CN111642122A - Electromagnetic shielding structure and manufacturing method thereof - Google Patents
Electromagnetic shielding structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN111642122A CN111642122A CN202010463597.9A CN202010463597A CN111642122A CN 111642122 A CN111642122 A CN 111642122A CN 202010463597 A CN202010463597 A CN 202010463597A CN 111642122 A CN111642122 A CN 111642122A
- Authority
- CN
- China
- Prior art keywords
- electromagnetic shielding
- shielding layer
- module
- packaging
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The embodiment of the invention provides an electromagnetic shielding structure and a manufacturing method thereof, wherein the electromagnetic shielding structure comprises a packaging module, a first electromagnetic shielding layer and a second electromagnetic shielding layer, wherein the packaging module comprises a top surface, a bottom surface and a plurality of side surfaces; the first electromagnetic shielding layer is connected with the top surface of the packaging module; the second electromagnetic shielding layer is connected with the bottom surface of the packaging module in a grounding mode, the second electromagnetic shielding layer is connected with the side surface of the packaging module, and the second electromagnetic shielding layer located on the side surface of the packaging module is connected with the first electromagnetic shielding layer in a grounding mode. In the embodiment of the invention, the first electromagnetic shielding layer and the second electromagnetic shielding layer can carry out electromagnetic shielding on all outer surfaces (including the bottom surface) of the packaging module, so that the electromagnetic shielding performance of the electromagnetic shielding structure is effectively improved, and the grounding is realized without additionally arranging a grounding bonding pad or a wire-planting port in the plastic packaging colloid, so that the size of the electromagnetic shielding structure can be effectively reduced.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure.
Background
At present, a plurality of circuit modules, such as a WLAN (Wireless Local area network) module, a BT (Bluetooth) module, a positioning module, and an RF (Radio Frequency) module, are usually packaged inside a package module. When the packaging module operates, a large amount of electromagnetic interference signals are generated among the circuit modules. Therefore, it is particularly important to electromagnetically shield the package module.
In order to achieve electromagnetic shielding of the package module, in the electromagnetic shielding structure in the prior art, a Sputtering (Sputtering) process is generally used to sputter an electromagnetic shielding material on each circuit module at the top of the package module and on the side surface of the package module, or a spraying (spraying) process is used to Spray the electromagnetic shielding material on each circuit module at the top of the package module and on the side surface of the package module, and a plurality of grounding pads or a plurality of wire-planting ports are arranged in a plastic molding colloid at the top of the package module to achieve grounding of the electromagnetic shielding material.
However, the electromagnetic shielding structure in the prior art has the following disadvantages: because the grounding of the electromagnetic shielding material is realized by additionally arranging a plurality of grounding bonding pads or a plurality of wire planting ports in the plastic package colloid, the grounding bonding pads or the wire planting ports additionally occupy the area of the top of the packaging module, and the size of the electromagnetic shielding structure is large.
Disclosure of Invention
In view of the above problems, an object of the embodiments of the present invention is to provide an electromagnetic shielding structure and a method for manufacturing the electromagnetic shielding structure, so as to solve the problem of the prior art that the size of the electromagnetic shielding structure is large.
In order to solve the above problems, an embodiment of the present invention discloses an electromagnetic shielding structure, which includes a package module, a first electromagnetic shielding layer, and a second electromagnetic shielding layer,
the package module comprises a top surface, a bottom surface and a plurality of side surfaces;
the first electromagnetic shielding layer is connected with the top surface of the packaging module;
the second electromagnetic shielding layer is connected with the bottom surface of the packaging module in a grounding mode, the second electromagnetic shielding layer is connected with the side surface of the packaging module and located on the side surface of the packaging module, and the second electromagnetic shielding layer is connected with the first electromagnetic shielding layer in a grounding mode.
In order to solve the above problem, an embodiment of the present invention further discloses a method for manufacturing an electromagnetic shielding structure, including:
forming a packaging jointed board; the packaging jointed board comprises a connecting region and a first packaging module and a second packaging module which are connected with the connecting region;
forming a first electromagnetic shielding layer on the top surface of the packaging jointed board;
cutting from the bottom surface of the connecting region to the top surface of the connecting region to form a gap; the gap extends to a top surface of the connection region; the top surface of the connecting area and the top surface of the packaging jointed board are on the same side;
forming second electromagnetic shielding layers on the bottom surface and the side surfaces of the packaging jointed board, and filling the second electromagnetic shielding layers in the gaps; the second electromagnetic shielding layer is respectively connected with the bottom surfaces of the first packaging module and the second packaging module in a grounding manner, and the second electromagnetic shielding layer positioned in the gap and the side surface of the packaging spliced plate is connected with the first electromagnetic shielding layer in a grounding manner;
and cutting the first electromagnetic shielding layer, the packaging jointed board and the second electromagnetic shielding layer along the gap to obtain the electromagnetic shielding structure corresponding to the first packaging module and the electromagnetic shielding structure corresponding to the second packaging module.
The embodiment of the invention has the following advantages: all outer surfaces (including the bottom surface) of the packaging module are electromagnetically shielded through the first electromagnetic shielding layer and the second electromagnetic shielding layer, and the first electromagnetic shielding layer and the second electromagnetic shielding layer form a shielding body, so that the electromagnetic shielding performance of the electromagnetic shielding structure is effectively improved; in addition, set up the bottom surface ground connection of second electromagnetic shield layer and encapsulation module, second electromagnetic shield layer and first electromagnetic shield layer ground connection, can realize first electromagnetic shield layer and second electromagnetic shield layer ground connection, need not additionally to set up a plurality of ground connection pads or a plurality of wire planting ports and realize first electromagnetic shield layer, second electromagnetic shield layer ground connection in the plastic envelope colloid, effectively reduced electromagnetic shielding structure's size.
Drawings
Fig. 1 is a schematic structural view of an embodiment of an electromagnetic shielding structure of the present invention;
fig. 2 is a schematic cross-sectional view of a second electromagnetic shielding layer in an embodiment of an electromagnetic shielding structure of the present invention;
fig. 3 is a schematic bottom structure diagram of a package module according to an embodiment of the electromagnetic shielding structure of the present invention;
fig. 4 is a schematic structural diagram of a second electromagnetic shielding layer in an embodiment of an electromagnetic shielding structure of the present invention;
FIG. 5 is a flowchart illustrating steps in an embodiment of a method of manufacturing an electromagnetic shielding structure according to the present invention;
fig. 6 is a flow chart illustrating steps of another embodiment of a method of manufacturing an electromagnetic shielding structure of the present invention;
fig. 7 is a schematic structural diagram of a package carrier with a top surface completed with circuit module soldering according to an embodiment of the method for manufacturing an electromagnetic shielding structure of the present invention;
fig. 8 is a schematic view illustrating a plastic encapsulant material, a first electromagnetic shielding layer material, and a package carrier board being pressed together according to an embodiment of the method for manufacturing an electromagnetic shielding structure of the present invention;
FIG. 9 is a schematic structural view of the package panel after step 20 of one embodiment of a method for manufacturing an electromagnetic shielding structure according to the present invention;
FIG. 10 is a schematic structural diagram of a package panel having a bottom surface for circuit module soldering according to an embodiment of the method for manufacturing an electromagnetic shielding structure of the present invention;
FIG. 11 is a schematic structural view of a package panel after forming a gap according to an embodiment of the method for manufacturing an electromagnetic shielding structure of the present invention;
fig. 12 is a schematic view illustrating the pressing of the second electromagnetic shielding layer and the package splicing board according to the embodiment of the method for manufacturing an electromagnetic shielding structure of the present invention;
fig. 13 is a schematic structural view of a second electromagnetic shielding layer and a package panel after being pressed together according to an embodiment of a method for manufacturing an electromagnetic shielding structure of the present invention.
Description of reference numerals: 1-packaging module, 2-first electromagnetic shielding layer, 3-second electromagnetic shielding layer, 11-packaging carrier plate, 12-wafer level packaging structure, 13-active element, 14-passive element, 15-plastic package colloid, 16-grounding device, 17-first circuit module, 18-second circuit module, 19-connector, 10-gap, 31-first metal film, 32-first insulating film, 33-second insulating film, 34-first through hole, 311-first sub-region, 312-second sub-region, 313-third sub-region.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1, which shows a schematic structural diagram of an electromagnetic shielding structure embodiment of the present invention, specifically, the electromagnetic shielding structure may include a package module 1, a first electromagnetic shielding layer 2, and a second electromagnetic shielding layer 3, where the package module 1 includes a top surface, a bottom surface, and a plurality of side surfaces; the first electromagnetic shielding layer 2 is connected with the top surface of the packaging module 1; the second electromagnetic shielding layer 3 is connected with the bottom surface of the packaging module 1 in a grounding manner, the second electromagnetic shielding layer 3 is connected with the side surface of the packaging module 1, and the second electromagnetic shielding layer 3 positioned on the side surface of the packaging module 1 is connected with the first electromagnetic shielding layer 2 in a grounding manner.
Specifically, the package module 1 may be a package module having any structure, and the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3 may be implemented by any electromagnetic shielding material. For example, as shown in fig. 1, in an embodiment of the invention, the package module 1 may include a package carrier 11, a circuit module (e.g., a wafer level package structure 12, an active device 13, a passive device 14, etc.), a molding compound 15, and the like.
Alternatively, the top layout of the package module 1 may have more circuit modules (e.g., the wafer level package structure 12, the active device 13, or the passive device 14, etc.) than the bottom layout of the package module 1 (e.g., the wafer level package structure 12, the active device 13, or the passive device 14, etc.).
Alternatively, the plurality of sides may be three or more sides.
According to the embodiment of the invention, electromagnetic shielding is performed on all outer surfaces (including the bottom surface) of the packaging module 1 through the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3, and the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3 form a shielding body, so that the electromagnetic shielding performance of the electromagnetic shielding structure is effectively improved; in addition, as the electromagnetic shielding layers (the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3) are connected with the outer surface of the packaging module 1, compared with the existing electromagnetic shielding structure applying the metal shielding cover, the electromagnetic shielding structure of the embodiment of the invention has the advantages that the height is greatly reduced, and the size is effectively reduced; in addition, because the second electromagnetic shielding layer 3 is connected with the bottom surface ground of the packaging module 1, the second electromagnetic shielding layer 3 is connected with the first electromagnetic shielding layer 2, so that the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3 can be grounded, a plurality of grounding welding pads or a plurality of wire-planting ports do not need to be additionally arranged in the plastic package colloid to realize the grounding of the first electromagnetic shielding layer 2 and the second electromagnetic shielding layer 3, and the size of the electromagnetic shielding structure is effectively reduced.
Alternatively, as shown in fig. 1, a ground device 16 such as a ground line or a land connected to ground may be disposed on the bottom surface of the package module 1, and the second electromagnetic shield layer 3 includes a first metal film 31, and the first metal film 31 is connected to the ground device 16. Because the grounding device 16 is arranged on the bottom surface of the packaging module 1, and because the number of the vacant areas on the bottom surface of the packaging module 1 is large (the bottom surface of the packaging module 1 is not provided with the plastic packaging adhesive layer), the size, the number and the position of the grounding device 16 can be set as required, and the connection area between the first metal film 31 and the bottom surface of the packaging module 1 is large, so that the connection is not easy to break, thereby realizing large-area reliable grounding and ensuring the electromagnetic shielding performance of the electromagnetic shielding structure.
Alternatively, the first electromagnetic shielding layer 2 may be a second metal film. This second metal film can also dispel the heat to the top surface of encapsulation module 1 when carrying out the electromagnetic shield to encapsulation module 1, has effectively improved electromagnetic shield structure's heat dispersion. For example, in the case that the top surface of the package module 1 is a plastic molding surface, the first electromagnetic shielding layer 2 is a second metal film, and due to poor heat dissipation of the plastic molding surface, after the second metal film is connected with the plastic molding surface, the plastic molding surface can be rapidly cooled.
Alternatively, as shown in fig. 1, the first metal film 31 may include a first sub-region 311, the first sub-region 311 is located at a side surface of the package module 1, and the first sub-region 311 is connected with the side surface (the whole side surface or a part of the side surface close to the first electromagnetic shielding layer 2) of the package module 1 and the first electromagnetic shielding layer 2. Since the first metal film 31 is connected to the grounding device 16, that is, the first metal film 31 is grounded, after the first sub-region 311 is connected to the side surface of the package module 1 and the first electromagnetic shielding layer 2, that is, the first sub-region 311 is connected to the second metal film, the second metal film is grounded.
Alternatively, as shown in fig. 1 and 3, the first circuit module 17 with an insulated outer surface may be disposed on the bottom surface of the package module 1, and as shown in fig. 1, the first metal film 31 may include a second sub-region 312, and the second sub-region 312 is connected to the first circuit module 17 and the bottom surface of the package module 1. So that the first circuit module 17, the outer surface of which is insulated, is electromagnetically shielded by the second sub-section 312.
Alternatively, as shown in fig. 1, the second circuit module 18 having a conductive outer surface may be disposed on the bottom surface of the package module 1, the second electromagnetic shield layer 3 may further include a first insulating film 32, the first metal film 31 may include a third sub-region 313, the first insulating film 32 is connected to the second circuit module 18 and the bottom surface of the package module 1, and the third sub-region 313 is connected to the first insulating film 32. The first insulating film 32 is provided between the second circuit module 18 and the third sub-area 313, so that even if the outer surface of the second circuit module 18 is electrically conductive, the second circuit module 18 and the third sub-area 313 are not electrically conductive, the grounding of the second electromagnetic shield layer 3 is ensured, and the third sub-area 313 is ensured to electromagnetically shield the second circuit module 18 whose outer surface is electrically conductive.
The first circuit module 17 with the insulated outer surface ensures the electromagnetic shielding performance only through the second sub-region 312, and the second circuit module 18 with the conductive outer surface ensures the electromagnetic shielding performance through the third sub-region 313 and the first insulating film 32, so that different shielding modes for different circuit modules are realized, and the material cost is saved.
Alternatively, the first metal film 31, the second metal film, and the first insulating film 32 may be flexible films, and since the flexible films have plasticity, the first electromagnetic shielding layer 2 may be laminated on the top surface of the package module 1 by a compression molding process apparatus or a vacuum lamination process apparatus, and the second electromagnetic shielding layer 3 may be laminated on the bottom surface and the side surface of the package module 1 by a compression molding process apparatus or a vacuum lamination process apparatus, so that the electromagnetic shielding layers (the first electromagnetic shielding layer 2, the second electromagnetic shielding layer 3) and the package module 1 are reliably connected, and at this time, the shapes of the electromagnetic shielding layers (the first electromagnetic shielding layer 2, the second electromagnetic shielding layer 3) are consistent with the shape of the package module 1.
Optionally, in a case that the package module 1 includes the plastic package colloid 15, the top surface of the package module 1 may be a plastic package colloid surface, and the plastic package colloid surface may be disposed on the package carrier 11 and the circuit module on the package carrier 11, and when the electromagnetic shielding structure is manufactured, the plastic package colloid surface may be formed by a compression molding process device or a vacuum press-fit process device and simultaneously press-fit the plastic package colloid surface and the second metal film.
The first electromagnetic shielding layer 2 can be pressed on the top surface of the packaging module 1 through compression molding process equipment or vacuum pressing process equipment, the second electromagnetic shielding layer 3 is pressed on the bottom surface and the side surface of the packaging module 1 through compression molding process equipment or vacuum pressing process equipment, and the plastic packaging adhesive surface is simultaneously formed and pressed with the second metal film through compression molding process equipment or vacuum pressing process equipment.
Optionally, as shown in fig. 2, the second electromagnetic shielding layer 3 may further include a second insulating film 33, and the second insulating film 33 is disposed on the first metal film 31 to improve the insulating performance of the electromagnetic shielding structure, wherein the sum of the thicknesses of the first insulating film 32, the first metal film 31, and the second insulating film 33 may be 45-55um, which is much smaller than the height of the existing electromagnetic shielding cover, thereby effectively reducing the size of the electromagnetic shielding structure.
Alternatively, the first insulating film 32 and the second insulating film 33 may be made of a high molecular material epoxy resin or the like, and the strength of the first insulating film 32 is greater than or equal to a preset strength to prevent the first insulating film 32 from being pierced by the electronic components in the second circuit module 18. Alternatively, the first metal film 31 and the second metal film may be composed of conductive metal particles, which may be silver particles, copper particles, stainless steel particles, or the like.
Alternatively, as shown in fig. 1 and 3, the connector 19 may be disposed on the bottom surface of the package module 1, and as shown in fig. 4, the second electromagnetic shielding layer 3 is disposed with a first through hole 34, and the first through hole 34 is disposed corresponding to the connector 19. Thereby exposing the connector 19 to facilitate connection of the connector 19 to other devices. Optionally, when other devices to be exposed are disposed on the package module 1, a second through hole is disposed on the second electromagnetic shielding layer 3, and the second through hole is disposed corresponding to the other devices to be exposed.
The electromagnetic shielding structure of the embodiment of the invention has the following advantages: all outer surfaces (including the bottom surface) of the packaging module are electromagnetically shielded through the first electromagnetic shielding layer and the second electromagnetic shielding layer, and the first electromagnetic shielding layer and the second electromagnetic shielding layer form a shielding body, so that the electromagnetic shielding performance of the electromagnetic shielding structure is effectively improved; because the electromagnetic shielding layers (the first electromagnetic shielding layer and the second electromagnetic shielding layer) are connected with the outer surface of the packaging module, compared with the existing electromagnetic shielding structure applying the metal shielding cover, the electromagnetic shielding structure of the embodiment of the invention has the advantages that the height is greatly reduced, the size is effectively reduced, and compared with the existing sputtering or spraying electromagnetic shielding material, because the electromagnetic shielding layers are complete films, the electromagnetic shielding layers are not easy to fall off, and the electromagnetic shielding performance is better; in addition, because the second electromagnetic shielding layer is connected with the bottom surface of the packaging module in a grounding manner, and the number of idle areas on the bottom surface of the packaging module is large (no plastic packaging adhesive layer is arranged on the bottom surface of the packaging module), compared with the conventional electromagnetic shielding structure which is grounded from the side surface of the packaging module, the embodiment of the invention can realize large-area reliable grounding on the bottom surface of the packaging module, thereby ensuring the electromagnetic shielding performance of the electromagnetic shielding structure; because the second electromagnetic shield layer is connected with the bottom surface ground connection of encapsulation module, the second electromagnetic shield layer is connected with the ground connection of first electromagnetic shield layer, can realize first electromagnetic shield layer and the ground connection of second electromagnetic shield layer, need not additionally to set up a plurality of ground connection pads or a plurality of wire planting ports in the plastic envelope colloid and come first electromagnetic shield layer and second electromagnetic shield layer and realize ground connection, effectively reduced electromagnetic shielding structure's size.
Referring to fig. 5, which shows a flowchart of steps of an embodiment of a method for manufacturing an electromagnetic shielding structure of the present invention, the method may specifically include the following steps:
The package module may be a package module having any structure, for example, the package module may include a package carrier, a wafer level package structure, an active device, a passive device, a plastic encapsulant, and the like. The connection area may include a package carrier, a plastic molding compound, and the like.
Alternatively, the package jointed board may include a package carrier, and step 10 may form a plastic molding colloid on the top surface of the package carrier by using a compression molding process device or a vacuum lamination process device, so as to obtain the package jointed board with the plastic molding colloid.
Alternatively, the first and second package modules may be one or at least two.
Alternatively, the first and second package modules may be package modules having the same function or package modules having different functions.
And 20, forming a first electromagnetic shielding layer on the top surface of the packaging jointed board.
Alternatively, the first electromagnetic shielding layer may be implemented by any electromagnetic shielding material.
Alternatively, the second electromagnetic shielding layer may be implemented by any electromagnetic shielding material.
Alternatively, there may be more circuit modules laid out on the top side of the package module than on the bottom side of the package module.
And step 50, cutting the first electromagnetic shielding layer, the packaging jointed board and the second electromagnetic shielding layer along the gap to obtain an electromagnetic shielding structure corresponding to the first packaging module and an electromagnetic shielding structure corresponding to the second packaging module.
After the first electromagnetic shielding layer, the packaging jointed board and the second electromagnetic shielding layer are cut along the gap, the cutting surface is used as the side surface of the packaging module (the first packaging module and the second packaging module).
Optionally, the electromagnetic shielding structure corresponding to the first package module and the electromagnetic shielding structure corresponding to the second package module may be the electromagnetic shielding structures shown in fig. 1.
Through the steps 10 to 50, the electromagnetic shielding of the whole packaging jointed board (including at least two packaging modules) can be realized to obtain at least two electromagnetic shielding structures, and compared with the prior art that only a single packaging module can be subjected to electromagnetic shielding to obtain a single electromagnetic shielding structure, the production efficiency of obtaining the electromagnetic shielding structure is effectively improved.
Optionally, the top surface of the package panels may be a plastic molding compound surface (e.g., a surface of a plastic molding compound), as shown in fig. 6, and the step 20 of forming the first electromagnetic shielding layer on the top surface of the package panels may include:
and 21, pressing the first electromagnetic shielding layer on the plastic packaging rubber surface.
Optionally, in step 10, when a compression molding process device or a vacuum lamination process device is used to form the plastic package adhesive surface on the top surface of the package carrier, step 20 may be simultaneously completed, that is, the compression molding process device or the vacuum lamination process device is simultaneously used to perform the lamination connection between the plastic package adhesive surface and the first electromagnetic shielding layer.
Optionally, as shown in fig. 6, step 40 is to form a second electromagnetic shielding layer on the bottom surface and the side surface of the package splicing board, and fill the second electromagnetic shielding layer in the gap; the second electromagnetic shielding layer is grounded to the bottom surfaces of the first package module and the second package module, respectively, and may include:
In step 41, the second electromagnetic shielding layer may be pressed on the bottom surface of the package splicing board, the side surface of the package splicing board and in the gap by using a compression molding process device or a vacuum pressing process device, and the second electromagnetic shielding layer may automatically fill the gap due to the pressurization and high temperature treatment of the second electromagnetic shielding layer during the pressing process by using the compression molding process device or the vacuum pressing process device.
Optionally, in an embodiment of the present invention, after the package carrier is formed in step 10, the circuit module (and/or electronic component) corresponding to the top surface of the first package module and the circuit module (and/or electronic component) corresponding to the top surface of the second package module are soldered on the top surface of the package carrier, where the soldering of the circuit module (and/or electronic component) on the package carrier can be achieved through a solder paste printing process, a die attach process, and a reflow soldering process, and the package carrier having the top surface on which the circuit module is soldered is subjected to plasma cleaning, drying, and the like. A package carrier with a top surface for soldering electronic components is shown in fig. 7. And then step 10, forming a plastic packaging adhesive surface on the top surface of the packaging carrier plate by using compression molding process equipment or vacuum lamination process equipment, and simultaneously completing step 20, namely, performing compression connection on the plastic packaging adhesive surface and the first electromagnetic shielding layer by using compression molding process equipment or vacuum lamination process equipment. In fig. 8, 4 is an upper mold of the compression molding process equipment or the vacuum lamination process equipment, 5 is a lower mold of the compression molding process equipment or the vacuum lamination process equipment, 6 is a plastic packaging adhesive material, 7 is a material of the first electromagnetic shielding layer, and a direction indicated by an arrow is a lamination direction of the compression molding process equipment or the vacuum lamination process equipment. After step 20, the structure of the package panels is shown in fig. 9. And step 10, soldering the circuit module (and/or electronic component) corresponding to the bottom surface of the first package module, the circuit module (and/or electronic component) corresponding to the bottom surface of the second package module, and the connector to the bottom surface of the package carrier, so as to form a package panel with a first electromagnetic shielding layer, where the package panel is as shown in fig. 10. And step 30, cutting from the bottom surface of the connection region to the top surface of the connection region to form a gap and expose the first electromagnetic shielding layer. The package panels are shown in fig. 11, where 10 is the gap in fig. 11. And step 40, pressing the second electromagnetic shielding layer on the bottom surface of the packaging jointed board, the side surface of the packaging jointed board and in the gap by adopting compression molding process equipment or vacuum pressing process equipment to realize the grounding of the second electromagnetic shielding layer, connecting the second electromagnetic shielding layer in the gap and the side surface of the packaging jointed board with the first electromagnetic shielding layer, and realizing the grounding of the first electromagnetic shielding layer. The compression molding process equipment or the vacuum compression process equipment has the upper mold and the lower mold for compressing the package jointed board and the second electromagnetic shielding layer as shown in fig. 12, and the package jointed board after compressing the second electromagnetic shielding layer is shown in fig. 13. Step 50, cutting the first electromagnetic shielding layer, the packaging jointed board and the second electromagnetic shielding layer along the gap to obtain an electromagnetic shielding structure corresponding to the first packaging module and an electromagnetic shielding structure corresponding to the second packaging module, as shown in fig. 1.
The manufacturing method of the electromagnetic shielding structure provided by the embodiment of the invention has the following advantages: the first electromagnetic shielding layer is arranged to be connected with the top surface of the packaging module; and the second electromagnetic shielding layer is arranged to be connected with the bottom surface of the packaging module in a grounding mode, the second electromagnetic shielding layer is connected with the side surface of the packaging module, and the second electromagnetic shielding layer located on the side surface of the packaging module is connected with the first electromagnetic shielding layer in a grounding mode. Therefore, the first electromagnetic shielding layer and the second electromagnetic shielding layer carry out electromagnetic shielding on all outer surfaces (including the bottom surface) of the packaging module, and the first electromagnetic shielding layer and the second electromagnetic shielding layer form a shielding body, so that the electromagnetic shielding performance of the electromagnetic shielding structure is effectively improved; because the electromagnetic shielding layers (the first electromagnetic shielding layer and the second electromagnetic shielding layer) are connected with the outer surface of the packaging module, compared with the existing electromagnetic shielding structure applying the metal shielding cover, the electromagnetic shielding structure of the embodiment of the invention has the advantages that the height is greatly reduced, the size is effectively reduced, and compared with the existing sputtering or spraying electromagnetic shielding material, because the electromagnetic shielding layers are complete films, the electromagnetic shielding layers are not easy to fall off, and the electromagnetic shielding performance is better; in addition, as the second electromagnetic shielding layer is grounded with the bottom surface of the packaging module, and the number of idle areas on the bottom surface of the packaging module is large (no plastic packaging adhesive layer is arranged on the bottom surface of the packaging module), compared with the conventional electromagnetic shielding structure which is grounded from the side surface of the packaging module, the embodiment of the invention can realize large-area reliable grounding on the bottom surface of the packaging module, thereby ensuring the electromagnetic shielding performance of the electromagnetic shielding structure; the second electromagnetic shielding layer is grounded with the bottom surface of the packaging module, and the second electromagnetic shielding layer is grounded with the first electromagnetic shielding layer, so that the first electromagnetic shielding layer and the second electromagnetic shielding layer can be grounded, and a plurality of grounding bonding pads or a plurality of wire-planting ports do not need to be additionally arranged in the plastic packaging colloid to realize the grounding of the first electromagnetic shielding layer and the second electromagnetic shielding layer, so that the size of the electromagnetic shielding structure is effectively reduced; the embodiment of the invention can also realize electromagnetic shielding on the whole packaging jointed board (comprising at least two packaging modules) to obtain at least two electromagnetic shielding structures, and compared with the prior art that only a single packaging module can be subjected to electromagnetic shielding to obtain a single electromagnetic shielding structure, the invention effectively improves the production efficiency of obtaining the electromagnetic shielding structure.
The method for manufacturing an electromagnetic shielding structure according to an embodiment of the present invention is used for manufacturing the electromagnetic shielding structure, and details thereof are not repeated below with reference to the description of the electromagnetic shielding structure.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing terminal to cause a series of operational steps to be performed on the computer or other programmable terminal to produce a computer implemented process such that the instructions which execute on the computer or other programmable terminal provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The present invention provides an electromagnetic shielding structure and a method for manufacturing the same, which are described in detail above, and the principle and the embodiment of the present invention are explained herein by using specific examples, and the description of the above examples is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. An electromagnetic shielding structure is characterized by comprising a packaging module, a first electromagnetic shielding layer and a second electromagnetic shielding layer,
the package module comprises a top surface, a bottom surface and a plurality of side surfaces;
the first electromagnetic shielding layer is connected with the top surface of the packaging module;
the second electromagnetic shielding layer is connected with the bottom surface of the packaging module in a grounding mode, the second electromagnetic shielding layer is connected with the side surface of the packaging module and located on the side surface of the packaging module, and the second electromagnetic shielding layer is connected with the first electromagnetic shielding layer in a grounding mode.
2. The electromagnetic shielding structure according to claim 1, wherein a grounding device is disposed on a bottom surface of the encapsulation module, and the second electromagnetic shielding layer includes a first metal film, and the first metal film is connected to the grounding device.
3. The electromagnetic shielding structure of claim 2, wherein the first electromagnetic shielding layer is a second metal film.
4. The electromagnetic shielding structure of claim 3, wherein the first metal film comprises a first sub-region located at a side of the package module, the first sub-region being connected with the side of the package module and the first electromagnetic shielding layer.
5. The electromagnetic shielding structure according to claim 2, wherein a first circuit module having an insulated outer surface is disposed on a bottom surface of the encapsulation module, and the first metal film includes a second sub-region connected to the first circuit module and the bottom surface of the encapsulation module.
6. The electromagnetic shielding structure according to claim 2, wherein a second circuit module having an outer surface that is electrically conductive is disposed on the bottom surface of the package module, the second electromagnetic shielding layer further comprises a first insulating film, the first metal film comprises a third sub-region, the first insulating film is connected to the second circuit module and the bottom surface of the package module, and the third sub-region is connected to the first insulating film.
7. The emi shielding structure of claim 1, wherein a connector is disposed on a bottom surface of the package module, and the second emi shielding layer has a first through hole disposed therein, the first through hole corresponding to the connector.
8. A method of manufacturing an electromagnetic shielding structure according to any one of claims 1 to 7, comprising:
forming a packaging jointed board; the packaging jointed board comprises a connecting region and a first packaging module and a second packaging module which are connected with the connecting region;
forming a first electromagnetic shielding layer on the top surface of the packaging jointed board;
cutting from the bottom surface of the connecting region to the top surface of the connecting region to form a gap; the gap extends to a top surface of the connection region; the top surface of the connecting area and the top surface of the packaging jointed board are on the same side;
forming second electromagnetic shielding layers on the bottom surface and the side surfaces of the packaging jointed board, and filling the second electromagnetic shielding layers in the gaps; the second electromagnetic shielding layer is respectively connected with the bottom surfaces of the first packaging module and the second packaging module in a grounding manner, and the second electromagnetic shielding layer positioned in the gap and the side surface of the packaging spliced plate is connected with the first electromagnetic shielding layer in a grounding manner;
and cutting the first electromagnetic shielding layer, the packaging jointed board and the second electromagnetic shielding layer along the gap to obtain the electromagnetic shielding structure corresponding to the first packaging module and the electromagnetic shielding structure corresponding to the second packaging module.
9. The manufacturing method as claimed in claim 8, wherein the top surface of the package panel is a plastic-encapsulated adhesive surface, and the forming the first electromagnetic shielding layer on the top surface of the package panel comprises:
and pressing the first electromagnetic shielding layer on the plastic packaging rubber surface.
10. The manufacturing method as claimed in claim 8, wherein a second electromagnetic shielding layer is formed on the bottom and side surfaces of the package panels and the gaps are filled with the second electromagnetic shielding layer; the second electromagnetic shield layer respectively with the first encapsulation module with the bottom surface ground connection of second encapsulation module includes:
pressing the second electromagnetic shielding layer on the bottom surface of the packaging jointed board, the side surface of the packaging jointed board and in the gap; the second electromagnetic shielding layer is connected with the grounding devices on the bottom surfaces of the first packaging module and the second packaging module respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463597.9A CN111642122B (en) | 2020-05-27 | 2020-05-27 | Electromagnetic shielding structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463597.9A CN111642122B (en) | 2020-05-27 | 2020-05-27 | Electromagnetic shielding structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111642122A true CN111642122A (en) | 2020-09-08 |
| CN111642122B CN111642122B (en) | 2023-02-03 |
Family
ID=72332866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010463597.9A Active CN111642122B (en) | 2020-05-27 | 2020-05-27 | Electromagnetic shielding structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111642122B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120052630A1 (en) * | 2010-08-27 | 2012-03-01 | Chang-Chih Lin | Method for manufacturing chip package |
| KR20120024284A (en) * | 2010-09-06 | 2012-03-14 | 삼성전기주식회사 | Apparatus for shielding electromagnetic wave, high frequency module having the same and fabricating method thereof |
| CN105810666A (en) * | 2016-03-30 | 2016-07-27 | 江苏长电科技股份有限公司 | Fabrication method for package structure having electromagnetic shielding function |
| US20170271822A1 (en) * | 2014-05-30 | 2017-09-21 | Molex, Llc | Electrical connector |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
-
2020
- 2020-05-27 CN CN202010463597.9A patent/CN111642122B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120052630A1 (en) * | 2010-08-27 | 2012-03-01 | Chang-Chih Lin | Method for manufacturing chip package |
| KR20120024284A (en) * | 2010-09-06 | 2012-03-14 | 삼성전기주식회사 | Apparatus for shielding electromagnetic wave, high frequency module having the same and fabricating method thereof |
| US20170271822A1 (en) * | 2014-05-30 | 2017-09-21 | Molex, Llc | Electrical connector |
| CN105810666A (en) * | 2016-03-30 | 2016-07-27 | 江苏长电科技股份有限公司 | Fabrication method for package structure having electromagnetic shielding function |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111642122B (en) | 2023-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102361804B1 (en) | sEMIconductor device with PARTIAL EMI SHIELDING and method of making the same | |
| JP4159636B2 (en) | Electronic component package and manufacturing method thereof | |
| JP6672113B2 (en) | Electronic circuit device and method of manufacturing electronic circuit device | |
| CN102446882B (en) | Semiconductor PiP (package in package) system structure and manufacturing method thereof | |
| US20200120810A1 (en) | Board-level architecture, method for manufacturing board-level architecture, and mobile terminal | |
| CN102543937B (en) | Flip chip on-chip package and manufacturing method thereof | |
| CN102543907B (en) | Package and manufacture method for thermal enhanced quad flat no-lead flip chip | |
| US20010052645A1 (en) | Packaged integrated circuit | |
| US20130113088A1 (en) | Chip packaging structure, chip packaging method, and electronic device | |
| US20140198459A1 (en) | Stacked package device and manufacturing method thereof | |
| EP2937900A2 (en) | Reconstitution techniques for semiconductor packages | |
| CN103811355B (en) | Molded bottom implant for stacked package device | |
| US6137162A (en) | Chip stack package | |
| TWI554196B (en) | Electronic packaging device and manufacturing method thereof | |
| CN108807360A (en) | The method of semiconductor packaging device and manufacture semiconductor packaging device | |
| CN106449440B (en) | A kind of manufacturing method of the encapsulating structure with electro-magnetic screen function | |
| JP7494432B2 (en) | Electronic element module and manufacturing method thereof | |
| KR20150047167A (en) | EMI shielding device for semiconductor package and method for manufacturing the same | |
| KR20180101832A (en) | Electric component module and manufacturing method thereof | |
| CN114823651B (en) | Radio frequency system module packaging structure with filter and method | |
| WO2014063281A1 (en) | Semiconductor device including stacked bumps for emi/rfi shielding | |
| CN111642122B (en) | Electromagnetic shielding structure and manufacturing method thereof | |
| JP6802314B2 (en) | Semiconductor package and its manufacturing method | |
| KR101141443B1 (en) | Method for manufacturing semiconductor package | |
| KR101478510B1 (en) | Semiconductor package and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |