the density of 8.96 and the melting point of 1083 ℃, and has excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance. The method is mainly used for manufacturing electrical equipment such as a generator, a bus, a cable, a switching device and a transformer, and heat-conducting equipment such as a heat exchanger, a pipeline and a flat plate collector of a solar heating device. Commonly used copper alloys are classified into brass, bronze, cupronickel 3 and the like.
The prior Chinese patent document CN107345280A discloses a copper alloy material with good heat conductivity and higher strength, and the method for preparing the copper alloy material comprises the following steps: mixing powder with a binder to prepare a precursor, wherein the powder comprises: 96-99.8 parts by weight of copper and 0.2-2 parts by weight of chromium; although the alloy material disclosed in the document has high strength and high heat resistance, the heat conductivity is not good, and the strength and the heat conductivity are difficult to be improved in a consistent and coordinated manner by adopting the main agent copper, the auxiliary chromium and other raw materials, so that further research and development treatment is required to improve the strength and the heat conductivity.
Disclosure of Invention
The invention aims to provide a high-strength high-conductivity heat-resistant copper alloy material to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention discloses a high-strength high-conductivity heat-resistant copper alloy material which comprises the following raw materials in percentage by weight:
3.5 to 4.5 percent of Si, 1.5 to 1.7 percent of Ni, 0.2 to 0.4 percent of Mn, 0.3 to 0.5 percent of Cr0.5 percent, 0.1 to 0.4 percent of ZrC, 0.02 to 0.04 percent of rare earth elements, 1.2 to 1.4 percent of medium regulating powder, 3.5 to 4.5 percent of leveling agent and the balance of copper.
Preferably, the high-strength, high-conductivity and heat-resistant copper alloy material comprises the following raw materials in parts by weight:
3.6 to 4.2 percent of Si, 1.52 to 1.6 percent of Ni, 0.24 to 0.3 percent of Mn, 0.32 to 0.4 percent of Cr0.2, 0.2 to 0.3 percent of ZrC, 0.03 to 0.035 percent of rare earth elements, 1.25 to 1.3 percent of medium regulating powder, 3.7 to 4.2 percent of homogenizing agent and the balance of copper.
Preferably, the high-strength, high-conductivity and heat-resistant copper alloy material comprises the following raw materials in parts by weight:
4.0% of Si, 1.6% of Ni, 0.3% of Mn, 0.4% of Cr0.25% of Zrs, 0.03% of rare earth elements, 1.3% of medium regulating powder, 4.0% of leveling agent and the balance of copper.
Preferably, the preparation method of the medium regulating powder comprises the following steps: adding sodium stearate into sodium alginate solution, adding bentonite with the particle size of 20-100 meshes, calcining at the rotating speed of 100-200r/min, and obtaining the medium regulating and controlling powder after the calcining is finished.
Preferably, the temperature of the calcination treatment is 1200-1500 ℃, and the calcination time is 10-20 min.
Preferably, the preparation method of the leveling agent comprises the following steps: the preparation method comprises the steps of firstly placing boron nitride nanosheets in hot concentrated alkali for soaking for 10-20min, wherein the temperature of the hot concentrated alkali is 65-75 ℃, then adding xylene, carrying out ultrasonic dispersion for 100-200W, carrying out ultrasonic treatment for 10-20min, then adding wollastonite to modify graphene, finally adding a rare earth lanthanum chloride solution, then carrying out gamma ray irradiation for 15-25min, wherein the radiation dose is 55-65Gy/min, finally placing the mixture in a reaction kettle at 65-75 ℃ for reaction for 1-2h, and after the reaction is finished, centrifuging and drying to obtain the homogenizing agent.
Preferably, the preparation method of the wollastonite modified graphene comprises the following steps: adding graphene into a dilute sulfuric acid solution, stirring for 15-25min at the rotating speed of 100-500r/min, then adding pretreated wollastonite and sodium chloride solution, then conducting electrifying treatment, and finally stirring for 15-25min at the rotating speed of 100r/min to obtain the wollastonite modified graphene.
Preferably, the voltage of the electrifying treatment is 215-225V, and the current is 2.5-2.9A.
Preferably, the voltage of the electrifying process is 220V, and the current is 2.7A.
Preferably, the pretreated wollastonite is calcined at 400 ℃ for 1-2h at 300-.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, a plurality of metal additives are adopted to prepare the performance of the alloy material, in order to increase the strength and the heat conductivity of the alloy material in a coordinated manner, boron nitride nanosheets are adopted as a leveling agent added in the preparation, the boron nitride nanosheets are known to have high strength and stable performance, the heat conductivity of the graphene improved material is introduced as a technical difficulty of the invention, the boron carbon bonds are firstly destroyed in hot concentrated alkali through research and improvement treatment, the reaction activity of the raw materials is better due to the addition of a rare earth lanthanum chloride solution, so that the graphene and the boron nitride nanosheets are combined, the graphene and the boron nitride nanosheets can be better combined with each other in the external environment of gamma-ray irradiation, and the leveling agent can be matched with other raw materials, so that the leveling agent has a great effect on improving the strength and the heat conductivity of the material.
(2) The graphene and boron nitride nanosheets are combined under the action of the medium control powder, and can be better combined with other raw materials, because the bentonite in the medium control powder is in a lamellar state and can be inserted into the raw materials, the bonding strength of the raw materials is better.
(3) The method for modifying graphene by wollastonite comprises the steps of blending graphene and wollastonite, adding sodium chloride, and electrifying, so that the graphene is modified by the wollastonite, wherein the wollastonite is in a needle-shaped structure and is inserted into the graphene, the stable structure of the graphene can be destroyed, the graphene is easier to combine with boron nitride nanosheets, and the heat conduction and strength properties of the material are improved.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to specific embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the high-strength high-conductivity heat-resistant copper alloy material comprises the following raw materials in percentage by weight:
3.5 percent of Si, 1.5 percent of Ni, 0.2 percent of Mn, 0.3 percent of Cr0.1 percent of Zr0.1 percent of rare earth elements, 1.2 percent of medium regulating powder, 3.5 percent of leveling agent and the balance of copper.
The preparation method of the medium control powder of the embodiment comprises the following steps: adding sodium stearate into sodium alginate solution, adding bentonite with the particle size of 20 meshes, calcining at the rotating speed of 100r/min, and obtaining the medium regulating powder after calcining.
The temperature of the calcination treatment in this example was 1200 ℃ and the calcination time was 10 min.
The preparation method of the leveling agent in the embodiment comprises the following steps: soaking boron nitride nanosheets in hot concentrated alkali for 10min at the temperature of 65 ℃, adding dimethylbenzene, ultrasonically dispersing for 100W for 10min, then adding wollastonite to modify graphene, finally adding a rare earth lanthanum chloride solution, irradiating for 15min by adopting gamma rays with the radiation dose of 55Gy/min, finally placing in a reaction kettle at the temperature of 65 ℃ for reacting for 1h, and centrifuging and drying after the reaction is finished to obtain the homogenizing agent.
The preparation method of the wollastonite modified graphene in the embodiment comprises the following steps: adding graphene into a dilute sulfuric acid solution, stirring for 15min at a rotating speed of 100r/min, then adding pretreated wollastonite and sodium chloride solution, then conducting electrifying treatment, and finally stirring for 15min at a rotating speed of 100r/min to obtain wollastonite modified graphene.
The voltage of the energization process in this example was 215V, and the current was 2.5A.
The pretreated wollastonite of this example was calcined at 300 ℃ for 1 hour and then ground at 500r/min for 15 minutes.
Example 2:
the high-strength high-conductivity heat-resistant copper alloy material comprises the following raw materials in percentage by weight:
4.5% of Si, 1.7% of Ni, 0.4% of Mn, 0.5% of Cr, 0.4% of Zr, 0.04% of rare earth element, 1.4% of medium regulating powder, 4.5% of leveling agent and the balance of copper.
The preparation method of the medium control powder of the embodiment comprises the following steps: adding sodium stearate into sodium alginate solution, adding bentonite with the particle size of 100 meshes, calcining at the rotating speed of 200r/min, and obtaining the medium regulating powder after calcining.
The temperature of the calcination treatment in this example was 1500 ℃ and the calcination time was 20 min.
The preparation method of the leveling agent in the embodiment comprises the following steps: soaking boron nitride nanosheets in hot concentrated alkali for 20min at the temperature of 75 ℃, adding dimethylbenzene, ultrasonically dispersing for 200W for 20min, then adding wollastonite to modify graphene, finally adding a rare earth lanthanum chloride solution, irradiating for 25min by adopting gamma rays with the radiation dose of 65Gy/min, finally placing in a reaction kettle at the temperature of 75 ℃ for reacting for 2h, and centrifuging and drying after the reaction is finished to obtain the homogenizing agent.
The preparation method of the wollastonite modified graphene in the embodiment comprises the following steps: adding graphene into a dilute sulfuric acid solution, stirring for 25min at a rotating speed of 500r/min, then adding pretreated wollastonite and sodium chloride solution, then conducting electrifying treatment, and finally stirring for 25min at a rotating speed of 100r/min to obtain wollastonite modified graphene.
The voltage of the energization process of this example was 225V and the current was 2.9A.
The pretreated wollastonite of this example was calcined at 400 ℃ for 2 hours and then ground at 1000r/min for 25 min.
Example 3:
the high-strength high-conductivity heat-resistant copper alloy material comprises the following raw materials in percentage by weight:
4.0% of Si, 1.6% of Ni, 0.3% of Mn, 0.4% of Cr0.25% of Zrs, 0.03% of rare earth elements, 1.3% of medium regulating powder, 4.0% of leveling agent and the balance of copper.
The preparation method of the medium control powder of the embodiment comprises the following steps: adding sodium stearate into sodium alginate solution, adding bentonite with the particle size of 60 meshes, calcining at the rotating speed of 150r/min, and obtaining the medium regulating powder after calcining.
The temperature of the calcination treatment in this example was 1350 ℃ and the calcination time was 15 min.
The preparation method of the leveling agent in the embodiment comprises the following steps: soaking boron nitride nanosheets in hot concentrated alkali for 15min at the temperature of 70 ℃, adding dimethylbenzene, ultrasonically dispersing for 150W for 15min, then adding wollastonite to modify graphene, finally adding a rare earth lanthanum chloride solution, irradiating for 15-25min by adopting gamma rays with the radiation dose of 60Gy/min, finally placing in a reaction kettle at the temperature of 70 ℃ for reacting for 1.5h, and centrifuging and drying after the reaction is finished to obtain the homogenizing agent.
The preparation method of the wollastonite modified graphene in the embodiment comprises the following steps: adding graphene into a dilute sulfuric acid solution, stirring for 20min at a rotating speed of 300r/min, then adding pretreated wollastonite and sodium chloride solution, then conducting electrifying treatment, and finally stirring for 20min at a rotating speed of 100r/min to obtain wollastonite modified graphene.
The voltage of the energization process of this example was 220V and the current was 2.7A.
The pretreated wollastonite of this example was calcined at 350 ℃ for 1.5 hours, and then ground at 750r/min for 20 min.
Comparative example 1:
the materials and preparation process were substantially the same as those of example 3, except that no medium control powder was added.
Comparative example 2:
the material and the preparation process are basically the same as those of the example 3, except that wollastonite modified graphene is changed into graphene.
The examples 1 to 3 and the comparative examples 1 to 2 were subjected to the performance test, and the test results are shown in Table 1 (the heat conductivity improvement rate and the strength improvement rate were compared with each other using an alloy material of Chinese patent document CN107345280A as the base number)
| Group of | Heat conductivity improvement (%) | Strength increasing ratio (%) |
| Example 1 | 22.5 | 21.7 |
| Example 2 | 23.1 | 22.4 |
| Example 3 | 28.3 | 26.6 |
| Comparative example 1 | 14.3 | 12.2 |
| Comparative example 2 | 17.3 | 16.1 |
TABLE 1
The heat conduction and strength performance of the alloy material is coordinately increased in a direct proportion manner, and the alloy material is obviously improved according to the embodiment 1-3 and the comparative example 1-2.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The high-strength high-conductivity heat-resistant copper alloy material is characterized by comprising the following raw materials in percentage by weight:
3.5 to 4.5 percent of Si, 1.5 to 1.7 percent of Ni, 0.2 to 0.4 percent of Mn, 0.3 to 0.5 percent of Cr0.5 percent, 0.1 to 0.4 percent of ZrC, 0.02 to 0.04 percent of rare earth elements, 1.2 to 1.4 percent of medium regulating powder, 3.5 to 4.5 percent of leveling agent and the balance of copper.
2. The high-strength high-conductivity heat-resistant copper alloy material as claimed in claim 1, wherein the high-strength high-conductivity heat-resistant copper alloy material comprises the following raw materials in parts by weight:
3.6 to 4.2 percent of Si, 1.52 to 1.6 percent of Ni, 0.24 to 0.3 percent of Mn, 0.32 to 0.4 percent of Cr0.2, 0.2 to 0.3 percent of ZrC, 0.03 to 0.035 percent of rare earth elements, 1.25 to 1.3 percent of medium regulating powder, 3.7 to 4.2 percent of homogenizing agent and the balance of copper.
3. The high-strength high-conductivity heat-resistant copper alloy material as claimed in claim 1, wherein the high-strength high-conductivity heat-resistant copper alloy material comprises the following raw materials in parts by weight:
4.0% of Si, 1.6% of Ni, 0.3% of Mn, 0.4% of Cr0.25% of Zrs, 0.03% of rare earth elements, 1.3% of medium regulating powder, 4.0% of leveling agent and the balance of copper.
4. The high-strength high-conductivity heat-resistant copper alloy material as claimed in claim 1, wherein the preparation method of the medium control powder comprises the following steps: adding sodium stearate into sodium alginate solution, adding bentonite with the particle size of 20-100 meshes, calcining at the rotating speed of 100-200r/min, and obtaining the medium regulating and controlling powder after the calcining is finished.
5. The high-strength high-conductivity heat-resistant copper alloy material as claimed in claim 4, wherein the calcination treatment temperature is 1200-1500 ℃, and the calcination time is 10-20 min.
6. The high-strength high-conductivity heat-resistant copper alloy material as recited in claim 1, wherein the preparation method of the leveling agent is: the preparation method comprises the steps of firstly placing boron nitride nanosheets in hot concentrated alkali for soaking for 10-20min, wherein the temperature of the hot concentrated alkali is 65-75 ℃, then adding xylene, carrying out ultrasonic dispersion for 100-200W, carrying out ultrasonic treatment for 10-20min, then adding wollastonite to modify graphene, finally adding a rare earth lanthanum chloride solution, then carrying out gamma ray irradiation for 15-25min, wherein the radiation dose is 55-65Gy/min, finally placing the mixture in a reaction kettle at 65-75 ℃ for reaction for 1-2h, and after the reaction is finished, centrifuging and drying to obtain the homogenizing agent.
7. The high-strength high-conductivity heat-resistant copper alloy material as claimed in claim 6, wherein the preparation method of the wollastonite modified graphene comprises the following steps: adding graphene into a dilute sulfuric acid solution, stirring for 15-25min at the rotating speed of 100-500r/min, then adding pretreated wollastonite and sodium chloride solution, then conducting electrifying treatment, and finally stirring for 15-25min at the rotating speed of 100r/min to obtain the wollastonite modified graphene.
8. The copper alloy material as claimed in claim 7, wherein the voltage of the electrical treatment is 215-225V and the current is 2.5-2.9A.
9. The copper alloy material according to claim 8, wherein the voltage of the electrical treatment is 220V and the current is 2.7A.
10. The copper alloy material as recited in claim 7, wherein the pretreated wollastonite is calcined at 400 ℃ for 1-2h and then ground at 1000r/min 500-.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010700627.3A CN111705238A (en) | 2020-07-20 | 2020-07-20 | High-strength high-conductivity heat-resistant copper alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010700627.3A CN111705238A (en) | 2020-07-20 | 2020-07-20 | High-strength high-conductivity heat-resistant copper alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111705238A true CN111705238A (en) | 2020-09-25 |
Family
ID=72546868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010700627.3A Pending CN111705238A (en) | 2020-07-20 | 2020-07-20 | High-strength high-conductivity heat-resistant copper alloy material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111705238A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113122755A (en) * | 2021-04-16 | 2021-07-16 | 江西富鸿金属有限公司 | Tinned alloy wire for medical data transmission and preparation method thereof |
| CN113293322A (en) * | 2021-04-15 | 2021-08-24 | 陕西斯瑞新材料股份有限公司 | Novel copper alloy manufacturing process for water-cooled exchanger based on monocrystalline silicon smelting |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012147780A1 (en) * | 2011-04-25 | 2012-11-01 | 千住金属工業株式会社 | Sliding material, alloy for bearing, and multilayer metal material for bearing |
| CN105385884A (en) * | 2015-12-24 | 2016-03-09 | 济南大学 | Electrical contact material and preparation method thereof |
| CN105603231A (en) * | 2015-12-07 | 2016-05-25 | 宁波墨西科技有限公司 | Graphene-modified copper alloy nano-material and preparation method thereof |
| CN105603247A (en) * | 2016-02-26 | 2016-05-25 | 济南大学 | Graphene reinforced copper-rare earth based electrical contact material and preparing method thereof |
| CN105908007A (en) * | 2016-06-06 | 2016-08-31 | 中国科学院过程工程研究所 | Graphene-copper composite material and preparation method thereof |
| JP2016180131A (en) * | 2015-03-23 | 2016-10-13 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND LEAD FRAME |
| CN107723500A (en) * | 2017-09-29 | 2018-02-23 | 江西理工大学 | A kind of graphene aluminum oxide mixing enhancement copper-base composite material and preparation method thereof |
-
2020
- 2020-07-20 CN CN202010700627.3A patent/CN111705238A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012147780A1 (en) * | 2011-04-25 | 2012-11-01 | 千住金属工業株式会社 | Sliding material, alloy for bearing, and multilayer metal material for bearing |
| JP2016180131A (en) * | 2015-03-23 | 2016-10-13 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND LEAD FRAME |
| CN105603231A (en) * | 2015-12-07 | 2016-05-25 | 宁波墨西科技有限公司 | Graphene-modified copper alloy nano-material and preparation method thereof |
| CN105385884A (en) * | 2015-12-24 | 2016-03-09 | 济南大学 | Electrical contact material and preparation method thereof |
| CN105603247A (en) * | 2016-02-26 | 2016-05-25 | 济南大学 | Graphene reinforced copper-rare earth based electrical contact material and preparing method thereof |
| CN105908007A (en) * | 2016-06-06 | 2016-08-31 | 中国科学院过程工程研究所 | Graphene-copper composite material and preparation method thereof |
| CN107723500A (en) * | 2017-09-29 | 2018-02-23 | 江西理工大学 | A kind of graphene aluminum oxide mixing enhancement copper-base composite material and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113293322A (en) * | 2021-04-15 | 2021-08-24 | 陕西斯瑞新材料股份有限公司 | Novel copper alloy manufacturing process for water-cooled exchanger based on monocrystalline silicon smelting |
| CN113293322B (en) * | 2021-04-15 | 2022-01-28 | 陕西斯瑞新材料股份有限公司 | Novel copper alloy manufacturing process for water-cooled exchanger based on monocrystalline silicon smelting |
| CN113122755A (en) * | 2021-04-16 | 2021-07-16 | 江西富鸿金属有限公司 | Tinned alloy wire for medical data transmission and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111705238A (en) | High-strength high-conductivity heat-resistant copper alloy material | |
| CN104711443A (en) | Graphene/copper composite and preparation method thereof | |
| CN103008676B (en) | Method for manufacturing high-dispersion ultrafine molybdenum-based powder | |
| CN102496704B (en) | Lithium titanate/titanium black anode material and preparation method thereof | |
| WO2024055747A1 (en) | Composite shielding yttrium-based alloy material, and preparation method therefor and use thereof | |
| CN105958079A (en) | Graphene composite coating layer aluminum foil and lithium ion battery applying same | |
| CN109686932A (en) | A kind of preparation method by the nickelic tertiary cathode material of polynary coating modification | |
| WO2023025280A1 (en) | Fe-based spherical shielding alloy powder and preparation method therefor | |
| CN115341125B (en) | Tungsten alloy medical shielding plate and preparation method thereof | |
| CN109280425A (en) | A kind of preparation method of floor heating electric hot plate | |
| CN108912606A (en) | A kind of graphene conductive heat generating pastes and preparation method thereof | |
| CN109338405B (en) | Amorphous electrocatalytic electrode and preparation method and application thereof | |
| CN105401149B (en) | A kind of preparation method of copper diamond composite gold tin welding coating | |
| CN111471301B (en) | Degaussing shielding cable for subway track system and preparation method thereof | |
| CN107134584A (en) | A kind of intermediate temperature solid oxide fuel cell electrolyte and preparation method thereof | |
| CN106834792A (en) | Add high intensity, dispersion-strengthened Cu of high conductivity of Rare Earth Lanthanum and preparation method thereof | |
| CN109754912A (en) | A kind of alloy cable and preparation method thereof | |
| CN113308622B (en) | High-strength high-conductivity copper-nickel-silicon alloy material and preparation method thereof | |
| CN202085325U (en) | High temperature rare earth thick film circuit heating element based on aluminium alloy substrate | |
| CN103343259A (en) | High-temperature and high-voltage-resistance copper alloy conductive material | |
| CN109351976A (en) | Semiconductor high-power device copper-molybdenum copper-carbon/carbon-copper composite material and preparation method thereof | |
| CN113563595A (en) | Bentonite grafting agent and preparation method and application thereof | |
| CN115262236A (en) | Electromagnetic protective clothing material and preparation method thereof | |
| CN110952045A (en) | High-performance alloy copper powder and preparation method thereof | |
| CN110315238B (en) | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200925 |
|
| RJ01 | Rejection of invention patent application after publication |