CN111570794A - System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming - Google Patents
System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming Download PDFInfo
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- CN111570794A CN111570794A CN202010258669.6A CN202010258669A CN111570794A CN 111570794 A CN111570794 A CN 111570794A CN 202010258669 A CN202010258669 A CN 202010258669A CN 111570794 A CN111570794 A CN 111570794A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000002844 melting Methods 0.000 title claims abstract description 42
- 230000008018 melting Effects 0.000 title claims abstract description 42
- 239000007787 solid Substances 0.000 title claims abstract description 38
- 238000012544 monitoring process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000009434 installation Methods 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims abstract description 6
- 238000010099 solid forming Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 4
- 238000007405 data analysis Methods 0.000 claims description 3
- 230000009123 feedback regulation Effects 0.000 claims 1
- 239000002002 slurry Substances 0.000 abstract description 3
- 238000012806 monitoring device Methods 0.000 abstract 1
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 238000010223 real-time analysis Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0037—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the heat emitted by liquids
- G01J5/004—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the heat emitted by liquids by molten metals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Abstract
The application discloses a system and a method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming. The thermocouple following installation device can monitor the temperature of any layer and specified position in the three-dimensional direct writing forming process of semi-solid metal melting in real time; the infrared camera device is used for acquiring the global temperature of the surface of the current layer; the substrate temperature control device is used for acquiring and adjusting the temperature of the formed substrate; the molten metal temperature monitoring device is used for acquiring the temperature of the semi-solid metal slurry; the data transmission device transmits the acquired temperature data to the background data processing center; the background data processing center is used for analyzing and processing the temperature in real time, providing decision basis for adjusting the semisolid forming process and producing a part product object with higher precision and better quality.
Description
Technical Field
The application relates to a temperature detection system and a temperature detection method for semi-solid metal melting three-dimensional direct-writing forming, and belongs to the field of metal additive manufacturing.
Background
The method is to deposit liquid metal on a substrate layer by layer according to a specified path to obtain a three-dimensional metal part. The high-performance flexible composite material has the characteristics of high efficiency, low cost, flexibility and greenness, and is widely applied to rapid and direct manufacturing of high-performance and complex-structure parts in high-end fields such as aviation, aerospace, military, medical treatment and the like at present.
The semi-solid forming is a novel technology developed in recent years, and has the advantages of lower forming temperature of materials, high dimensional precision of obtained parts, less material waste and realization of near-net forming. The temperature control of the semi-solid forming is a relatively critical process parameter, for example, the temperature control precision requirement of a forming substrate is +/-5 ℃, the temperature control precision of the semi-solid metal forming melting temperature is +/-3 ℃, and the detection control of the overall temperature is required, including the temperature of the forming substrate, the forming metal melting temperature and the temperatures of different layers and different areas in the forming process. The semi-solid process requires real-time analysis, feedback and control of the detected temperature to optimize process parameters and improve the forming quality of a formed part.
Disclosure of Invention
The invention aims to solve the problem that temperature parameters are difficult to comprehensively and directly obtain in the metal semi-solid melting direct-writing process and improve the forming precision, and provides a temperature monitoring system and a temperature monitoring method suitable for semi-solid melting three-dimensional direct-writing forming.
The utility model discloses a three-dimensional direct-write forming temperature monitoring system suitable for semi-solid metal melting on one hand, including thermocouple follow installation device, infrared camera device, base plate temperature control device, molten metal temperature measurement device, data transmission device and backstage data processing center.
The thermocouple following installation device is arranged on the side of the forming platform and is flush with the initial position of the forming platform, real-time temperature monitoring can be carried out on any layer and an appointed position in the three-dimensional direct writing process of semi-solid metal melting, temperature data are sent to a background data processing center through a data transmission device, and a process temperature interval is controlled to be in a semi-solid metal forming effective interval
The infrared camera device is arranged at the top of the forming platform and used for shooting according to set time to obtain the global temperature in the direct writing process.
The substrate temperature control device is arranged in the substrate and can be used for acquiring and adjusting the temperature of the formed substrate; the forming device comprises a thermocouple preset in a forming substrate and a heating coil at the bottom of the forming substrate; and the thermocouple in the forming substrate detects the temperature of the forming substrate, is used for judging whether the temperature of the forming substrate is at a process safety threshold value or not, and triggers a forming substrate heating coil switch to heat or stop heating when the judgment result is negative.
The molten metal temperature measuring device is arranged on thermocouples arranged on the inner side of the crucible from top to bottom and used for acquiring the temperature of the molten metal and judging whether the temperature of the molten metal is in a semi-solid forming temperature range, and when the judgment result is negative, alarming is carried out and feedback adjustment can be carried out according to the set temperature.
The data transmission device is connected with the thermocouple following installation device, the infrared camera device and the molten metal temperature measuring device and is used for sending the temperature data to the background data processing center; and the background processing center is used for analyzing and processing the temperature in real time and judging whether the current temperature range is in the temperature range of the semi-solid forming process or not according to the temperature measured by the thermocouple and the infrared camera device.
The embodiment of the application discloses a system and a method suitable for monitoring three-dimensional direct-writing forming temperature of semi-solid metal melting. The thermocouple is arranged on the side of the forming platform along with the mounting device, and can monitor the temperature of any layer and specified position in the three-dimensional direct writing process of semi-solid metal melting in real time; the infrared camera device is arranged at the top of the forming platform and used for acquiring the global temperature of the surface of the current layer of the formed part in the forming process of the metal melting three-dimensional direct-writing semi-solid forming piece; the substrate temperature control device is arranged in the forming substrate and used for acquiring the temperature information in the forming substrate, judging whether the temperature information is in a process safety threshold value or not and feeding back and adjusting the heating temperature of the forming substrate; the molten metal temperature measuring device is arranged in the crucible and used for acquiring the molten metal temperature information in the crucible and judging whether the molten metal temperature information is in a semi-solid forming temperature range. And each temperature measuring device is connected with the data transmission device and used for sending the temperature information to the background processing center for temperature analysis processing, recording the historical temperatures of the thermocouple and the infrared camera device and generating a temperature process report. The method and the device are based on various temperature measuring modes, the temperature parameters in the semi-solid metal melting direct-writing forming process are obtained in real time, whether the current temperature parameters are in the semi-solid forming interval or not is judged through temperature data analysis, automatic measurement of the melting direct-writing temperature is achieved, and forming accuracy is improved.
Drawings
Fig. 1 is a schematic flow chart of a temperature monitoring system applied to three-dimensional direct-write forming of semi-solid metal melting according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a temperature monitoring system applied to aluminum alloy semi-solid melting three-dimensional direct-writing forming according to an embodiment of the present invention.
Detailed Description
In order to solve the problem that temperature parameters are difficult to obtain in the process of metal semi-solid melting direct-writing technology and improve forming precision, the application discloses a temperature monitoring system and method suitable for semi-solid melting three-dimensional direct-writing forming through the following embodiments.
Example 1
Referring to fig. 1, the present embodiment is a temperature monitoring system suitable for three-dimensional direct-writing forming of semi-solid metal melting, taking temperature monitoring of a356 semi-solid aluminum alloy melting three-dimensional direct-writing as an example, the monitoring system includes a thermocouple following installation device 1, an infrared camera device 2, a substrate temperature control device 3, a molten metal temperature measurement device 4, a data transmission device 5, and a background data processing center 6.
The thermocouple following installation device 1 is arranged on the side of the forming platform 7 and is flush with the initial position of the forming platform 7, temperature real-time monitoring can be carried out on any layer and specified position in the three-dimensional direct writing process of semi-solid metal melting, temperature data are sent to the background data processing center 6 through the data transmission device 5, and the process temperature interval is controlled in the effective semi-solid aluminum alloy forming interval 574-630 ℃.
The infrared camera device 2 is arranged at the top of the forming platform 7 and used for acquiring the surface global temperature of the current layer of the part forming in the forming process of the metal melting three-dimensional direct-writing semi-solid forming piece.
The substrate temperature control device 3 includes a thermocouple provided inside the molding substrate 8 and a heating coil provided at the bottom of the molding substrate 8. The thermocouple in the forming substrate 8 detects the temperature of the forming substrate 8, and is used for judging whether the temperature of the forming substrate 8 is at a process safety threshold of 150-.
The molten metal temperature measuring device 4 is arranged on the inner side of the crucible 9 and used for acquiring the real-time temperature information of the molten metal liquid in the crucible 9 and judging whether the molten metal liquid is in a semi-solid forming temperature range of 630 +/-3 ℃.
And the data transmission device 5 is connected with the thermocouple following installation device 1, the infrared camera device 2 and the molten metal temperature measurement device 4, and is used for sending the temperature data information to the background data processing center 6, carrying out temperature analysis processing, recording the historical temperatures of the thermocouple and the infrared camera device 2, and generating a temperature process report.
The background processing center 6 is used for analyzing and processing the temperature in real time, and judging whether the current temperature range is in the temperature range of the semi-solid forming process or not according to the temperature measured by the thermocouple and the infrared camera device 2.
Example 2
In this embodiment, a semi-solid aluminum alloy is taken as an example, and the method is applied to a semi-solid metal melting three-dimensional direct-writing forming temperature monitoring system disclosed in the embodiments of the present application, as shown in fig. 1 and fig. 2, and the method includes:
And 2, judging whether the current temperature of the forming substrate 8 is 150-200 ℃ of the process safety threshold according to the acquired temperature information of the forming substrate 8, and if so, performing the next step. If the result of the determination is no, the heating temperature of the heating coil inside the substrate is feedback-adjusted until the measured temperature of the formed substrate 8 becomes 200 ℃.
And step 3, acquiring temperature information of the molten metal temperature measuring device 4.
And 4, judging whether the temperature of the aluminum alloy slurry is in a semisolid forming process interval of 574 plus or minus 3 ℃ or not according to the obtained molten metal temperature information and whether the thermocouple acquisition temperature at the nozzle is in a 630 ℃ +/-3 ℃ or not. If the judgment result is yes, the next step is carried out, if the judgment result is no, an alarm is given, and a heating coil on the outer side of the crucible is adjusted in real time, so that the temperature of the aluminum alloy slurry is always kept at about 630 ℃.
And 5, starting the thermocouple following installation device 1, and arranging the thermocouples by the thermocouple ejection device 1-1 according to set time and set positions according to the metal melting three-dimensional direct writing process.
And 6, acquiring the internal temperature of the formed part in the semi-solid metal melting three-dimensional direct-writing forming process.
And 7, carrying out infrared camera shooting collection according to set time, and obtaining the external global temperature of the formed part in the semi-solid metal melting three-dimensional direct-writing forming process.
Further, the method further comprises the steps of recording historical temperatures of the thermocouple and the infrared camera device 2 and generating a temperature process report.
The method and the device are based on various temperature measuring modes, the temperature parameters in the semi-solid metal melting direct-writing forming process are obtained in real time, whether the current temperature parameters are in the semi-solid forming interval or not is judged through temperature data analysis, automatic measurement of the melting direct-writing temperature is achieved, and forming accuracy is improved.
The present application has been described in detail with reference to the specific embodiments and the exemplary embodiments, which are only preferred embodiments of the present patent and are not intended to limit the present patent, and it will be apparent to those skilled in the art that various modifications and variations can be made to the present patent. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (6)
1. The utility model provides a be applicable to three-dimensional direct-write of semi-solid metal melting and take shape temperature monitoring system which characterized in that, includes thermocouple follow installation device (1), infrared camera device (2), base plate temperature control device (3), molten metal temperature survey device (4), data transmission device (5) and backstage data processing center (6):
the thermocouple following installation device (1) is arranged on the side of the forming platform (7) and is flush with the initial position of the forming platform (7), and is used for arranging thermocouples according to set time and set positions according to a metal melting three-dimensional direct writing process to obtain continuous data of forming temperature of each layer;
the infrared camera device (2) is arranged at the top of the forming platform (7) and is used for acquiring the global temperature of the surface of the current layer;
the substrate temperature control device (3) is arranged in the forming substrate (8) and can be used for acquiring and adjusting the temperature of the forming substrate (8);
the molten metal temperature measuring device (4) is arranged on the inner side of the crucible (9) and is used for acquiring the real-time temperature of molten metal;
the data transmission device (5) is connected with the thermocouple following installation device (1), the infrared camera device (2) and the molten metal temperature measuring device (4) and is used for sending the temperature data to the background data processing center (6);
the background processing center (6) is used for analyzing and processing the temperature in real time, comprises a data analysis module and a report generation module, and judges and feeds back and adjusts the current temperature range according to the temperature measured by the thermocouple, so that the process temperature is always in the semi-solid forming process temperature range.
2. The semi-solid metal melting three-dimensional direct-writing forming temperature monitoring system according to claim 1, wherein the thermocouple following installation device (1) can monitor the temperature of any layer and designated position in the semi-solid metal melting three-dimensional direct-writing process in real time, and send the temperature data to the background data processing center (6) through the data transmission device (5), and the process temperature interval is controlled to be in the semi-solid metal forming effective interval.
3. The semi-solid metal melting three-dimensional direct-writing forming temperature monitoring system according to claim 1, wherein the substrate temperature control device (3) comprises a thermocouple pre-arranged inside the forming substrate (8) and a heating coil at the bottom of the forming substrate (8);
and the thermocouple in the forming substrate (8) detects the temperature of the forming substrate (8) and is used for judging whether the temperature of the forming substrate (8) is at a process safety threshold value or not, and when the judgment result is negative, feedback regulation of the heating temperature of the forming substrate (8) is carried out, so that the temperature of the forming substrate (8) is always in a metal melting three-dimensional direct-writing forming temperature interval.
4. The semi-solid metal melting three-dimensional direct-writing forming temperature monitoring system according to claim 1, wherein the molten metal temperature measuring device (4) comprises thermocouples arranged from top to bottom inside the crucible (9) and used for judging whether the molten metal temperature is in a semi-solid forming temperature range when the liquid levels are different in height, giving an alarm when the liquid levels are not in the semi-solid forming temperature range, and feeding back and adjusting according to the set temperature.
5. A method for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming, which is applied to a system for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming disclosed in any one of claims 1 to 3, and comprises:
acquiring temperature information of a set position inside a part in the forming process of a metal melting three-dimensional direct-writing semi-solid forming piece;
obtaining the external global temperature information of the part in the forming process of the metal melting three-dimensional direct-writing semi-solid forming piece;
acquiring internal temperature information of the forming substrate (8), judging whether the internal temperature information is in a process safety threshold value, and feeding back and adjusting the heating temperature of the forming substrate (8);
and obtaining the temperature information of the molten metal in the crucible (9), judging whether the molten metal is in a semi-solid forming temperature range, alarming when the judgment result is negative, and performing feedback adjustment according to the set temperature.
6. The method for monitoring the temperature of the semi-solid metal melting three-dimensional direct-write forming according to claim 5, further comprising,
and recording the historical temperatures of the thermocouple and the infrared camera device (2) and generating a temperature process report.
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CN202010258669.6A CN111570794A (en) | 2020-04-03 | 2020-04-03 | System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming |
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CN202010258669.6A CN111570794A (en) | 2020-04-03 | 2020-04-03 | System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming |
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Cited By (2)
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---|---|---|---|---|
CN114309524A (en) * | 2021-11-26 | 2022-04-12 | 深圳南科强正轻合金技术有限公司 | On-line monitoring system and method for quality of semi-solid slurry |
CN114669758A (en) * | 2022-03-31 | 2022-06-28 | 西安交通大学 | Powder bed melting equipment and method capable of realizing online regulation and control of temperature field |
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CN114669758A (en) * | 2022-03-31 | 2022-06-28 | 西安交通大学 | Powder bed melting equipment and method capable of realizing online regulation and control of temperature field |
CN114669758B (en) * | 2022-03-31 | 2023-10-03 | 西安交通大学 | Powder bed melting equipment and method capable of realizing online regulation and control of temperature field |
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