CN111624923B - Low-voltage high-power controller structure - Google Patents
Low-voltage high-power controller structure Download PDFInfo
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- CN111624923B CN111624923B CN202010534563.4A CN202010534563A CN111624923B CN 111624923 B CN111624923 B CN 111624923B CN 202010534563 A CN202010534563 A CN 202010534563A CN 111624923 B CN111624923 B CN 111624923B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/25—Pc structure of the system
- G05B2219/25257—Microcontroller
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Abstract
A low-voltage high-power controller structure relates to the technical field of controllers. The invention provides a low-voltage high-power controller structure, which aims to solve the problem that the current value flowing through a current sensor cannot be reasonably reduced due to mutual interference among modules caused by unreasonable layout and structure of conductive copper evacuation of the existing driving controller. Through changing the drive mode of drive optocoupler to application reasonable copper arrangement mode and connected mode, proper adjustment can be applied to 48V and two kinds of busbar voltage of 80V, thereby improves the stability and the flexibility of whole controller, rationally reduces the current value that flows through current sensor, compact structure just can not take place to interfere, but reduce cost, and the heat dissipation is good, and the drive capability is stronger.
Description
Technical field:
the invention belongs to the technical field of controllers, and particularly relates to a low-voltage high-power controller structure.
The background technology is as follows:
the low-voltage high-power driving control system is a power link of the necessary power driving of the all-electric engineering vehicle and the wind power driving system. The low-voltage high-power drive control system comprises a low-voltage high-power drive controller, an angular displacement sensor and a motor. Because the system bus voltage is low, the output power is high, the bus current and the phase current are high, the conventional PCB internal wiring copper foil is replaced by copper bars in the design of the low-voltage high-power driving controller, so that the reliability of the system is improved, the heat dissipation capacity is improved, the copper bar structure is difficult to design due to the complex circuit wiring, the previous design experience is difficult to iteratively use for low-voltage controller products with different bus voltage values, the difference between the copper bars and the circuit board layout is large, and the reasonable design of the layout and the structure between the copper bars is needed in order to improve the reliability of the design of the low-voltage high-power driving device and the derivatization of the design experience, so that the interference between the copper bar structure and the PCB structure of modules such as a capacitor plate is one of the technical problems to be solved. In addition, since the phase current output is large, the selected current sensor is large in size and high in cost, so that how to design a current loop to reasonably reduce the value of the current flowing through the current sensor is one of the technical problems to be considered.
SUMMARY OF THE PATENT FOR INVENTION
In order to solve the problems, the invention provides a low-voltage high-power controller structure. Through changing the drive mode of drive optocoupler to application reasonable copper arrangement mode and connected mode, proper adjustment can be applied to 48V and two kinds of busbar voltage of 80V, thereby improves the stability and the flexibility of whole controller, rationally reduces the current value that flows through current sensor, compact structure just can not take place to interfere, but reduce cost, and the heat dissipation is good, and the drive capability is stronger.
The invention is realized by the following technical scheme.
The utility model provides a high-power controller of low pressure, includes controller casing, CAP module, power module, main control module, power drive module and heating panel, CAP module links firmly with power drive module, power module is connected through the pin that cut straightly with main control module, main control module links firmly by 5M 4 screws with power drive module, power drive module links firmly through a plurality of screws with the heating panel, controller casing and heating panel are by 6M 4 screw connection and form a cavity that holds all modules, thereby controller casing, CAP module, power module, main control module, power drive module and heating panel connect into a whole.
The controller shell comprises a ground wire jack, a W-phase jack, a programming program jack, an encoder jack, a CAN bus jack, a V-phase jack, a U-phase jack, a positive power jack and a safety jack.
The CAP module comprises a plurality of electrolytic capacitors fixed on the PCB substrate.
The main control module comprises a W-phase lower bridge arm driving optocoupler, a W-phase upper bridge arm driving optocoupler, a V-phase lower bridge arm driving optocoupler, a V-phase upper bridge arm driving optocoupler, a U-phase lower bridge arm driving optocoupler, a U-phase upper bridge arm driving optocoupler, a U-phase current copper bar hole, a current sensor, a CAN bus interface, a V-phase current copper bar hole, an encoder interface, a program programming interface, a main control power supply interface, a W-phase current copper bar hole and a driving optocoupler power supply interface, wherein the driving optocoupler power supply interface is connected with a driving optocoupler power supply output port, the main control power supply interface is connected with a main control power supply output port, and the W-phase lower bridge arm driving optocoupler is connected with the W-phase upper bridge arm driving optocoupler in parallel with the V-phase upper bridge arm driving optocoupler, and the U-phase lower bridge arm driving optocoupler is connected with the U-phase upper bridge arm driving optocoupler in parallel respectively.
The power driving module comprises a U-phase current interface, a V-phase upper bridge arm, a V-phase current interface, a W-phase upper bridge arm, a W-phase current interface, a bus bridge plate a, a bus copper bar a, a W-phase lower bridge arm, an Msofet element, a bus copper bar b, a V-phase lower bridge arm, a bus copper bar c, a U-phase lower bridge arm, a bus copper bar d, a bus bridge plate b, a U-phase upper bridge arm, a conductive copper bar and a film capacitor, wherein the U-phase current interface, the V-phase current interface and the W-phase current interface are respectively and symmetrically connected with a U-phase upper bridge arm, a V-phase upper bridge arm and a W-phase upper bridge arm which are fixed on a PCB substrate through screws, and the U-phase upper bridge arm, the V-phase upper bridge arm and the W-phase upper bridge arm are respectively connected with a U-phase lower bridge arm, a V-phase lower bridge arm and a W-phase lower bridge arm.
In the power driving module, 5 Msofet elements are respectively arranged on each of the left side and the right side of a U-phase upper bridge arm, a U-phase lower bridge arm, a V-phase upper bridge arm, a V-phase lower bridge arm, a W-phase upper bridge arm and a W-phase lower bridge arm, and two Msofet elements opposite to each other on the left side and the right side of each bridge arm are connected in parallel.
In the power driving module, the upper ends of a bus bar copper bar a, a bus bar copper bar b, a bus bar copper bar c and a bus bar copper bar d respectively penetrate through the CAP module, the lower end of the bus bar copper bar b is fixedly connected to a PCB substrate, one end of the bus bar bridge plate a is connected with the bus bar copper bar a through a screw, the other end of the bus bar bridge plate b is connected with the bus bar copper bar b through a screw, the other end of the bus bar bridge plate b is connected with the bus bar copper bar d through a screw, and the bus bar bridge plate a and the bus bar bridge plate b are arranged on the side surfaces of the four bus bar copper bars.
In the power driving module, a U-phase upper bridge arm, a V-phase upper bridge arm, a W-phase upper bridge arm, a U-phase lower bridge arm, a V-phase lower bridge arm, a W-phase lower bridge arm, a bus copper bar a, a bus copper bar b, a bus copper bar c and a bus copper bar d are all in copper bar structures, and 4 conductive copper bars fixed on a PCB substrate are arranged on two sides of the U-phase upper bridge arm, the V-phase upper bridge arm and the W-phase upper bridge arm.
The heat dissipation plate comprises a heat dissipation plate mounting nail and a plurality of fixing screw holes, and bridge arms, bus copper bars and other copper bars contained in the power driving module are mounted on the fixing screw holes through screws.
The power module comprises a main control power supply output port, a transformer and a driving optocoupler power supply output port, wherein the transformer is connected with the PCB substrate through a direct contact pin, and the main control power supply output port and the driving optocoupler power supply output port are respectively fixed on the PCB substrate.
The beneficial effects of the invention are as follows:
1. the invention designs a controller structure for a low-voltage high-power system based on the existing controller, wherein a bus bridge plate a and a bus bridge plate b in the designed controller are used as elements for connecting bus copper bars and are arranged on the side surfaces of the bus copper bars, so that the two bus copper bars can be effectively conducted, and when the input bus voltage is adjusted from 48V to 80V, the bus bridge plate and the electrolytic capacitor are not interfered due to the increase of the height of the electrolytic capacitor, thereby improving the flexibility and the stability of the whole controller system, enabling the structure to be more compact and reducing the cost of the controller.
2. The main control module comprises 2U-phase driving optocouplers, 2V-phase driving optocouplers and 2W-phase driving optocouplers, and the two opposite driving optocouplers are connected in parallel, so that the situation that the driving capability of a single driving optocoupler cannot meet the larger current for directly driving a Mosfet can be avoided, and the driving capability of the driving optocoupler is effectively improved.
3. The power driving module is provided with the plurality of copper bar structures for conducting, and because the bus current of the high-power alternating-current servo control system and the three-phase current of the motor are larger, a great amount of heat is generated, and the current is conveyed by covering copper and adding copper bars, so that the condition that the PCB is broken down by using a great amount of heat generated by conveying the current by only covering copper is effectively avoided. .
4. The power driving module is provided with 60 field effect transistor MOSFETs driving elements, and adopts a mode of parallel connection between MOSFETs, so that the current carrying capacity of the circuit is improved.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a schematic diagram of an explosive structure of the present invention;
FIG. 2 is a schematic illustration of the external configuration of the present invention;
FIG. 3 is a schematic top view of the controller housing of FIG. 2 with the controller housing removed;
FIG. 4 is a schematic diagram of a controller housing according to the present invention;
FIG. 5 is a schematic diagram of CAP module structure according to the present invention;
FIG. 6 is a schematic diagram of a master control module according to the present invention;
FIG. 7 is a schematic diagram of a power module according to the present invention;
FIG. 8 is a schematic diagram of a power driving module according to the present invention;
FIG. 9 is a schematic diagram of a heat sink structure according to the present invention;
in the figure: 1. the controller comprises a controller shell, 2, CAP modules, 3, a main control module, 4, a power driving module, 5, a heat dissipation plate, 6, a power module, 1-1, a ground wire jack, 1-2, a W-phase jack, 1-3, a programming program jack, 1-4, an encoder jack, 1-5, a CAN bus jack, 1-6, a V-phase jack, 1-7, a U-phase jack, 1-8, a positive power jack, 1-9, a safety jack, 3-1, a W-phase lower bridge arm driving optocoupler, 3-2, a W-phase upper bridge arm driving optocoupler, 3-3, V-phase lower bridge arm driving optocoupler, 3-4, V-phase upper bridge arm driving optocoupler, 3-5, U-phase lower bridge arm driving optocoupler, 3-6, U-phase upper bridge arm driving optocoupler, 3-7, U-phase current copper bar hole, 3-8, a current sensor, 3-9, a CAN bus interface, 3-10, a V-phase current copper bar hole 3-11, an encoder interface, 3-12, a program burning interface, 3-13, a main control power supply interface, 3-14, a W-phase current copper bar hole, 3-15, a driving optocoupler power supply interface, 4-1, a U-phase current interface, 4-2, a V-phase upper bridge arm, 4-3, a V-phase current interface, 4-4, a W-phase upper bridge arm, 4-5, a W-phase current interface, 4-6, a bus bridge plate a,4-7, a bus copper bar a,4-8, a W-phase lower bridge arm, 4-9, a Msofet element, 4-10, a bus copper bar b,4-11, a V-phase lower bridge arm, 4-12, a bus copper bar c,4-13, a U-phase lower, 4-14 parts of bus copper bars d,4-15 parts of bus bridge plates b,4-16 parts of U-phase upper bridge arms, 4-17 parts of conductive copper bars, 4-18 parts of film capacitors, 5-1 parts of radiating plate mounting nails, 5-2 parts of fixing screw holes, 6-1 parts of main control power supply output ports, 6-2 parts of transformers, 6-3 parts of driving optocouplers power supply output ports.
The specific embodiment is as follows:
the following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
As shown in fig. 1 to 9, the low-voltage high-power controller structure of the present invention includes a controller housing, a CAP module, a power module, a main control module, a power driving module and a heat dissipation plate, wherein the CAP module 2 is fixedly connected with the power driving module 4, the power module 6 is connected with the main control module 3 through a direct plug pin, the main control module 3 is fixedly connected with the power driving module 4 through 5M 4 screws, the power driving module 4 is fixedly connected with the heat dissipation plate 5 through a plurality of screws, the controller housing 1 is connected with the heat dissipation plate 5 through 6M 4 screws and forms a cavity for accommodating all modules, so that the controller housing 1, the CAP module 2, the power module 6, the main control module 3, the power driving module 4 and the heat dissipation plate 5 are connected into a whole;
in an embodiment, for example, the CAP module 2 includes a plurality of electrolytic capacitors fixed on the PCB substrate, and the height of the electrolytic capacitors is adapted to the change of the bus voltage.
In an embodiment, for example, in this embodiment, the master control module 3 includes a W-phase lower bridge arm driving optocoupler 3-1, a W-phase upper bridge arm driving optocoupler 3-2, a V-phase lower bridge arm driving optocoupler 3-3, a V-phase upper bridge arm driving optocoupler 3-4, a U-phase lower bridge arm driving optocoupler 3-5, a U-phase upper bridge arm driving optocoupler 3-6, a U-phase current copper bar hole 3-7, a current sensor 3-8, a CAN bus interface 3-9, a V-phase current copper bar hole 3-10, an encoder interface 3-11, a program programming interface 3-12, a master control power supply interface 3-13, a W-phase current copper bar hole 3-14, and a driving optocoupler power supply interface 3-15, wherein the master control power supply interface 3-13 is connected with the master control power supply output port 6-1, the W-phase lower bridge arm driving optocoupler 3-2, the V-phase lower bridge arm driving optocoupler 3-3 and the V-phase upper bridge arm driving optocoupler 3-4 are connected in parallel with each other, so that parallel driving forces of the two parallel driving optocouplers 3-5 and the U-phase driving optocoupler 3-4 CAN be improved.
In one embodiment, for example, the power driving module 4 includes a U-phase current interface 4-1, a V-phase upper arm 4-2, a V-phase current interface 4-3, a W-phase upper arm 4-4, a W-phase current interface 4-5, a bus bridge board a4-6, a bus copper bar a4-7, a W-phase lower arm 4-8, a Mlife element 4-9, a bus copper bar b4-10, a V-phase lower arm 4-11, a bus copper bar c4-12, a U-phase lower arm 4-13, a bus copper bar d4-14, a bus bridge board b4-15, a U-phase upper arm 4-16, a conductive copper bar 4-17, and a thin film capacitor 4-18, the U-phase current interface 4-1, the V-phase current interface 4-3 and the W-phase current interface 4-5 are respectively and fixedly connected with a U-phase upper bridge arm 4-16, a V-phase upper bridge arm 4-2 and a W-phase upper bridge arm 4-4 which are fixed on a PCB substrate through screws, the U-phase upper bridge arm 4-16, the V-phase upper bridge arm 4-2 and the W-phase upper bridge arm 4-4 are respectively connected with a U-phase lower bridge arm 4-13, a V-phase lower bridge arm 4-11 and a W-phase lower bridge arm 4-8, and 5 Msofet elements 4-10 are symmetrically arranged on each of the left side and the right side of the U-phase upper bridge arm 4-16, the V-phase upper bridge arm 4-2, the V-phase lower bridge arm 4-11 and the W-phase upper bridge arm 4-8, namely 60 Mosfet elements 4-10 are arranged in a total, and are connected in a two-by-two parallel mode for improving the current carrying capacity of a driving circuit.
In an embodiment, for example, in this embodiment, the upper ends of the bus bar copper bars a4-7, the bus bar copper bars b4-10, the bus bar copper bars c4-12 and the bus bar copper bars d4-14 respectively pass through the CAP module 2, the lower ends of the bus bar copper bars are fixedly connected to the PCB substrate, one end of the bus bar bridge plate a4-6 is connected with the bus bar copper bars a4-7 through a screw, the other end of the bus bar bridge plate b4-15 is connected with the bus bar copper bars b4-10 through a screw, the other end of the bus bar bridge plate b4-15 is connected with the bus bar copper bars d4-14 through a screw, the bus bar bridge plate a4-6 and the bus bar bridge plate b4-15 are uniformly distributed on the side surfaces of the four bus bar copper bars, and the bus bar bridge plates a4-6 and the bus bar bridge plate b4-15 are respectively and effectively conducted, and when the input bus bar voltage is adjusted to 80V from 48V, the two bridge plates and the electrolytic capacitor are not interfered due to the increase of the height of the electrolytic capacitor, so that the flexibility and the stability of the whole controller system are improved, and the controller is more compact in structure and cost is reduced.
In an embodiment, for example, in this embodiment, the U-phase upper bridge arm 4-16, the V-phase upper bridge arm 4-2, the W-phase upper bridge arm 4-4, the U-phase lower bridge arm 4-13, the V-phase lower bridge arm 4-11, the W-phase lower bridge arm 4-8, the bus copper bar a4-7, the bus copper bar b4-10, the bus copper bar c4-12, and the bus copper bar d4-14 are all copper bar structures, and 4 conductive copper bars 4-17 fixed on the PCB substrate are disposed on two sides of the U-phase upper bridge arm 4-16, the V-phase upper bridge arm 4-2, and the W-phase upper bridge arm 4-4.
In an embodiment, for example, in this embodiment, the heat dissipation plate 5 includes a heat dissipation plate mounting nail 5-1 and a plurality of fixing screw holes 5-2, and the bridge arm, the bus bar copper bar and other copper bars included in the power driving module 4 are mounted on the fixing screw holes 5-2 through screws.
In an embodiment, for example, in this embodiment, the power module 6 includes a main control power supply output port 6-1, a transformer 6-2, and a driving optocoupler power supply output port 6-3, wherein the transformer 6-2 is connected with the PCB substrate through a direct plug pin, and the main control power supply output port 6-1 and the driving optocoupler power supply output port 6-3 are respectively fixed on the PCB substrate.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although the terms CAP module 2, W-phase lower arm drive optocoupler 3-1, W-phase upper arm drive optocoupler 3-2, V-phase lower arm drive optocoupler 3-3, V-phase upper arm drive optocoupler 3-4, U-phase lower arm drive optocoupler 3-5, U-phase upper arm drive optocoupler 3-6, U-phase current copper bar hole 3-7, V-phase upper arm 4-2, W-phase upper arm 4-4, bus bar bridge plate a4-6, bus bar copper bar a4-7, W-phase lower arm 4-8, bus bar copper bar b4-10, V-phase lower arm 4-11, bus bar copper bar c4-12, U-phase lower arm 4-13, bus bar copper bar d4-14, bus bar bridge plate b4-15, U-phase upper arm 4-16, heat dissipation plate 5, etc. are used more herein, the use of other terms is not precluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
Claims (6)
1. A low voltage high power controller structure, characterized in that: the intelligent controller comprises a controller shell, a CAP module, a power module, a main control module, a power driving module and a heat dissipation plate, wherein the CAP module (2) is fixedly connected with the power driving module (4), the power module (6) is connected with the main control module (3) through direct-insert pins, the main control module (3) is fixedly connected with the power driving module (4) through 5M 4 screws, the power driving module (4) is fixedly connected with the heat dissipation plate (5) through a plurality of screws, and the controller shell (1) is connected with the heat dissipation plate (5) through 6M 4 screws and forms a cavity for accommodating all modules, so that the controller shell (1), the CAP module (2), the power module (6), the main control module (3), the power driving module (4) and the heat dissipation plate (5) are connected into a whole.
The power driving module (4) comprises a U-phase current interface (4-1), a V-phase upper bridge arm (4-2), a V-phase current interface (4-3), a W-phase upper bridge arm (4-4), a W-phase current interface (4-5), a bus bridge plate a (4-6), a bus copper bar a (4-7), a W-phase lower bridge arm (4-8), an Mlife element (4-10), a bus copper bar b (4-10), a V-phase lower bridge arm (4-11), a bus copper bar c (4-12), a U-phase lower bridge arm (4-13), a bus copper bar d (4-14), a bus bridge plate b (4-15), a U-phase upper bridge arm (4-16), a conductive copper bar (4-17) and a film capacitor (4-18), the U-phase current interface (4-1), the V-phase current interface (4-3) and the W-phase current interface (4-5) are respectively symmetrical and fixedly connected with a U-phase upper bridge arm (4-16), a V-phase upper bridge arm (4-2) and a W-phase upper bridge arm (4-4) which are fixed on a PCB substrate through screws, and the U-phase upper bridge arm (4-16), the V-phase upper bridge arm (4-2) and the W-phase upper bridge arm (4-4) are respectively connected with a U-phase lower bridge arm (4-13), the V-phase lower bridge arm (4-11) and the W-phase lower bridge arm (4-8) are connected;
each of the left side and the right side of the U-phase upper bridge arm (4-16), the U-phase lower bridge arm (4-13), the V-phase upper bridge arm (4-2), the V-phase lower bridge arm (4-11), the W-phase upper bridge arm (4-4) and the W-phase lower bridge arm (4-8) is respectively provided with 5 Msofet elements (4-10), and two Msofet elements opposite to each other on the left side and the right side of each bridge arm are connected in parallel;
the upper ends of the bus bar copper bars a (4-7), the bus bar copper bars b (4-10), the bus bar copper bars c (4-12) and the bus bar copper bars d (4-14) respectively penetrate through the CAP module (2), the lower ends of the bus bar copper bars are fixedly connected to the PCB substrate, one end of the bus bar bridging plate a (4-6) is connected with the bus bar copper bars a (4-7) through screws, the other end of the bus bar bridging plate b (4-15) is connected with the bus bar copper bars b (4-10) through screws, the other end of the bus bar bridging plate b (4-15) is connected with the bus bar copper bars d (4-14) through screws, the bus bar bridging plate a (4-6) and the bus bar bridging plate b (4-15) are arranged on the side surfaces of the four bus bar copper bars, and the bus bar bridging plate a (4-6) and the bus bar bridging plate b (4-15) are arranged up and down;
the U-phase upper bridge arm (4-16), the V-phase upper bridge arm (4-2), the W-phase upper bridge arm (4-4), the U-phase lower bridge arm (4-13), the V-phase lower bridge arm (4-11), the W-phase lower bridge arm (4-8), the bus copper bar a (4-7), the bus copper bar b (4-10), the bus copper bar c (4-12) and the bus copper bar d (4-14) are all of copper bar structures, and 4 conductive copper bars (4-17) fixed on a PCB substrate are arranged on two sides of the U-phase upper bridge arm (4-16), the V-phase upper bridge arm (4-2) and the W-phase upper bridge arm (4-4).
2. The low-voltage high-power controller structure according to claim 1, wherein the controller housing (1) comprises a ground wire jack (1-1), a W-phase jack (1-2), a programming jack (1-3), an encoder jack (1-4), a CAN bus jack (1-5), a V-phase jack (1-6), a U-phase jack (1-7), a positive power jack (1-8) and a safety jack (1-9).
3. A low voltage high power controller structure according to claim 1, characterized in that said CAP module (2) comprises a plurality of electrolytic capacitors fixed on a PCB substrate.
4. The low-voltage high-power controller structure according to claim 1, wherein the master control module (3) comprises a W-phase lower bridge arm driving optocoupler (3-1), a W-phase upper bridge arm driving optocoupler (3-2), a V-phase lower bridge arm driving optocoupler (3-3), a V-phase upper bridge arm driving optocoupler (3-4), a U-phase lower bridge arm driving optocoupler (3-5), a U-phase upper bridge arm driving optocoupler (3-6), a U-phase current copper bar hole (3-7), a current sensor (3-8), a CAN bus interface (3-9), a V-phase current copper bar hole (3-10), an encoder interface (3-11), a program programming interface (3-12), a master control power supply interface (3-13), a W-phase current copper bar hole, and a driving optocoupler power supply interface (3-15), wherein the driving optocoupler power supply interface (3-15) is connected with a driving optocoupler power supply output port (6-3), the master control power supply interface (3-13) is connected with the master control output port (6-1), the W-phase lower bridge arm (3-1) and the V-phase upper bridge arm driving optocoupler (3-4) The U-phase lower bridge arm driving optocoupler (3-5) and the U-phase upper bridge arm driving optocoupler (3-6) are respectively connected in parallel.
5. The low-voltage high-power controller structure according to claim 1, wherein the heat dissipation plate (5) comprises a heat dissipation plate mounting nail (5-1) and a plurality of fixing screw holes (5-2), and bridge arms, bus copper bars and other copper bars contained in the power driving module (4) are mounted on the fixing screw holes (5-2) through screws.
6. The low-voltage high-power controller structure according to claim 1, wherein the power module (6) comprises a main control power supply output port (6-1), a transformer (6-2) and a driving optocoupler power supply output port (6-3), wherein the transformer (6-2) is connected with the PCB substrate through a direct plug pin, and the main control power supply output port (6-1) and the driving optocoupler power supply output port (6-3) are respectively fixed on the PCB substrate.
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| CN102412704B (en) * | 2011-11-22 | 2013-12-11 | 东风汽车公司 | Low-voltage high-current three-phase driving power module group structure |
| CN202334264U (en) * | 2011-11-22 | 2012-07-11 | 东风汽车公司 | Connecting and fixing structure of low-voltage heavy current three-phase driving power module groups |
| CN102882408A (en) * | 2012-10-29 | 2013-01-16 | 金海新源电气江苏有限公司 | Power unit of inverter |
| CN103204072B (en) * | 2013-04-17 | 2015-07-15 | 奇瑞汽车股份有限公司 | Vehicle controller |
| CN106329951A (en) * | 2016-08-31 | 2017-01-11 | 浙江海得新能源有限公司 | Power cabinet of wind power converter |
| WO2018108040A1 (en) * | 2016-12-15 | 2018-06-21 | 上海理工大学 | Electric driving device, electric equipment, inverter and multiphase alternating current motor |
| CN109194092B (en) * | 2018-08-03 | 2020-09-08 | 卧龙电气集团辽宁荣信电气传动有限公司 | Modularized water-cooling power unit and signal acquisition method |
| CN115021588A (en) * | 2022-06-30 | 2022-09-06 | 刘通 | Low-voltage current intelligent power inverter |
-
2020
- 2020-06-12 CN CN202010534563.4A patent/CN111624923B/en active Active
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Effective date of registration: 20211217 Address after: 201108 No. 535, Shennan Road, Xinzhuang Industrial Zone, Minhang District, Shanghai Applicant after: Shanghai Frequency Control Technology Co.,Ltd. Address before: 215000 No. 6 Beijing West Road, Taicang Economic Development Zone, Suzhou City, Jiangsu Province Applicant before: Shaohong Electrical and Mechanical (Suzhou) Co.,Ltd. |
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