CN111665246A - Image composite detection system - Google Patents

Image composite detection system Download PDF

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Publication number
CN111665246A
CN111665246A CN202010143512.9A CN202010143512A CN111665246A CN 111665246 A CN111665246 A CN 111665246A CN 202010143512 A CN202010143512 A CN 202010143512A CN 111665246 A CN111665246 A CN 111665246A
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Prior art keywords
optical
chamber
image
microscope device
image composite
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CN202010143512.9A
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Chinese (zh)
Inventor
黄继震
黄祈欣
谢宏宗
黄胜茂
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Hermes Epitek Corp
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Hermes Epitek Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/2206—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/03—Investigating materials by wave or particle radiation by transmission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/071—Investigating materials by wave or particle radiation secondary emission combination of measurements, at least 1 secondary emission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/079—Investigating materials by wave or particle radiation secondary emission incident electron beam and measuring excited X-rays

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

An image composite detection system integrates an electron microscope device and a plurality of optical microscope devices with the same or different support magnifications, an object to be detected is detected by the electron microscope device in a vacuum cabin and is detected by the plurality of optical microscope devices arranged in an optical detection area in an atmospheric environment to establish an optical panoramic image and an optical local image of the object to be detected, and the magnifications of image identification are effectively enlarged through the combination of the electron microscope device and the plurality of optical microscope devices.

Description

Image composite detection system
[ technical field ] A method for producing a semiconductor device
The present invention relates to an image detection system, and more particularly to an image composite detection system for detecting a surface image of an object.
[ background of the invention ]
The optical image has a wide application in measurement or detection, and a general optical image can be viewed through a CCD, but the image resolution of the existing CCD is limited, and the field of view under the CCD lens is also limited. To increase the field of view, the magnification of the CCD needs to be adjusted to be small, and the image resolution of the CCD needs to be increased. However, when the resolution of measurement or detection is to be increased to the nanometer level, the conventional optical CCD cannot be applied, and an electron microscope with higher resolution must be used instead.
However, the conventional electron microscope is expensive and must be measured or detected in a vacuum environment, so that it is difficult to construct and use the electron microscope in large quantities. In view of the above, it is a very important objective to provide a measurement or detection method that is cost effective and improves resolution.
[ summary of the invention ]
The image composite detection system comprises an optical microscope device for detecting in an atmospheric environment and an electron microscope device for detecting in a vacuum environment, which are integrated together, and can be applied to surface detection of semiconductor equipment elements, surface detection of semiconductor elements or structures, surface detection of various industrial components, or surface detection of LED industry, electronic manufacturing process, biotechnology, medical materials, biomedical samples, chemical coatings and the like.
The image composite detection system comprises an optical microscope device for detecting in an atmospheric environment and a desktop electronic microscope device for detecting in a vacuum environment, has the advantages of enlarging the magnification of image detection and effectively reducing the cost, and can provide an economical and practical high-quality scheme meeting various requirements in the detection application requirements of Automatic Optical Inspection (AOI).
The image composite detection system comprises an optical microscope device for detecting in an atmospheric environment and a desktop electron microscope device for detecting in a vacuum environment, wherein the occupied area (footprint) of the whole machine can be adjusted according to actual requirements, but the size of a detectable object to be detected can be maximized to 50 x 50 cm.
According to the above, an image composite detection system comprises: a first chamber providing a vacuum environment for accommodating an object to be measured; an electron microscope device disposed on the first chamber for detecting the object under test in the vacuum environment; an optical detection area located outside the first chamber and providing an atmospheric environment for the object to be detected; a first optical microscope device disposed in the optical detection area for detecting the object under test in the atmospheric environment, wherein the first optical microscope device comprises an optical panoramic image for creating the object under test; a second optical microscope device disposed in the optical detection area for detecting the object under test in the atmospheric environment, wherein the second optical microscope device comprises an optical local image for creating the object under test; and a transfer module for transferring the object to be detected to the first cabin body for detection or to the optical detection area for detection.
In one example, the image composite inspection system further comprises a second chamber disposed between the first chamber and the optical inspection area; and a plurality of gate mechanisms respectively control the communication and the isolation of the first cabin body and the second cabin body and the communication and the isolation of the optical detection area and the second cabin body.
In one example, the gate mechanism corresponding to the first chamber is disposed on the first chamber or the second chamber, and the gate mechanism corresponding to the optical detection area is disposed on the second chamber.
In one example, when the first cabin and the second cabin are communicated, the transfer module transfers the object to be tested between the first cabin and the second cabin; and when the optical detection area is communicated with the second cabin body, the transferring module transfers the object to be detected between the optical detection area and the second cabin body.
In one example, the image composite inspection system further comprises a vacuum pumping device connected to the first chamber, an analysis tool for collecting secondary electron beams, an image navigation module or an automatic optical inspection module or a combination of any two or more of the above modules for respectively establishing respective coordinate systems and a reference coordinate system for the first optical microscope device, the second optical microscope device and the electron microscope device.
In one example, the first optical microscope and the second optical microscope are charge coupled optical microscopes, respectively, and the plurality of charge coupled optical microscopes have the same or different support magnifications, and the support magnifications of the plurality of charge coupled optical microscopes are from 0.1 to 500.
In one example, the electron microscope apparatus includes a desktop scanning electron microscope, a transmission electron microscope, or a scanning transmission electron microscope, and the support magnification is from 30 to 50000.
The purpose, technical content, features and effects of the present invention will be more readily understood by the following detailed description of the embodiments taken in conjunction with the accompanying drawings.
[ description of the drawings ]
Fig. 1 is a schematic front perspective view illustrating an embodiment of a composite image inspection system according to the present invention.
Fig. 2 is a perspective side view of a system for image composite inspection according to an embodiment of the present invention.
FIG. 3 is a top perspective view of some components of an image composite inspection system according to an embodiment of the present invention.
[ notation ] to show
1 image composite detection system
2 base station
5 test substance
10 optical detection zone
11. 21, 31 base
12 first optical microscope device
13. 23 brake mechanism
14 second optical microscope device
16. 26 mechanism
18 adjustment mechanism
20 first cabin
22 electron microscope device
28 vacuum suction device
30 second cabin
32 move and carry module
[ detailed description ] embodiments
The following detailed description of the embodiments of the invention is provided in connection with the accompanying drawings. Aside from the specific details disclosed herein, this invention is capable of other embodiments and its several details are capable of modifications in various obvious respects, all without departing from the scope of the invention. In the description of the specification, numerous specific details are set forth in order to provide a more thorough understanding of the invention; however, the present invention may be practiced without some or all of these specific details. In other instances, well-known steps or elements have not been described in detail so as not to unnecessarily obscure the present invention. The same or similar elements in the drawings will be denoted by the same or similar symbols. It is noted that the drawings are for illustrative purposes only and do not represent actual sizes or quantities of elements, and some details may not be drawn completely to simplify the drawings.
Referring to fig. 1, 2 and 3, the image composite inspection system 1 includes a first chamber 20(chamber), a second chamber 30, a first optical microscope device 12, a second optical microscope device 14 and an electron microscope device 22. In one example, most components of the image composite inspection system 1 can be disposed on a base 2, and the base 2 can carry a plurality of bases 11, 21 and 31 with the same or different sizes and heights. The first optical microscope device 12 and the second optical microscope device 14 are disposed in an optical detection area 10, which respectively detect an analyte 5. The optical inspection area 10 provides an atmospheric environment and provides a mechanism 16 for placing or fixing the object 5 on the mechanism 16, such as a scanning moving mechanism (scanstage), and the mechanism 16 can be placed on the base 11 by changing and arranging the position of the object 5 in the optical inspection area 10 by the operation of the mechanism 16. Furthermore, the image composite inspection system 1 further includes an adjusting mechanism 18 capable of adjusting the inspection heights of the first optical microscope device 12 and the second optical microscope device 14, so as to adjust the relative position between the first optical microscope device 12 and the object 5 or adjust the relative position between the second optical microscope device 14 and the object 5 according to the requirement, thereby inspecting the better surface image of the object 5. Again, adjustment mechanism 18 may be integral with or separate from mechanism 16.
With continued reference to fig. 1, 2 and 3, the image composite detection system 1 further includes a plurality of switch mechanisms, such as a gate mechanism 13, disposed on the second chamber 30 for controlling communication and isolation (isolation) between the optical detection region 10 and the second chamber 30, and the second chamber 30 can be disposed on the base 31. In addition, a gate mechanism 23 may be disposed on the second chamber 30 or the first chamber 20, which controls communication and isolation between the first chamber 20 and the second chamber 30, and the first chamber 20 may be placed on the base 21. Next, the image composite inspection system 1 further includes a transfer module 32, such as a robot, which can be disposed in the second chamber 30. When the optical detection area 10 and the second chamber 30 are connected, the transferring module 32 transfers the object 5 to the optical detection area 10 or the second chamber 30. When the optical detection area 10 and the second chamber 30 are isolated, the optical detection area 10 and the second chamber 30 can provide different working environments, for example, the optical detection area 10 provides an atmospheric environment, and the second chamber 30 provides a vacuum environment, but the present invention is not limited thereto. Similarly, the communication and isolation between the first cabin 20 and the second cabin 30, and the transfer module 32 therebetween are also the same, which are not described herein. Thus, the second chamber 30 is a relay chamber for providing the object 5 to be tested to enter and exit the optical detection area 10 or the first chamber 20, and in one example, the second chamber 30 may be a chamber for providing load/loader in the semiconductor device. Alternatively, if the second chamber 30 is omitted, the gate mechanism 23 is disposed on the first chamber 20 and controls the communication and isolation between the optical detection area 10 and the first chamber 20, and the transfer module 32 may be disposed in the first chamber 20 or the optical detection area 10.
With continued reference to fig. 1, 2, and 3, the first chamber 20 provides a space for accommodating the mechanism 26 and the object 5, wherein the space provides a vacuum environment for processing or further testing the object 5. Next, the electron microscope 22 may be wholly or partially accommodated in the first chamber 20, and detects the object 5. Also, like the mechanism 16, the object 5 can be placed or fixed on the mechanism 26, and the position of the object 5 in the first chamber 20 can be changed by the operation of the mechanism 26. Furthermore, the image composite inspection system 1 further includes a vacuum pumping device 28 connected to the first chamber 20, and the vacuum environment of the first chamber 20 can be created by the vacuum pumping device 28. It is understood that when the first chamber 20 and the second chamber 30 are in communication and the optical detection zone 10 and the second chamber 30 are isolated, the vacuum pumping arrangement 28 is operable to simultaneously create a vacuum environment in both the first chamber 20 and the second chamber 30. In addition, it is understood that, in order to meet the control requirements of the machine, the image composite inspection system 1 may further include appropriate electronic control components, such as a human-machine interface. In one example, the image composite inspection system 1 further includes an analysis tool (not shown) connected to the electron microscope device 22, wherein the analysis tool can further analyze the inspection image of the electron microscope device 22.
Referring to fig. 1, 2 and 3, in an example, the first optical microscope Device 12 and the second optical microscope Device 14 may be Charge Coupled Devices (CCD) optical microscopes, respectively, wherein different magnifications, such as 0.1-10 and 10-500, are achieved by selecting lenses with different magnifications, but the present invention is not limited thereto. Thus, the first optical microscope device 12 and the second optical microscope device 14 can respectively establish a panoramic view of the optical image of the object 5 and a local viewing area of the optical image, which will be described in detail later. Second, the first optical microscope device 12 and the second optical microscope device 14 may be configured with the same or separate light sources to optimize the inspection environment in response to the inspection image requirements. The Electron Microscope device 22 may be a desktop Scanning Electron Microscope (SEM), a Transmission Electron Microscope (TEM), or a Scanning Transmission Electron Microscope (STEM), and has a supporting magnification of 30 to 50,000, and performs detailed Electron beam inspection on the sample 5. Furthermore, the electron microscope device 22 may be further configured to perform a magnified scanning and detection of the local image based on the optical image of the first optical microscope device 12 or/and the second optical microscope device 14. In addition, in the case of the electron microscope device 22 having both scanning and penetrating functions, besides the detectable element composition, the quantitative analysis can be performed by software. In addition, the electron microscopy apparatus 22 can incorporate direct liquid detection techniques, such as the use of special electron beam transparent membranes to keep liquids or volatile substances in vacuum, which can simultaneously allow scanning measurements of microstructures and transmission analysis of nanoparticles.
With continued reference to fig. 1, 2, and 3, in one example, the mechanism 16 and the mechanism 26 may each be a multi-axis motion or, more generally, a rotational mechanical system, wherein the adjustment mechanism 18 may be an axial adjustment portion of the mechanism 16. Thus, the mechanism 16, such as an XYZ three-axis linear translation mechanism, may have a stroke of 50 x 10cm, with the Z-axis being the adjustment mechanism 18 for adjusting the focus position of the first optical microscopy apparatus 12 and the second optical microscopy apparatus 14. The mechanism 26, for example an XYZR linear translation and rotation mechanism, may have a translation stroke of 50 x 10cm, the R-axis providing a rotation angle of +/-20 degrees (deg), providing the possibility of 3D detection. Further, the vacuum pumping arrangement 28 may be a combination of several pumping systems, including, for example and without limitation, a pre-pump and a high vacuum pump. The pre-pump can be oil-free dry rotary pump or oil-type mechanical pump, and the high vacuum pump can be turbo molecular pump. The analysis tool may be an analysis technique used in cooperation with the electron microscope 22, which can collect the secondary electron beam to detect the microstructure on the surface of the sample 5 and perform material analysis. An analysis tool, such as, but not limited to, an Energy Dispersive X-ray spectroscopy (EDS) tool, performs qualitative or semi-quantitative chemical composition analysis of the analyte 5 using characteristic X-rays excited by an electron beam generated by the electron microscopy apparatus 22.
In view of the above, the image composite inspection system 1 of the present invention combines optical and electron beam scanning with different support magnifications to effectively expand the magnification of image inspection, and uses a desktop electron microscope to perform high-order inspection to expand the magnification, but effectively reduce the cost. Secondly, the function of the image composite inspection system 1 can be further improved by combining software functions, such as an Automatic Optical Inspection (AOI) imaging technology. In an example, the image composite detection system 1 further includes an automatic optical detection module (not shown), and for a large object 5 to be detected, the automatic optical detection module can obtain a panoramic image of the object 5 to be detected by image segmentation, capturing and collaging through the cooperation of the mechanism 16. Firstly, scanning the panorama of the whole object to be detected 5 to establish a coordinate axis; then, dividing the object 5 to be measured into a plurality of image lattices; then, sequentially scanning each image cell of the object 5 to be measured by the first optical microscope device 12 or the second optical microscope device 14 and capturing the respective image of each image cell, wherein the sequential scanning may be sequential, back-and-forth, or alternate; and tiling the plurality of individual images to obtain a panoramic image of the object 5.
In consideration of the difference between the supporting magnifications of the optical microscope and the electron microscope, the image composite inspection system 1 further includes an image navigation module (not shown), which establishes respective coordinate systems and reference coordinate systems for the first optical microscope device 12, the second optical microscope device 14 and the electron microscope device 22, respectively, so as to enable the optical and electron inspection systems to be switched smoothly. It should be noted that the deviation between the respective coordinate systems and the reference coordinate system can be calibrated and stored in advance during the assembly process of the image composite detecting system 1. In addition, through the connection of the image navigation module, the detected magnification can be mutually converted among the first optical microscope device 12, the second optical microscope device 14 and an electron microscope device 22, and the detection range of the maximum margin (margin) is obtained.
The above-described embodiments are merely illustrative of the technical spirit and features of the present invention, and the object of the present invention is to enable those skilled in the art to understand the content of the present invention and to implement the same, and the scope of the present invention should not be limited by the above-described embodiments, i.e., all equivalent changes and modifications made in the spirit of the present invention should be covered by the scope of the present invention.

Claims (16)

1. An image composite detection system, comprising:
a first chamber providing a vacuum environment for accommodating an object to be measured;
an electron microscope device disposed on the first chamber for detecting the object under test in the vacuum environment;
an optical detection area located outside the first chamber and providing an atmospheric environment for the object to be detected;
a first optical microscope device disposed in the optical detection area for detecting the object under test in the atmospheric environment, wherein the first optical microscope device comprises an optical panoramic image for creating the object under test;
a second optical microscope device disposed in the optical detection area for detecting the object under test in the atmospheric environment, wherein the second optical microscope device comprises an optical local image for creating the object under test; and
a transfer module transfers the object to be tested to the first chamber for testing or to the optical testing area for testing.
2. The image composite detection system of claim 1, further comprising a plurality of scanning moving mechanisms respectively disposed in the optical detection area and the first chamber, wherein each of the scanning moving mechanisms carries the object and changes a position of the object in the optical detection area and the first chamber.
3. The image composite detection system of claim 2, wherein the scanning movement mechanism disposed in the optical detection area further comprises adjusting the focus positions of the first optical microscope device and the second optical microscope device.
4. The image composite detection system of claim 1, further comprising a second chamber disposed between the first chamber and the optical detection region; and a plurality of gate mechanisms respectively control the communication and the isolation of the first cabin body and the second cabin body and the communication and the isolation of the optical detection area and the second cabin body.
5. The image composite detection system of claim 4, wherein the gate mechanism corresponding to the first chamber is disposed on the first chamber or the second chamber, and the gate mechanism corresponding to the optical detection area is disposed on the second chamber.
6. The image composite inspection system of claim 4, wherein the transfer module transfers the object to be inspected between the first chamber and the second chamber when the first chamber and the second chamber are connected; and when the optical detection area is communicated with the second cabin body, the transferring module transfers the object to be detected between the optical detection area and the second cabin body.
7. The image composite detection system of claim 6, wherein the transfer module comprises a robotic arm.
8. The image composite inspection system of claim 1, further comprising a vacuum pumping device coupled to the first chamber for pumping air to the first chamber to create the vacuum environment of the first chamber.
9. The image composite detection system of claim 1, wherein the first optical microscope device and the second optical microscope device are charge coupled optical microscopes, and the supporting magnifications of the charge coupled optical microscopes are the same or different.
10. The image composite detection system of claim 9, wherein the plurality of ccd microscopes support a magnification of from 0.1 to 500.
11. The image composite detection system of claim 1, wherein the electron microscopy device comprises a desktop scanning electron microscope, a transmission electron microscope, or a scanning transmission electron microscope.
12. The image composite detection system of claim 11, wherein the electron microscopy device has a support magnification of from 30 to 50000.
13. The image composite inspection system of claim 1, further comprising an analysis tool for collecting secondary electron beams to analyze a material of the object.
14. The image composite inspection system of claim 1, further comprising an image navigation module that establishes respective coordinate systems and a reference coordinate system for the first optical microscope device, the second optical microscope device and the electron microscope device, respectively, wherein the respective coordinate systems are switched based on the reference coordinate system.
15. The image composite inspection system of claim 1, further comprising an automatic optical inspection module for generating the optical panoramic image by image segmentation, capture and collage.
16. The image composite detection system of claim 1, further comprising a base station carrying the first chamber, wherein the optical detection area is located within a footprint of the base station.
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Application publication date: 20200915