CN107732359A - Electric automobile power battery heat management device based on semiconductor refrigerating technology - Google Patents
Electric automobile power battery heat management device based on semiconductor refrigerating technology Download PDFInfo
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- CN107732359A CN107732359A CN201710792640.4A CN201710792640A CN107732359A CN 107732359 A CN107732359 A CN 107732359A CN 201710792640 A CN201710792640 A CN 201710792640A CN 107732359 A CN107732359 A CN 107732359A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/63—Control systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6552—Closed pipes transferring heat by thermal conductivity or phase transition, e.g. heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
- H01M10/6572—Peltier elements or thermoelectric devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to the electric automobile power battery heat management device based on semiconductor refrigerating technology, is arranged in battery core module and gap is left between battery core；Including semiconductor chilling plate, two radiators being fixedly connected, controller and by the uniform heat conducting element on a heat sink of heat caused by semiconductor chilling plate or cold；Two radiators are separately positioned on hot junction and the cold end of semiconductor chilling plate, and some heat conducting elements are respectively crimped between the hot junction or cold end of radiator and semiconductor chilling plate；Controller is connected by wire with semiconductor chilling plate and controls semiconductor refrigeration chip heating or refrigeration by switching polarity of voltage.The present invention uses semiconductor electronic technology, by switching polarity of voltage, realizes heating and cooling function, and sets two radiators respectively in the two sides of semiconductor chilling plate, improves heat transference efficiency；By crimping heat conducting element between radiator and semiconductor chilling plate, the heat transfer efficiency between semiconductor chilling plate and radiator is improved.
Description
Technical field
The present invention relates to the heat management device of power battery of electric automobile, and in particular to one kind is based on semiconductor refrigerating technology
Electric automobile power battery heat management device.
Background technology
Electrokinetic cell is the unique power source of pure electric automobile, and its service behaviour and service life is by environment temperature
Influence very big.In high temperature environments, inside battery irreversible reaction thing formation speed is accelerated, and increasing for irreversible reaction thing causes
The active volume of battery accelerates to reduce, and when the active volume of battery is less than the 80% of battery rated capacity, the life-span of battery is whole
Knot；Battery discharge and recharge at low ambient temperatures, the internal resistance of battery are increased, and discharge voltage plateau is reduced, and active volume is reduced, battery
Efficiency for charge-discharge substantially reduces, and has certain infringement in itself to battery, and according to the statistics of international battery association, automobile is in winter
It is required that startup power higher 40% to 70% than summer.At -18 DEG C, a fully charged brand-new electrokinetic cell can only also provide
40% startup power.To improve the service life of electric automobile power battery system, improve the high temperature performance of electrokinetic cell,
Therefore, heat management important in inhibiting is carried out to electric automobile power battery.Power battery thermal management system can not only make battery
Group effectively radiating, and be required at low temperature effectively heat battery under the high temperature conditions, is operated in battery pack
Suitable environment temperature, to keep the optimal service behaviour of battery pack.
At present, the conventional heat management system of electric automobile power battery is divided into heating system and cooling system, that is, heats work(
Can separately it be designed with heat sinking function.Typically heated using flexible heater film or PTC, radiated using air-cooled or liquid is cold,
The device being related to is more, and protection is complicated, reduces the reliability of system, adds failure risk, and cost is higher.
The content of the invention
The technical problems to be solved by the invention are in view of the shortcomings of the prior art, there is provided one kind is based on semiconductor refrigerating skill
The electric automobile power battery heat management device of art.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：Electric powered motor based on semiconductor refrigerating technology
Thermal management device of battery, it is arranged in battery core module and gap is left between battery core；Including semiconductor chilling plate, two fixations
The radiator of connection, controller and heat or cold caused by the semiconductor chilling plate are distributed on the radiator
Heat conducting element；
Two radiators are separately positioned on hot junction and the cold end of the semiconductor chilling plate, the radiator and described
Some heat conducting elements are respectively crimped between the hot junction of semiconductor chilling plate or cold end；The controller and the semiconductor system
Cold is connected by wire and controls the semiconductor refrigeration chip heating or refrigeration by switching polarity of voltage.
The beneficial effects of the invention are as follows：The present invention uses semiconductor electronic technology, by switching polarity of voltage, realizes heating
And cooling function, make heating or refrigeration cool-down function unified, reduce heat management related device, reduce cost, and partly leading
The two sides of body cooling piece set two radiators respectively, improve heat transference efficiency；By in radiator and semiconductor refrigerating
Heat conducting element is crimped between piece, improves the heat transfer efficiency between semiconductor chilling plate and radiator.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the radiator offered on the one side of the semiconductor chilling plate it is some along its length
The mounting groove of arrangement, adaptation is arranged in some mounting grooves some heat conducting elements correspondingly.
It is using the above-mentioned further beneficial effect of scheme：By opening up mounting groove on a heat sink, and by heat conducting element
Be arranged in mounting groove so that heat conducting element it is easier for installation, consolidate.
Further, the heat conducting element is concordant close to the one side of the semiconductor chilling plate with the radiator.
It is using the above-mentioned further beneficial effect of scheme：By by heat conducting element and radiator close to semiconductor chilling plate
One side it is concordant, the one side of radiator is fully contacted with the one side of semiconductor chilling plate, increase heat conducting element with
The contact area of semiconductor chilling plate.
Further, the heat conducting element is heat pipe.
It is using the above-mentioned further beneficial effect of scheme：By using heat pipe as heat conducting element, due to heat pipe be according to
The heat transfer element of heat transfer is realized by the phase transformation of therein hydraulic fluid, there is very high thermal conductivity, excellent isothermal, hot-fluid
The features such as density changeability, the invertibity of direction of heat flow, thermostatic characteristics and environmental suitability, therefore heat pipe utilizes medium in heat
In the phase transition process (evaporation latent heat and the latent heat of condensation that utilize liquid) of cold end condensation after the evaporation of end, heat is set quickly to conduct.
Further, in addition to the thermal insulation board that is fixed between two radiators, the two sides difference of the thermal insulation board
Crimped with two radiator sealings, the mounting hole of insertion, the semiconductor chilling plate adaptation are offered on the thermal insulation board
In the mounting hole.
It is using the above-mentioned further beneficial effect of scheme：By setting thermal insulation board between two radiators, heat-insulated
Mounting hole is opened up on plate, and semiconductor chilling plate adaptation is arranged on mounting hole, semiconductor chilling plate is encapsulated in mounting hole
It is interior, avoid semiconductor chilling plate and produce being scattered and disappeared from the gap between two radiators for heat or cold.
Further, offered on the thermal insulation board and the cooling piece outlet of the mounting hole and ft connection is kept away into a hole, institute
State the wire on semiconductor chilling plate and keep away a hole from the cooling piece outlet and pass.
It is using the above-mentioned further beneficial effect of scheme：A hole is kept away by opening up cooling piece outlet on thermal insulation board, side
Just the wire on semiconductor chilling plate is kept away a hole from cooling piece outlet and passed.
Further, in addition to respectively the temperature-monitoring element and warning device electrically connected with the controller；
The temperature-monitoring element is used for the temperature that the temperature of the semiconductor chilling plate is monitored and will monitored
Value is sent to controller；
The controller is used to control the warning device to be alarmed when the temperature value exceeds preset temperature range.
It is using the above-mentioned further beneficial effect of scheme：By setting temperature-monitoring element, possess temperature-monitoring function,
It is too high or cryogenic temperature is too low to prevent heating-up temperature, prevent temperature control risk.
Further, the radiator is is made and sandblasting and anodized are passed through in surface of aluminium extrusion moulding process
Heat sink, the heat sink is plane close to the one side of the semiconductor chilling plate, and the heat sink is partly led away from described
The one side of body cooling piece is connected with multiple radiation tooths.
It is using the above-mentioned further beneficial effect of scheme：Radiator is molded using aluminium extruded, surface sand-blasting process, improves
Area of dissipation, surface hard Yang Hua processing, enhances antiseptic power, improves radiating efficiency, strengthen insulating properties.
Further, it is coated with heat-conducting silicone grease between the radiator and the semiconductor chilling plate；The battery core module and
Heat-conducting insulated film is provided between the radiator, the heat-conducting insulated film is covered in the table of the battery core module or the radiator
Face.
It is using the above-mentioned further beneficial effect of scheme：By smearing heat conduction between radiator and semiconductor chilling plate
Silicone grease, improve heat transference efficiency.
Further, the number of the semiconductor chilling plate is multiple and uniform crimp between two radiators.
It is using the above-mentioned further beneficial effect of scheme：By setting multiple semiconductor chilling plates and being evenly arranged in two
Between individual radiator, heat exchange area is increased, improves heat exchange efficiency.
Brief description of the drawings
Fig. 1 is the exploded perspective structural representation of the electric automobile power battery heat management device of the present invention；
Fig. 2 is the dimensional structure diagram of the electric automobile power battery heat management device of the present invention；
Fig. 3 is the dimensional structure diagram of the radiator of the present invention；
Fig. 4 is the dimensional structure diagram of the thermal insulation board of the present invention；
Fig. 5 is the dimensional structure diagram of the heat pipe of the present invention.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, semiconductor chilling plate；11st, wire；2nd, radiator；21st, mounting groove；22nd, heat sink；23rd, radiation tooth；3rd, heat conduction
Element；4th, thermal insulation board；41st, mounting hole；42nd, cooling piece outlet keeps away a hole；5th, temperature-monitoring element；6th, connecting rivet.
Embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
As Figure 1-Figure 5, the electric automobile power battery heat management device based on semiconductor refrigerating technology, is arranged on electricity
Gap is left in core group and between battery core；Including 1, two radiator being fixedly connected 2 of semiconductor chilling plate, controller with
And heat or cold caused by the semiconductor chilling plate 1 are distributed on the heat conducting element 3 on the radiator 2；Described in two
Radiator 2 is separately positioned on hot junction and the cold end of the semiconductor chilling plate 1, the radiator 2 and the semiconductor chilling plate 1
Hot junction or cold end between be respectively crimped with some heat conducting elements 3；The controller is with the semiconductor chilling plate 1 by leading
Line 11 connects and controls the semiconductor chilling plate 1 to heat or freeze by switching polarity of voltage.
The present embodiment uses semiconductor electronic technology, by switching polarity of voltage, realizes heating and cooling function, makes heating
Or refrigeration cool-down function is unified, reduces heat management related device, cost is reduced, and in the two sides of semiconductor chilling plate point
Not She Zhi two radiators, improve heat transference efficiency；By crimping heat conducting element between radiator and semiconductor chilling plate,
Improve the heat transfer efficiency between semiconductor chilling plate and radiator.
Specifically, be attached between two radiators by some connecting rivets 6, for example, as shown in figures 1 and 3, can
Two radiators 2 are fixed up using four connecting rivets 6.
As shown in figure 3, the radiator 2 of the present embodiment offers on the one side of the semiconductor chilling plate 1
Some mounting grooves 21 arranged along its length, some heat conducting elements 3 are adapted to installed in some described correspondingly
In mounting groove 21.It is arranged on by opening up mounting groove on a heat sink, and by heat conducting element in mounting groove so that heat conducting element
It is easier for installation, consolidate.
As shown in Figure 3 and Figure 5, the heat conducting element 3 of the present embodiment and the radiator 2 are close to the semiconductor refrigerating
The one side of piece 1 is concordant.By the way that heat conducting element is concordant close to the one side of semiconductor chilling plate with radiator, make radiator
One side fully contacts with the one side of semiconductor chilling plate, increases the contact area of heat conducting element and semiconductor chilling plate.
Specifically, the heat conducting element 3 is heat pipe.By using heat pipe as heat conducting element, because heat pipe is to rely on certainly
The heat transfer element of heat transfer is realized in the phase transformation of body internal working fluid, has very high thermal conductivity, excellent isothermal, heat flow density
The features such as changeability, the invertibity of direction of heat flow, thermostatic characteristics and environmental suitability, therefore heat pipe is steamed using medium in hot junction
In the phase transition process (evaporation latent heat and the latent heat of condensation that utilize liquid) of cold end condensation after hair, heat is set quickly to conduct.
The heat conducting element 3 of the present embodiment is multiple, i.e., heat pipe has more；Mounting groove 21 on radiator 2 is also more
Individual, multiple mounting grooves 21 are arranged in parallel and equidistant.The bottom land of the mounting groove 21 is globoidal structure, the heat pipe adaptation
In the mounting groove 21, heat pipe is located at a part for the notch of mounting groove 21 and radiator 2 is crimped on semiconductor system
One side on cold 1 is concordant.Bottom land is the mounting groove of globoidal structure, it is possible to increase the contact area of heat pipe and radiator, is improved
Heat transfer efficiency.Heat pipe is concordant with radiator one side, the heat transfer area between heat pipe and semiconductor chilling plate is also increased,
Improve heat transfer efficiency.
Specifically, the length of the mounting groove 21 is adapted with the length of heat pipe, and when radiator 2 is crimped on semiconductor system
When on cold 1, every heat pipe on the radiator 2 can connect with all semiconductor chilling plates 1 between two radiators 2
Touch.
As depicted in figs. 1 and 2, the electric automobile power battery heat management device of the present embodiment also includes being fixed on two institutes
The thermal insulation board 4 between radiator 2 is stated, the two sides of the thermal insulation board 4 crimp with two sealings of radiator 2 respectively, described
The mounting hole 41 of insertion is offered on thermal insulation board 4, the mounting hole connects two radiators 2, the semiconductor chilling plate 1
Adaptation is arranged in the mounting hole 41.By setting thermal insulation board between two radiators, mounting hole is opened up on thermal insulation board,
And semiconductor chilling plate adaptation is arranged on mounting hole, semiconductor chilling plate is encapsulated in mounting hole, avoid semiconductor
Cooling piece produces being scattered and disappeared from the gap between two radiators for heat or cold.
As shown in figure 4, the mounting hole 41 on the thermal insulation board 4 can be square opening, the side of being also configured as of semiconductor chilling plate 1
Shape structure, two wires 11 are drawn on each semiconductor chilling plate 1.
As shown in Fig. 2 the electric automobile power battery heat management device of the present embodiment also include respectively with the controller
The temperature-monitoring element 5 and warning device of electrical connection；The temperature-monitoring element 5 is used for the temperature to the semiconductor chilling plate 1
Degree is monitored and sends the temperature value monitored to controller；The controller is used for when the temperature value is beyond default temperature
The warning device is controlled to be alarmed when spending scope.By setting temperature-monitoring element, possesses temperature-monitoring function, to prevent half
The heating-up temperature of conductor cooling piece is too high or cryogenic temperature is too low, prevents temperature control risk.
Specifically, the temperature-monitoring element 5 can be arranged on the inner surface of the radiator 2, for monitoring semiconductor
The temperature of cooling piece 1.The number of temperature-monitoring element 5 can be any number, and the present embodiment is preferably three.
As shown in figure 3, the radiator 2 of the present embodiment is is made and sandblasting is passed through on surface of aluminium extrusion moulding process
With the heat sink 22 of anodized, the heat sink 22 is plane close to the one side of the semiconductor chilling plate 1, described
One side of the heat sink 22 away from the semiconductor chilling plate 1 is connected with multiple radiation tooths 23.Radiator uses aluminium extrusion
Shaping, surface sand-blasting process, improves area of dissipation, surface hard Yang Hua processing, enhances antiseptic power, improves radiating effect
Rate, strengthen insulating properties.
Heat-conducting silicone grease is coated between the radiator 2 and the semiconductor chilling plate 1 of the present embodiment；The battery core mould
Heat-conducting insulated film is provided between group and the radiator 2, the heat-conducting insulated film is covered in the battery core module or the radiating
The surface of device 2.By smearing heat-conducting silicone grease between radiator and semiconductor chilling plate, heat transference efficiency is improved.
As shown in Fig. 2 the number of the semiconductor chilling plate 1 of the present embodiment be multiple and uniform crimp described in two
Between radiator 2, preferably three semiconductor chilling plates 1.By setting multiple semiconductor chilling plates and being evenly arranged in two
Between radiator, heat exchange area is increased, improves heat exchange efficiency.
Specifically, the heat sink 22 and thermal insulation board 4 of the present embodiment are rectangle structure, four connecting rivets 6 pass through two
Individual heat sink 22 and thermal insulation board 4 are fastened.Length direction of three semiconductor chilling plates 1 along the thermal insulation board 4 is equidistantly arranged
Cloth.Length direction arrangement of the heat pipe along heat sink 22, every heat pipe can crimp with three semiconductor chilling plates 1.
Specifically, the radiation tooth is along the square extension of the length of heat sink 22, radiation tooth and the length of the long side of heat sink 22
Spend equal, the long side of radiation tooth 23 and heat sink 22 is be arranged in parallel, the cross section of radiation tooth 23 is radiated in substantially trapezium structure
The one end of tooth 23 away from the heat sink 22 can pass through arc transition.Side of the heat sink 22 away from the semiconductor chilling plate 1
It is covered with the radiation tooth 23 on face.
The heat pipe of the present embodiment can use straight tube, can also use bend pipe, can press multiple semiconductor chilling plates 1
Catching is advisable.
As shown in figure 4, the refrigeration by the mounting hole 41 and ft connection is offered on the thermal insulation board 4 of the present embodiment
Piece outlet keeps away a hole 42, and the wire 11 on the semiconductor chilling plate 1 is kept away a hole 42 from the cooling piece outlet and passed.By
Cooling piece outlet is opened up on thermal insulation board and keeps away a hole, facilitates the wire on semiconductor chilling plate to keep away a hole from cooling piece outlet and passes.
A kind of electric automobile power battery heat management device based on semiconductor refrigerating technology of the present embodiment, it has temperature
Two-way regulating function is spent, is the Peltier effects using semi-conducting material, when direct current passes through two kinds of different semi-conducting material strings
During the galvanic couple being unified into, heat can be absorbed respectively at the both ends of galvanic couple and release heat, be provided simultaneously with heating and refrigeration characteristic, can
To realize the purpose of heating or refrigeration.Semiconductor chilling plate is used cooperatively with radiator, when electric automobile is in low temperature environment
This heat management device can be utilized to apply pole reversal voltage (reversely connecting circuit), you can heated to battery pack.Conversely,
When electric vehicle battery system internal temperature reaches setting threshold temperature, this heat management device can be also utilized to apply polarity in the same direction
Voltage (i.e. positive to connect circuit), is cooled by semiconductor refrigerating to battery pack.It is internally integrated simultaneously in heat sink material
Temperature-sensitive thermo-sensitive material, i.e. temperature-monitoring element, when the environment temperature on semiconductor chilling plate periphery rises to predetermined action temperature,
Temperature-monitoring element acts, and controls warning device then to produce alarm by controller, to reach temperature-monitoring function.
The semiconductor chilling plate that the present embodiment uses is a kind of telluride bismuth compound solid solution, using ceramic package, insulation
Safe, movement-less part, reliability is also higher, no refrigerant pollution, more environmentally friendly.The heat conduction of collocation high thermal conductivity dissipates
Hot material, in heating or refrigeration in order to which heat transmits faster, design the heat-transfer device of uniqueness and formed with heated object
Thermal conductive surface to greatest extent, conductive performance is good, heating is uniform, energy-saving safe, service life are long, corrosion resistance is strong, low-voltage direct
Input, drive circuit is simple and low cost and other advantages.
The electric automobile power battery heat management device of the present embodiment is provided simultaneously with heating and radiating and cooling function, also has concurrently
Temperature feedback function, and the characteristic with quick heating and radiating and cooling, are greatly improved heating and radiating efficiency.
In the description of the invention, it is to be understood that term " length ", " width ", " thickness ", " on ", " under ",
The orientation or position relationship of the instruction such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or dark
Show that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, thus it is it is not intended that right
The limitation of the present invention.
In addition, in the description of the invention, " multiple " are meant that at least two, such as two, three etc., unless otherwise
It is clearly specific to limit.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect；Can be joined directly together, can also be indirectly connected by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements, limited unless otherwise clear and definite.For one of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office
Combined in an appropriate manner in one or more embodiments or example.In addition, in the case of not conflicting, the skill of this area
Art personnel can be tied the different embodiments or example and the feature of different embodiments or example described in this specification
Close and combine.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changed, replacing and modification.
Claims (10)
1. the electric automobile power battery heat management device based on semiconductor refrigerating technology, it is arranged in battery core module and and battery core
Between leave gap；It is characterised in that it includes semiconductor chilling plate (1), two radiators (2) being fixedly connected, controller with
And heat or cold caused by the semiconductor chilling plate (1) are distributed on to the heat conducting element (3) on the radiator (2)；
Two radiators (2) are separately positioned on hot junction and the cold end of the semiconductor chilling plate (1), the radiator (2)
Some heat conducting elements (3) are respectively crimped between the hot junction of the semiconductor chilling plate (1) or cold end；The controller with
The semiconductor chilling plate (1) is connected by wire (11) and controls the semiconductor chilling plate (1) by switching polarity of voltage
Heating or refrigeration.
2. the electric automobile power battery heat management device based on semiconductor refrigerating technology according to claim 1, its feature
It is, the radiator (2) offers on the one side of the semiconductor chilling plate (1) and some arranged along its length
Mounting groove (21), some heat conducting elements (3) correspondingly adaptation be arranged on some mounting grooves (21) in.
3. the electric automobile power battery heat management device based on semiconductor refrigerating technology according to claim 2, its feature
It is, the heat conducting element (3) is concordant close to the one side of the semiconductor chilling plate (1) with the radiator (2).
4. the electric automobile power battery heat management dress based on semiconductor refrigerating technology according to any one of claims 1 to 3
Put, it is characterised in that the heat conducting element (3) is heat pipe.
5. the electric automobile power battery heat management dress based on semiconductor refrigerating technology according to any one of claims 1 to 3
Put, it is characterised in that also include being fixed on thermal insulation board (4) between two radiators (2), the two of the thermal insulation board (4)
Side is crimped with two radiator (2) sealings respectively, and the mounting hole (41) of insertion, institute are offered on the thermal insulation board (4)
Semiconductor chilling plate (1) adaptation is stated to be arranged in the mounting hole (41).
6. the electric automobile power battery heat management device based on semiconductor refrigerating technology according to claim 5, its feature
It is, is offered on the thermal insulation board (4) and the cooling piece outlet of the mounting hole (41) and ft connection is kept away into a hole (42), institute
State the wire (11) on semiconductor chilling plate (1) and keep away a hole (42) from the cooling piece outlet and pass.
7. the electric automobile power battery heat management based on semiconductor refrigerating technology according to claims 1 to 3,6 any one
Device, it is characterised in that also include the temperature-monitoring element (5) and warning device electrically connected respectively with the controller；
The temperature-monitoring element (5) is used for the temperature that the temperature of the semiconductor chilling plate (1) is monitored and will monitored
Angle value is sent to controller；
The controller is used to control the warning device to be alarmed when the temperature value exceeds preset temperature range.
8. the electric automobile power battery heat management based on semiconductor refrigerating technology according to claims 1 to 3,6 any one
Device, it is characterised in that the radiator (2) is is made and sandblasting and anodic oxidation are passed through in surface of aluminium extrusion moulding process
The heat sink (22) of processing, the heat sink (22) are plane close to the one side of the semiconductor chilling plate (1), the radiating
One side of the plate (22) away from the semiconductor chilling plate (1) is connected with multiple radiation tooths (23).
9. the electric automobile power battery heat management based on semiconductor refrigerating technology according to claims 1 to 3,6 any one
Device, it is characterised in that be coated with heat-conducting silicone grease between the radiator (2) and the semiconductor chilling plate (1)；The battery core
Heat-conducting insulated film is provided between module and the radiator (2), the heat-conducting insulated film is covered in the battery core module or described
The surface of radiator (2).
10. the electric automobile power battery heat management based on semiconductor refrigerating technology according to claims 1 to 3,6 any one
Device, it is characterised in that the number of the semiconductor chilling plate (1) is multiple and uniform crimp in two radiators (2)
Between.
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| CN201710792640.4A CN107732359A (en) | 2017-09-05 | 2017-09-05 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
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| CN201710792640.4A CN107732359A (en) | 2017-09-05 | 2017-09-05 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
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| CN107732359A true CN107732359A (en) | 2018-02-23 |
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| CN109459520A (en) * | 2018-12-05 | 2019-03-12 | 成都科林分析技术有限公司 | A kind of multi-channel electronic cold-trap |
| CN110459829A (en) * | 2018-05-07 | 2019-11-15 | 南京农业大学 | A kind of thermal management device of battery of phase-change material couple semiconductor cooling piece |
| CN110707344A (en) * | 2019-11-07 | 2020-01-17 | 安徽伯华氢能源科技有限公司 | Device for controlling hydrogen release efficiency of alloy hydrogen storage equipment |
| CN111244571A (en) * | 2020-01-19 | 2020-06-05 | 浙江大学 | Square lithium battery pack thermal management structure and method thereof |
| CN111554851A (en) * | 2020-05-18 | 2020-08-18 | 东莞新能安科技有限公司 | Battery pack and heat dissipation method thereof |
| CN111565549A (en) * | 2020-06-15 | 2020-08-21 | 高创(苏州)电子有限公司 | Heat dissipation assembly, backlight source assembly and display device |
| CN112968228A (en) * | 2021-02-01 | 2021-06-15 | 徐州储盈电子科技有限公司 | Electric motor car lithium cell heat abstractor |
| CN112993438A (en) * | 2021-02-08 | 2021-06-18 | 中电科创智联(武汉)有限责任公司 | Semiconductor thermal management system for lithium battery of forklift |
| CN115443026A (en) * | 2021-06-02 | 2022-12-06 | 北京智行者科技股份有限公司 | Temperature regulation structure, controller and moving tool |
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