CN110315238B - Carbon nanotube reinforced lead-free solder, and preparation method and application thereof - Google Patents
Carbon nanotube reinforced lead-free solder, and preparation method and application thereof Download PDFInfo
- Publication number
- CN110315238B CN110315238B CN201910710360.3A CN201910710360A CN110315238B CN 110315238 B CN110315238 B CN 110315238B CN 201910710360 A CN201910710360 A CN 201910710360A CN 110315238 B CN110315238 B CN 110315238B
- Authority
- CN
- China
- Prior art keywords
- free solder
- carbon nanotube
- tin
- nickel
- reinforced lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses a carbon nano tube reinforced lead-free solder, a preparation method and application thereof, relating to the technical field of soft soldering, in particular to the carbon nano tube reinforced lead-free solder which comprises the following components in percentage by mass: tin: 98.4% -99.3%; copper: 0.5 to 0.7 percent; nickel: 0.05 percent to 0.3 percent; bismuth: 0.05 percent to 0.5 percent; carbon nanotube: 0.01 to 0.1 percent. The carbon nanotube reinforced lead-free solder has the advantages of high thermal conductivity, excellent welding performance and excellent mechanical property, and is particularly suitable for welding a copper water tank of a large radiator.
Description
Technical Field
The invention relates to the technical field of soldering, in particular to a carbon nano tube reinforced lead-free solder, a preparation method and application thereof.
Background
The high-power heat radiator of generator set, engineering machinery and the like is an important component in mechanical equipment and is a main part in an equipment cooling system.
With the rapid development of nuclear power generating sets and large-scale engineering machinery industries, the environmental protection requirement is continuously improved, and the high-power radiator is developing towards the directions of high reliability, high heat dissipation, high economy and environmental protection.
The existing welding material has some defects in the aspects of elongation percentage, heat conductivity or tensile strength, and the comprehensive performance of the welding material cannot completely meet the welding requirement of the existing high-power radiator, so that the radiator is subsequently influenced.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a carbon nano tube reinforced lead-free solder, a preparation method of the carbon nano tube reinforced lead-free solder and application of the carbon nano tube reinforced lead-free solder in welding a high-power copper water tank radiator.
The invention is realized by the following steps:
in a first aspect, an embodiment of the present invention provides a carbon nanotube reinforced lead-free solder, which includes the following components, by mass: tin: 98.4% -99.3%; copper: 0.5 to 0.7 percent; nickel: 0.05 percent to 0.3 percent; bismuth: 0.05 percent to 0.5 percent; carbon nanotube: 0.01 to 0.1 percent.
The carbon nano tube reinforced lead-free solder does not contain any environment-friendly components and meets the requirement of environmental protection. By adding the components, the long-term reliability, the elongation and the thermal conductivity of the brazing filler metal are remarkably improved. Specifically, nickel is added into the carbon nano tube reinforced lead-free solder to refine solder tissues, so that the tensile strength of the solder is increased; by adding bismuth, the transformation of white tin (beta-Sn) to gray tin (alpha-Sn) can be effectively inhibited, and the long-term reliability of the brazing filler metal is greatly improved; the elongation of the brazing filler metal can be enhanced by adding copper, the reliability of a welding spot is enhanced, and meanwhile, the cost can be reduced; by adding the carbon nano tubes, the elongation of the brazing filler metal can be improved, and the thermal conductivity of the brazing filler metal can be obviously improved.
In an alternative embodiment, it comprises the following components, in mass percent: tin: 98.8 to 99.0 percent; copper powder: 0.6 to 0.7 percent; nickel: 0.08 to 0.2 percent; bismuth: 0.15 to 0.25 percent; carbon nanotube: 0.05 to 0.1 percent. The brazing filler metal prepared according to the proportion has better long-term reliability, elongation and thermal conductivity.
In an optional embodiment, the tensile strength of the carbon nanotube reinforced lead-free solder is greater than or equal to 43Mpa, preferably, the tensile strength is greater than or equal to 46 Mpa; more preferably, the tensile strength is ≥ 48 MPa. The elongation of the carbon nano tube reinforced lead-free solder is more than or equal to 35 percent, and preferably, the elongation is more than or equal to 38 percent; more preferably, the elongation is 41% or more. The thermal conductivity of the carbon nano tube reinforced lead-free solder is more than or equal to 67W/(m.K); preferably, the thermal conductivity is more than or equal to 75W/(m.K); more preferably, the thermal conductivity is 75W/(mK).
In an alternative embodiment, the carbon nanotubes are single-walled carbon nanotubes. Compared with the traditional additives, such as multi-wall carbon nanotubes, carbon fibers and most types of carbon black, the additive amount of the single-wall carbon nanotubes can obviously improve the performance of the material, the component purity of more than 99 percent is beneficial to component control, and other adverse effects caused by impurities are reduced.
Preferably, the carbon nanotube is a single-walled carbon nanotube after acidification, ultrasonic treatment and drying treatment;
preferably, the acidifying comprises: the volume ratio is 1: 1, treating for 10 hours by concentrated nitric acid and concentrated sulfuric acid, wherein the ultrasonic treatment comprises the following steps: putting into hydrochloric acid solution for ultrasonic treatment for 10min, wherein the drying comprises the following steps: and drying in a drying oven. Acid treatment is carried out to prevent the carbon nano tubes from agglomerating, so that the carbon nano tubes can be uniformly dispersed in the plating solution; on the other hand, the acid treatment can not only disperse and purify the carbon nanotubes, but also form stable functional groups such as hydroxyl, carboxyl, carbonyl and the like on the surfaces of the carbon nanotubes, thereby improving the hydrophilicity and the dispersibility of the carbon nanotubes.
Preferably, the purity of the tin is more than or equal to 99.99 percent;
preferably, the copper is copper powder, the purity of the copper powder is more than or equal to 99.99%, and the granularity of the copper powder is 100-200 meshes;
preferably, the nickel is foam nickel with the purity of more than or equal to 99.99 percent;
preferably, the purity of the bismuth is more than or equal to 99.99 percent.
In a second aspect, an embodiment of the present invention provides a method for preparing a carbon nanotube-reinforced lead-free solder, including the following steps: the components and the mass percentages thereof in the carbon nanotube reinforced lead-free solder according to any one of the preceding embodiments are prepared.
In an alternative embodiment, the preparation method comprises the steps of mixing and stirring the composite material of the carbon nano tube and the copper powder with the mixture of tin, nickel and bismuth;
preferably, the mixing and stirring time of the composite material and the mixed melt of tin, nickel and bismuth is 30-40 min, and the stirring temperature is 360-400 ℃.
In an alternative embodiment, the preparation of the composite material of carbon nanotubes and copper powder comprises: ball-milling the mixture of the copper powder and the carbon nano tube under the protection of inert gas;
preferably, the ball-milling has a ball-to-feed ratio of 10: (1-2);
preferably, the rotating speed of the ball milling is 400-600 r/min;
preferably, the ball milling time is 2-10 h.
In an alternative embodiment, the preparing of the tin, nickel, bismuth melt mixture comprises: mixing the mixed melt of nickel and nickel with bismuth, and stirring and mixing the mixture;
preferably, the mixing and melting temperature for stirring and mixing and melting the bismuth after mixing is 360-400 ℃;
preferably, the stirring time for stirring, mixing and melting after mixing with bismuth is 25-35 min;
preferably, the preparation of the tin and nickel mixture comprises: mixing and stirring nickel and the melted tin at 400-500 ℃;
preferably, the smelting temperature of the tin is 400-500 ℃, and the smelting time is 10-15 min.
The lead-free material prepared by the smelting sequence has better mechanical property, because the melting point of nickel is very high, the melting of nickel and tin is not easy, the temperature for dissolving nickel is the highest, about 450 ℃, the melting point of bismuth is firstly dissolved, then the temperature is reduced to about 380 ℃, bismuth is dissolved, because the melting point of bismuth is lower, the nickel is easier than the dissolution of tin, finally the temperature is reduced to 350 ℃, the composite material of the carbon nano tube and the copper powder is added, the copper and the tin have the best mutual fusibility and are easy to add, and the smelting time of the carbon nano tube is reduced as much as possible. The selection of the melting temperature and the stirring time is beneficial to the full mutual melting and uniform dispersion of the solder in tin, so that the solder has fine and smooth structure and better mechanical property.
In a third aspect, embodiments of the present disclosure provide a carbon nanotube-reinforced lead-free solder prepared by the method for preparing a carbon nanotube-reinforced lead-free solder according to any one of the preceding embodiments.
In a fourth aspect, embodiments of the present invention provide a use of the carbon nanotube-reinforced lead-free solder according to any one of the previous embodiments for welding a high-power copper tank heat sink.
The invention has the following beneficial effects:
the embodiment of the invention provides a carbon nano tube reinforced lead-free solder, which comprises the following components in percentage by mass: tin: 98.4% -99.3%; copper: 0.5 to 0.7 percent; nickel: 0.05 percent to 0.3 percent; bismuth: 0.05 percent to 0.5 percent; carbon nanotube: 0.01 to 0.1 percent. The carbon nano tube reinforced lead-free solder prepared from the components and the proportion has the advantages of high thermal conductivity and excellent welding performance and mechanical property.
In addition, the embodiment of the invention also provides a preparation method of the carbon nano tube reinforced lead-free solder, the carbon nano tube reinforced lead-free solder prepared by the preparation method and application of the carbon nano tube reinforced lead-free solder. The preparation method is simple and easy to operate, and is beneficial to industrial production, and the carbon nano tube reinforced lead-free solder obtained by the preparation method has the advantages of high thermal conductivity and excellent welding performance and mechanical property.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The carbon nano tube reinforced lead-free solder comprises the following components in percentage by mass:
a preparation method of a carbon nanotube reinforced lead-free solder comprises the following steps:
preparing raw materials: preparing raw materials according to the components and the percentages. The raw materials specifically comprise tin, copper powder, nickel, bismuth and carbon nanotubes. Wherein, the purity of the tin is 99.99 percent; the purity of the copper powder is 99.99 percent, and the granularity of the copper powder is 100 meshes; the nickel is foamed nickel with the purity of 99.99 percent; the purity of bismuth was 99.99%.
The carbon nanotubes are single-walled carbon nanotubes.
The preparation method comprises the following steps:
adding the prepared tin into a tin furnace, heating to 450 ℃, melting the tin and continuously stirring for 15 min. And mixing the prepared foam nickel with the mixed and melted tin, keeping the temperature constant, stirring for 25min, and uniformly mixing and melting the nickel in the tin to obtain a mixed and melted substance of the tin and the nickel. And cooling the mixed melt of tin and nickel to 380 ℃, keeping the temperature constant, adding bismuth, mixing and stirring for 30min to completely mix and melt the bismuth, and obtaining the mixed melt of tin, nickel and tin.
Mixing the prepared copper powder and the carbon nano tube, wherein the ball material ratio is 10: and 1, continuously ball-milling for 5 hours at the rotating speed of 500r/min under the protection of argon to obtain the carbon nano tube/copper composite material.
Mixing the obtained carbon nano tube/copper composite material with the tin, nickel and tin mixed melt, continuously stirring for 30min, then quickly cooling, and extruding into strips.
Example 2
This example provides a carbon nanotube-reinforced lead-free solder and a method for preparing the same, which is different from the method provided in example 1 in the component ratio of the carbon nanotube-reinforced lead-free solder.
The carbon nanotube reinforced lead-free solder provided by the embodiment comprises the following components in percentage by mass:
example 3
This example provides a carbon nanotube-reinforced lead-free solder and a method for preparing the same, which is different from the method provided in example 1 in the component ratio of the carbon nanotube-reinforced lead-free solder.
The carbon nanotube reinforced lead-free solder provided by the embodiment comprises the following components in percentage by mass:
example 4
This example provides a carbon nanotube-reinforced lead-free solder and a method for preparing the same, which is different from the method provided in example 1 in the component ratio of the carbon nanotube-reinforced lead-free solder.
The carbon nanotube reinforced lead-free solder provided by the embodiment comprises the following components in percentage by mass:
comparative example 1
The carbon nanotube reinforced lead-free solder provided by the embodiments 1-4 of the invention is verified in mechanical property and thermal conductivity.
Set 3 sets of comparative examples, wherein comparative example 1 is Sn-0.7Cu lead-free solder provided by the welding technology institute of guangdong province (black research institute of guangdong province) as a conventional solder. The components of comparative example 1 are 99.3% tin and 0.7% copper, and the comparative example is prepared by melting tin to 400-500 ℃ (about 450 ℃), adding copper to tin solution, stirring uniformly, cooling to 300 ℃, and casting into solder.
Comparative examples 2 to 3 were prepared in the same manner as in example 1 except for the differences in the parameters shown in Table 1.
TABLE 1 Components of comparative examples 2 to 3
| Components | Comparative example 2 | Comparative example 3 |
| Tin (Sn) | 99.22％ | 99％ |
| Copper (Cu) | 0.7％ | 0.7％ |
| Nickel (II) | 0％ | 0.1％ |
| Bismuth (III) | 0％ | 0.2％ |
| Carbon nanotube | 0.08％ | 0％ |
Experimental methods
1. Tensile Strength test
According to the standard GBT 228.1-2010 metal material room temperature tensile test method, a PS-281 servo large-scale tensile testing machine of a company with limited Pengsheng instruments and equipment in Dongguan is adopted to carry out tensile strength and elongation rate tests, lead-free solder samples of comparative examples and examples are prepared into round test bars according to the national standard, and the test results are shown in Table 1.
2. Thermal conductivity test
According to the standard GB/T3651-2008 metal high-temperature thermal conductivity coefficient measuring method, DRJ-II metal high-temperature thermal conductivity coefficient tester of Hunan Tan instruments and meters Limited is adopted, lead-free solder samples of the comparative example and the example are prepared into wire-shaped samples with the size of phi 2 multiplied by 30(mm), thermal conductivity test is carried out under vacuum, and the test results are shown in Table 2.
Results of the experiment
TABLE 2 lead-free solder Performance test
| Tensile strength (MPa) | Elongation (%) | Thermal conductivity W/(m.K) | |
| Comparative example 1 | 38 | 34 | 64 |
| Comparative example 2 | 40 | 36 | 78 |
| Comparative example 3 | 42 | 35 | 65 |
| Example 1 | 48 | 41 | 85 |
| Example 2 | 46 | 35 | 67 |
| Example 3 | 50 | 38 | 75 |
| Example 4 | 43 | 43 | 86 |
As can be seen from Table 2, the carbon nanotube reinforced lead-free solder provided in the embodiments 1 to 4 of the present invention has various performances superior to those of the Sn-0.7Cu solder of the comparative example 1. The brazing filler metal structure can be refined by adding nickel and bismuth, so that the tensile strength of the brazing filler metal is increased; the reinforcing effect of the composite lead-free solder is not obvious when the content of the carbon nano tubes is too low; the elongation and the thermal conductivity of the lead-free solder are improved along with the increase of the carbon nano tubes, because the carbon nano tubes have extremely high elastic modulus and thermal conductivity, the distribution area is increased along with the increase of the content of the carbon nano tubes, and the carbon nano tubes in the composite lead-free solder are connected and staggered, so that the elongation and the thermal conductivity are improved; however, the content of the carbon nanotubes is too high, the strength of the composite lead-free solder is reduced on the contrary, and the composite lead-free solder has adverse effects on the comprehensive performance of the composite material, because the excessive carbon nanotubes begin to agglomerate in the matrix, most of the agglomerated carbon nanotubes are embedded in the grain boundary and often become crack sources, so that cracks are induced to generate, and the tensile strength of the composite lead-free solder is reduced.
In addition, the alloy elements of nickel and bismuth are reduced in comparative example 2 compared with example 1, so that all properties are reduced, and the tensile strength is reduced more, and the carbon nanotubes are reduced in comparative example 3 compared with example 1, so that all properties are reduced, and the thermal conductivity is reduced more.
To sum up, the embodiment of the invention provides a carbon nanotube reinforced lead-free solder, which comprises the following components in percentage by mass: tin: 98.4% -99.3%; copper: 0.5 to 0.7 percent; nickel: 0.05 percent to 0.3 percent; bismuth: 0.05 percent to 0.5 percent; carbon nanotube: 0.01 to 0.1 percent. The carbon nanotube reinforced lead-free solder has the advantages of high thermal conductivity, excellent welding performance and excellent mechanical property, and is particularly suitable for welding a copper water tank of a large radiator.
In addition, the embodiment of the invention also provides a preparation method of the carbon nano tube reinforced lead-free solder, the carbon nano tube reinforced lead-free solder prepared by the preparation method and application of the carbon nano tube reinforced lead-free solder. The preparation method is simple and easy to operate, and is beneficial to industrial production, and the carbon nano tube reinforced lead-free solder obtained by the preparation method has the advantages of high thermal conductivity and excellent welding performance and mechanical property.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (14)
1. The carbon nanotube reinforced lead-free solder is characterized by comprising the following components in percentage by mass: tin: 98.8 to 99.0 percent; copper: 0.6 to 0.7 percent; nickel: 0.08 to 0.2 percent; bismuth: 0.15 to 0.25 percent; carbon nanotube: 0.05 percent to 0.1 percent;
the preparation method of the carbon nano tube reinforced lead-free solder comprises the following steps: mixing and stirring the composite material of the carbon nano tube and the copper powder and the mixed melt of the tin, the nickel and the bismuth at the temperature of 360-400 ℃ for 30-40 min;
the preparation of the mixed melt of tin, nickel and bismuth comprises the following steps: mixing the tin and nickel mixed melt with bismuth, and stirring and mixing and melting at 360-400 ℃ for 25-35 min;
the preparation of the mixed melt of tin and nickel comprises the following steps: mixing and stirring nickel and molten tin at 400-500 ℃, wherein the melting temperature of the tin is 400-500 ℃, and the melting time is 10-15 min.
2. The carbon nanotube-reinforced lead-free solder according to claim 1, wherein the carbon nanotube-reinforced lead-free solder has a tensile strength of 43MPa or more, an elongation of 35% or more, and a thermal conductivity of 67W/(m.K) or more.
3. The carbon nanotube-reinforced lead-free solder according to claim 1, wherein the carbon nanotubes are single-walled carbon nanotubes.
4. The carbon nanotube-reinforced lead-free solder according to claim 3, wherein the carbon nanotubes are single-walled carbon nanotubes subjected to acidification, ultrasound and drying treatment.
5. The carbon nanotube-reinforced lead-free solder according to claim 3, wherein the purity of tin is not less than 99.99%.
6. The carbon nanotube-reinforced lead-free solder according to claim 3, wherein the purity of the copper powder is not less than 99.99%, and the particle size of the copper powder is 100-200 meshes.
7. The carbon nanotube-reinforced lead-free solder according to claim 3, wherein the nickel is foamed nickel having a purity of not less than 99.99%.
8. The carbon nanotube-reinforced lead-free solder according to claim 3, wherein the purity of bismuth is not less than 99.99%.
9. A preparation method of a carbon nanotube reinforced lead-free solder is characterized by comprising the steps of preparing the components in the carbon nanotube reinforced lead-free solder according to any one of claims 1 to 8 and mass percent of the components;
the preparation method comprises the following steps: mixing and stirring the composite material of the carbon nano tube and the copper powder and the mixed melt of the tin, the nickel and the bismuth at the temperature of 360-400 ℃ for 30-40 min;
the preparation of the mixed melt of tin, nickel and bismuth comprises the following steps: mixing the tin and nickel mixed melt with bismuth, and stirring and mixing and melting at 360-400 ℃ for 25-35 min;
the preparation of the mixed melt of tin and nickel comprises the following steps: mixing and stirring nickel and molten tin at 400-500 ℃, wherein the melting temperature of the tin is 400-500 ℃, and the melting time is 10-15 min.
10. The method for preparing the carbon nanotube-reinforced lead-free solder according to claim 9, wherein the preparation of the composite material of the carbon nanotube and the copper powder comprises: and ball-milling the mixture of the copper powder and the carbon nano tubes under the protection of inert gas.
11. The method for preparing the carbon nanotube reinforced lead-free solder according to claim 10, wherein the ball-milling has a ball-to-material ratio of 10: (1-2).
12. The preparation method of the carbon nanotube reinforced lead-free solder according to claim 10, wherein the rotation speed of the ball mill is 400-600 r/min.
13. The preparation method of the carbon nanotube reinforced lead-free solder according to claim 10, wherein the ball milling time is 2-10 h.
14. The use of the carbon nanotube-reinforced lead-free solder according to any one of claims 1 to 8 for welding a high-power copper water tank radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910710360.3A CN110315238B (en) | 2019-07-31 | 2019-07-31 | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910710360.3A CN110315238B (en) | 2019-07-31 | 2019-07-31 | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110315238A CN110315238A (en) | 2019-10-11 |
| CN110315238B true CN110315238B (en) | 2021-09-17 |
Family
ID=68125315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910710360.3A Active CN110315238B (en) | 2019-07-31 | 2019-07-31 | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110315238B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560768B (en) * | 2021-07-29 | 2023-06-23 | 南昌航空大学 | Foam metal reinforced lead-free solder and preparation method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101224524A (en) * | 2007-01-18 | 2008-07-23 | 浙江亚通焊材有限公司 | Lead-free solder |
| CN101653877B (en) * | 2009-08-25 | 2011-08-10 | 深圳市亿铖达工业有限公司 | Nano-enhanced leadless solder and preparation method thereof |
| KR101200026B1 (en) * | 2010-04-27 | 2012-11-09 | 한국생산기술연구원 | Carbon Nanotube Mixed Solder Ball And Carbon Nanotube Mixed Solder Paste Using The Same |
| CN104395035B (en) * | 2013-05-29 | 2017-10-20 | 新日铁住金高新材料株式会社 | Solder ball and electronic component |
| AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| KR101654523B1 (en) * | 2014-08-29 | 2016-09-07 | 한국기계연구원 | Hybrid Composite Solder Alloys and Their Fabrication Methods |
| CN104741820A (en) * | 2015-03-24 | 2015-07-01 | 东莞市成飞焊接材料有限公司 | Lead-free brazing filler metal |
| CN104858564A (en) * | 2015-06-01 | 2015-08-26 | 谷华 | Soldering tin capable of not dissolving copper |
| CN106363315B (en) * | 2016-10-26 | 2019-05-21 | 亿铖达焊锡制造（昆山）有限公司 | A kind of tin plating carbon nanomaterial enhancing combined solder alloy and its soldering paste |
-
2019
- 2019-07-31 CN CN201910710360.3A patent/CN110315238B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110315238A (en) | 2019-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111349810B (en) | Graphene/copper composite wire and preparation method thereof | |
| CN109371266B (en) | Production method of high-strength corrosion-resistant weldable Al-Mg-Si series alloy extrusion material | |
| CN106057273A (en) | High strength heat resistant aluminum alloy wire | |
| CN111411247A (en) | Composite treatment method for regenerated wrought aluminum alloy melt | |
| CN110066942A (en) | A kind of ultra-high-strength/tenacity combarloy nickeltin and preparation method thereof | |
| CN112359244B (en) | High-strength high-conductivity graphene copper composite wire and preparation method thereof | |
| CN110315238B (en) | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof | |
| CN106834793A (en) | Add high intensity dispersion-strengthened Cu of cerium and preparation method thereof | |
| CN112680639A (en) | High-conductivity heat-resistant rare earth aluminum alloy wire and preparation method thereof | |
| CN107419131A (en) | A kind of Cu-base composites for locomotive conductive parts and preparation method thereof | |
| CN113005320B (en) | Method for preparing carbon nanotube/copper composite material through interface regulation | |
| CN105506406A (en) | High-conductivity aluminum alloy wire and preparing method thereof | |
| CN111304489B (en) | Preparation and processing method of copper alloy plate strip for vapor chamber | |
| CN112410597B (en) | Preparation method of nano WC dispersion strengthened copper | |
| CN113977133A (en) | Corrosion-resistant composite brazing filler metal for copper-aluminum transition wire clamp and preparation method thereof | |
| CN106148752A (en) | A kind of strain insulator splicing fitting aluminum carbon composite and preparation method thereof | |
| CN113528896B (en) | Nano carbon-aluminum composite heat conduction material and application thereof in preparation of high-power LED light source radiator | |
| CN113308622B (en) | High-strength high-conductivity copper-nickel-silicon alloy material and preparation method thereof | |
| CN115780801A (en) | Preparation method of ball-milled carbon nanotube modified aluminum-based composite material at high temperature | |
| CN105400191B (en) | A kind of high heat conduction nylon-graphite-low-melting-point metal composite material and preparation method thereof | |
| CN113996968A (en) | Exothermic welding flux based on copper-iron alloy | |
| CN108425031B (en) | A kind of Cu-Fe-C system alloy and preparation method thereof | |
| CN116913614B (en) | Graphene aluminum alloy conductive wire and cold rolling preparation method thereof | |
| CN114700649B (en) | Zinc-aluminum brazing filler metal with strong conductivity and high strength for copper-aluminum brazing connection brazing seam | |
| CN111575557B (en) | High-conductivity aluminum alloy and heat treatment process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 510000, compound 363, Changxin Road, Guangzhou, Guangdong, Tianhe District Applicant after: China Uzbekistan Welding Research Institute, Guangdong Academy of Sciences Address before: 510000, compound 363, Changxin Road, Guangzhou, Guangdong, Tianhe District Applicant before: Guangdong Welding Institute (China-Ukraine E.O. Paton Institute of Welding) |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |