CN111554851B - Battery pack and heat dissipation method thereof - Google Patents

Battery pack and heat dissipation method thereof Download PDF

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Publication number
CN111554851B
CN111554851B CN202010421739.5A CN202010421739A CN111554851B CN 111554851 B CN111554851 B CN 111554851B CN 202010421739 A CN202010421739 A CN 202010421739A CN 111554851 B CN111554851 B CN 111554851B
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Prior art keywords
bms
heat
radiator
battery pack
semiconductor
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CN111554851A (en
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廖绪滨
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Dongguan Poweramp Technology Ltd
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Dongguan Poweramp Technology Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625—Vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6554—Rods or plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
    • H01M10/6569—Fluids undergoing a liquid-gas phase change or transition, e.g. evaporation or condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
    • H01M10/6572—Peltier elements or thermoelectric devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4278—Systems for data transfer from batteries, e.g. transfer of battery parameters to a controller, data transferred between battery controller and main controller
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

A battery pack comprises a shell, and a battery cell and a BMS (battery management system) which are arranged in the shell, wherein the BMS is electrically connected with the battery cell. The battery pack further comprises a first radiator arranged in the shell, a second radiator arranged outside the shell and a semiconductor refrigeration piece arranged between the first radiator and the second radiator, wherein the semiconductor refrigeration piece comprises a first end connected with the first radiator and a second end connected with the second radiator. The BMS is also electrically connected with the semiconductor refrigeration piece and is used for controlling the semiconductor refrigeration piece to refrigerate at the first end and heat at the second end respectively. The application also provides a heat dissipation method of the battery pack.

Description

Battery pack and heat dissipation method thereof
Technical Field
The application relates to the field of batteries, in particular to a battery pack and a heat dissipation method thereof.
Background
At present, with the rapid development of new energy industries, the battery application field is wider, for example, a power battery system provides electric energy for an electric automobile, and the use of non-renewable resources can be reduced.
In the use process of the Battery, electric devices on a Battery Management System (BMS) consume part of electric energy and convert the electric energy into heat, and if the heat dissipation is not good, the internal part of the electric devices is easy to accumulate heat continuously. Heat continues to build up inside the electrical device. Especially for the great electric devices with high power such as a pre-charging resistor, a relay, an MOS tube and the like, great heat can be generated under extreme working conditions (for example, the relay is switched on and off for many times in a short time under a high-temperature environment, and the pre-charging resistor causes instantaneous temperature rise), if an effective cooling measure cannot be taken to enable the part of heat to be dissipated in time, the temperature in the electric devices can rise rapidly, and even exceeds the normal working temperature of the electric devices. This accelerates the aging of the electric device and reduces its service life.
Disclosure of Invention
For overcoming the defects in the prior art, the battery pack capable of effectively dissipating heat of the BMS is required to be provided, so that the service life of the BMS is prolonged.
In addition, it is necessary to provide a heat dissipation method for a battery pack.
The application provides a battery pack, including the shell and set up electric core and BMS in the shell, electric core is connected to the BMS electricity. The battery pack further comprises a first radiator arranged in the shell, a second radiator arranged outside the shell and a semiconductor refrigeration piece located between the first radiator and the second radiator, wherein the semiconductor refrigeration piece comprises a first end connected with the first radiator and a second end connected with the second radiator. The BMS is still connected the semiconductor refrigeration piece electrically, and the BMS is used for controlling the semiconductor refrigeration piece and is made cold and heat at the first end respectively with making heat at the second end.
This application is controlled semiconductor refrigeration piece through BMS and is refrigerated and heat respectively at first end and second end to form cold junction and hot junction. So the cold energy that semiconductor refrigeration piece produced in cold junction department can be conducted to BMS through first radiator, and the cold energy temperature of cold junction can be less than ambient temperature, even if consequently BMS's electronic component is in extreme operating mode, also can lower the temperature to electronic component sooner, avoids singly leaning on the problem that the radiating effect is not high when first radiator dispels the heat to electronic component, realizes the thermal management to BMS under the extreme operating mode, prolongs BMS's life.
In at least one embodiment of the present application, when a temperature value of the BMS is greater than or equal to a preset value, the BMS is further configured to control conduction between the battery cell and the semiconductor cooling plate.
In at least one embodiment of the present application, a first phase change material layer is disposed between the semiconductor chilling plate and the first heat sink. When heat is conducted to the first phase change material layer, the heat conduction phase change material in the first phase change material layer absorbs latent heat and is changed from a solid state to a liquid state, so that heat on the electronic element is quickly dissipated.
In at least one embodiment of the present application, a second phase change material layer is disposed between the semiconductor chilling plate and the second heat sink. When heat is conducted to the second phase-change material layer, the heat-conducting phase-change material in the second phase-change material layer absorbs latent heat and is converted from a solid state to a liquid state, and therefore heat of the semiconductor chilling plate is dissipated rapidly.
In at least one embodiment of the present disclosure, the first heat sink includes a first substrate and a first heat sink disposed on the first substrate, the first substrate further includes a first receiving groove, and the first end is disposed in the first receiving groove.
In at least one embodiment of the present application, the second heat sink includes a second substrate and a second heat sink disposed on the second substrate, the second substrate further includes a second receiving groove, and the second end is disposed in the second receiving groove. The semiconductor refrigeration piece can be positioned in the first containing groove and the second containing groove.
In at least one embodiment of the present application, a heat conductive material is disposed between the first end and the first receiving groove.
In at least one embodiment of the present application, a heat conductive material is disposed between the second end and the second receiving groove. The heat conduction material is used for improving the heat conduction efficiency between the semiconductor refrigeration piece and the first radiator and the heat conduction efficiency between the semiconductor refrigeration piece and the second radiator.
The present application also provides a heat dissipation method of the battery pack, including the following steps: the BMS controls the semiconductor refrigeration piece to respectively refrigerate at the first end and heat at the second end; the first end conducts cold energy to the first heat sink and the BMS, and the second end conducts heat to the second heat sink.
In at least one embodiment of the present application, before the BMS controls the semiconductor cooling fins to cool at the first end and to heat at the second end, respectively, the heat dissipation method further includes: when the temperature value of the BMS is larger than or equal to the preset value, the BMS controls the conduction between the battery cell and the semiconductor refrigeration piece.
In at least one embodiment of the present application, the heat dissipation method further includes: when the temperature value of the BMS is reduced to be smaller than the preset value, the BMS stops conducting the battery cell and the semiconductor refrigerating sheet.
In at least one embodiment of the present application, the heat dissipation method further includes: the BMS conducts heat to the first heat sink.
Drawings
Fig. 1 is a schematic structural diagram of a battery pack according to an embodiment of the present application.
Fig. 2 is a front view of the battery pack of fig. 1 with the casing and the battery core removed.
Fig. 3 is an exploded view of the battery pack of fig. 1 with the housing and the cells removed.
Fig. 4 is a schematic diagram of electrical connections between the battery cell, the BMS, and the semiconductor cooling plate in the battery pack shown in fig. 1.
Fig. 5A is a schematic structural view of the semiconductor chilling plate shown in fig. 3.
Fig. 5B is a schematic structural view of the semiconductor chilling plate shown in fig. 3 at another angle.
Fig. 6 is a schematic structural diagram of the first heat sink shown in fig. 3.
Fig. 7 is a schematic view of the second heat sink shown in fig. 3 at another angle.
Description of the main elements
Outer casing 10
Battery cell 20
BMS 30
Circuit board 31
Electronic component 32
First heat sink 40
First substrate 41
First heat sink 42
Second heat sink 50
Second substrate 51
Second heat sink 52
Semiconductor refrigerating sheet 60
First end 61
Second end 62
First terminal 63
Second terminal 64
First phase change material layer 70
Second phase change material layer 80
Battery pack 100
The first accommodation groove 410
Second receiving groove 510
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.
Referring to fig. 1 to 4, an embodiment of the present application provides a battery pack 100 including a housing 10, and a battery cell 20 and a BMS 30 disposed in the housing 10. The BMS 30 is electrically connected to the battery cell 20. The BMS 30 may include a circuit board 31 and an electronic component 32 disposed on the circuit board 31, among others. The electronic component 32 may be, but is not limited to, a pre-charge resistor, a relay, a MOS transistor, etc. When the BMS 30 operates, the electronic component 32 generates a certain amount of heat, and particularly under extreme conditions (e.g., the relay is turned on and off repeatedly in a short time under a high temperature environment or the electronic component 32 is frequently subjected to thermal shock, etc.), the electronic component 32 generates a large amount of heat, which causes heat accumulation inside the internal electronic component 32.
The battery pack 100 further includes a first heat sink 40 disposed inside the case 10, a second heat sink 50 disposed outside the case 10, and a semiconductor cooling sheet 60 located between the first heat sink 40 and the second heat sink 50. The BMS 30 is also electrically connected to the semiconductor chilling plates 60.
Referring to fig. 5A and 5B, the semiconductor cooling plate 60 includes a first end 61 connected to the first heat sink 40 and a second end 62 connected to the second heat sink 50. The BMS 30 serves to control the semiconductor cooling fins 60 to cool at a first end 61 and to heat at a second end 62, respectively, thereby forming a cold side and a hot side. In at least one embodiment of the present application, when the temperature value of the electronic component 32 of the BMS 30 is greater than or equal to a preset value (e.g., the electronic component 32 generates more heat under an extreme condition), the BMS 30 is further configured to conduct the battery cell 20 and the semiconductor cooling plate 60. Since the semiconductor chilling plate 60 includes a galvanic couple formed by two different types of semiconductor materials connected in series, when the battery cell 20 and the semiconductor chilling plate 60 are conducted, the battery cell 20 supplies power to the semiconductor chilling plate 60 by using the Peltier (Peltier) effect of the semiconductor materials, so that heat transfer occurs between both ends of the galvanic couple, and the heat is transferred from one end to the other end. That is, the semiconductor chilling plates 60 are capable of chilling at the first end 61 and heating at the second end 62, respectively, thereby forming a cold end and a hot end.
As such, on the one hand, the cold energy generated at the cold end of the semiconductor cooling fins 60 can be conducted to the BMS 30 through the first heat sink 40, thereby cooling the electronic component 32. A mode in which cold energy is conducted to the BMS 30 through the semiconductor cooling fins 60 to cool down the electronic components 32 is referred to as an active heat dissipation mode. When the temperature value of the electronic components 32 of the BMS 30 is greater than or equal to a preset value, the battery pack 100 may dissipate heat in an active heat dissipation mode. On the other hand, the heat generated at the semiconductor cooling fins 60 and the hot end can be conducted to the second heat sink 50 and dissipated by the second heat sink 50 to the air of the external environment.
In addition, when the temperature value of the electronic component 32 of the BMS 30 is less than the preset value, the battery cell 20 may stop supplying power to the semiconductor cooling plate 60, and the semiconductor cooling plate 60 does not operate. At this time, the heat generated by the electronic component 32 is conducted to the first heat sink 40, and is dissipated into the air in the housing 10 by the first heat sink 40. The mode in which the electronic component 32 conducts heat to the first heat sink 40 and dissipates heat is a passive heat dissipation mode.
In the present application, when the temperature value of the electronic component 32 of the BMS 30 is greater than or equal to a preset value, the BMS 30 controls the semiconductor cooling sheet 60 to perform cooling and heating at the first and second ends 61 and 62, respectively. Consequently, the cold energy that semiconductor refrigeration piece 60 produced in cold junction department can be conducted to BMS 30 through first radiator 40, and the cold energy temperature of cold junction can be less than ambient temperature, even if consequently BMS 30's electronic component 32 is in extreme operating mode, also can lower the temperature to electronic component 32 relatively fast, the not high problem of radiating effect when avoiding singly leaning on first radiator 40 to dispel the heat to electronic component 32, realize the thermal management to BMS 30 under the extreme operating mode, extension BMS 30's life.
Specifically, as shown in fig. 4 to 5B, the semiconductor chilling plate 60 further comprises a first terminal 63 and a second terminal 64 with opposite polarities. For example, the first terminal 63 may be a positive terminal, and the second terminal 64 may be a negative terminal. The first terminal 63 is connected to a positive terminal of the BMS 30, and the positive terminal of the BMS is further connected to a positive terminal of the battery cell 20. The second terminal 64 is connected with a negative terminal of the BMS 30, and the negative terminal of the BMS is further connected with a negative terminal of the battery cell 20.
As shown in fig. 1 to 3, in at least one embodiment of the present application, a first phase change material layer 70 is disposed between the semiconductor chilling plate 60 and the first heat sink 40.
When in the passive heat dissipation mode, heat generated by the electronic component 32 is conducted through the first phase change material layer 70 to the first heat sink 40. Since the first phase change material layer 70 includes a heat conductive phase change material, when heat is conducted to the first phase change material layer 70, the heat conductive phase change material in the first phase change material layer 70 absorbs latent heat and changes from a solid state to a liquid state, so that heat on the electronic element 32 is rapidly dissipated while the temperature of the heat conductive phase change material is maintained within a certain range. In addition, when the phase transformation of the heat conductive phase change material of the first phase change material layer 70 is completed, the heat can be conducted to the first heat sink 40 as a heat conductive material.
Further, a second phase change material layer 80 is provided between the semiconductor chilling plate 60 and the second heat sink 50.
When in the active heat dissipation mode, the heat of the semiconductor chilling plate 60 is conducted to the second heat sink 50 through the second phase change material layer 80. Because the second phase-change material layer 80 includes the heat-conducting phase-change material, when heat is conducted to the second phase-change material layer 80, the heat-conducting phase-change material in the second phase-change material layer 80 absorbs latent heat and changes from a solid state to a liquid state, so that heat of the semiconductor chilling plate 60 is rapidly dissipated, and meanwhile, the temperature of the heat-conducting phase-change material is maintained within a certain range, so that the semiconductor chilling plate 60 can normally work. In addition, when the phase transformation of the heat conducting phase change material of the second phase change material layer 80 is completed, the heat can be conducted to the second heat sink 50 as the heat conducting material.
Referring to fig. 6, in at least one embodiment of the present disclosure, the first heat sink 40 includes a first substrate 41 and a first heat sink 42 disposed on the first substrate 41, the first substrate 41 further has a first receiving slot 410, and the first end 61 is disposed in the first receiving slot 410.
Further, referring to fig. 7, the second heat sink 50 includes a second substrate 51 and a second heat sink 52 disposed on the second substrate 51, the second substrate 52 is further provided with a second receiving groove 510, and the second end 62 is disposed in the second receiving groove 510. Therefore, the semiconductor chilling plates 60 may be positioned in the first receiving groove 410 and the second receiving groove 510.
However, since the first and second heat dissipation fins 42 and 52 are each provided in a plurality of numbers and have a small thickness-height ratio, the surface areas of the first and second heat dissipation fins 42 and 52 are large, and heat can be dissipated quickly. The number of the first receiving grooves 410 and the second receiving grooves 510 may be set according to the number of the semiconductor chilling plates 60. The number of the semiconductor cooling fins 60 is two, and thus the number of the first receiving grooves 410 and the number of the second receiving grooves 510 are two.
In at least one embodiment of the present disclosure, a heat conductive material (not shown) may be disposed between the first end 61 and the first receiving groove 410, and a heat conductive material (not shown) may be disposed between the second end 62 and the second receiving groove 510. The thermally conductive material may be a thermally conductive grease. The heat conductive material is used to fill the gap between the first end 61 and the first receiving groove 410 and the gap between the second end 62 and the second receiving groove 510, thereby improving the heat conduction efficiency between the semiconductor chilling plate 60 and the first heat sink 40 and the heat conduction efficiency between the semiconductor chilling plate 60 and the second heat sink 50.
The present application further provides a heat dissipation method of the battery pack 100, including the following steps:
step S1: the BMS 30 controls the semiconductor chilling plates 60 to chill at a first end 61 and to heat at a second end 62, respectively.
In at least one embodiment of the present application, when the temperature value of the BMS 30 is greater than or equal to the preset value, the BMS 30 controls conduction between the battery cell 20 and the semiconductor cooling plate 60, and the battery cell 20 supplies power to the semiconductor cooling plate 60, so that heat is transferred from one end of the semiconductor cooling plate 60 to the other end. That is, the semiconductor cooling fins 60 cool at the first end 61 and heat at the second end 62, respectively.
Step S2: the first end 61 conducts cold heat to the first heat sink 40 and the BMS 30, and the second end 62 conducts heat to the second heat sink 50.
That is, the battery pack 100 enters the active heat dissipation mode. On the one hand, the electronic component 32 is cooled by conducting the cold energy generated at the first end 61 of the semiconductor cooling fin 60 to the BMS 30 through the first heat sink 40. On the other hand, the heat generated by the semiconductor cooling fins 60 at the second end 62 is conducted to the second heat sink 50 and dissipated by the second heat sink 50 to the air of the external environment.
More specifically, the heat of the semiconductor chilling plates 60 is conducted to the second heat sink 50 through the second phase change material layer 80. When heat is conducted to the second phase-change material layer 80, the heat-conducting phase-change material in the second phase-change material layer 80 absorbs latent heat and changes from a solid state to a liquid state, so that heat of the semiconductor chilling plate 60 is dissipated quickly, and meanwhile, the temperature of the heat-conducting phase-change material is maintained within a certain range, so that the semiconductor chilling plate 60 can work normally. In addition, when the phase transformation of the heat conducting phase change material of the second phase change material layer 80 is completed, the heat can be conducted to the second heat sink 50 as the heat conducting material.
In at least one embodiment of the present application, the heat dissipation method further includes:
and step S3: when the temperature value of the BMS 30 is reduced to be less than the preset value, the BMS 30 stops conducting the battery cell 20 and the semiconductor chilling plate 60.
When the BMS 30 stops conducting the battery cell 20 and the semiconductor cooling plate 60, the semiconductor cooling plate 60 does not work, that is, the semiconductor cooling plate 60 stops cooling and heating at the first end 61 and the second end 62.
And step S4: the BMS 30 conducts heat to the first heat sink 40.
That is, when the BMS 30 temperature value is reduced below the preset value through the active heat dissipation mode, the battery pack 100 may be switched to the passive heat dissipation mode.
When in the passive heat dissipation mode, the heat generated by the electronic component 32 is conducted to the first heat sink 40 and dissipated into the air in the housing 10 by the first heat sink 40. More specifically, heat generated by the electronic component 32 is conducted through the first phase change material layer 70 to the first heat sink 40. When heat is conducted to the first phase change material layer 70, the heat conductive phase change material in the first phase change material layer 70 absorbs latent heat and changes from a solid state to a liquid state, thereby rapidly dissipating the heat on the electronic element 32. In addition, when the phase transformation of the heat conductive phase change material of the first phase change material layer 70 is completed, the heat can be conducted to the first heat sink 40 as a heat conductive material.
In at least one embodiment of the present application, a temperature sensor (not shown) is disposed on the electronic component 32 of the BMS 30, and the temperature sensor is electrically connected to the circuit board 31 of the BMS 30. The temperature sensor is used to sense a temperature value of the electronic component 32. The circuit board 31 receives a temperature value of the electronic component 32 sensed by the temperature sensor, and conducts the battery cell 20 and the semiconductor chilling plate 60 when the temperature value is greater than or equal to a preset value.
Further, when the circuit board 31 determines that the temperature value sensed by the temperature sensor is reduced to be lower than the preset value, the conduction of the battery cell 20 and the semiconductor chilling plate 60 is stopped, so that the semiconductor chilling plate 60 does not work at this time.
In addition, it is obvious to those skilled in the art that other various corresponding changes and modifications can be made according to the technical idea of the present application, and all such changes and modifications should fall within the protective scope of the claims of the present application.

Claims (8)

1. A battery pack comprising a case, and a battery cell and a BMS disposed in the case, the BMS being electrically connected to the battery cell,
the battery pack further comprises a first radiator arranged in the shell, a second radiator arranged outside the shell and a semiconductor refrigerating sheet positioned between the first radiator and the second radiator, a first phase change material layer is arranged between the BMS and the first radiator, a second phase change material layer is arranged between the semiconductor refrigerating sheet and the second radiator, the semiconductor refrigerating sheet comprises a first end connected with the first radiator and a second end connected with the second radiator, the first radiator comprises a first substrate and first radiating fins positioned on the first substrate, a first accommodating groove is further formed in the first substrate, the first accommodating groove and the first radiating fins are positioned on one side, away from the BMS, of the first substrate, the second radiator comprises a second substrate and second radiating fins positioned on the second substrate, a second accommodating groove is further formed in the second substrate, and the semiconductor refrigerating sheet is positioned in the first accommodating groove and the second accommodating groove;
the BMS is also electrically connected with the semiconductor refrigerating sheet, the BMS is used for controlling the semiconductor refrigerating sheet to refrigerate at the first end and heat at the second end respectively, the first radiator is connected with the BMS, when the temperature value of the BMS is greater than or equal to a preset value, cold energy generated at the first end is conducted to the BMS through the first radiator so as to cool electronic elements on the BMS, and heat generated at the second end can be conducted to the second radiator and is radiated by the second radiator.
2. The battery pack according to claim 1,
and when the temperature value of the BMS is greater than or equal to a preset value, the BMS is also used for controlling the conduction between the battery cell and the semiconductor refrigeration piece.
3. The battery pack of claim 1, wherein a thermally conductive material is disposed between the first end and the first receiving groove.
4. The battery pack of claim 1, wherein a thermally conductive material is disposed between the second end and the second receiving groove.
5. A heat dissipation method of a battery pack according to any one of claims 1 to 4, comprising the steps of:
the BMS controls the semiconductor refrigeration piece to refrigerate at the first end and heat at the second end respectively; and
the first end conducts cold energy to the first heat sink and the BMS, and the second end conducts heat to the second heat sink.
6. The heat dissipation method of claim 5, wherein the BMS controls the semiconductor chilling plates to respectively cool at the first end and heat at the second end, further comprising:
and when the temperature value of the BMS is greater than or equal to a preset value, the BMS controls the conduction between the battery cell and the semiconductor refrigeration piece.
7. The heat dissipation method of claim 6, further comprising:
and when the temperature value of the BMS is reduced to be smaller than the preset value, the BMS stops conducting the battery cell and the semiconductor refrigerating sheet.
8. The heat dissipation method of claim 7, further comprising:
the BMS conducts heat to the first heat sink.
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