CN111596484A - 一种彩膜基板和显示面板 - Google Patents
一种彩膜基板和显示面板 Download PDFInfo
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Abstract
本申请提供一种彩膜基板和显示面板,该彩膜基板包括第一像素区域和邻近第一像素区域的第二像素区域,彩膜基板还包括:基底;多个Micro LED发光单元,对应第一像素区域设置于基底的一侧,其中,多个Micro LED发光单元之间设有透光区;彩色色阻,对应第二像素区域设于基底的相对另一侧。本申请通过在彩膜基板上对应第一像素区域设置Micro LED发光单元,从而解决了在LCD屏中光学式传感器与光学显示无法在空间上重合的问题,进而使LCD屏能够满足人们对全面屏的极致需求。
Description
技术领域
本申请涉及显示技术领域,尤其涉及一种彩膜基板和显示面板。
背景技术
随着全面屏的普及和消费者对机身一体化的追求,屏下传感技术成为中小尺寸显示领域开发重点。由于LCD屏属于整面背光的被动发光,光学式传感器与光学显示无法在空间上重合,因此限制了LCD屏向全面屏的方向发展。
而OLED屏则是采用逐颗的OLED像素主动发光,相较LCD屏而言一方面具有高对比、轻薄、可弯曲、可折叠等优势,另一方面,基于OLED屏无需背光的特性,可以很好的与现行的光学传感器兼容,因而面内光学传感技术已成为目前OLED屏的“独有优势”,从而可以使OLED屏在显示模式和成像模式间切换,并且无需现行LCD屏挖孔方案所造成的挖孔区无法显示。
因此,在日益追求极致全面屏的当下,LCD屏的低成本优势显得岌岌可危,如何使LCD屏能够满足当下对全面屏的极致需求已成为目前亟待解决的问题。
发明内容
本申请提供一种彩膜基板和显示面板,能够解决传统LCD屏中光学式传感器与光学显示无法在空间上重合,进而导致LCD屏不能满足人们对全面屏极致需求的问题。
为解决上述问题,本申请提供的技术方案如下:
本申请提供一种彩膜基板,包括第一像素区域和邻近所述第一像素区域的第二像素区域,所述彩膜基板包括:
基底;
多个Micro LED发光单元,对应所述第一像素区域设置于所述基底的一侧,其中,多个所述Micro LED发光单元之间设有透光区;
彩色色阻,对应所述第二像素区域设于所述基底的相对另一侧。
在本申请的彩膜基板中,所述基底面向所述Micro LED发光单元的一侧设有封装层,所述封装层位于所述第一像素区域和所述第二像素区域内。
在本申请的彩膜基板中,所述封装层背离所述基底一侧的表面与所述基底之间的距离大于所述Micro LED发光单元背离所述基底一侧的表面与所述基底之间的距离。
在本申请的彩膜基板中,所述封装层的厚度为3μm-100μm;所述封装层对应所述Micro LED发光单元的部分的厚度为2μm-80μm。
在本申请的彩膜基板中,所述封装层的透光率大于或等于70%。
在本申请的彩膜基板中,所述彩膜基板还包括第一驱动电路,所述第一驱动电路对应所述第一像素区域设于所述基底面向所述Micro LED发光单元的一侧,所述Micro LED发光单元与所述第一驱动电路电连接。
在本申请的彩膜基板中,所述第一驱动电路包括沿横向延伸的扫描线和沿纵向延伸的数据线,相邻两所述扫描线与相邻两所述数据线界定出子像素区域,所述Micro LED发光单元在所述基底上的正投影面积小于所述子像素区域的面积。
在本申请的彩膜基板中,所述Micro LED发光单元在所述基底上的正投影面积占所述子像素区域面积的10%-50%,所述Micro LED发光单元包括红色发光单元、绿色发光单元以及蓝色发光单元。
在本申请的彩膜基板中,所述彩色色阻背离所述基底的一侧设有平坦层,所述平坦层位于所述第一像素区域和所述第二像素区域内,所述平坦层背离所述基底一侧的表面为平整面。
本申请还提供一种显示面板,包括如上所述的彩膜基板。
本申请的有益效果为:本申请提供的彩膜基板和显示面板,通过将Micro LED(微发光二极管)显示技术与LCD(液晶显示器)显示技术相结合,从而实现LCD极致全面屏显示;并充分利用Micro LED发光单元体积小、可提升面板透过性的优势实现屏内传感集成功能。本申请在显示上实现了Micro LED显示技术与LCD显示技术在横向与纵向空间的无缝衔接,从而解决传统LCD屏中光学式传感器与光学显示无法在空间上重合,进而导致LCD屏不能满足人们对全面屏极致需求的问题。
附图说明
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。
图1(a)-1(e)为本申请实施例提供的不同类型的彩膜基板的俯视图;
图2为本申请一种实施例提供的彩膜基板的截面示意图;
图3为本申请实施例提供的彩膜基板具有Micro LED发光单元的示意图;
图4为本申请实施例提供的彩膜基板的第一种制备方法流程图;
图5(a)-5(d)为本申请彩膜基板的第一种制备方法流程示意图;
图6为本申请实施例提供的彩膜基板的第二种制备方法流程图;
图7(a)-7(b)为本申请彩膜基板的第二种制备方法流程示意图;
图8为本申请实施例提供的显示面板的结构示意图;
图9为本申请实施例提供的显示装置的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本申请的描述中,需要理解的是,术语“纵向”、“横向”、“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。在本申请中,“/”表示“或者”的意思。
本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。
在中小尺寸显示领域,全面屏技术成为当前的重点研发方向目前主流的显示技术包括液晶显示器(Liquid Crystal Display,LCD)和有机发光二极管(Organic Light-Emitting Diode,OLED),其中LCD为被动发光技术,通过整面背光结构照射液晶盒实现光纤的亮暗控制,而OLED技术则是采用逐颗的OLED像素主动发光。因为相较而言具有高对比、轻薄、可弯曲、可折叠等优势,以及可以很好的与现行的光学指纹识别模组等兼容,因而面内光学传感技术已成为目前OLED屏的“独有优势”。而LCD屏的低成本优势显得岌岌可危。
基于此,本申请的首要目的在于提供一种彩膜基板及其制备方法、显示面板及显示装置,用以解决传统LCD屏中光学式传感器与光学显示无法在空间上重合,进而导致LCD屏不能满足人们对全面屏极致需求的问题。
另外,Micro LED(微发光二极管)相较于OLED技术具有相似的主动发光特性,同时由于无机LED本身的稳定性与高效率等特点,在技术上较OLED具有寿命长、亮度高、控制芯片(chip)尺寸小、响应时间长等优势。但是相较于传统面板技术通过刻蚀等“减法制造”方式,Micro LED主要依赖于巨量转移(mass-transfer)的“加法制造”方式,在技术成熟度上较低,特别是面临巨量显示画素转移时具有先天的制程良率与成本挑战的问题。
基于此,本申请的另一目的在于提供一种彩膜基板及其制备方法、显示面板及显示装置,以解决Micro LED应用于显示技术时由于巨量转移而导致制程良率低及成本高从而限制了Micro LED在显示技术上应用的问题。
以下请结合具体实施例对本申请的彩膜基板及其制备方法、显示面板及显示装置进行详细描述。
请参照图1(a)-1(e)所示,为本申请实施例提供的不同类型的彩膜基板的俯视图。本申请的彩膜基板包括第一像素区域100和邻近所述第一像素区域100的第二像素区域200,其中,所述第一像素区域100为Micro LED显示区域,所述第二像素区域200为液晶显示区域。所述第一像素区域100与所述第二像素区域200无缝衔接,因而在视觉上没有任何显示中断及不连续边界,因此,可以实现完全的全面屏设计。又由于Micro LED具有高亮、长寿命特征,故可以采用所述第一像素区域100内的部分Micro LED发光单元兼做补光灯、指示灯等功能。
请结合图1(a)-1(e)以及图2所示,本申请的彩膜基板包括:基底10,所述基底10位于所述第一像素区域100和所述第二像素区域200内;多个Micro LED发光单元30,对应所述第一像素区域100设置于所述基底10的一侧,其中,多个所述Micro LED发光单元30之间设有透光区;彩色色阻50,对应所述第二像素区域200设于所述基底10的相对另一侧。
由于本申请的彩膜基板采用微发光二极管显示技术与液晶显示技术相结合的形式,从而可以实现LCD极致全面屏显示。又由于彩膜基板在相邻两所述Micro LED发光单元30之间设有透光区,所述透光区可以允许光线穿过,因此可以在所述第一像素区域100内实现屏内传感集成方案。另外,本申请通过将所述Micro LED发光单元30集成于彩膜基板的表面(on cell),因此可免除外挂式Micro LED显示玻璃导致的液晶面板和Micro LED显示玻璃额外对组制程,并且还可以缓解采用外挂式Micro LED显示玻璃导致的画面悬浮问题,本申请可实现将Micro LED显示方案集成于面板上。
请参照图2所示,以下对本申请一种实施例提供的彩膜基板进行详细说明。所述彩膜基板包括:基底10,所述基底10可以为透光率较高的玻璃基板,或是柔性基板;第一驱动电路20,所述第一驱动电路20对应所述第一像素区域100设于所述基底10的第一表面10a上,第一驱动电路20用于为Micro LED发光单元30提供驱动信号,以使所述Micro LED发光单元30能够发光;多个Micro LED发光单元30对应所述第一像素区域100设置于所述基底10的第一表面10a一侧,且所述Micro LED发光单元30与所述第一驱动电路20电连接;封装层40设置于所述Micro LED发光单元30以及所述基底10上,用于封装所述Micro LED发光单元30;彩色色阻50对应所述第二像素区域200设于所述基底10的第二表面10b上,且相邻两所述彩色色阻50之间设置有黑色矩阵60;其中,所述彩色色阻50以及所述黑色矩阵60避开所述第一像素区域100设置。
其中,所述第一驱动电路20包括沿横向延伸的扫描线(未图示)和沿纵向延伸的数据线(未图示),相邻两所述扫描线与相邻两所述数据线界定出子像素区域。所述扫描线与所述数据线也可以延伸至所述第二像素区域200内,可以理解的是,为了不影响所述第二像素区域200内的像素显示,延伸至所述第二像素区域200内的所述扫描线以及所述数据线的部分避开所述彩色色阻50设置,即可以对应位于所述黑色矩阵60的位置。
在一种实施例中,所述第一驱动电路20可以采用主动阵列(AM)驱动技术,即所述第一驱动电路20还包括薄膜晶体管(未图示),每一所述Micro LED发光单元30通过对应的所述薄膜晶体管分别与对应的所述扫描线和对应的所述数据线电连接。
在本实施例中,为优先保证所述第一像素区域100的穿透率,所述第一驱动电路20采用被动阵列(PM)驱动技术,即所述第一驱动电路20不设置薄膜晶体管。
在本实施例中,所述Micro LED发光单元30为三色显示,即所述Micro LED发光单元30包括红色发光单元、绿色发光单元以及蓝色发光单元。所述Micro LED发光单元30的尺寸为1μm-100μm,所述Micro LED发光单元30的高度为1μm-20μm。其中,所述Micro LED发光单元30可以为基底面出射结构或者电极面出射结构,此处不做限制。
在另一种实施例中,所述Micro LED发光单元30采用蓝色显示结合色转换技术方案,也就是说,所述红色发光单元包括蓝色发光单元以及设于所述蓝色发光单元上的色转换层,该色转换层可将所述蓝色发光单元发出的蓝光转换为红光;所述绿色发光单元包括蓝色发光单元以及设于所述蓝色发光单元上的色转换层,该色转换层可将所述蓝色发光单元发出的蓝光转换为绿光。其中,所述色转换层为量子点膜或荧光粉等,此处不做特殊限定。
结合图3所示,为本申请实施例提供的彩膜基板具有Micro LED发光单元的示意图。由于所述Micro LED发光单元30具有尺寸小的优势,因此所述Micro LED发光单元30在所述基底上的正投影面积小于所述子像素区域P的面积,使得多个所述Micro LED发光单元30之间具有透光区300。
进一步的,所述Micro LED发光单元30在所述基底上的正投影面积占所述子像素区域P面积的10%-50%。
在所述第一像素区域100可以实现正常显示的情况下,又由于各所述MicroLED发光单元30的覆盖面积皆小于各子像素区域P的面积,因此,在所述子像素区域P内无所述Micro LED发光单元30覆盖的区域光线可以正常透过。可以通过对所述Micro LED发光单元30关闭,使所述第一像素区域100采集外界图像进入屏下传感器。如此一来,便可实现屏下指纹识别、屏下摄像头、屏下面部识别、屏下距离感知等各种屏下传感方案。
请参照图2所示,所述封装层40整面的设置于所述第一像素区域100和所述第二像素区域200内,所述封装层40可以为层叠的无机层和有机层,此处不做限制。所述封装层40的材料具有良好的耐高温性能以及良好的透光性。所述封装层40一方面用于对所述MicroLED发光单元30及所述第一驱动电路20进行保护和封装,避免外界水汽等进入彩膜基板内部对器件造成损伤;另一方面用于对形成有所述Micro LED发光单元30的所述基底表面进行平整化。所述封装层40的厚度为3μm-200μm,能够填平由于绑定所述Micro LED发光单元30而在基底上形成的段差。即所述封装层40背离所述基底10一侧的表面与所述基底10之间的距离大于所述Micro LED发光单元30背离所述基底10一侧的表面与所述基底10之间的距离。
进一步的,由于所述Micro LED发光单元30的高度通常为1μm-20μm,为保证彩膜基板的轻薄化,同时兼顾封装及平坦作用,所述封装层40的厚度可以为3μm-100μm。
其中,所述封装层40对应所述Micro LED发光单元30的部分的厚度小于所述封装层40对应所述Micro LED发光单元30之外的部分的厚度。
进一步的,所述封装层40对应所述Micro LED发光单元30的部分的厚度为2μm-80μm。因此,能够保证所述封装层40完全覆盖所述Micro LED发光单元30,以保证其良好的封装性能。
其中,所述封装层40背离所述基底10一侧的表面为平整面,因此所述封装层40的设置还有效的解决了所述Micro LED发光单元30绑定工艺中造成的较大段差。
为了不影响所述第一像素区域100的透光性能,所述封装层40的透光率大于或等于70%。
进一步的,所述封装层40的透光率大于或等于85%。
在一种实施例中,所述彩色色阻50背离所述基底10的一侧设有平坦层(未图示),所述平坦层位于所述第一像素区域100和所述第二像素区域200内,所述平坦层背离所述基底10一侧的表面为平整面,如此一来,所述平坦层可以对所述基底设置有所述彩色色阻50一侧的表面进行平整化。
在本实施例中,所述封装层40背向所述基底10一侧还设置有保护层,所述保护层用于保护所述封装层40不受损伤。
由于本申请的彩膜基板只在所述第一像素区域100内设置所述Micro LED发光单元30,而所述第一像素区域100的面积占比较小,因此无需依赖巨量转移的方式。如此一来,即可以实现Micro LED显示技术在显示面板/显示装置上的应用,又可以解决巨量显示画素转移时制程良率较低以及成本较高的问题。
在Micro LED显示技术应用于显示面板上时,由于在制备Micro LED的驱动电路以及绑定Micro LED发光单元的工艺都是需要在高温下进行的,高温会对显示面板上的元器件等造成一定的不良影响;尤其是Micro LED发光单元及其驱动电路制作在彩膜基板上时,制程的高温会影响彩膜基板上彩色色阻材料的特性,从而影响显示效果。
基于此,本申请的又一目的在于提供一种彩膜基板的制备方法,以解决Micro LED发光单元及其驱动电路制作在彩膜基板上时,高温制程影响彩色色阻材料特性的问题。
请参照图4所示,为本申请一种实施例提供的彩膜基板的制备方法流程图。
所述方法包括以下步骤:
步骤S1,请参照图5(a)所示,在基底10的第一表面10a上对应第一像素区域100的位置制备第一驱动电路20以及与所述第一驱动电路20电连接的第一焊接电极20a,所述第一驱动电路20包括沿横向延伸的扫描线和沿纵向延伸的数据线,所述第一焊接电极20a位于相邻两所述扫描线与相邻两所述数据线界定出的子像素区域内。
其中,所述第一焊接电极20a包括一个N电极以及一个与N电极相对设置的P电极。
步骤S2,请参照图5(b)所示,将Micro LED发光单元30转印于所述基底10的第一像素区域100内,且将所述Micro LED发光单元30上的第二焊接电极30a与所述第一焊接电极20a电性绑定。
其中,所述第二焊接电极30a包括一个N电极以及一个与N电极相对设置的P电极,在绑定工艺中,所述Micro LED发光单元30的N电极与所述基底10上的N电极电连接,所述Micro LED发光单元30的P电极与所述基底10上的P电极电连接。
步骤S3,请参照图5(c)所示,在所述Micro LED发光单元30以及所述基底10上制备封装层40。
其中,所述封装层40能够填平所述Micro LED发光单元30与所述基底10形成的段差,且所述封装层40背离所述基底10的表面形成平整面。
步骤S4,请参照图5(d)所示,在所述基底10的第二表面10b上制备彩色色阻50,所述彩色色阻50形成于邻近所述第一像素区域100的第二像素区域200内。
其中,所述制备方法还包括在所述第二像素区域200内制备黑色矩阵60,所述黑色矩阵60位于相邻两所述彩色色阻50之间。所述彩色色阻50与所述黑色矩阵60制备的先后顺序此处不做限制。
在另一种实施例中,在所述步骤S2之后,所述制备方法还包括以下步骤:
在所述Micro LED发光单元上制备色转换薄膜,去除对应所述Micro LED发光单元之外的所述色转换薄膜,以形成正对所述Micro LED发光单元的色换换层。
由于本申请的彩膜基板是先在基底上制备第一驱动电路以及绑定Micro LED发光单元,之后再制作彩色色阻及黑色矩阵,因此,可以保证第一驱动电路制作工艺以及MicroLED发光单元绑定工艺中的高温制程不影响彩色色阻材料特性。
在本申请的另一种实施例中,还提供了一种彩膜基板的制备方法,如图6所示,与上述彩膜基板的制备方法的区别仅在于步骤S2,本实施例的步骤S2中又包括两个步骤,具体如下:
步骤S21,请参照图7(a)所示,以Micro LED发光单元30具有电性接触区的表面30b背离所述基底10的方式将所述Micro LED发光单元30转印于所述基底10的第一像素区域100内。
步骤S22,请参照图7(b)所示,在所述Micro LED发光单元30上制备导电薄膜,并对所述导电薄膜进行图案化,以形成电性连接所述Micro LED发光单元30的电性接触区与所述第一焊接电极20a的导电电极400。
其中,所述电性接触区包括相对设置的N接触区和P接触区,一个所述导电电极400将N接触区与基底10上的N电极电连接,一个所述导电电极400将P接触区与基底10上的P电极电连接。
由于本实施例的彩膜基板是先在基底上制备第一驱动电路以及绑定Micro LED发光单元,之后再制作彩色色阻及黑色矩阵,因此,可以保证第一驱动电路制作工艺以及Micro LED发光单元绑定工艺中的高温制程不影响彩色色阻材料特性。另外,又由于本实施例在Micro LED发光单元绑定工艺中,Micro LED发光单元无需设置传统的焊接电极,因此,可以减小Micro LED发光单元绑定后的高度。
本申请还提供一种显示面板,如图8所示,所述显示面板包括如上所述的彩膜基板1,和阵列基板2,以及位于所述彩膜基板1与所述阵列基板2之间的液晶层3。其中,所述阵列基板2上设置有第二驱动电路21,所述第二驱动电路21设置于第二显示区域200内。由于对应显示面板的第一像素区域100内不设置所述第二驱动电路21,因此不会影响所述第一像素区域100的透光性。
本申请还提供一种显示装置,如图9所示,所述显示装置包括如上所述的显示面板,以及背光模组4和传感器组件5。所述背光模组4对应第一像素区域100设有通孔41,所述传感器组件5正对所述通孔41设置。
其中,所述传感器组件5为光学式传感器,可以实现面部识别、距离感应、指纹识别等,此处不做限制。
综上所述,本申请提供的彩膜基板及其制备方法、显示面板、显示装置,通过采用微发光二极管显示技术与液晶显示技术相结合的形式,从而可以实现LCD极致全面屏显示。又由于彩膜基板在相邻两所述Micro LED发光单元之间设有透光区,所述透光区可以允许光线穿过,因此可以实现屏内传感集成方案。另外,由于本申请的彩膜基板是先在基底上制备第一驱动电路以及绑定Micro LED发光单元,之后再制作彩色色阻及黑色矩阵,因此,可以保证第一驱动电路制作工艺以及Micro LED发光单元绑定工艺中的高温制程不影响彩色色阻材料特性。
综上所述,虽然本申请已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。
Claims (10)
1.一种彩膜基板,包括第一像素区域和邻近所述第一像素区域的第二像素区域,其特征在于,所述彩膜基板包括:
基底;
多个Micro LED发光单元,对应所述第一像素区域设置于所述基底的一侧,其中,多个所述Micro LED发光单元之间设有透光区;
彩色色阻,对应所述第二像素区域设于所述基底的相对另一侧。
2.根据权利要求1所述的彩膜基板,其特征在于,所述基底面向所述Micro LED发光单元的一侧设有封装层,所述封装层位于所述第一像素区域和所述第二像素区域内。
3.根据权利要求2所述的彩膜基板,其特征在于,所述封装层背离所述基底一侧的表面与所述基底之间的距离大于所述Micro LED发光单元背离所述基底一侧的表面与所述基底之间的距离。
4.根据权利要求3所述的彩膜基板,其特征在于,所述封装层的厚度为3μm-100μm;所述封装层对应所述Micro LED发光单元的部分的厚度为2μm-80μm。
5.根据权利要求2所述的彩膜基板,其特征在于,所述封装层的透光率大于或等于70%。
6.根据权利要求1所述的彩膜基板,其特征在于,所述彩膜基板还包括第一驱动电路,所述第一驱动电路对应所述第一像素区域设于所述基底面向所述Micro LED发光单元的一侧,所述Micro LED发光单元与所述第一驱动电路电连接。
7.根据权利要求6所述的彩膜基板,其特征在于,所述第一驱动电路包括沿横向延伸的扫描线和沿纵向延伸的数据线,相邻两所述扫描线与相邻两所述数据线界定出子像素区域,所述Micro LED发光单元在所述基底上的正投影面积小于所述子像素区域的面积。
8.根据权利要求7所述的彩膜基板,其特征在于,所述Micro LED发光单元在所述基底上的正投影面积占所述子像素区域面积的10%-50%,所述Micro LED发光单元包括红色发光单元、绿色发光单元以及蓝色发光单元。
9.根据权利要求1所述的彩膜基板,其特征在于,所述彩色色阻背离所述基底的一侧设有平坦层,所述平坦层位于所述第一像素区域和所述第二像素区域内,所述平坦层背离所述基底一侧的表面为平整面。
10.一种显示面板,其特征在于,包括如权利要求1-9任一项所述的彩膜基板。
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Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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2020
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- 2020-06-23 WO PCT/CN2020/097618 patent/WO2021243766A1/zh active Application Filing
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