CN107910344B - Packaging structure and packaging method of optical fingerprint identification chip - Google Patents

Packaging structure and packaging method of optical fingerprint identification chip Download PDF

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Publication number
CN107910344B
CN107910344B CN201711364625.6A CN201711364625A CN107910344B CN 107910344 B CN107910344 B CN 107910344B CN 201711364625 A CN201711364625 A CN 201711364625A CN 107910344 B CN107910344 B CN 107910344B
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fingerprint identification
substrate
optical fingerprint
identification chip
hole
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CN107910344A (en
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王之奇
谢国梁
胡汉青
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China Wafer Level CSP Co Ltd
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China Wafer Level CSP Co Ltd
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Priority to US16/210,989 priority patent/US10817700B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1463—Pixel isolation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention discloses a packaging structure and a packaging method of an optical fingerprint identification chip, wherein a cover plate is arranged on the front surface of the optical fingerprint identification chip, the substrate comprises a substrate and a light shielding layer, the light shielding layer is arranged on the surface of one side of the substrate, which is far away from the optical fingerprint identification chip, the substrate is provided with a plurality of first through holes used for exposing photosensitive pixels of the optical fingerprint identification chip, the light shielding layer is provided with second through holes corresponding to the first through holes one by one, and when fingerprint identification is carried out, light rays reflected by a finger can be partitioned through the first through holes and the second through holes corresponding to one by one, so that crosstalk generated by sensing results of different photosensitive pixels is reduced, and the fingerprint identification precision is improved.

Description

Packaging structure and packaging method of optical fingerprint identification chip
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging structure and a packaging method of an optical fingerprint identification chip.
Background
With the continuous progress of science and technology, more and more electronic devices are widely applied to the daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present. With the increasing functions of electronic devices, the electronic devices store more and more important information, and the authentication technology of electronic devices becomes a main direction for the research and development of electronic devices.
The fingerprint has uniqueness and invariance, so that the fingerprint identification technology has the advantages of good safety, high reliability, simplicity in use and the like. Therefore, fingerprint identification technology is the mainstream technology for authentication of various electronic devices.
At present, an optical fingerprint identification chip is one of fingerprint identification chips commonly used in existing electronic devices, and collects fingerprint information of a user through a large number of photosensitive pixels (pixels) in a fingerprint identification area, and each photosensitive pixel is used as a detection. Specifically, when fingerprint identification is carried out, light irradiates to the fingerprint surface of a user and is reflected to photosensitive pixels through the fingerprint surface, the photosensitive pixels convert optical signals of fingerprints into electric signals, and fingerprint information can be acquired according to the electric signals converted by all the pixels.
When the existing optical fingerprint identification chip is packaged, a transparent cover plate is generally directly arranged on the photosensitive side. However, the transparent cover plate is completely transparent, which may cause crosstalk in the sensing results of different photosensitive pixels, and affect the fingerprint identification accuracy.
Disclosure of Invention
In order to solve the above problems, the technical solution of the present invention provides a package structure and a package method for an optical fingerprint identification chip, which solve the problem of crosstalk generated by sensing results of different photosensitive pixels and improve the accuracy of fingerprint identification.
In order to achieve the above purpose, the invention provides the following technical scheme:
an optical fingerprint identification chip package structure, the package structure comprising:
the optical fingerprint identification chip is provided with a front surface and a back surface which are opposite, the front surface is provided with a fingerprint identification area and a peripheral area which surrounds the fingerprint identification area, the fingerprint identification area is provided with a plurality of photosensitive pixels, and the peripheral area is provided with a welding pad which is electrically connected with the photosensitive pixels;
the cover plate is arranged opposite to the front surface of the optical fingerprint identification chip;
the cover plate comprises a substrate and a shading layer; the substrate is provided with a plurality of first through holes for exposing the photosensitive pixels; the light shielding layer is located on one side, away from the optical fingerprint identification chip, of the substrate, and the light shielding layer is provided with a plurality of second through holes which are one-to-one opposite to the first through holes.
Preferably, in the above package structure, a preset distance is provided between the cover plate and the optical fingerprint identification chip, and is used for adjusting an image distance of the cover plate for small-hole imaging.
Preferably, in the above package structure, an optical filter glass is disposed between the cover plate and the optical fingerprint identification chip, and is configured to filter stray light outside a detection light band.
Preferably, in the above package structure, a surface of one side of the cover plate facing away from the optical fingerprint identification chip is provided with filter glass for filtering out stray light outside the detection light band.
Preferably, in the above package structure, a spacer having a predetermined thickness is disposed between the periphery of the cover plate and the periphery of the optical fingerprint identification chip.
Preferably, in the package structure, a first opening for exposing the pad is formed in a position of the substrate corresponding to the pad;
the position of the light shielding layer corresponding to the first opening is provided with a second opening used for exposing the first opening;
the welding pad is used for being electrically connected with a metal wire through the first opening and the second opening so as to be electrically connected with a welding pad of a backboard through the metal wire.
Preferably, in the package structure, the first opening includes a first groove and a second groove located in the first groove, and the first groove and the second groove are used for exposing the pad.
Preferably, in the package structure, a through silicon via is formed in a position, corresponding to the pad, of the back surface of the optical fingerprint identification chip, and the through silicon via is used for exposing the pad;
the side wall of the silicon through hole and the back surface of the optical fingerprint identification chip are covered with insulating layers;
the surface of the insulating layer is covered with a rewiring layer, and the rewiring layer is electrically connected with the welding pad through the silicon through hole and extends to the outside of the silicon through hole;
the rewiring layer is covered with a solder mask, an opening is formed in an area, opposite to the back face of the optical fingerprint identification chip, of the solder mask, and the opening is used for arranging a welding protrusion so as to be electrically connected with a welding pad of a back plate through the welding protrusion.
Preferably, in the above package structure, the substrate is a silicon substrate.
Preferably, in the above package structure, the light shielding layer is a dry film or a wet film.
Preferably, in the above package structure, an aspect ratio of the first through hole is not greater than 6: 1.
Preferably, in the above package structure, an aspect ratio of the second through hole is not greater than 6: 1.
Preferably, in the above package structure, the substrate has a thickness of not more than 200 μm.
Preferably, in the above package structure, the light-shielding layer has a thickness of not more than 200 μm.
Preferably, in the above package structure, the substrate and the optical fingerprint identification chip are fixed by bonding with a DAF film.
Preferably, in the above package structure, the photosensitive pixels are arranged in an array, and the first through holes correspond to the pixels one to one.
The invention also provides a packaging method for manufacturing the packaging structure, which comprises the following steps:
providing a wafer, wherein the wafer comprises a plurality of optical fingerprint identification chips; the optical fingerprint identification chip is provided with a front surface and a back surface which are opposite, the front surface is provided with a fingerprint identification area and a peripheral area which surrounds the fingerprint identification area, the fingerprint identification area is provided with a plurality of photosensitive pixels, and the peripheral area is provided with a welding pad which is electrically connected with the photosensitive pixels;
fixing a substrate on the wafer;
forming a light shielding layer on the surface of one side of the substrate, which is far away from the optical fingerprint identification chip;
patterning the light shielding layer to form a plurality of second through holes penetrating through the light shielding layer;
patterning the substrate by taking the patterned light shielding layer as a mask layer to form a first through hole penetrating through the substrate; the first through holes are used for exposing the welding pads and correspond to the second through holes one by one;
cutting the wafer, the substrate and the light shielding layer through a cutting process to form a plurality of single-grain packaging structures;
the wafer is cut into a plurality of optical fingerprint identification chips; the substrate and the shading layer are both cut into a plurality of parts which are in one-to-one correspondence with the optical fingerprint identification chips.
Preferably, in the above packaging method, the fixing of the substrate on the wafer includes:
aligning and pressing the substrate and the wafer, and bonding and fixing a preset area on the front surface of each optical fingerprint identification chip with the preset area of the substrate;
the optical fingerprint identification device comprises a substrate, an optical fingerprint identification chip, a cover plate and a shading layer, wherein a preset distance is formed between the substrate and the optical fingerprint identification chip and used for adjusting the image distance of the cover plate for small-hole imaging, and the cover plate comprises the substrate and the shading layer.
Preferably, in the above packaging method, after the forming of the first via hole, the method further includes:
and adhering optical filter glass to the surface of one side, which is far away from the substrate, of the light shielding layer, wherein the optical filter glass corresponds to the optical fingerprint identification chips one to one.
Preferably, in the above packaging method, a spacer is provided between the substrate and the periphery of the optical fingerprint identification chip, and the thickness of the spacer is equal to the pitch.
Preferably, in the packaging method, the spacer is used for bonding and fixing the substrate and the optical fingerprint identification chip.
Preferably, in the above packaging method, the fixing of the substrate on the wafer includes:
adhering and fixing optical filter glass to the front surface of each optical fingerprint identification chip;
fixing the substrate on the surface of the optical filter glass, wherein the substrate covers all the optical filter glass;
the thickness of the optical filter glass enables a preset distance to be reserved between the substrate and the optical fingerprint identification chip, the preset distance is used for adjusting the image distance of the cover plate for small-hole imaging, and the cover plate comprises the substrate and the shading layer.
Preferably, in the above packaging method, the light-shielding layer is a dry film or a wet film of photoresist, and the second through holes corresponding to the photosensitive pixels one to one are formed on the light-shielding layer through an exposure and development process;
the substrate is a silicon substrate, the shading layer is used as a mask layer, and the first through hole is formed by utilizing a silicon etching process.
Preferably, in the above packaging method, while the second through hole is formed, a second opening is formed at a position of the light shielding layer corresponding to the pad by using an exposure and development process; forming a first opening on the substrate corresponding to the welding pad by adopting an etching process based on the second opening, wherein the first opening is used for exposing the welding pad;
the bonding pad is electrically connected with a metal wire through the first opening and the second opening so as to be electrically connected with a bonding pad of a backboard through the metal wire.
Preferably, in the above packaging method, the method further includes:
before cutting, forming a through silicon via on the surface of one side of the optical fingerprint identification chip, which is far away from the substrate, wherein the through silicon via is used for exposing the welding pad;
forming an insulating layer covering the side wall of the through silicon via and the back surface of the optical fingerprint identification chip;
forming a rewiring layer covering the insulating layer, wherein the rewiring layer is electrically connected with the welding pad through the silicon through hole and extends to the outside of the silicon through hole;
and forming a solder mask layer covering the rewiring layer, wherein an opening is formed in the region, opposite to the back surface of the optical fingerprint identification chip, of the solder mask layer, and the opening is used for arranging a welding bulge which is used for being electrically connected with a welding pad of a back plate.
As can be seen from the above description, in the packaging structure and the packaging method of the optical fingerprint identification chip according to the technical solution of the present invention, the cover plate is disposed on the front surface of the optical fingerprint identification chip, the substrate includes the substrate and the light shielding layer, the light shielding layer is disposed on the surface of the substrate on the side away from the optical fingerprint identification chip, the substrate has a plurality of first through holes for exposing the photosensitive pixels of the optical fingerprint identification chip, and the light shielding layer has the second through holes corresponding to the first through holes one to one.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1a is a schematic structural diagram of a package structure of an optical fingerprint identification chip according to an embodiment of the present invention;
fig. 1b is a schematic structural diagram of another optical fingerprint identification chip package structure according to an embodiment of the present invention;
fig. 2a is a schematic diagram of a package structure of an optical fingerprint identification chip according to another embodiment of the present invention;
fig. 2b is a schematic diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention;
fig. 3a is a schematic diagram of a package structure of an optical fingerprint identification chip according to another embodiment of the present invention;
FIG. 3b is a schematic diagram of a package structure of an optical fingerprint identification chip according to another embodiment of the present invention;
fig. 4a is a schematic diagram of a package structure of an optical fingerprint identification chip according to another embodiment of the present invention;
fig. 4b is a schematic diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention;
fig. 5 a-10 are schematic flow charts of a packaging method according to an embodiment of the present invention;
fig. 11-14 are schematic flow charts of another packaging method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1a, fig. 1a is a schematic structural diagram of a package structure of an optical fingerprint identification chip according to an embodiment of the present invention, where the package structure includes: the optical fingerprint identification chip 11 is provided with a front surface 111 and a back surface 112 which are opposite, wherein the front surface 111 is provided with a fingerprint identification area and a peripheral area which surrounds the fingerprint identification area, the fingerprint identification area is provided with a plurality of photosensitive pixels 113, and the peripheral area is provided with a welding pad 114 which is electrically connected with the photosensitive pixels 113; a cover plate disposed opposite to the front surface 111 of the optical fingerprint identification chip 11, the cover plate including a substrate 12 and a light shielding layer 13, the substrate 12 having a plurality of first through holes T1 for exposing the photosensitive pixels 113; the light shielding layer 13 is located on a side of the substrate 12 away from the optical fingerprint identification chip 11, and the light shielding layer 13 has a plurality of second through holes T2 that are opposite to the first through holes T1 one by one.
Optionally, the optical fingerprint identification chip 11 further includes a transparent film layer covering the front surface thereof for flattening the outer surface thereof to protect the photosensitive pixels 113 and facilitate the optical fingerprint identification chip 11 to be attached and fixed to other structural members. By adopting the transparent film layer with the set refractive index, the transparent film layer can be reused as an antireflection layer to increase the light transmittance. The transparent film layer covers the photosensitive pixels 113 and exposes the bonding pads 114.
In the package structure of the embodiment of the invention, the aperture of the first through hole T1 is the same as the aperture of the second through hole T12, or smaller than the aperture of the second through hole T2. The first through hole T1 is opposite to the center of the second through hole T2.
Have the first through-hole T1 of one-to-one relative in the apron with second through-hole T2, the aperture of first through-hole T1 with second through-hole T2 the aperture all with photosensitive pixel 113's size is in same order of magnitude, say that the aperture of the two is all less, makes like this the apron has the aperture function of formation of image with second through-hole T2 through first through-hole T1, the apron is regulated and control finger reflection light through the aperture function of formation of image, reduces the crosstalk problem between different photosensitive pixel 113, improves fingerprint identification's precision. As shown in fig. 1a, a preset distance is provided between the cover plate and the optical fingerprint identification chip 11, and is used for adjusting an image distance of the cover plate for pinhole imaging, and the image distance is set by setting the distance, so that the fingerprint image quality of the photosensitive pixel 13 is better, and a proper distance can be selected through a specific experiment or a test effect, and further a proper image distance is selected.
The packaging structure further comprises optical filter glass L, and the optical filter glass L is used for filtering stray light outside the detection light wave band so as to reduce stray light interference and improve fingerprint identification precision.
In the manner shown in fig. 1a, a filter glass L is disposed on a surface of the cover plate facing away from the optical fingerprint identification chip 11, and the filter glass L only covers the photosensitive pixels 113 and exposes the bonding pads 114. At this time, a spacer J having a predetermined thickness is disposed between the peripheral edge of the cover plate and the peripheral edge of the optical fingerprint recognition chip 11. The thickness of the spacer J is equal to the distance and is matched with the image distance of the cover plate for small hole imaging. This mode can realize adjusting through adjusting the thickness of spacer J the apron carries out the image distance that the aperture was formed images to in order to regulate and control light. In this embodiment, the spacer J is used to bond and fix the substrate 12 and the optical fingerprint recognition chip 11.
Another mode is as shown in fig. 1b, and fig. 1b is a schematic structural diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, in this mode, the optical filter glass L is provided between the cover plate and the optical fingerprint identification chip 11, at this time, the thickness of the optical filter glass L is equal to the distance, and is matched with the image distance of the cover plate for pinhole imaging, and in this mode, the image distance of the cover plate for pinhole imaging can be adjusted by adjusting the thickness of the optical filter glass L, so as to adjust and control light.
In the manner shown in fig. 1a and 1b, the substrate 12 has a first opening K1 for exposing the pad 114 at a position corresponding to the pad 114; the light shielding layer 13 has a second opening K2 corresponding to the first opening K1 for exposing the first opening K1; the bonding pad 114 is electrically connected to a metal line through the first opening K1 and the second opening K2, so as to be electrically connected to a bonding pad of a backplane through the metal line. When electrically connected with the back plate, the metal wire, the first opening K1 and the second opening K2 can be covered by a plastic package layer.
In the manner shown in fig. 1a and 1b, the first opening K1 includes a first groove Ka and a second groove Kb located in the first groove Ka, the first groove Ka and the second groove Kb are used to expose the pad 114, and the depth of the second groove Kb is smaller than the thickness of the substrate 12.
Optionally, the back plate is a PCB, or a ceramic substrate, or a glass substrate. The substrate 12 is a silicon substrate. The light shielding layer 13 is a dry film or a wet film of photoresist, and the second through hole T2 may be formed through a photolithography process, and may also be reused as a mask layer of the substrate 12 to form the first through hole T1.
In the package structure according to the embodiment of the invention, the aspect ratio of the first through hole T1 is not greater than 6: 1. The aspect ratio of the second through hole T2 is not more than 6: 1. The thickness of the substrate 12 is not more than 200 μm. The thickness of the light shielding layer 13 is not more than 200 μm. In this way, pinhole imaging can be achieved with a cover plate of smaller thickness.
Optionally, the substrate 12 and the optical fingerprint identification chip 11 are fixed by bonding through a DAF film. The filter glass is positioned on the surface of the shading layer 13, which is far away from the optical fingerprint identification chip 11. When the optical filter glass is located between the substrate 12 and the optical fingerprint identification chip 11, the optical filter glass and the optical fingerprint identification chip 11 may be bonded and fixed through a DAF film, and the substrate 12 is attached to the surface of the optical filter glass on the side away from the optical fingerprint identification chip 11.
The photosensitive pixels 113 are arranged in an array, and in order to avoid the problem of crosstalk between different photosensitive pixels 113 to the greatest extent, the first through holes T1 may be arranged in one-to-one correspondence with the pixels 113.
In the manner shown in fig. 1a and 1b, a wire process is adopted to electrically connect the pad 114 of the optical fingerprint identification chip 11 and the pad of the backplane, and in other embodiments, the pad 114 of the optical fingerprint identification chip 11 and the pad of the backplane may also be electrically connected through a TSV (through silicon via) process. Since the through-silicon via penetrates through the back surface of the optical fingerprint identification chip 11, an opening for exposing the bonding pad 114 is not required to be formed on the cover plate, so that the filter glass L can be set to have the same size as the cover plate, and cover the whole front surface of the optical fingerprint identification chip 11. At this time, the encapsulation structure may be as shown in fig. 2a to 4 b.
Referring to fig. 2a, fig. 2a is a schematic diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, in this embodiment, a through-silicon via GT is provided on a back surface of the optical fingerprint identification chip 11 at a position corresponding to the pad 114, and the through-silicon via GT is used for exposing the pad 114. The side wall of the through silicon via GT and the back surface of the optical fingerprint identification chip are covered with an insulating layer 21; the surface of the insulating layer 21 is covered with a redistribution layer 22, and the redistribution layer 22 is electrically connected to the pad 114 through the through-silicon via GT and extends to the outside of the through-silicon via GT; the rewiring layer 21 is covered with a solder mask layer 23, and an area of the solder mask layer 23 opposite to the back surface 11 of the optical fingerprint identification chip 11 is provided with an opening for arranging a welding bump 24 so as to be electrically connected with a pad of a back plate through the welding bump 24. The bonding bumps 24 are electrically connected to the redistribution layer 22 at the openings. The bonding bumps 24 may be solder balls, and are bonded to the bonding pads. In this way, an adhesive layer is further provided between the optical fingerprint identification chip 11 and the back plate, so that the two are bonded and fixed.
In the embodiment shown in fig. 2a, the optical fingerprint identification chip 11 is bound and electrically connected to the backplane through a TSV (through silicon via) process. In this mode, the through-silicon via GT is a double-step through-hole, and the double-step through-hole includes: a groove GT1 located on the back side 112 of the optical fingerprint identification chip 11, the depth of the groove GT1 being less than the thickness of the optical fingerprint identification chip 11; and a through hole GT2 in the groove GT1, the through hole GT2 penetrating the optical fingerprint recognition chip 11 for exposing the pad 114. The grooves GT1 corresponding to the through holes GT2 on the same side of the optical fingerprint identification chip 11 may be an integral structure.
In the manner shown in fig. 2a, the filter glass L is located on a surface of the cover plate facing away from the optical fingerprint identification chip 11. At this time, a spacer J is provided between the cover plate and the optical fingerprint recognition chip 11, and the image distance of the cover plate for pinhole imaging is adjusted by setting the thickness of the spacer J. The method is a double step silicon through hole.
Through the two-step silicon through hole, when the pad 114 of the optical fingerprint identification chip 11 is electrically connected to the pad of the back plate, the package structure may be as shown in fig. 2b, where fig. 2b is a schematic view of another package structure of the optical fingerprint identification chip according to an embodiment of the present invention, and fig. 2b is different from fig. 2a in that the filter glass L is disposed between the cover plate and the optical fingerprint identification chip 11, and the image distance of the cover plate for pinhole imaging is adjusted by setting the thickness of the filter glass L.
When the optical fingerprint identification chip 11 and the backplane are bound and electrically connected by using a TSV process, the through-silicon via GT may also be a straight hole as shown in fig. 3a, and fig. 3a is a schematic diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, where a width of the straight hole in a first direction is not changed, the first direction is perpendicular to the optical fingerprint identification chip 11, and the front surface 111 of the optical fingerprint identification chip 11 points to the back surface 112 of the optical fingerprint identification chip 11. In this mode, the filter glass is located on the surface of one side of the cover plate, which is far away from the optical fingerprint identification chip 11. At this time, the cover plate and the optical fingerprint recognition chip 11 have a spacer J therebetween.
When the through-silicon via GT is a straight hole, as shown in fig. 3b, fig. 3b is a schematic view of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, and an optical filter glass may be disposed between the cover plate and the optical fingerprint identification chip 11.
When the optical fingerprint identification chip 11 and the backplane are bound and electrically connected by using a TSV process, the structure of the through-silicon via GT may also be a trapezoid hole as shown in fig. 4a, and fig. 4a is a schematic diagram of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, the width of the trapezoid hole is gradually increased in a first direction, the first direction is perpendicular to the optical fingerprint identification chip 11, and the front surface 111 of the optical fingerprint identification chip 11 points to the back surface 112 of the optical fingerprint identification chip 11. In this mode, the filter glass is located on the surface of one side of the cover plate, which is far away from the optical fingerprint identification chip 11. At this time, the cover plate and the optical fingerprint recognition chip 11 have a spacer J therebetween.
When the through-silicon via GT is a trapezoid hole, as shown in fig. 4b, fig. 4b is a schematic view of a package structure of another optical fingerprint identification chip according to an embodiment of the present invention, and a filter glass may be disposed between the cover plate and the optical fingerprint identification chip 11.
In the package structure according to the embodiment of the present invention, the front opening disposed on the cover plate may be used to expose the pad 114 for electrically connecting an external circuit, as shown in fig. 1a and 1b, or an interconnection structure disposed on the back surface of the optical fingerprint identification chip 11, the interconnection structure is used to electrically connect an external circuit, and the interconnection structure includes an interconnection layer, and the interconnection layer includes the insulating layer 21, the redistribution layer 22, and the solder resist layer 23.
As can be seen from the above description, in the package structure according to the embodiment of the invention, the substrate 12 having the first through hole T1 is disposed on the front surface 111 of the optical fingerprint identification chip 11, the light shielding layer 13 is disposed on a side surface of the substrate 12 facing away from the optical fingerprint identification chip 11, the light shielding layer 13 has the second through holes T2 corresponding to the first through holes T1, and light reflected at a specific angle can pass through the cover plate and enter the fingerprint identification area through the first through hole T1 and the second through hole T2, so as to control a light path and avoid crosstalk, and the first through holes T1 may correspond to the photosensitive pixels 113 one by one, or one first through hole T1 may correspond to a plurality of photosensitive pixels 113.
When fingerprint identification is carried out, the light rays reflected by the finger can be partitioned through the first through hole T1 and the second through hole T2 in one-to-one correspondence, so that crosstalk generated by sensing results of different photosensitive pixels is reduced, and the accuracy of fingerprint identification is improved.
Based on the foregoing package structure embodiment, another embodiment of the present invention further provides a packaging method, configured to package an optical fingerprint identification chip to form the package structure according to the foregoing embodiment, where the packaging method is shown in fig. 5a to 10, and fig. 5a to 10 are schematic flow diagrams of a packaging method according to an embodiment of the present invention, where the packaging method includes:
step S11: as shown in fig. 5a and 5b, a wafer 10 is provided.
Fig. 5a is a top view of the wafer 10 corresponding to the front surface of the optical fingerprint identification core, and fig. 5b is a cross-sectional view of the wafer shown in fig. 5a at a-a'. The wafer 10 includes a plurality of optical fingerprint recognition chips 11. The optical fingerprint identification chip 11 has a front surface 111 and a back surface 112 opposite to each other, and the front surface 111 has a fingerprint identification area and a peripheral area surrounding the fingerprint identification area. The fingerprint identification area is provided with a plurality of photosensitive pixels 113, and the peripheral area is provided with a welding pad 114 electrically connected with the photosensitive pixels 113; and a cutting channel 20 is arranged between the adjacent optical fingerprint identification chips 11.
Step S12: as shown in fig. 6, a substrate 12 is fixed on the wafer 10.
In this step, one way of fixing the substrate 10 on the wafer 10 is to align and press the substrate 12 and the wafer 10, and bond and fix a preset area of the front surface of each optical fingerprint identification chip 11 and a preset area of the substrate 12, so that after cutting, each optical fingerprint identification chip 11 is bonded and fixed with a correspondingly cut cover plate in each package structure; the substrate 12 and the optical fingerprint identification chip 11 have a preset distance therebetween, and the preset distance is used for adjusting an image distance of a cover plate for small-hole imaging, and the cover plate comprises the substrate and a light shielding layer.
This way, the substrate 12 is directly bonded and fixed to the periphery of the front surface of each optical fingerprint recognition chip 11 by the spacer J. The periphery of the optical fingerprint identification chip 11 and the base plate 12 are provided with a spacer, and the thickness of the spacer is matched with the image distance of the cover plate for small hole imaging. In this manner, the cover plate is directly bonded and fixed to the periphery of the front surface of each optical fingerprint recognition chip 11 in fig. 6.
Optionally, the substrate 12 is a silicon substrate. In the subsequent steps, the substrate 12 uses the light-shielding layer 13 as a mask layer, and a silicon etching process is used to form the first through hole T1.
Step S13: as shown in fig. 7, a light shielding layer 13 is formed on a surface of the substrate 12 facing away from the optical fingerprint identification chip 11.
Optionally, the light shielding layer 13 is a dry film or a wet film, so that the second through holes T2 corresponding to the photosensitive pixels 113 one to one are formed on the light shielding layer 13 through an exposure and development process in the subsequent step.
Step S14: as shown in fig. 8, the light-shielding layer 13 is patterned to form a plurality of second through holes T2 penetrating through the light-shielding layer 13.
Step S15: as shown in fig. 9, the substrate 12 is patterned using the patterned light-shielding layer 13 as a mask layer, and a first through hole T1 penetrating through the substrate 12 is formed.
The first through holes T1 are used to expose the pads 114, and correspond to the second through holes T2 one by one.
Step S16: as shown in fig. 10, the wafer 10, the substrate 12, and the light shielding layer 13 are diced by a dicing process to form a plurality of single-grain package structures.
The wafer 10 is cut into a plurality of optical fingerprint identification chips 11; the substrate 12 and the light shielding layer 13 are both cut into a plurality of parts corresponding to the optical fingerprint identification chips 11 one to one.
After forming the first via T1, the packaging method further includes: and adhering optical filter glass L to the surface of one side, which is far away from the substrate 12, of the light shielding layer 13 to form a packaging structure as shown in FIG. 1a, wherein the optical filter glass L corresponds to the optical fingerprint identification chip one to one. In this case, the filter glass L may be bonded to the region corresponding to each optical fingerprint recognition chip 11 before dicing, or may be bonded to the region corresponding to each optical fingerprint recognition chip 11 after dicing.
In the packaging method shown in fig. 5 a-10, a spacer J is provided between the substrate 12 and the periphery of the optical fingerprint identification chip 11, and the thickness of the spacer J is equal to the pitch. The spacer J is used for bonding and fixing the substrate 12 and the optical fingerprint identification chip 11.
In the packaging method according to the embodiment of the present invention, the light shielding layer 13 is a dry film or a wet film of photoresist, and the second through holes T2 corresponding to the photosensitive pixels 113 one to one are formed on the light shielding layer 13 through an exposure and development process; the substrate 11 is a silicon substrate, the light-shielding layer 13 is a mask layer, and the first through hole T1 is formed by a silicon etching process.
In the packaging method shown in fig. 5 a-10, while forming the second through hole T2, an exposure and development process is used to form a second opening K2 at a position of the light-shielding layer 13 corresponding to the pad 114; forming a first opening K1 at a position corresponding to the welding pad on the substrate by adopting an etching process based on the second opening K2, wherein the first opening K1 is used for exposing the welding pad 114; the pad 114 is electrically connected to a metal wire through the first opening K1 and the second opening K2, so as to be electrically connected to a pad of a backplane through the metal wire. The first opening is provided with a first groove Ka and a second groove Kb positioned in the first groove Ka. The first opening K1 may be formed at the same time that the first through hole T1 is formed.
In another embodiment, before the wafer 10 is fixed to the substrate 12, a filter glass L may be bonded to each optical fingerprint identification chip 11, and in this case, the fixing of the substrate 12 to the wafer 10 includes bonding a filter glass L to the front surface 111 of each optical fingerprint identification chip 11; fixing the substrate 12 on the surface of the filter glass L, wherein the substrate 12 covers all the filter glass L; the thickness of the filter glass L enables a preset distance to be formed between the substrate 12 and the optical fingerprint identification chip 11, and the preset distance is used for adjusting an image distance of a cover plate for small-hole imaging, the cover plate also comprises the substrate 12 and the light shielding layer 13, and a finally formed packaging structure is shown in fig. 1 b.
In the packaging method according to the embodiment of the invention, the substrate 12 with the first through hole T1 and the light shielding layer 13 with the second through hole T2 are arranged on the front surface 111 of the optical fingerprint identification chip, so that the crosstalk problem between different photosensitive pixels 113 can be effectively avoided, and the fingerprint identification accuracy is improved. Meanwhile, the light shielding layer 13 can also be used as a mask layer of the substrate 12, so that the process flow is simplified, and the manufacturing cost is reduced.
The packaging method further comprises the following steps: arranging a back plate on one side of the optical fingerprint identification chip, which is far away from the substrate, wherein the back plate comprises a metal circuit layer and a bonding pad which is electrically connected with the metal circuit layer; the welding pad is electrically connected with the welding pad so as to be electrically connected with an external circuit through the backboard. The optical fingerprint identification chip can be bound with the backboard through a wire and electrically connected.
In other manners, an interconnection structure may also be formed on the back surface of the package structure through a TSV process, so as to be bound and electrically connected to the backplane, so as to be electrically connected to an external circuit through the backplane, and the finally formed package structure is as shown in fig. 2a to 4 b.
As shown in fig. 2a to 4a, the method for manufacturing the package structure as shown in fig. 11 to 14 further includes, after forming the first via T1 and the second via T2:
step S21: as shown in fig. 11, before cutting, a through-silicon via GT is formed on a surface of the optical fingerprint identification chip 11 facing away from the substrate 12, and the through-silicon via GT is used for exposing the pad 114.
In this step, the wafer 10 is brought so that the lid is placed downwards in order to form the through-silicon-vias GT. Fig. 11 illustrates an example of a double-step through-hole, which includes: a groove GT1 located on the back side 112 of the optical fingerprint recognition chip 11 and a through hole GT2 located within the groove GT 1.
Step S22: as shown in fig. 12, an insulating layer 21 is formed to cover the sidewalls of the through-silicon via GT and the backside of the optical fingerprint recognition chip 11.
Step S23: as shown in fig. 13, a redistribution layer 22 is formed to cover the insulating layer 21, and the redistribution layer 22 is electrically connected to the pad 114 through the through-silicon via GT and extends to the outside of the through-silicon via GT.
Step S24: as shown in fig. 14, a solder resist layer 23 is formed to cover the rewiring layer 22, and an area of the solder resist layer 23 opposite to the back surface of the optical fingerprint identification chip 11 has an opening for disposing a solder bump 24, and the solder bump 24 is used for electrically connecting with a pad of a back board.
After forming the back interconnection structure on the back surface of the wafer, the back interconnection structure of the wafer is pre-cut, and the interconnection layer (including the insulating layer, the rewiring layer and the solder resist layer) is cut. The pre-cutting may be performed along the cutting channel by a laser. And after finishing and cutting, cutting the back plate and the wafer by the cutter. Because the interconnection layer is made of brittle materials and has poor ductility and toughness, the laser is adopted to pre-cut the interconnection layer on the back, so that the damage to the interconnection layer can be reduced, the cracking or the fault of the interconnection layer can be avoided, and the reliability of the chip can be ensured. The material hardness of wafer, base plate and light shield layer is the same or similar, and the same cutter that adopts cuts along the vestige of laser precutting, can guarantee the roughness of cutting terminal surface, avoids the section damage.
After cutting, the filter glass L is attached to form a package structure as shown in fig. 2 a. For the package structures shown in fig. 2 b-4 b, the difference is that the shapes of the through silicon vias GT are different, and the positions of the filter glass are different, and the forming process can refer to the above description, which is not repeated herein.
The packaging method provided by the embodiment of the invention can be used for manufacturing the packaging structure of the embodiment, the process is simple, the manufacturing cost is low, the formed packaging structure avoids the crosstalk problem among different photosensitive pixels, and the fingerprint identification precision is improved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the packaging method disclosed by the embodiment, since the packaging method corresponds to the packaging structure disclosed by the embodiment, the description is relatively simple, and the relevant points can be referred to the description of the packaging structure part.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (23)

1. An optical fingerprint identification chip package structure, comprising:
the optical fingerprint identification chip is provided with a front surface and a back surface which are opposite, the front surface is provided with a fingerprint identification area and a peripheral area which surrounds the fingerprint identification area, the fingerprint identification area is provided with a plurality of photosensitive pixels, and the peripheral area is provided with a welding pad which is electrically connected with the photosensitive pixels;
the cover plate is arranged opposite to the front surface of the optical fingerprint identification chip;
the cover plate comprises a substrate and a shading layer; the substrate is provided with a plurality of first through holes for exposing the photosensitive pixels; the light shielding layer is positioned on one side of the substrate, which is far away from the optical fingerprint identification chip, and is provided with a plurality of second through holes which are one-to-one opposite to the first through holes; the aperture of the first through hole is the same as that of the second through hole or smaller than that of the second through hole; the depth-to-width ratio of the first through hole and the depth-to-width ratio of the second through hole are not more than 6: 1.
2. The package structure of claim 1, wherein a predetermined distance is provided between the cover plate and the optical fingerprint identification chip, so as to adjust an image distance of the cover plate for pinhole imaging.
3. The package structure of claim 1, wherein a filter glass is disposed between the cover plate and the optical fingerprint identification chip for filtering out stray light outside a detection light band.
4. The package structure according to claim 1, wherein a surface of the cover plate facing away from the optical fingerprint identification chip is provided with filter glass for filtering out stray light outside a detection light wavelength band.
5. The package structure of claim 1, wherein a spacer of a predetermined thickness is disposed between the periphery of the cover plate and the periphery of the optical fingerprint identification chip.
6. The package structure according to claim 1, wherein the substrate has a first opening for exposing the pad at a position corresponding to the pad;
the position of the light shielding layer corresponding to the first opening is provided with a second opening used for exposing the first opening;
the welding pad is used for being electrically connected with a metal wire through the first opening and the second opening so as to be electrically connected with a welding pad of a backboard through the metal wire.
7. The package structure of claim 6, wherein the first opening comprises a first recess and a second recess located in the first recess, and the first recess and the second recess are used for exposing the pad.
8. The package structure according to claim 1, wherein a through silicon via is formed on the back surface of the optical fingerprint identification chip at a position corresponding to the pad, and the through silicon via is used for exposing the pad;
the side wall of the silicon through hole and the back surface of the optical fingerprint identification chip are covered with insulating layers;
the surface of the insulating layer is covered with a rewiring layer, and the rewiring layer is electrically connected with the welding pad through the silicon through hole and extends to the outside of the silicon through hole;
the rewiring layer is covered with a solder mask, an opening is formed in an area, opposite to the back face of the optical fingerprint identification chip, of the solder mask, and the opening is used for arranging a welding protrusion so as to be electrically connected with a welding pad of a back plate through the welding protrusion.
9. The package structure of claim 1, wherein the substrate is a silicon substrate.
10. The package structure of claim 1, wherein the light shielding layer is a dry film or a wet film.
11. The package structure of claim 1, wherein the substrate has a thickness of no greater than 200 μ ι η.
12. The package structure according to claim 1, wherein the light-shielding layer has a thickness of not more than 200 μm.
13. The package structure of claim 1, wherein the substrate and the optical fingerprint identification chip are adhesively secured by a DAF film.
14. The package structure of claim 1, wherein the photosensitive pixels are arranged in an array, and the first vias correspond to the pixels one to one.
15. A packaging method for making a package structure according to any one of claims 1 to 14, wherein the packaging method comprises:
providing a wafer, wherein the wafer comprises a plurality of optical fingerprint identification chips; the optical fingerprint identification chip is provided with a front surface and a back surface which are opposite, the front surface is provided with a fingerprint identification area and a peripheral area which surrounds the fingerprint identification area, the fingerprint identification area is provided with a plurality of photosensitive pixels, and the peripheral area is provided with a welding pad which is electrically connected with the photosensitive pixels;
fixing a substrate on the wafer;
forming a light shielding layer on the surface of one side of the substrate, which is far away from the optical fingerprint identification chip;
patterning the light shielding layer to form a plurality of second through holes penetrating through the light shielding layer;
patterning the substrate by taking the patterned light shielding layer as a mask layer to form a first through hole penetrating through the substrate; the first through holes are used for exposing the welding pads and correspond to the second through holes one by one; the aperture of the first through hole is the same as that of the second through hole or smaller than that of the second through hole; the depth-to-width ratio of the first through hole and the depth-to-width ratio of the second through hole are not more than 6: 1;
cutting the wafer, the substrate and the light shielding layer through a cutting process to form a plurality of single-grain packaging structures;
the wafer is cut into a plurality of optical fingerprint identification chips; the substrate and the shading layer are both cut into a plurality of parts which are in one-to-one correspondence with the optical fingerprint identification chips.
16. The method of claim 15, wherein securing the substrate on the wafer comprises:
aligning and pressing the substrate and the wafer, and bonding and fixing a preset area on the front surface of each optical fingerprint identification chip with the preset area of the substrate;
the optical fingerprint identification device comprises a substrate, an optical fingerprint identification chip, a cover plate and a shading layer, wherein a preset distance is formed between the substrate and the optical fingerprint identification chip and used for adjusting the image distance of the cover plate for small-hole imaging, and the cover plate comprises the substrate and the shading layer.
17. The method of claim 16, wherein after forming the first via, further comprising:
and adhering optical filter glass to the surface of one side, which is far away from the substrate, of the light shielding layer, wherein the optical filter glass corresponds to the optical fingerprint identification chips one to one.
18. The packaging method of claim 17, wherein a spacer is disposed between the substrate and a periphery of the optical fingerprint identification chip, the spacer having a thickness equal to the pitch.
19. The method of packaging of claim 18, wherein the spacer is configured to adhesively secure the substrate and the optical fingerprint identification chip.
20. The method of claim 15, wherein securing the substrate on the wafer comprises:
adhering and fixing optical filter glass to the front surface of each optical fingerprint identification chip;
fixing the substrate on the surface of the optical filter glass, wherein the substrate covers all the optical filter glass;
the thickness of the optical filter glass enables a preset distance to be reserved between the substrate and the optical fingerprint identification chip, the preset distance is used for adjusting the image distance of the cover plate for small-hole imaging, and the cover plate comprises the substrate and the shading layer.
21. The packaging method according to claim 15, wherein the light-shielding layer is a dry film or a wet film, and the second through holes corresponding to the photosensitive pixels one to one are formed on the light-shielding layer by an exposure and development process;
the substrate is a silicon substrate, the shading layer is used as a mask layer, and the first through hole is formed by utilizing a silicon etching process.
22. The packaging method according to claim 21, wherein a second opening is formed in a position of the light shielding layer corresponding to the pad by using an exposure and development process while the second through hole is formed; forming a first opening on the substrate corresponding to the welding pad by adopting an etching process based on the second opening, wherein the first opening is used for exposing the welding pad;
the bonding pad is electrically connected with a metal wire through the first opening and the second opening so as to be electrically connected with a bonding pad of a backboard through the metal wire.
23. The method of packaging of claim 15, further comprising:
before cutting, forming a through silicon via on the surface of one side of the optical fingerprint identification chip, which is far away from the substrate, wherein the through silicon via is used for exposing the welding pad;
forming an insulating layer covering the side wall of the through silicon via and the back surface of the optical fingerprint identification chip;
forming a rewiring layer covering the insulating layer, wherein the rewiring layer is electrically connected with the welding pad through the silicon through hole and extends to the outside of the silicon through hole;
and forming a solder mask layer covering the rewiring layer, wherein an opening is formed in the region, opposite to the back surface of the optical fingerprint identification chip, of the solder mask layer, and the opening is used for arranging a welding bulge which is used for being electrically connected with a welding pad of a back plate.
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