CN111668321A - Packaging structure and method of biological identification fingerprint chip - Google Patents
Packaging structure and method of biological identification fingerprint chip Download PDFInfo
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- CN111668321A CN111668321A CN202010587982.4A CN202010587982A CN111668321A CN 111668321 A CN111668321 A CN 111668321A CN 202010587982 A CN202010587982 A CN 202010587982A CN 111668321 A CN111668321 A CN 111668321A
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 239000011368 organic material Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a packaging structure and a packaging method of a biological identification fingerprint chip, wherein the packaging structure comprises the following components: the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface of the fingerprint identification chip is provided with a plurality of pixel points for collecting fingerprint information; the fingerprint identification chip comprises a first light-transmitting layer formed on the front surface of the fingerprint identification chip, wherein a shading groove is formed in the first light-transmitting layer, the shading groove is enclosed into a plurality of light-transmitting areas, and each light-transmitting area corresponds to one pixel point; and the shading layer at least covers the surface of the side wall of the shading groove. The shading layer is arranged around the pixel point, so that oblique light can be blocked and absorbed, and the interference of the oblique light on image forming is filtered; on the other hand, by forming the light shielding hole in the light transmitting layer and forming the light shielding layer, the thickness is small and the manufacturing cost is low.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a biological fingerprint identification chip packaging structure and a biological fingerprint identification chip packaging method.
Background
With the continuous progress of science and technology, more and more electronic devices are widely applied to the daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present. With the increasing functions of electronic devices, the electronic devices store more and more important information, and the authentication technology of electronic devices becomes a main direction for the research and development of electronic devices.
The fingerprint has uniqueness and invariance, so that the fingerprint identification technology has the advantages of good safety, high reliability, simplicity in use and the like. Therefore, fingerprint identification technology is the mainstream technology for authentication of various electronic devices.
At present, an optical fingerprint identification chip is one of fingerprint identification chips commonly used in existing electronic devices, and collects fingerprint information of a user through a large number of photosensitive pixels (pixels) in a fingerprint identification area, and each photosensitive pixel is used as a detection. Specifically, when fingerprint identification is carried out, light irradiates to the fingerprint surface of a user and is reflected to photosensitive pixels through the fingerprint surface, the photosensitive pixels convert optical signals of fingerprints into electric signals, and fingerprint information can be acquired according to the electric signals converted by all the pixels.
When the existing optical fingerprint identification chip is packaged, a transparent cover plate is generally directly arranged on the photosensitive side. However, the transparent cover plate is completely transparent, which may cause crosstalk in the sensing results of different photosensitive pixels, and affect the fingerprint identification accuracy.
To solve the technical problem, chinese patent application CN111192931A discloses a method for packaging a fingerprint identification chip, in which a cover plate having a through hole structure is fixed on a side of a wafer facing a pixel point to avoid the crosstalk problem. The problems that exist at least include: the cover plate made of silicon is used as the shading layer, so that the thickness is large and the manufacturing cost is high.
Disclosure of Invention
An embodiment of the present invention provides a package structure and a method for a fingerprint identification chip, which are used to solve the technical problems of large thickness and high manufacturing cost in the prior art, and include:
a package structure of a biometric fingerprint chip comprises:
the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface of the fingerprint identification chip is provided with a plurality of pixel points for collecting fingerprint information;
the fingerprint identification chip comprises a first light-transmitting layer formed on the front surface of the fingerprint identification chip, wherein a shading groove is formed in the first light-transmitting layer, the shading groove is enclosed into a plurality of light-transmitting areas, and each light-transmitting area corresponds to one pixel point;
and the shading layer at least covers the surface of the side wall of the shading groove.
In an embodiment, the light-transmitting region is a transparent cylinder or a cylindrical cavity, and when the light-transmitting region is a cylindrical cavity, the light-shielding layer is formed on the sidewall of the cavity (the bottom surface is not paved so that light can be directly incident on the pixel).
In one embodiment, the shading layer covers the bottom surface of the shading groove.
In one embodiment, the light shielding layer extends from the sidewall of the light shielding groove to the top surface of the first light transmissive layer.
In an embodiment, the shading groove includes a plurality of circular grooves, and each pixel point corresponds to the bottom of an area surrounded by one of the grooves.
In another embodiment, the transparent region is a cylindrical cavity, and the light-shielding layer is formed on the sidewall of the cavity (the bottom surface is not laid to facilitate the light to directly irradiate the pixel).
In one embodiment, the light shielding layer is made of black glue.
In one embodiment, the display device further comprises a second light-transmitting layer covering the light-shielding groove and the light-transmitting area.
In one embodiment, the display device further comprises a condensing lens formed on the surface of the second light-transmitting layer,
and each condensing lens corresponds to one pixel point respectively.
In one embodiment, the first light-transmitting layer and/or the second light-transmitting layer is selected from a dry film, inorganic glass or organic glass.
In one embodiment, the fingerprint identification chip further comprises an optical filter formed between the front surface of the fingerprint identification chip and the first light-transmitting layer.
A packaging method of a biological identification fingerprint chip comprises the following steps:
providing a wafer, wherein the wafer is provided with a plurality of fingerprint identification chips, the fingerprint identification chips are provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
manufacturing a first euphotic layer on the front side of the fingerprint identification chip;
manufacturing a shading groove on the first light-transmitting layer, wherein the shading groove is surrounded into a plurality of light-transmitting areas, and each light-transmitting area corresponds to one pixel point;
forming a light shielding layer on at least the surface of the side wall of the light shielding groove;
and cutting the wafer through a cutting process to form a plurality of single-grain packaging structures.
Compared with the prior art, the shading layer is arranged around the pixel points, so that oblique light can be blocked and absorbed, and the interference of the oblique light on image forming is filtered; on the other hand, by forming the light shielding hole in the light transmitting layer and forming the light shielding layer, the thickness is small and the manufacturing cost is low.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a sectional view of a package structure in embodiment 1 of the present application;
fig. 2 to 9 are schematic views of intermediate structures formed by the package structure in embodiment 1 of the present application.
Detailed Description
The present invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which can be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed embodiment.
The present embodiment provides a package structure 10, and referring to fig. 1, the package structure 10 includes a fingerprint identification chip 11 and a cover plate 12.
The fingerprint identification chip 11 has a front surface 111 and a back surface 112 opposite to each other, and the front surface has a plurality of pixel points 113 for collecting fingerprint information.
The cover 12 covers the front surface 111 of the fingerprint recognition chip 11. The front surface 111 includes a sensing area and a non-sensing area surrounding the sensing area. Wherein, the pixel point 113 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel 113, and the pad is used for electrically connecting to an external circuit.
In one embodiment, the cover plate 12 includes a filter layer 121 and a first transparent layer 122 sequentially covering the front surface 111 of the fingerprint identification chip.
The filter layer 121 is used to filter stray light outside the detection light band, so as to reduce stray light interference and improve fingerprint identification accuracy.
The filter layer 121 may cover only the upper portions corresponding to the pixel points 113, or may cover the entire front surface 111 of the fingerprint identification chip 11. However, in order to facilitate the fabrication of the first transparent layer 122 and ensure the flatness thereof, the filter layer 121 preferably covers the entire front surface 111 of the fingerprint identification chip 11.
In one embodiment, the filter layer 121 and the first transparent layer 122 are fixed by bonding through a DAF film. The first transparent layers 122 and the front surface 111 of the fingerprint identification chip 11 are fixed by adhesive.
The first light-transmitting layer 122 covers the front surface 111 of the fingerprint identification chip 11, and is used for protecting the front surface of the fingerprint identification chip 11 to be packaged. Since the light is required to reach the pixel 113 through the first transparent layer 122, the first transparent layer 122 has a higher light transmittance and is a transparent material. The two surfaces of the first transparent layer 122 are flat and smooth, and do not scatter or diffuse the incident light.
Specifically, the material of the first light-transmitting layer 122 may be a dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength, and the transmittance needs to be more than 92%.
In this embodiment, the thickness of the first light-transmitting layer 122 is preferably 5 to 20 μm in consideration of both the optical properties and the adhesive properties of the first light-transmitting layer 122.
In this embodiment, the filter layer 121 is optional, and in an embodiment, the filter layer may not be provided.
In order to realize that the received light of the pixel 113 can only be direct light, ensure the image definition, and filter the interference of oblique light on the image formation, a light shielding groove 123 is formed on the first light transmitting layer 122, the light shielding groove 123 surrounds a plurality of light transmitting areas 124, each light transmitting area 124 corresponds to one pixel 113, and a light shielding layer 125 for shielding the oblique light covers the side wall surface of the light shielding groove 123.
In a direction perpendicular to the front surface 111, a projection of the light-transmitting region 124 on the front surface 111 at least partially overlaps a projection of the corresponding pixel 113 on the front surface 111. In order to ensure the accuracy of fingerprint identification, the projection of the transparent area 124 on the front surface 111 may be set to completely cover the projection of the corresponding pixel 113 on the front surface 111. Optimally, the projection of the transparent region 124 on the front surface 111 and the projection of the corresponding pixel 113 on the front surface 111 can be set to completely coincide.
In order to facilitate the one-step molding of the light shielding layer 125 and to achieve the complete light shielding effect, the light shielding layer 125 is filled in the light shielding groove 123 and covers the bottom thereof. In an embodiment, the light-shielding layer 125 may further extend from the sidewall of the light-shielding groove 123 to the top surface of the first light-transmitting layer 122
The light shielding groove 123 includes a plurality of circular grooves, each circular groove encloses a light transmitting area 124, each light transmitting area 124 is formed by a transparent cylinder, and each pixel 113 corresponds to the bottom of one cylinder.
The light-shielding layer 122 is made of a black light-shielding material, preferably BKL black glue.
The light-shielding groove 123 may penetrate through the first light-transmitting layer 122 vertically, or may be recessed in a side surface (an upper surface or a lower surface) of the first light-transmitting layer 122, when the light-shielding groove 123 is recessed in the lower surface (for penetration) of the first light-transmitting layer, the light-shielding layer needs to be pre-fabricated on the first light-transmitting layer, and then the first light-transmitting layer and the light-shielding layer are integrally fabricated on the front surface of the chip.
In one aspect of the scheme, the shading layer 125 is arranged around the pixel point, so that oblique light can be blocked and absorbed, and the interference of the oblique light on image forming is filtered; on the other hand, the light-shielding holes are formed in the light-transmitting layer, and the light-shielding layer is formed, so that the light-transmitting layer is thin and low in cost.
In one embodiment, the fingerprint identification chip 11 is a capacitive fingerprint identification chip or an optical fingerprint identification chip.
If fingerprint identification chip 11 is the fingerprint identification chip of electric capacity type, when carrying out fingerprint identification, 113 detection capacitance values of pixel point convert the capacitance value into the signal of telecommunication, and external circuit can acquire fingerprint information according to this signal of telecommunication, carries out identity identification, and light-transmitting zone 124 is used for exposing the pixel point, light shield layer 125 has lower dielectric constant, can reduce the problem of crosstalking between the adjacent pixel point, has improved fingerprint identification's accuracy.
If the fingerprint identification chip 11 is an optical fingerprint identification chip, when fingerprint identification is performed, the pixel 113 collects fingerprint information of a preset collection area corresponding to the light-transmitting area 124 through the corresponding light-transmitting area 124. Because each pixel point 113 collects fingerprint information of the corresponding collection area of the pixel point through the corresponding light-transmitting area 124, mutual crosstalk between corresponding preset areas of different pixel points is avoided, distortion of fingerprint images is further avoided, and accuracy of fingerprint identification is further improved.
The shape of the light-transmitting region 124 may be circular or square or triangular. Specifically, the shape of the light-transmitting region 124 may be a circular cylinder with the same top and bottom, a square cylinder with the same top and bottom, a triangular cylinder with the same top and bottom, or a polygonal cylinder with the same top and bottom in other structures.
It is easy to think that the shape of the light-transmitting area 124 can be a circular cylinder with different top and bottom, a square cylinder with different top and bottom, a triangular cylinder with different top and bottom, or a polygonal cylinder with different top and bottom.
In an embodiment, the light-shielding groove 123 and the light-transmitting region 124 are further covered with a second light-transmitting layer 126 for shielding an opening of the light-shielding groove 123, and when the light-shielding layer extends to an upper surface of the first light-transmitting layer 126, the second light-transmitting layer 126 can also squeeze the light-shielding layer to prevent the light-shielding layer from being separated from the surface of the first light-transmitting layer. Since the light is required to reach the pixel 113 through the second transparent layer 126, the second transparent layer 126 has a higher light transmittance and is a transparent material. The two surfaces of the second transparent layer 126 are flat and smooth, and do not scatter or diffuse incident light.
Specifically, the material of the second light-transmitting layer 126 may be a dry film, inorganic glass, organic glass, or other light-transmitting material with a specific strength, and the transmittance needs to be more than 92%.
In this embodiment, the thickness of the second light-transmitting layer 126 is preferably 5 to 20 μm in consideration of the optical property and the adhesive property of the second light-transmitting layer 126.
In one embodiment, the second transparent layer 126 and the first transparent layer 122 are fixed by an adhesive.
The side of the second light-transmitting layer 126 away from the front surface 111 of the fingerprint identification chip 11 is provided with a plurality of condensing lenses 127, each condensing lens 127 corresponds to one light-transmitting area, and the condensing lenses 127 are used for condensing external light to the surface of the corresponding pixel points 113.
In one embodiment, the condenser lens 127 may be formed by photolithography and baking, and in another embodiment, the condenser lens 127 may also be formed on the surface of the second transparent layer 126 by stamping.
Correspondingly, the embodiment of the invention provides a packaging method for forming the packaging structure shown in fig. 1. Fig. 2 to 9 are schematic diagrams of intermediate structures formed in a packaging process of a packaging method according to an embodiment of the invention.
Step s 1: referring to fig. 2 and 3, a wafer 100 to be packaged is provided, wherein fig. 2 is a schematic top view of the wafer 100 to be packaged, and fig. 3 is a cross-sectional view taken along a-a in fig. 2.
The wafer 100 to be packaged has a front side 111 and a back side 112 opposite to the front side 111. The wafer 100 includes a plurality of fingerprint identification chips 11 arranged in an array. Each adjacent fingerprint identification chip 11 has a plurality of pixel points 13 for collecting fingerprint information. The pixel 13 is located on the front side 111. The adjacent fingerprint identification chips 11 have a cutting channel 120 therebetween to facilitate a cutting process in a subsequent cutting process.
The first surface 111 includes a sensing region and a non-sensing region surrounding the sensing region, the pixel 113 is disposed in the sensing region, and a pad (not shown) is disposed in the non-sensing region and electrically connected to the pixel 113, and the pad is used for electrically connecting to an external circuit.
It should be noted that the cutting channel 120 between two adjacent fingerprint identification chips 11 is only a margin area reserved between two fingerprint identification chips 11 for cutting, and there is no actual boundary line between the cutting channel 120 and the fingerprint identification chips 11 on both sides.
Step s 2: referring to fig. 4, the front surface 111 of the wafer 100 to be packaged is covered with a filter layer 121. In this step, the filter layer 121 is fixed on the surface of the wafer 100 to be packaged by adhesive.
Step s 3: referring to fig. 5, the first light-transmitting layer 122 covers a surface of the filter layer 121.
Step s 4: referring to fig. 6, a light-shielding groove 123 is formed on the first light-transmitting layer 122 by photolithography using a high-transmittance material, the light-shielding groove 123 encloses a plurality of light-transmitting regions of a cylindrical body, and each light-transmitting region corresponds to one pixel 113.
Step s 5: referring to fig. 7, a light-shielding layer 125 is formed on the bottom and the sidewall of the light-shielding groove 123, and the light-shielding layer 125 is a black organic material with no or low light transmittance, such as black glue. The black organic material is a photosensitive material, which can be patterned by a photolithography process. Specifically, the method of forming the light-shielding layer 125 includes: forming a black photosensitive organic material layer on the bottom surface and the sidewall of the light-shielding groove 123 and the top surface of the first light-transmitting layer by spin coating, spray coating or pasting; according to the positive and negative developing characteristics of the black photosensitive organic material, exposing the area of the black photosensitive organic material layer where the light-transmitting window (light-transmitting area 124) is to be formed, or exposing the area outside the window to be formed; and finally, baking the black photosensitive organic material layer for hardening, so as to enhance the mechanical strength of the black photosensitive organic material layer and the adhesion with the first light-transmitting layer. In some embodiments, the thickness of the black photosensitive organic material is 10 μm to 50 μm, and preferably, may be 15 μm, 20 μm, or the like.
Step s 6: referring to fig. 8, a second light transmitting layer 126 is covered over the first light transmitting layer 122. In this step, the second light-transmitting layer 126 is fixed on the surface of the first light-transmitting layer 122 by an adhesive.
Step s 7: referring to fig. 9, a plurality of condensing lenses 127 are formed on the surface of the second transparent layer 126, and each condensing lens 127 corresponds to one pixel 113.
Step s 8: the wafer 100, the filter layer 121, the first transparent layer 122, and the second transparent layer 126 are cut by a cutting process, and when the wafer is cut, the wafer is cut along the direction of the cutting channels 120, so as to form a plurality of package structures 10 of the fingerprint identification chip 11. The cutting can be performed by a slicing knife or a laser cutting, and the slicing knife can be performed by a metal knife or a resin knife.
In the whole packaging process, the processes of wafer thinning, bonding pad manufacturing, wiring layer manufacturing and the like can be included, and the scheme is not repeated.
In addition, after the wafer to be packaged is packaged, the chip package structure obtained by subsequent cutting can be connected with an external circuit through an external bump (not shown).
The aspects, embodiments, features and examples of the present invention should be considered as illustrative in all respects and not intended to be limiting of the invention, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
The use of headings and sections in this application is not meant to limit the invention; each section may apply to any aspect, embodiment, or feature of the disclosure.
Throughout this application, where a composition is described as having, containing, or comprising specific components or where a process is described as having, containing, or comprising specific process steps, it is contemplated that the composition of the present teachings also consist essentially of, or consist of, the recited components, and the process of the present teachings also consist essentially of, or consist of, the recited process steps.
In this application, where an element or component is referred to as being included in and/or selected from a list of recited elements or components, it is understood that the element or component can be any one of the recited elements or components and can be selected from a group consisting of two or more of the recited elements or components. Moreover, it should be understood that elements and/or features of the compositions, apparatus, or methods described herein may be combined in various ways, whether explicitly described or implicitly described herein, without departing from the spirit and scope of the present teachings.
Unless specifically stated otherwise, use of the terms "comprising", "including", "having" or "having" is generally to be understood as open-ended and not limiting.
The use of the singular herein includes the plural (and vice versa) unless specifically stated otherwise. Furthermore, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. In addition, where the term "about" is used before a quantity, the present teachings also include the particular quantity itself unless specifically stated otherwise.
It should be understood that the order of steps or the order in which particular actions are performed is not critical, so long as the teachings of the invention remain operable. Further, two or more steps or actions may be performed simultaneously.
It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, other elements. However, those skilled in the art will recognize that these and other elements may be desirable. However, because such elements are well known in the art, and because they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein. It should be understood that the figures are presented for illustrative purposes and not as construction diagrams. The omission of details and modifications or alternative embodiments is within the scope of one skilled in the art.
It is to be understood that in certain aspects of the invention, a single component may be replaced by multiple components and that multiple components may be replaced by a single component to provide an element or structure or to perform a given function or functions. Except where such substitution would not operate to practice a particular embodiment of the invention, such substitution is considered within the scope of the invention.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Claims (10)
1. A packaging structure of a biological identification fingerprint chip is characterized by comprising:
the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface of the fingerprint identification chip is provided with a plurality of pixel points for collecting fingerprint information;
the fingerprint identification chip comprises a first light-transmitting layer formed on the front surface of the fingerprint identification chip, wherein a shading groove is formed in the first light-transmitting layer, the shading groove is enclosed into a plurality of light-transmitting areas, and each light-transmitting area corresponds to one pixel point;
and the shading layer at least covers the surface of the side wall of the shading groove.
2. The package structure of claim 1, wherein the light shielding layer covers a bottom surface of the light shielding groove.
3. The package structure of claim 1, wherein the light shielding layer extends from a sidewall of the light shielding groove to a top surface of the first light transmissive layer.
4. The package structure of claim 1, wherein the light-shielding groove comprises a plurality of circular grooves, and each pixel point corresponds to a bottom of a region surrounded by one of the grooves.
5. The package structure of claim 1, wherein the light shielding layer is made of black glue.
6. The package structure of claim 1, further comprising a second transparent layer covering the light-shielding groove and the transparent region.
7. The package structure of biometric fingerprint chip according to claim 6, further comprising a condensing lens formed on the surface of the second transparent layer,
and each condensing lens corresponds to one pixel point respectively.
8. The package structure of claim 6, wherein the first light-transmitting layer and/or the second light-transmitting layer is selected from a dry film, inorganic glass, and organic glass.
9. The package structure of claim 1, further comprising a filter formed between the front surface of the fingerprint identification chip and the first transparent layer.
10. A packaging method of a biological identification fingerprint chip is characterized by comprising the following steps:
providing a wafer, wherein the wafer is provided with a plurality of fingerprint identification chips, the fingerprint identification chips are provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
manufacturing a first euphotic layer on the front side of the fingerprint identification chip;
manufacturing a shading groove on the first light-transmitting layer, wherein the shading groove is surrounded into a plurality of light-transmitting areas, and each light-transmitting area corresponds to one pixel point;
forming a light shielding layer on at least the surface of the side wall of the light shielding groove;
and cutting the wafer through a cutting process to form a plurality of single-grain packaging structures.
Priority Applications (2)
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| CN202010587982.4A CN111668321A (en) | 2020-06-24 | 2020-06-24 | Packaging structure and method of biological identification fingerprint chip |
| PCT/CN2020/120862 WO2021258581A1 (en) | 2020-06-24 | 2020-10-14 | Packaging structure and method for biological identification fingerprint chip |
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| CN202010587982.4A CN111668321A (en) | 2020-06-24 | 2020-06-24 | Packaging structure and method of biological identification fingerprint chip |
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| CN111668321A true CN111668321A (en) | 2020-09-15 |
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| CN202010587982.4A Pending CN111668321A (en) | 2020-06-24 | 2020-06-24 | Packaging structure and method of biological identification fingerprint chip |
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| CN (1) | CN111668321A (en) |
| WO (1) | WO2021258581A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112215152A (en) * | 2020-10-13 | 2021-01-12 | 业泓科技(成都)有限公司 | Display device with fingerprint identification module |
| WO2021258581A1 (en) * | 2020-06-24 | 2021-12-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method for biological identification fingerprint chip |
| US20220188536A1 (en) * | 2020-12-11 | 2022-06-16 | Samsung Display Co., Ltd. | Display device including detection sensor and method of manufacturing the detection sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117423715B (en) * | 2023-12-19 | 2024-04-12 | 华天科技（昆山）电子有限公司 | Preparation method of wafer-level optical chip packaging structure and packaging structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3063564B1 (en) * | 2017-03-06 | 2021-05-28 | Isorg | INTEGRATED FINGERPRINT SENSOR IN A DISPLAY SCREEN |
| CN208298199U (en) * | 2017-12-18 | 2018-12-28 | 深圳市为通博科技有限责任公司 | Optical path modulator, image recognition sensor and electronic equipment |
| CN110580473A (en) * | 2019-09-23 | 2019-12-17 | 上海思立微电子科技有限公司 | Fingerprint identification subassembly, display module and electronic equipment |
| CN111192931A (en) * | 2020-03-19 | 2020-05-22 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method of fingerprint identification chip |
| CN111668321A (en) * | 2020-06-24 | 2020-09-15 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method of biological identification fingerprint chip |
-
2020
- 2020-06-24 CN CN202010587982.4A patent/CN111668321A/en active Pending
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021258581A1 (en) * | 2020-06-24 | 2021-12-30 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method for biological identification fingerprint chip |
| CN112215152A (en) * | 2020-10-13 | 2021-01-12 | 业泓科技(成都)有限公司 | Display device with fingerprint identification module |
| CN112215152B (en) * | 2020-10-13 | 2023-10-03 | 业泓科技(成都)有限公司 | Display device with fingerprint identification module |
| US20220188536A1 (en) * | 2020-12-11 | 2022-06-16 | Samsung Display Co., Ltd. | Display device including detection sensor and method of manufacturing the detection sensor |
| US12014565B2 (en) * | 2020-12-11 | 2024-06-18 | Samsung Display Co., Ltd. | Display device including detection sensor and method of manufacturing the detection sensor |
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| WO2021258581A1 (en) | 2021-12-30 |
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