CN111517797B - 一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法 - Google Patents

一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法 Download PDF

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CN111517797B
CN111517797B CN202010328719.3A CN202010328719A CN111517797B CN 111517797 B CN111517797 B CN 111517797B CN 202010328719 A CN202010328719 A CN 202010328719A CN 111517797 B CN111517797 B CN 111517797B
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梅辉
赵钰
常鹏
成来飞
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Northwestern Polytechnical University
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Abstract

本发明涉及一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法,以涂层的形式应用于需要耐高温、抗氧化及耐腐蚀等防护性能的领域。其技术特征在于步骤为调配高纯SiC料浆、刷涂和低温无压烧结。本发明所提供的技术方案通过调控高纯SiC料浆配方来控制SiC涂层的纯度和烧结温度,实现高纯SiC涂层在1750~1800℃的常压烧结和工业化制备生产。本发明中高纯SiC的料浆配方及刷涂和烧结过程灵活可控,涂层与基体结合良好,无明显剥落和裂纹,工艺过程操作简单,耗时短,大幅度降低了成本。

Description

一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法
技术领域
本发明属于碳化硅(SiC)陶瓷材料领域,涉及一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法。
背景技术
SiC陶瓷因其高硬度、高耐磨损性、高抗弯强度和优良的抗氧化性、耐酸碱腐蚀性及高温力学性能被广泛应用于航天、航空、微电子、汽车、激光、矿业及原子能等领域。而高纯SiC涂层在这些领域起着高温防护、抗氧化及耐腐蚀的重要作用,SiC涂层的纯度越高,在极端严苛工况下,由杂质引起的污染越小,防护性能越优异。目前,国内对低成本产业化高纯SiC陶瓷涂层的制备与使用还处于探索阶段,主要存在制备工艺复杂、设备昂贵,SiC涂层烧结温度高、纯度不易控制,成本耗费大的问题。
SiC作为防护涂层,常见的制备方法有固渗法(包埋法)、溅射法、化学气相沉积法和涂刷法。如中国专利CN 105948822A提供了一种SiC基复合材料表面SiC涂层的制备方法,将硅粉包埋于碳化硅基复合材料表面,在过量的碳源中高温热处理得到SiC涂层;中国专利CN 102373417A提供了一种在石墨材料表面制备抗氧化SiC涂层的方法,采用超高真空多功能磁控溅射镀膜设备,在石墨材料表面制备硅(Si)涂层,经真空热处理得到抗氧化SiC涂层;中国专利CN 105503270A提供了通过化学气相沉积和先驱体浸渍裂解的方法制备SiC涂层;中国专利CN 107082651B提供了一种涂刷法制备的SiC涂层,分为内覆层和外覆层,内覆层以SiC粉、Si粉为主,涂覆于含碳材料表面,外覆层以硅化浆料为主涂覆于内覆层表面,真空烧结得到SiC涂层。采用固渗法制备的SiC涂层与基体没有明显的界面,可以缓解基体与涂层热膨胀系数不匹配的问题,但存在涂层不致密、纯度不高、含杂质较多,制备工艺复杂的问题,从而影响了SiC涂层的使用;溅射法和化学气相沉积法制备的SiC涂层与基体结合度好,有良好的工艺可重复性,可在大面积的基体材料表面制备厚度均匀的涂层,但设备昂贵、生产成本高,工艺复杂;涂刷法借助表面粘结的方法先形成预涂层,然后烧结成功能涂层,工艺简便、生产成本低,不需要专门的设备,可操作性高,适用于大型复杂构件表面涂层的工业化生产,相比较其他方法在工业化应用上具有很大的优势。
由于SiC是基本晶体结构单元为Si-C四面体的强共价键化合物,共价键约占88%,离子键占12%,这种强共价键性使得SiC在烧结时自扩散速率低,烧结驱动力很小,不易获得足够的能量形成晶界,而且不添加烧结助剂时,SiC的烧结温度约为2100~2200℃,对设备及使用环境要求极高,限制了其在工业上的应用。目前,国内外对SiC陶瓷材料的烧结进行了多方面的研究,主要有常压烧结、热压烧结和反应烧结。常压烧结可分为固相烧结和液相烧结,固相烧结一般以碳(C)或硼(B)作为烧结助剂促进SiC在常压下的烧结致密化,所需温度超过2000℃,液相烧结则是引入金属或金属氧化物等在高温时形成液相促进烧结,所需温度约为1800~1950℃。热压烧结即在烧结的同时进行加压,一般引入与常压烧结类似的烧结助剂,是目前常用的SiC陶瓷的快速烧结制备方法。反应烧结是将有反应活性的熔融硅在毛细管力作用下,向含有C的陶瓷素坯内的孔隙浸渗,通过C和Si发生反应生成SiC,常存在体积分数为5~30%的游离Si。但对于高纯SiC的烧结来说,液相烧结会引入较多的金属杂质,反应烧结会有5%及以上游离Si的存在,均无法保证SiC陶瓷材料的纯度,热压烧结温度大于1750℃,所需压力不等,通常对设备要求高,制备条件苛刻,工业化生产成本高。因此,综合考虑产业化高纯SiC涂层的制备,优先选择常压烧结,烧结过程不需要加压,工艺相对简单,适用范围广,可有效节约成本。
发明内容
要解决的技术问题
为了避免现有技术的不足之处,本发明提出一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法,针对高纯SiC陶瓷涂层纯度不易控制、烧结温度高,制备工艺复杂,生产成本大的应用局限性。
技术方案
一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法,其特征在于步骤如下:
步骤1.调配高纯SiC料浆:将纯度≥99%的高纯SiC粉溶于乙醇和丁酮中,加入质量分数2%的磷酸三乙酯,然后转移到球磨罐,用玛瑙球球磨8~12小时后,继续加入质量分数3%的聚乙烯醇缩丁醛、质量分数3%、混合比1:1的丙三醇和邻苯二甲酸二辛酯、质量分数5%的高纯Si粉和质量分数2%的碳化硼粉,接着球磨8~12小时形成的高纯SiC料浆;
步骤2.刷涂:将高纯SiC料浆刷涂于基体表面,室温干燥形成预涂层;
步骤3.低温无压烧结:将得到的预涂层在惰性气氛下进行烧结,升温速率2.5℃/min,烧结温度1750℃~1800℃,保温2~3小时后,自然降温完成高纯SiC陶瓷涂层的低温常压烧结。
所述乙醇和丁酮混合比为1:1。
所述高纯SiC粉的粒度为3~5μm、500nm。
有益效果
本发明提出的一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法,目的是有效控制SiC涂层的纯度,在常压烧结的条件下降低SiC陶瓷涂层的烧结温度,制备出高纯SiC涂层,简化工艺,有效降低生产成本。本发明的思想在于通过调控高纯SiC料浆配方来控制SiC涂层的纯度和烧结温度,从料浆的制备、刷涂到烧结过程不引入任何其他金属杂质等,实现高纯SiC陶瓷涂层的常压低温烧结和批量制备。
本发明的有益效果有以下几点:
(1)相比较其他常用的SiC涂层的制备方法,本发明通过调控高纯SiC料浆的配方来控制SiC涂层的纯度,料浆以≥99%的高纯SiC粉为原料,溶剂均为有机溶剂且易挥发,不引入其他金属杂质等,从刷涂到烧结过程由惰性气氛保护,有效实现了SiC涂层纯度的可控性。
(2)通过在高纯SiC料浆配方里加入一定比例的高纯Si粉和碳化硼粉实现了该涂层在1750~1800℃的烧结。
(3)采用涂刷和常压烧结法制备的高纯SiC涂层与基体结合良好,无明显的剥落和裂纹,层厚约为100μm,与磁控溅射法和化学气相沉积法对比,本发明使用的方法可灵活控制高纯SiC涂层厚度,且操作简便,详见表1。
(4)每平方米刷涂料浆成本低,从制备料浆到烧结仅需2~3天,工艺过程操作简单,耗时短,相比较溅射法和沉积法,采用该方法大幅降低了设备及制备成本,可以实现高纯SiC涂层的量产,详见表1。
(5)本发明使用的高纯SiC涂层的制备方法适用于需要具有耐高温、抗氧化及抗腐蚀等防护性能的基体及复杂构件,相比较磁控溅射法适用范围广,详见表1。
附图说明
图1.是本发明可量产的高纯SiC涂层低温常压烧结制备方法图。
图2.是本发明实施例1、实施例2和实施例3的高纯SiC涂层。
(a)实施例1中的高纯SiC涂层;(b)实施例2中的高纯SiC涂层;(c)实施例3中的高纯SiC涂层
图3.是本发明实施例1、实施例2和实施例3的高纯SiC涂层扫描电镜(SEM)图。
(a)实施例1中的高纯SiC涂层;(b)实施例2中的高纯SiC涂层;(c)实施例3中的高纯SiC涂层
图4.是本发明实施例1、实施例2和实施例3的高纯SiC涂层X射线衍射(XRD)图。
(a)实施例1中的高纯SiC涂层;(b)实施例2中的高纯SiC涂层;(c)实施例3中的高纯SiC涂层
图5.是实用构件上刷涂法低温常压烧结制备的高纯SiC涂层。
具体实施方式
现结合实施例、附图对本发明作进一步描述:
实施例1.
步骤一:以纯度≥99%,粒度500nm的高纯SiC粉为原料,溶于混合比1:1的乙醇与丁酮中,加入质量分数2%的磷酸三乙酯,然后转移到球磨罐,用玛瑙球球磨8~12小时后,继续加入质量分数3%的聚乙烯醇缩丁醛,质量分数3%、混合比1:1的丙三醇和邻苯二甲酸二辛酯,质量分数5%的高纯Si粉,质量分数2%的碳化硼粉,继续球磨8~12小时。
步骤二:将步骤1形成的高纯SiC料浆均匀的刷涂于反应烧结SiC基体表面,室温干燥形成预涂层。
步骤三:将步骤2得到的预涂层在惰性气氛下进行烧结,升温速率2.5℃/min,烧结温度1750℃~1800℃,保温2~3小时后,自然降温。
实施例2.
步骤一:以纯度≥99%,粒度3~5μm的高纯SiC粉为原料,溶于混合比1:1的乙醇与丁酮中,加入质量分数2%的磷酸三乙酯,然后转移到球磨罐,用玛瑙球球磨8~12小时后,继续加入质量分数3%的聚乙烯醇缩丁醛,质量分数3%、混合比1:1的丙三醇和邻苯二甲酸二辛酯,质量分数5%的高纯Si粉,质量分数2%的碳化硼粉,接着球磨8~12小时。
步骤二:将步骤1形成的高纯SiC料浆均匀的刷涂于反应烧结SiC基体表面,室温干燥形成预涂层。
步骤三:将步骤2得到的预涂层在惰性气氛下进行烧结,升温速率2.5℃/min,烧结温度1750℃~1800℃,保温2~3小时后,自然降温。
实施例3.
步骤一:以纯度≥99%,粒度500nm的高纯SiC粉为原料,加入5%的高纯SiC晶须,溶于混合比1:1的乙醇与丁酮中,加入质量分数2%的磷酸三乙酯,然后转移到球磨罐,用玛瑙球球磨8~12小时后,继续加入质量分数3%的聚乙烯醇缩丁醛,质量分数3%、混合比1:1的丙三醇和邻苯二甲酸二辛酯,质量分数5%的高纯Si粉,质量分数2%的碳化硼粉,接着球磨8~12小时。
步骤二:将步骤1形成的高纯SiC料浆均匀的刷涂于反应烧结SiC基体表面,室温干燥形成预涂层。
步骤三:将步骤2得到的预涂层在惰性气氛下进行烧结,升温速率2.5℃/min,烧结温度1750℃~1800℃,保温2~3小时后,自然降温。
表1本发明使用的涂刷+低温常压烧结高纯SiC涂层法与其他几种SiC涂层制备方法对比

Claims (1)

1.一种可量产的高纯SiC陶瓷涂层的低温常压烧结制备方法,其特征在于步骤如下:
步骤1.调配高纯SiC料浆:将纯度≥99%的高纯SiC粉溶于乙醇和丁酮中,其中乙醇和丁酮混合比为1:1,加入质量分数2%的磷酸三乙酯,然后转移到球磨罐,用玛瑙球球磨8~12小时后,继续加入质量分数3%的聚乙烯醇缩丁醛、质量分数3%、混合比1:1的丙三醇和邻苯二甲酸二辛酯、质量分数5%的高纯Si粉和质量分数2%的碳化硼粉,接着球磨8~12小时形成的高纯SiC料浆;
步骤2.刷涂:将高纯SiC料浆刷涂于基体表面,室温干燥形成预涂层;
步骤3.低温无压烧结:将得到的预涂层在惰性气氛下进行烧结,升温速率2.5℃/min,烧结温度1750℃~1800℃,保温2~3小时后,自然降温完成高纯SiC陶瓷涂层的低温常压烧结;
所述高纯SiC粉的粒度为3~5μm或500nm。
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