CN111664106A - Fan control method and fan control device - Google Patents
Fan control method and fan control device Download PDFInfo
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- CN111664106A CN111664106A CN201910175241.2A CN201910175241A CN111664106A CN 111664106 A CN111664106 A CN 111664106A CN 201910175241 A CN201910175241 A CN 201910175241A CN 111664106 A CN111664106 A CN 111664106A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/004—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying driving speed
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Abstract
The invention provides a fan control method, which is characterized in that gas is conveyed into a process chamber through a fan, and the rotating speed of the fan is controlled according to the change of process parameters adopted by a cleaning process, so that the energy consumption of the fan is reduced. The invention also provides a fan control device, which comprises an acquisition unit and a control unit, wherein the acquisition unit is used for acquiring the process parameters adopted by the cleaning process and sending the process parameters to the control unit; the control unit is used for controlling the rotating speed of the fan according to the change of the process parameters so as to reduce the energy consumption of the fan. The fan control method and the fan control device provided by the invention can save energy consumed by a cleaning process and reduce the cost of the cleaning process.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a fan control method and a fan control device.
Background
At present, in a semiconductor process, a wafer is usually required to be cleaned to remove pollutants attached to the wafer in the process, and the wafer is subjected to spin-drying treatment after cleaning to avoid adhesion of a cleaning agent on the surface of the cleaned wafer.
In the prior art, the cleaning apparatus includes a process chamber, a spin base, a fan (FFU) and an Exhaust outlet (Exhaust), wherein the spin base is disposed in the process chamber and used for carrying a wafer during a cleaning process, the fan is used for supplying air into the process chamber, the process chamber exhausts air through the Exhaust outlet, an air flow in the process chamber is constant during and before the cleaning process, and the fan operates at a full speed, and the Exhaust outlet is also opened to a maximum to ensure a high-speed air flow.
However, in practical applications, the fan does not need to operate at full speed in different stages of the cleaning process to achieve the process effect, and therefore, in the prior art, the fan operates at full speed all the time in the whole cleaning process, which results in energy waste.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a fan control method and a fan control device, which can save energy consumed by a cleaning process and reduce the cost of the cleaning process.
To achieve the object of the present invention, a method for controlling a blower for supplying gas into a process chamber includes the steps of:
and S1, controlling the rotating speed of the fan according to the change of the process parameters adopted by the cleaning process so as to reduce the energy consumption of the fan.
Preferably, the process parameter comprises the rotation speed of the base;
in step S1, the rotation speed of the fan is controlled so as to be in a direct proportional relationship with the rotation speed of the base.
Preferably, the step S1 further includes the steps of:
s11, judging whether the rotation speed of the base is in a first rotation speed range, a second rotation speed range or a third rotation speed range; if the speed is within the first rotating speed range, performing step S12; if the rotation speed is within the second rotation speed range, performing step S13; if the rotation speed is within the third rotation speed range, performing step S14; the maximum value of the first rotational speed range is smaller than the minimum value of the second rotational speed range; the maximum value of the second rotational speed range is smaller than the minimum value of the third rotational speed range;
s12, controlling the rotating speed of the fan within a first preset range;
s13, controlling the rotating speed of the fan within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S14, controlling the rotating speed of the fan within a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
Preferably, the process parameters further include a swing state of the spray arm, and the swing state includes a static state and a motion state;
the step S1 further includes the following steps:
s11, judging whether the swing state of the spray arm is the static state or the motion state, if the swing state is the static state, executing the step S12; if the motion state is true, judging whether the rotation speed of the base is in a first rotation speed range or a second rotation speed range;
if the speed is within the first rotating speed range, performing step S13; if the rotation speed is within the second rotation speed range, performing step S14; the maximum value of the first rotational speed range is smaller than the minimum value of the second rotational speed range;
s12, controlling the rotating speed of the fan within a first preset range;
s13, controlling the rotating speed of the fan within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S14, controlling the rotating speed of the fan within a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
Preferably, the first rotation speed range is less than 400 rad/min; the second rotating speed range is more than or equal to 400rad/min and less than 1900 rad/min; the third rotational speed range is greater than or equal to 1900 rad/min.
Preferably, the process parameters include process time;
in the step S1, the rotation speed of the fan is controlled according to a preset rule along with the accumulation of the process time.
Preferably, the step S1 further includes the steps of:
s101, judging whether the process time reaches a first time point, if not, controlling the rotating speed of the fan within a first preset range, and returning to the step S101; if yes, controlling the rotating speed of the fan within a second preset range, and performing step S102; the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
s102, judging whether the process time reaches a second time point, if not, controlling the rotating speed of the fan within a second preset range, and returning to the step S102; if so, controlling the rotating speed of the fan within a third preset range; the maximum value of the second preset range is less than or equal to the minimum value of the third preset range.
Preferably, in the step S1, the exhaust flow rate of the exhaust channel is controlled according to the change of the rotation speed of the fan, so as to ensure the stable air flow in the chamber.
Preferably, the exhaust flow rate of the exhaust passage is controlled so as to be in a direct proportional relationship with the rotation speed of the fan.
The invention also provides a fan control device, which comprises an acquisition unit and a control unit, wherein the acquisition unit is used for acquiring the process parameters adopted by the cleaning process and sending the process parameters to the control unit; the control unit is used for controlling the rotating speed of the fan according to the change of the process parameters so as to reduce the energy consumption of the fan.
The invention has the following beneficial effects:
according to the fan control method provided by the invention, the fan is used for conveying gas into the process chamber, and the rotating speed of the fan is controlled according to the change of the process parameters adopted by the cleaning process, so that the rotating speed of the fan is changed along with the change of the process parameters, and the fan can work at a lower rotating speed instead of the maximum rotating speed all the time in the whole cleaning process, thereby reducing the energy consumption of the fan in the cleaning process, further saving the energy consumed by the cleaning process and reducing the cost of the cleaning process.
The fan control device comprises an acquisition unit and a control unit, wherein the acquisition unit is used for acquiring process parameters adopted by a cleaning process and sending the process parameters to the control unit; the rotating speed of the fan is controlled by the control unit according to the change of the process parameters, so that the rotating speed of the fan is changed along with the change of the process parameters, and the fan can work at a lower rotating speed instead of the maximum rotating speed all the time in the whole cleaning process, thereby reducing the energy consumption of the fan in the cleaning process, saving the energy consumed by the cleaning process and reducing the cost of the cleaning process.
Drawings
FIG. 1 is a block flow diagram of a method for controlling a fan according to the present invention;
FIG. 2 is a block flow diagram of a first embodiment of a method of controlling a fan according to the present invention;
FIG. 3 is a block flow diagram illustrating another embodiment of a first exemplary embodiment of a method for controlling a wind turbine according to the present invention;
FIG. 4 is a block flow diagram of a second embodiment of a method of fan control according to the present invention;
FIG. 5 is a schematic structural diagram of a fan control apparatus according to the present invention;
FIG. 6 is a schematic structural diagram of a fan control apparatus according to the present invention;
description of reference numerals:
1-an acquisition unit; 2-a control unit; 3-a process chamber; 4-a rotating electrical machine; 5-an exhaust channel; 6, a fan; 7-adjusting valve; 8-adjusting the motor.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the fan control method and the fan control device provided by the present invention in detail with reference to the accompanying drawings.
Referring to fig. 1, the present embodiment provides a fan control method, in which a fan 6 is connected to a process chamber 3 and used for delivering gas into the process chamber 3, the fan control method includes the following steps:
and S1, controlling the rotating speed of the fan 6 according to the change of the process parameters adopted by the cleaning process so as to reduce the energy consumption of the fan 6.
According to the fan control method provided by the embodiment, the rotating speed of the fan 6 is controlled according to the change of the process parameters adopted by the cleaning process, so that the rotating speed of the fan 6 changes along with the change of the process parameters, and the fan 6 can work at a lower rotating speed instead of the maximum rotating speed all the time in the whole cleaning process, thereby reducing the energy consumption of the fan 6 in the cleaning process, further saving the energy consumed by the cleaning process, and reducing the cost of the cleaning process.
Specifically, in the process of the cleaning process, the process parameters adopted by the cleaning process change along with the cleaning process going to different cleaning stages so as to meet the process effect of the current cleaning stage, the rotating speed of the fan 6 is controlled according to the change of the process parameters adopted by the cleaning process, so that the rotating speed of the fan 6 changes along with the change of the process parameters, and the rotating speed of the fan 6 is also controlled to meet the process effect of the current cleaning stage.
In practical application, the process parameters of the cleaning process include the rotation speed of the base, the process time, the swing state of the spray arm, the flow rate of the liquid sprayed by the spray arm and the like, and the process parameters can be changed along with the cleaning process in different cleaning stages so as to meet the process effect of the current cleaning stage.
Specifically, the change of the rotating speed and the process time of the base in the loading stage, the cleaning stage, the spin-drying stage and the unloading stage of the cleaning process is taken as an example for explanation, wherein in the process from the loading stage to the cleaning stage of the cleaning process, the process time is increased, the rotating speed of the base in the cleaning stage is greater than that of the base in the loading stage, in the process from the cleaning stage to the spin-drying stage, the process time is continuously increased, the rotating speed of the base in the spin-drying stage is greater than that of the base in the cleaning stage, in the process from the spin-drying stage to the unloading stage, the process time is continuously increased, and the rotating speed of the base in the unloading stage is less than that of the base in the spin.
Optionally, the process parameter includes a rotation speed of the susceptor; in step S1, the rotation speed of the fan 6 is controlled so as to be in a proportional relationship with the rotation speed of the base.
Specifically, in the cleaning process, the fan 6 is used for supplying air into the process chamber 3, and the magnitude of the airflow in the process chamber 3 can be changed by changing the rotating speed of the fan 6, generally, the larger the rotating speed of the base is, the larger the airflow required by the cleaning process is, the smaller the rotating speed of the base is, and the smaller the airflow required by the cleaning process is, so that when the rotating speed of the fan 6 is controlled according to the rotating speed of the base, the rotating speed of the fan 6 is increased along with the increase of the rotating speed of the base and decreased along with the decrease of the rotating speed of the base, so that the energy consumption of the fan 6 is reduced, the energy consumption of the cleaning process is saved, the cost of the cleaning process is reduced.
As shown in fig. 2, in the first embodiment of the fan control method, step S1 further includes the following steps:
s11, judging whether the rotation speed of the base is in the first rotation speed range, the second rotation speed range or the third rotation speed range; if the speed is within the first speed range, the step S12 is carried out; if the rotation speed is within the second rotation speed range, the step S13 is carried out; if the rotation speed is within the third rotation speed range, the step S14 is carried out; the maximum value of the first rotation speed range is smaller than the minimum value of the second rotation speed range; the maximum value of the second rotational speed range is smaller than the minimum value of the third rotational speed range;
s12, controlling the rotating speed of the fan 6 within a first preset range;
s13, controlling the rotating speed of the fan 6 within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S14, controlling the rotating speed of the fan 6 in a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
Specifically, when the rotating speed of the base is judged to be in the first rotating speed range, the rotating speed of the fan 6 is controlled in the first preset range to reduce the energy consumption of the fan 6, so that the energy consumed by the cleaning process is saved, the cost of the cleaning process is reduced, the process requirement when the rotating speed of the base is in the first rotating speed range is met, when the rotating speed of the base is judged to be in the second rotating speed range, the rotating speed of the fan 6 is increased to the second preset range to meet the process requirement when the rotating speed of the base is in the second rotating speed range, and when the rotating speed of the base is judged to be in the third rotating speed range, the rotating speed of the fan 6 is controlled in the third preset range to meet the process requirement when the rotating speed of the base is in the third rotating speed range.
In the following, a loading stage, a cleaning stage, a spin-drying stage and an unloading stage in the cleaning process are taken as examples, wherein the loading stage is to place the wafer into the process chamber 3 and adjust the wafer to a process position in the process chamber 3, the cleaning stage is to clean the wafer at the process position, the spin-drying stage is to spin-dry the cleaning agent on the wafer, the unloading stage is to adjust the wafer to an unloading position in the process chamber 3 after the spin-drying stage so as to move the wafer out of the process chamber 3 to complete the cleaning process of the wafer, in the loading stage and the unloading stage, the rotation speed of the susceptor is within a first lower rotation speed range, only a smaller air flow is required in the process chamber 3, therefore, the rotation speed of the fan 6 can be controlled within a first lower preset range to reduce the energy consumption of the fan 6, in the cleaning stage, the cleaning agent needs to be uniformly sprayed to the surface of the wafer, at this time, the rotation speed of the susceptor is in a second rotation speed range higher than the first rotation speed range, and the air flow required in the process chamber 3 is also higher than that in the loading stage and the unloading stage, so that the rotation speed of the fan 6 needs to be controlled in a second preset range higher than the first preset range to increase the air flow in the process chamber 3, and in the spin-drying stage, in order to spin-dry the cleaning agent on the surface of the wafer, the rotation speed of the susceptor needs to be in a third larger rotation speed range, and the air flow required in the process chamber 3 is also higher than that in the cleaning stage, so that the rotation speed of the fan 6 needs to be controlled in a third preset range higher than the second preset range to further increase the air flow in the process chamber 3, and meet the process requirements in the spin-drying stage.
As shown in fig. 3, in another specific process of the first embodiment of the fan control method, the process parameters further include a swing state of the spray arm, and the swing state includes a stationary state and a moving state; step S1, further comprising the steps of:
s110, judging whether the swing state of the spray arm is a static state or a motion state, and if the swing state of the spray arm is the static state, performing the step S120; if the base is in the motion state, judging whether the rotating speed of the base is in a first rotating speed range or a second rotating speed range;
if the speed is within the first rotating speed range, the step S130 is carried out; if the rotation speed is within the second rotation speed range, the step S140 is carried out; the maximum value of the first rotation speed range is smaller than the minimum value of the second rotation speed range;
s120, controlling the rotating speed of the fan 6 within a first preset range;
s130, controlling the rotating speed of the fan 6 within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S140, controlling the rotating speed of the fan 6 in a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
Specifically, when the swinging state of the spray arm is judged to be a static state, the rotating speed of the fan 6 is controlled within a first preset range; when the swing state of the spray arm is judged to be the motion state, whether the rotating speed of the base is in a first rotating speed range or a second rotating speed range is continuously judged, when the rotating speed of the base is judged to be in the first rotating speed range, the rotating speed of the fan 6 is controlled to be in a second preset range, and when the rotating speed of the base is judged to be in the second rotating speed range, the rotating speed of the fan 6 is controlled to be in a third preset range.
Still taking the loading stage, the cleaning stage, the spin-drying stage and the unloading stage as an example in the cleaning process, the swinging state of the spray arm usually occurs in the cleaning stage and the spin-drying stage, in order to spray the cleaning agent or the drying agent to the surface of the wafer, the air flow required in the process chamber 3 is different in the two stages, and the rotation speed of the base is different in the cleaning stage and the spin-drying stage, so when the spray arm is in the swinging state, it is further determined whether the rotation speed of the base is in the first rotation speed range of the cleaning stage or in the second rotation speed range of the spin-drying stage, so as to control the rotation speed of the fan 6 to be in the second preset range or in the third preset range, so as to meet the process requirements of the cleaning stage and the spin-drying stage; the rest state of the spray arm usually occurs during the unloading phase of the loading phase, and the air flow required in the process chamber 3 is smaller and substantially the same as during the rinsing phase and the spin-drying phase, so that the rotation speed of the fan 6 can be directly controlled within the first predetermined range when the spray arm is judged to be in the rest state.
In this embodiment, the first range of rotational speeds is less than 400 rad/min; the second rotating speed range is more than or equal to 400rad/min and less than 1900 rad/min; the third speed range is greater than or equal to 1900 rad/min.
Specifically, the rotational speed of the susceptor is in a first rotational speed range, i.e., less than 400rad/min, during the loading and unloading stages, in a second rotational speed range, i.e., greater than or equal to 400rad/min and less than 1900rad/min, during the washing stage, and in a third rotational speed range, i.e., greater than or equal to 1900rad/min, during the spin-drying stage. However, in practical applications, the rotation speed of the base in the loading stage, the unloading stage, the washing stage and the spin-drying stage is not limited thereto.
In the present embodiment, in step S1, the exhaust flow rate of the exhaust passage 5 is controlled according to the change in the rotation speed of the fan 6 to ensure the stability of the airflow in the chamber.
In practical application, the rotating speed of the fan 6 is controlled according to the change of the process parameters adopted by the cleaning process, and meanwhile, the exhaust flow of the exhaust channel 5 is controlled according to the change of the rotating speed of the fan 6, so that the air inlet flow of the process chamber 3 is matched with the exhaust flow in the process of changing the air volume blown into the process chamber 3 by the fan 6, the condition of turbulent flow in the process chamber 3 is avoided, and the stability of the air flow in the process chamber 3 is kept.
In the present embodiment, the exhaust flow rate of the exhaust passage 5 is controlled so as to be in a direct proportional relationship with the rotation speed of the fan 6.
Specifically, the increase of the rotation speed of the fan 6 increases the intake flow rate of the process chamber 3, the decrease of the rotation speed of the fan 6 decreases the intake flow rate of the process chamber 3, and the increase of the exhaust flow rate of the exhaust duct 5 with the increase of the rotation speed of the fan 6 and the decrease of the rotation speed of the fan 6 increase the exhaust flow rate of the process chamber 3 with the increase of the intake flow rate and decrease of the exhaust flow rate with the decrease of the rotation speed of the fan 6, thereby preventing the occurrence of turbulence in the process chamber 3 and maintaining the stability of the air flow in the process chamber 3. In addition, in the cleaning stage and the spin-drying stage, when the pedestal works at a high rotating speed, the cleaning agent on the wafer splashes to the side wall of the process chamber 3 under the action of centrifugal force, so that the process chamber 3 is polluted, and by increasing the exhaust flow of the process chamber 3 when the rotating speed of the pedestal is at the high rotating speed, more cleaning agent can be sucked away from the process chamber 3, so that liquid drops splashed to the side wall of the process chamber 3 are reduced, and the pollution of the process chamber 3 is reduced.
As shown in fig. 4, in the second embodiment of the blower control method, the process parameter includes a process time; in step S1, the rotation speed of the fan 6 is controlled according to a preset rule as the process time is accumulated.
As a second embodiment of the fan control method, different from the first embodiment, the rotation speed of the fan 6 is controlled according to the process time, not according to the rotation speed of the base and the swing state of the spray arm, specifically, in the cleaning process, the process time is continuously accumulated along with the cleaning process, and the process stages correspond to different process times, so that the rotation speed of the fan 6 can be controlled according to the accumulation of the process time and according to the preset rule.
In this embodiment, step S1 further includes the following steps:
s101, judging whether the process time reaches a first time point, if not, controlling the rotating speed of the fan 6 within a first preset range, and returning to the step S101; if yes, controlling the rotating speed of the fan 6 within a second preset range, and performing step S102; the maximum value of the first preset range is less than or equal to the minimum value of the second preset range;
s102, judging whether the process time reaches a second time point, if not, controlling the rotating speed of the fan 6 within a second preset range, and returning to the step S102; if so, controlling the rotating speed of the fan 6 within a third preset range; the maximum value of the second preset range is less than or equal to the minimum value of the third preset range.
Taking the loading stage, the cleaning stage and the spin-drying stage of the cleaning process as an example, wherein the starting time point of the cleaning stage corresponds to a first time point, the starting time point of the spin-drying stage corresponds to a second time point, when the process time does not reach the first time point, the cleaning process is in the loading stage, the rotating speed of the fan 6 is controlled in a first preset range, when the process time reaches the first time point, the cleaning process is carried out to the cleaning stage, the cleaning process has larger air flow relative to the loading stage, therefore, the rotating speed of the fan 6 is controlled in the second preset range to meet the process requirements of the cleaning stage, whether the process time reaches the time point is continuously judged, if the process time does not reach the second time point, the cleaning process is still in the cleaning stage, and the rotating speed of the fan 6 is still controlled in the second preset range, when the process time reaches the second time point, the cleaning process proceeds to the spin-drying stage, and at this time, the cleaning process requires a larger airflow than the cleaning stage, so that the rotation speed of the fan 6 is controlled within a third preset range to meet the process requirements of the spin-drying stage.
It should be noted that the fan control method in the second embodiment also includes controlling the exhaust flow of the exhaust channel 5 according to the change of the rotation speed of the fan 6, and details thereof are not repeated here.
As shown in fig. 5 and fig. 6, the present embodiment further provides a fan control device, which includes an obtaining unit 1 and a control unit 2, where the obtaining unit 1 is configured to obtain a process parameter adopted by a cleaning process, and send the process parameter to the control unit 2; the control unit 2 is used for controlling the rotating speed of the fan 6 according to the change of the process parameters so as to reduce the energy consumption of the fan 6.
In the fan control device provided by this embodiment, the process parameters adopted by the cleaning process are acquired by the acquisition unit 1 and sent to the control unit 2; the rotating speed of the fan 6 is controlled by the control unit 2 according to the change of the process parameters, so that the rotating speed of the fan 2 changes along with the change of the process parameters, and the fan 2 can work at a lower rotating speed instead of the maximum rotating speed all the time in the whole cleaning process, thereby reducing the energy consumption of the fan 2 in the cleaning process, further saving the energy consumed by the cleaning process and reducing the cost of the cleaning process.
In practical application, the control unit 2 can control the rotation speed of the fan 6 through PLC control, encoder control and program control.
In practical applications, a rotating motor 4 is usually connected to the base, and the rotating motor 4 can control the rotating speed of the base.
In practical application, the exhaust channel 5 is communicated with the process chamber 3, the adjusting valve 7 can be arranged in the exhaust channel 5, the adjusting motor 8 connected with the adjusting valve 7 is arranged, the adjusting motor 8 is controlled to rotate by the control unit 2 to control the rotation angle of the adjusting valve 7 in the exhaust channel 5, so as to control the exhaust flow of the exhaust channel 5, wherein the adjusting valve 7 can adopt a butterfly valve, and the adjusting motor 8 can adopt a servo motor or a stepping motor.
As shown in fig. 6, the obtaining unit 1 sends the obtained process parameters adopted by the cleaning process to the control unit 2, and the control unit 2 controls the rotation speed of the fan 6 according to the change of the process parameters and controls the exhaust flow of the exhaust channel 5 according to the change of the rotation speed of the fan 6.
In summary, the fan control method and the fan control device provided in this embodiment can save energy consumed by the cleaning process, and reduce the cost of the cleaning process.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A method of controlling a blower for delivering gas into a process chamber, comprising the steps of:
and S1, controlling the rotating speed of the fan according to the change of the process parameters adopted by the cleaning process so as to reduce the energy consumption of the fan.
2. The fan control method of claim 1, wherein the process parameter comprises a rotational speed of the base;
in step S1, the rotation speed of the fan is controlled so as to be in a direct proportional relationship with the rotation speed of the base.
3. The fan control method according to claim 2, wherein the step S1 further comprises the steps of:
s11, judging whether the rotation speed of the base is in a first rotation speed range, a second rotation speed range or a third rotation speed range; if the speed is within the first rotating speed range, performing step S12; if the rotation speed is within the second rotation speed range, performing step S13; if the rotation speed is within the third rotation speed range, performing step S14; the maximum value of the first rotational speed range is smaller than the minimum value of the second rotational speed range; the maximum value of the second rotational speed range is smaller than the minimum value of the third rotational speed range;
s12, controlling the rotating speed of the fan within a first preset range;
s13, controlling the rotating speed of the fan within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S14, controlling the rotating speed of the fan within a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
4. The fan control method according to claim 2, wherein the process parameters further include a swing state of the spray arm, the swing state including a stationary state and a moving state;
the step S1 further includes the following steps:
s11, judging whether the swing state of the spray arm is the static state or the motion state, if the swing state is the static state, executing the step S12; if the motion state is true, judging whether the rotation speed of the base is in a first rotation speed range or a second rotation speed range;
if the speed is within the first rotating speed range, performing step S13; if the rotation speed is within the second rotation speed range, performing step S14; the maximum value of the first rotational speed range is smaller than the minimum value of the second rotational speed range;
s12, controlling the rotating speed of the fan within a first preset range;
s13, controlling the rotating speed of the fan within a second preset range, wherein the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
and S14, controlling the rotating speed of the fan within a third preset range, wherein the maximum value of the second preset range is smaller than or equal to the minimum value of the third preset range.
5. The fan control method of claim 3, wherein the first range of rotational speeds is less than 400 rad/min; the second rotating speed range is more than or equal to 400rad/min and less than 1900 rad/min; the third rotational speed range is greater than or equal to 1900 rad/min.
6. The fan control method according to claim 1, wherein the process parameter comprises a process time;
in the step S1, the rotation speed of the fan is controlled according to a preset rule along with the accumulation of the process time.
7. The fan control method according to claim 6, wherein the step S1 further comprises the steps of:
s101, judging whether the process time reaches a first time point, if not, controlling the rotating speed of the fan within a first preset range, and returning to the step S101; if yes, controlling the rotating speed of the fan within a second preset range, and performing step S102; the maximum value of the first preset range is smaller than or equal to the minimum value of the second preset range;
s102, judging whether the process time reaches a second time point, if not, controlling the rotating speed of the fan within a second preset range, and returning to the step S102; if so, controlling the rotating speed of the fan within a third preset range; the maximum value of the second preset range is less than or equal to the minimum value of the third preset range.
8. The fan control method according to any one of claims 1 to 7, wherein in the step S1, an exhaust flow rate of an exhaust passage is controlled according to a change in a rotation speed of the fan to ensure a stable airflow in the chamber.
9. The fan control method according to claim 8, wherein an exhaust flow rate of the exhaust passage is controlled so as to be in a direct proportional relationship with a rotation speed of the fan.
10. The fan control device is characterized by comprising an acquisition unit and a control unit, wherein the acquisition unit is used for acquiring process parameters adopted by a cleaning process and sending the process parameters to the control unit; the control unit is used for controlling the rotating speed of the fan according to the change of the process parameters so as to reduce the energy consumption of the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910175241.2A CN111664106B (en) | 2019-03-08 | 2019-03-08 | Fan control method and fan control device |
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| KR20170073294A (en) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | Rinsing and drying device |
| CN206862015U (en) * | 2017-04-11 | 2018-01-09 | 安徽高芯众科半导体有限公司 | Ultra-clean drying equipment for photoelectricity parts |
| CN108240740A (en) * | 2016-12-26 | 2018-07-03 | 北京北方华创微电子装备有限公司 | A kind of drying equipment |
| CN108352312A (en) * | 2015-12-24 | 2018-07-31 | 爱思开矽得荣株式会社 | Wafer polishing chamber and the wafer polishing system for including wafer polishing chamber |
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| CN103008312A (en) * | 2012-11-29 | 2013-04-03 | 北京七星华创电子股份有限公司 | Air conditioning monitoring system |
| KR20170073294A (en) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | Rinsing and drying device |
| CN108352312A (en) * | 2015-12-24 | 2018-07-31 | 爱思开矽得荣株式会社 | Wafer polishing chamber and the wafer polishing system for including wafer polishing chamber |
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