CN111453997A - Method for manufacturing ultrathin glass by single-side etching and ultrathin glass - Google Patents
Method for manufacturing ultrathin glass by single-side etching and ultrathin glass Download PDFInfo
- Publication number
- CN111453997A CN111453997A CN202010290299.4A CN202010290299A CN111453997A CN 111453997 A CN111453997 A CN 111453997A CN 202010290299 A CN202010290299 A CN 202010290299A CN 111453997 A CN111453997 A CN 111453997A
- Authority
- CN
- China
- Prior art keywords
- acid
- glass substrate
- etching
- glass
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention provides a method for manufacturing ultrathin glass by single-side etching, belonging to the technical field of glass etching. The method comprises the following steps: 1) forming an acid-resistant protective layer capable of realizing a glass pattern on one surface of the glass substrate, adhering an acid-resistant film I on the acid-resistant protective layer, and etching the single surface to thin the glass substrate; 2) peeling the acid-resistant film I from the glass substrate, and sticking an acid-resistant film II with a compensatory thickness on the other surface; 3) etching a single surface of the glass substrate, and only reserving the part with the formed pattern; 4) and stripping the acid-resistant protective layer and the acid-resistant film II from the glass substrate to obtain the ultrathin glass. The invention can reduce the cost of the photoresist; the glass substrate is thinned through the etching solution and etched into a section, so that the shape of the pattern is cut with high precision without repair processing; and the problem that the thickness of the etched glass is too thin and is difficult to fix can be solved by sticking the compensatory acid film II, and the mobility of the ultrathin glass is improved.
Description
Technical Field
The invention belongs to the technical field of glass etching, and particularly relates to a method for manufacturing ultrathin glass by single-side etching and the ultrathin glass.
Background
The CPI material is used as a cover plate of the folding mobile phone at present, surface waves are easily generated in a folding area of the folding mobile phone, a thin film is easily deformed after repeated folding, and the problems can be well solved by Ultra-thin Glass (Ultra-thin Glass).
The glass is cut by a physical method using a diamond wheel, a laser beam, a Water jet (Water jet), a Sand blast (Sand blast) or the like, and a chemical method using a double-sided cutting method using etching after forming a photoresist pattern on both sides of the glass. The physical method requires overlapping after glass cutting, grinding and polishing the cut surfaces, and then repairing, i.e. chemical etching, is required in order to reduce microcracks. The process is easy to damage when being carried out on ultrathin glass, and the processing difficulty is increased. The physical cutting method for the thin glass has low yield, and whether the microcracks are completely removed or not cannot be verified, so that the method for manufacturing the cover plate glass of the foldable mobile phone with the characteristic that the folding times can reach more than 20 ten thousand has a great problem.
The chemical cutting method does not require physical cutting and polishing, and thus, does not cause micro-cracks, but requires double-sided photoresist coating and patterning. The high photoresist of two-sided use leads to the unit price to promote when carrying out the etching cutting, and the product after the etching has also produced the problem that is difficult to fix because the thickness is too thin simultaneously.
Disclosure of Invention
The invention aims to provide a method for manufacturing ultrathin glass by single-sided etching and the ultrathin glass, which can solve the problems of damage and strength reduction of the ultrathin glass caused by grinding and polishing in the existing method for manufacturing the ultrathin glass by adopting a physical method, and can solve the problems of higher cost of photoresist by adopting chemical etching and double-sided etching and difficulty in fixing due to over-thin thickness of an etched product.
The purpose of the invention is realized by the following technical scheme:
a method for preparing ultrathin glass by single-sided etching comprises the following steps:
1) forming an acid-resistant protective layer capable of realizing a glass pattern on one surface of the glass substrate, adhering an acid-resistant film I on the acid-resistant protective layer, and etching the single surface of the glass substrate to thin the glass substrate;
2) peeling the acid-resistant film I from the glass substrate, and sticking an acid-resistant film II with a compensating thickness on the other surface of the acid-resistant protective layer of the glass substrate;
2) etching the surface of the glass substrate with the acid-resistant protective layer and the acid-resistant film II on the single surface by using an etching solution, and only keeping the patterned part;
3) and stripping the acid-resistant protective layer and the acid-resistant film II from the glass substrate to obtain the ultrathin glass.
Furthermore, the thickness of the glass substrate is 0.1-0.5 mm, and the thickness of the single-side etched and thinned glass substrate is 0.03-0.1 mm.
Further, the specific implementation manner of forming the acid-resistant protective layer capable of realizing the glass pattern is as follows: an acid-resistant protective layer is formed on one surface of a glass substrate to be etched, and then the acid-resistant protective layer is patterned by exposure using a mask.
Further, the acid-resistant protective layer is formed using PR applied to the entire surface of the glass substrate by screen printing, DFR attached to the entire surface of the glass substrate by a film attaching process, and INK applied to the non-etched portion by screen printing.
Further, the acid-resistant film I and the acid-resistant film II are one or more of PVC, PP and PET, and the thickness of the acid-resistant film I and the acid-resistant film II is 0.1 mm-1 mm.
Further, the specific operation of peeling the glass substrate from the acid-resistant protective layer is as follows: after the etching is completed, the entire glass substrate is put into a stripping solution to separate the acid protective layer from the glass substrate, and then the remaining etching solution and the acid resistant protective layer are cleaned with DI.
Further, the specific operation of peeling the acid-resistant film i or the acid-resistant film ii from the glass substrate is: the glass substrate from which the acid-resistant protective layer is removed is placed in an irradiator generating a light source having a wavelength of 250 to 600nm, and the acid-resistant film I or the acid-resistant film II is separated from the glass substrate.
Further, the etching is carried out through the processes of top spraying and side spraying, and the glass substrate is rotated by 0 degree, 90 degrees, 180 degrees and 270 degrees in the etching process, so that the etching deviation caused by the flowing of the etching solution is reduced.
Further, in the etching process, the glass substrate rotates the pre-etched glass by 0 degree, 90 degrees, 180 degrees and 270 degrees in turn from the initial position at a preset angle interval of 90 degrees for interval type periodic rotation, and etching is fixedly carried out at each angle direction by 1/4n of the total etching time of single-side etching as a preset time, wherein n is a positive integer greater than or equal to 1.
The ultrathin glass is prepared by adopting the method.
Further, the ultra-thin glass is one or more of a foldable or rollable cover glass in a foldable or rollable mobile phone, a bendable O L ED cover glass in lighting, a cover glass for improving fingerprint identification performance, and a multi-purpose foldable or bendable ultra-thin glass substrate for a screen panel of O L ED, TFT-L CD, micro-L ED.
Compared with the prior art, the invention has the following beneficial effects:
the method for manufacturing the ultrathin glass by single-side etching comprises the steps of forming an acid-resistant protective layer on a glass substrate, protecting the acid-resistant protective layer by using an acid-resistant film I, thinning the glass substrate by single-side etching, peeling off the acid-resistant film I, protecting a non-etched surface of the glass substrate by attaching an acid-resistant film II to the other surface of the glass substrate, and finally etching the single side of the acid-resistant protective layer with a pattern, so that the cutting of the glass is realized.
Compared with the existing double-sided chemical etching, the method for preparing the ultrathin glass by adopting the single-sided etching does not need to coat expensive photoresist on the double sides, so that the cost of the photoresist can be reduced; the glass substrate is thinned through the etching solution, and the pattern formed on the surface of the glass substrate is etched into a section, so that the shape of the pattern is cut with high precision, microcracks are not generated, and polishing, repairing and processing are not needed; the compensatory acid film II is adhered to the non-etched surface of the glass substrate, so that the problem that the thickness of the glass is too thin and is difficult to fix after the existing double-sided etching can be solved, the photoetching process is not carried out in the state of the ultrathin glass, the process yield and the operation convenience are improved, and the mobility of the ultrathin glass is improved after processing. Meanwhile, the damage generated when the ultrathin glass is moved can be reduced, the reduction of the coating quality caused by warping can be prevented, and high-quality products can be manufactured.
Drawings
FIG. 1 is a flow chart of a process for making ultra-thin glass by single-sided etching;
FIG. 2 is a schematic view of a process for manufacturing ultra-thin glass by single-sided etching;
FIG. 3 is a view showing a manner in which a glass substrate is vertically placed in an apparatus for etching, rotated, and an etching solution is sprayed aside for etching in the etching process;
FIG. 4 is a schematic view showing a mode in which a glass substrate is horizontally placed in an apparatus, moved, and etched by spraying an etching solution on the upper part;
reference numerals: 1-glass substrate, 2-acid-resistant protective layer, 3-acid-resistant film I, 4-spraying etching solution, 5-etching substrate, 6-acid-resistant film II.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The method for manufacturing ultra-thin glass by single-sided etching and the ultra-thin glass according to the present invention will be described in detail with reference to the specific processes and principles.
A method for preparing ultra-thin glass by single-sided etching is shown in figure 1 and figure 2, and comprises the following steps:
1. an acid-resistant protective layer capable of realizing a glass pattern is formed on one surface of a glass substrate, an acid-resistant film I is pasted on the acid-resistant protective layer, and the glass substrate is etched on one surface to be thinned.
Specifically, an acid-resistant protective layer is formed on one surface of a glass substrate, and then the acid-resistant protective layer is patterned by exposure using a mask, thereby forming an acid-resistant protective layer that can realize a glass pattern. The manner of masking and exposing is conventional in the art and is readily accomplished by those skilled in the art.
The thickness of the glass substrate is 0.1-0.5 mm, and the thickness of the glass substrate after single-side etching and thinning is 0.03-0.1 mm, and is further preferably 0.04-0.08 mm, 0.05-0.07 mm and 0.06 mm. The thickness of the glass substrate is determined according to the thickness of the ultra-thin glass product.
In order to realize the formation of the etched glass pattern, the acid-resistant protective layer is formed by using PR, DFR and INK, wherein the PR is coated on the whole surface of the glass substrate in a screen printing mode, and the DFR is attached to the whole surface of the glass substrate through a film pasting process; INK was applied to the non-etched portion by screen printing, which is equivalent to the pattern of the glass finish. The formation using PR, DFR, and INK with the acid-resistant protective layer is to cut the shape of glass by subsequent etching, and when forming the acid-resistant protective layer using PR and DFR, masking and exposure are required to form a pattern, and when forming the acid-resistant protective layer using INK, it is not required.
The acid-resistant film i is preferably in the form of a film having flexibility, and the acid-resistant film i is attached to the acid-resistant protective layer to protect the acid-resistant protective layer, thereby etching a single surface of the acid-resistant protective layer, and further thinning the glass substrate. In order to achieve the above effects, the acid-resistant film i is preferably one or more of PVC, PP, and PET, and the thickness is preferably 0.1mm to 1mm, more preferably 0.3mm to 0.7mm, and even more preferably 0.5mm to 0.6 mm.
And (3) attaching the edge of the glass substrate formed with the acid-resistant protective layer and the acid-resistant film I on a clamp by using a film, fixing, then placing the clamp into etching equipment for etching, and etching and thinning the glass substrate on the side without the acid-resistant film I in the etching process.
The clamp in the etching device divides the total etching time t into 4n parts by a rotating shaft, wherein t is time and n is a positive integer greater than or equal to 1, and each part of sub-period is t/4n, and the etching of each part of sub-period is performed by rotating 90 degrees at the beginning of each part of sub-period in the same direction from the initial position until the etching is completed.
The etching is carried out by the processes of top spraying and side spraying, and the glass substrate is rotated by 0 degree, 90 degrees, 180 degrees and 270 degrees in the etching process, so that the etching deviation generated by the flowing of the etching solution is reduced. The arrangement of the glass substrate and the spraying manner of the etching solution in the etching process are shown in fig. 3 and 4.
In the etching process, the glass substrate rotates the pre-etched glass by 0 degree, 90 degrees, 180 degrees and 270 degrees in turn from an initial position at a preset angle interval of 90 degrees, and performs etching at intervals, wherein 1/4n of the total etching time of single-side etching is fixed in each angle direction and serves as a preset time, and n is a positive integer greater than or equal to 1. By unifying the etching conditions for each area of 4 to 1 of the glass surface, the thickness and surface deviation are eliminated, and the product quality is improved by repeating the rotation if necessary. And a Top-spraying (Top Spray) method is used in the etching process of the horizontal movement.
2. The acid-resistant film I is peeled off from the glass substrate, and an acid-resistant film II having a compensating thickness is bonded to the other surface of the acid-resistant protective layer of the glass substrate.
Specifically, after the etching and thinning of the glass substrate are completed, the thinned glass substrate is placed in an irradiator generating a light source with a wavelength of 250-600 nm, and the acid-resistant film I is separated from the glass substrate. The acid-resistant film I is one or more of PVC, PP and PET, and the film made of the materials loses adhesive force when irradiated by a light source with the wavelength of 250-600 nm, and is further peeled from the glass substrate.
The acid-resistant film II is adhered to the other surface, opposite to the acid-resistant protective layer, of the glass substrate, and is used for protecting the glass substrate in the etching process, fixing a glass product after the glass substrate is etched, etched and cut, compensating the thickness to ensure process mobility, and avoiding the problem that the glass substrate is difficult to fix due to the fact that the glass substrate is too thin. In order to achieve the above effects, the acid-resistant film is preferably one or more of PVC, PP, and PET, and the thickness is preferably 0.1mm to 1mm, more preferably 0.3mm to 0.7mm, and even more preferably 0.5mm to 0.6 mm.
3. The glass substrate with the acid-resistant protective layer and the acid-resistant thin film II was etched on one side with an etching solution, leaving only the patterned portion.
In this step, the acid-resistant protective layer is used to protect the glass in the non-etching region from being etched and retained by the etching solution during the etching process, and the etching region is etched and removed by the etching solution during the etching process to cut the glass substrate and obtain the desired glass pattern.
The same operation method is used for the etching in this step and the etching in step 1.
4) And stripping the acid-resistant protective layer and the acid-resistant film II from the glass substrate to obtain the ultrathin glass.
Specifically, after the etching is completed, the entire glass substrate is put into a stripping solution to separate the acid-resistant protective layer from the glass substrate, and then the remaining etching solution and the acid-resistant protective layer are washed with DI. In order to clean the residual components and residues of the etching solution, a spray type cleaning method is preferable. In the separation and cleaning processes, the acid-resistant film is attached to the glass, so that the mobility is facilitated, and the glass is prevented from being damaged in the separation and cleaning processes.
The glass substrate from which the acid-resistant protective layer is removed is placed in an irradiator generating a light source having a wavelength of 250 to 600nm, and the acid-resistant film II is separated from the glass substrate. The acid-resistant film II is made of one or more of PVC, PP and PET, and the film made of the materials loses adhesive force when irradiated by a light source with the wavelength of 250-600 nm, so that the product can be separated from the acid-resistant film II.
In order to clean dust and foreign matter on the glass substrate after the separation of the acid-resistant thin film, it is necessary to perform final cleaning by a cleaning agent of a spray or immersion type. The cleaning agent is selected from the conventional cleaning agents in the field, and only the effect of removing dust and foreign matters on the glass substrate can be realized.
The ultrathin glass is prepared by adopting the method.
The existing ultrathin glass with double-sided patterns can generate double-sided deviation, and the method for forming single-sided patterns to prepare the ultrathin glass can improve the precision of the etched edge of the glass.
The ultrathin glass prepared by the single-sided etching method is one or more of foldable or rollable cover glass in a foldable mobile phone or a rollable mobile phone, bendable O L ED lighting cover glass, cover glass for improving fingerprint identification performance and screen panel multipurpose foldable or bendable ultrathin glass substrates of O L ED, TFT-L CD and micro-L ED.
Example 1
The process of manufacturing the ultra-thin glass by single-sided etching in the embodiment is as follows:
1. coating PR on one surface of a glass substrate with the thickness of 0.2mm by adopting a screen printing mode, and then carrying out masking and exposure to form an acid-resistant protective PR layer capable of realizing a glass pattern;
and (3) pasting a PVC film with the thickness of 0.5mm on the acid-resistant protective PR layer, and etching the single surface of the glass substrate to reduce the thickness of the glass substrate to 0.05 mm.
The single-side etching operation comprises the following specific steps: and (3) attaching the edge of the glass substrate with the acid-resistant protective PR layer and the PVC film on a clamp by using the film and fixing, then placing the clamp into etching equipment for etching, and etching and thinning the glass substrate on the side without the PVC film in the etching process.
The etching is carried out by the processes of top spraying and side spraying, and the glass substrate is rotated by 0 degree, 90 degrees, 180 degrees and 270 degrees in the etching process, so that the etching deviation generated by the flowing of the etching solution is reduced.
During the etching process, the glass substrate rotates the pre-etched glass at intervals of 0 degree, 90 degrees, 180 degrees and 270 degrees in turn from the initial position at intervals of 90 degrees serving as preset angle intervals, and etching is carried out in each angle direction by using 1/4 of the total etching time of single-side etching as a preset time for fixation until the etching is finished.
2. After the etching and thinning of the glass substrate are finished, placing the thinned glass substrate in an irradiator generating a light source with a wavelength of 250-600 nm to separate the PVC film from the glass substrate; a PP film with a thickness of 0.7mm is pasted on the other side of the glass substrate opposite to the acid-resistant protective layer.
3. The glass substrate having the acid-resistant protective PR layer and the PP film was etched on one side using an etching solution, leaving only the patterned portion. The specific operation of etching is the same as that of step 1.
4. After etching, putting the whole glass substrate into alkaline PR stripping solution sodium hydroxide to separate the acid-resistant protective PR layer from the glass substrate, and then cleaning the residual etching solution and the acid-resistant protective PR layer by using DI;
placing the glass substrate with the acid-resistant protective PR layer removed in an irradiator generating a light source with a wavelength of 250-600 nm, and separating the PP film from the glass substrate;
and finally, finally cleaning the glass substrate by using a cleaning agent DI water in a spraying mode to obtain the ultrathin glass.
Example 2
The process of manufacturing the ultra-thin glass by single-sided etching in the embodiment is as follows:
1. attaching DFR to the whole surface of a glass substrate with the thickness of 0.3mm by adopting a film pasting process, and then carrying out masking and exposure to form an acid-resistant protective DFR layer capable of realizing a glass pattern;
and (3) adhering a PET film with the thickness of 0.7mm on the acid-resistant protective layer, and etching the single surface of the glass substrate to reduce the thickness of the glass substrate to 0.07 mm.
The single-side etching operation comprises the following specific steps: and (3) attaching the edge of the glass substrate with the acid-resistant protective layer and the PET film on a clamp by using the film and fixing, then placing the clamp into etching equipment for etching, and etching and thinning the glass substrate on the side without the PET film in the etching process.
The etching is carried out by the processes of top spraying and side spraying, and the glass substrate is rotated by 0 degree, 90 degrees, 180 degrees and 270 degrees in the etching process, so that the etching deviation generated by the flowing of the etching solution is reduced.
During the etching process, the glass substrate rotates the pre-etched glass at intervals of 0 degree, 90 degrees, 180 degrees and 270 degrees in turn from the initial position at intervals of 90 degrees serving as preset angle intervals, and etching is carried out in each angle direction by using 1/8 of the total etching time of single-side etching as a preset time for fixation until the etching is finished.
2. After the glass substrate is etched and thinned, placing the thinned glass substrate in an irradiator generating a light source with a wavelength of 250-600 nm to separate the PET film from the glass substrate; a PET film having a thickness of 0.7mm was adhered to the other surface of the glass substrate opposite to the acid-resistant protective layer.
3. The glass substrate having the acid-resistant protective DFR layer and the PET film was etched on one side using an etching solution, leaving only the patterned portion. The specific operation of etching is the same as that of step 1.
4. After the etching is completed, putting the whole glass substrate into alkaline DFR stripping solution sodium hydroxide to separate the acid-resistant protective DFR layer from the glass substrate, and then cleaning the residual etching solution and the acid-resistant protective DFR layer by using DI;
placing the glass substrate with the acid-resistant protective DFR layer removed in an irradiator generating a light source with a wavelength of 250-600 nm, and separating the PET film from the glass substrate;
and finally, finally cleaning the glass substrate by using a cleaning agent DI water in a spraying mode to obtain the ultrathin glass.
Example 3
The process of manufacturing the ultra-thin glass by single-sided etching in the embodiment is as follows:
1. coating INK on one surface of a glass substrate with the thickness of 0.5mm on a non-etching part by adopting a screen printing mode to form an acid-resistant protective INK layer capable of realizing a glass pattern;
and (3) pasting a PVC film with the thickness of 1mm on the acid-resistant protective layer, and etching the single surface of the glass substrate to reduce the thickness of the glass substrate to 0.1 mm.
The single-side etching operation comprises the following specific steps: and (3) attaching the edge of the glass substrate with the acid-resistant protective INK layer and the PVC film on a clamp by using the film and fixing, then placing the clamp into etching equipment for etching, and etching and thinning the glass substrate on the side without the PVC film in the etching process.
The etching is carried out by the processes of top spraying and side spraying, and the glass substrate is rotated by 0 degree, 90 degrees, 180 degrees and 270 degrees in the etching process, so that the etching deviation generated by the flowing of the etching solution is reduced.
During the etching process, the glass substrate rotates the pre-etched glass at intervals of 0 degree, 90 degrees, 180 degrees and 270 degrees in turn from the initial position at intervals of 90 degrees serving as preset angle intervals, and etching is carried out in each angle direction by using 1/12 of the total etching time of single-side etching as a preset time for fixation until the etching is finished.
2. After the etching and thinning of the glass substrate are finished, placing the thinned glass substrate in an irradiator generating a light source with a wavelength of 250-600 nm to separate the PVC film from the glass substrate; a PVC film having a thickness of 0.5mm was adhered to the other surface of the glass substrate opposite to the acid-resistant protective layer.
3. The glass substrate having the acid-resistant protective INK layer and the PVC film was etched on one side using an etching solution, leaving only the patterned portion. The specific operation of etching is the same as that of step 1.
4. After etching, putting the whole glass substrate into alkaline PR stripping solution-sodium hydroxide to separate the acid-resistant protective INK layer from the glass substrate, and then cleaning the residual etching solution and the acid-resistant protective INK layer by using DI;
placing the glass substrate with the acid-resistant protective DFR layer removed in an irradiator generating a light source with a wavelength of 250-600 nm, and separating the PVC film from the glass substrate;
and finally, finally cleaning the glass substrate by using a cleaning agent DI water in a spraying mode to obtain the ultrathin glass.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (11)
1. A method for preparing ultrathin glass by single-side etching is characterized by comprising the following steps:
1) forming an acid-resistant protective layer capable of realizing a glass pattern on one surface of the glass substrate, adhering an acid-resistant film I on the acid-resistant protective layer, and etching the single surface of the glass substrate to thin the glass substrate;
2) peeling the acid-resistant film I from the glass substrate, and sticking an acid-resistant film II with a compensating thickness on the other surface of the acid-resistant protective layer of the glass substrate;
3) etching the single side of the glass substrate with the acid-resistant protective layer and the acid-resistant film II by using an etching solution, and only keeping the part with the formed pattern;
4) and stripping the acid-resistant protective layer and the acid-resistant film II from the glass substrate to obtain the ultrathin glass.
2. The method for preparing ultrathin glass by single-sided etching as claimed in claim 1, wherein the thickness of the glass substrate is 0.1-0.5 mm, and the thickness of the glass substrate after single-sided etching and thinning is 0.03-0.1 mm.
3. The method for preparing ultrathin glass by single-sided etching as claimed in claim 1, wherein the forming of the acid-resistant protective layer capable of realizing glass pattern is realized by: an acid-resistant protective layer is formed on one surface of a glass substrate to be etched, and then the acid-resistant protective layer is patterned by exposure using a mask.
4. The method of claim 1, wherein the acid-resistant protective layer is formed using PR, DFR, INK, wherein PR is applied to the entire surface of the glass substrate by screen printing, DFR is attached to the entire surface of the glass substrate by a film-attaching process, and INK is applied to the non-etched portion by screen printing.
5. The method for preparing ultrathin glass by single-sided etching as claimed in claim 1, wherein the acid-resistant film I and the acid-resistant film II are one or more of PVC, PP and PET, and have a thickness of 0.1mm to 1 mm.
6. The method for preparing ultrathin glass by single-sided etching as claimed in claim 1, wherein the specific operation of peeling the glass substrate from the acid-resistant protective layer is as follows: after the etching is completed, the entire glass substrate is put into a stripping solution to separate the acid protective layer from the glass substrate, and then the remaining etching solution and the acid resistant protective layer are cleaned with DI.
7. The method for preparing ultrathin glass by single-sided etching as claimed in claim 1, wherein the specific operation of peeling the acid-resistant film I or the acid-resistant film II from the glass substrate is as follows: the glass substrate is placed in an irradiator generating a light source having a wavelength of 250 to 600nm, and the acid-resistant film I or the acid-resistant film II is separated from the glass substrate.
8. The method for single-sided etching of ultra-thin glass according to claim 1, wherein the etching is performed by a top-spraying and side-spraying process, and the glass substrate is rotated by 0 °, 90 °, 180 °, 270 ° during the etching process, thereby reducing etching deviation due to the flow of the etching solution.
9. The method for preparing ultra-thin glass by single-sided etching as claimed in claim 1, wherein the glass substrate is periodically rotated at intervals by sequentially rotating the pre-etched glass by 0 degree, 90 degrees, 180 degrees and 270 degrees from the initial position at predetermined angular intervals of 90 ° and is fixedly etched at each angular direction with 1/4n of the total etching time of the single-sided etching as a predetermined time, wherein n is a positive integer greater than or equal to 1.
10. An ultra-thin glass, characterized in that it is produced by the method according to any of the preceding claims 1 to 9.
11. The ultra-thin glass of claim 10, wherein the ultra-thin glass is one or more of a foldable or rollable cover glass in a foldable or rollable cellular phone, a bendable O L ED cover glass in lighting, a cover glass for enhancing fingerprint recognition performance, and a multi-purpose foldable or bendable ultra-thin glass substrate for a screen panel of O L ED, TFT-L CD, micro-L ED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010290299.4A CN111453997A (en) | 2020-04-14 | 2020-04-14 | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010290299.4A CN111453997A (en) | 2020-04-14 | 2020-04-14 | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111453997A true CN111453997A (en) | 2020-07-28 |
Family
ID=71675547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010290299.4A Pending CN111453997A (en) | 2020-04-14 | 2020-04-14 | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111453997A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111882991A (en) * | 2020-08-07 | 2020-11-03 | 邹思良 | Flexible display screen and manufacturing method thereof |
| CN112110652A (en) * | 2020-08-14 | 2020-12-22 | 江西沃格光电股份有限公司 | Method for producing anti-glare glass and anti-glare glass |
| WO2021027781A1 (en) * | 2019-08-12 | 2021-02-18 | 重庆鑫景特种玻璃有限公司 | Ultrathin glass cover plate and ultrathin tempered glass cover plate, and preparation methods therefor |
| CN112707646A (en) * | 2020-12-30 | 2021-04-27 | 芜湖长信科技股份有限公司 | Production process of ultrathin glass |
| CN112876090A (en) * | 2021-04-07 | 2021-06-01 | 惠州市清洋实业有限公司 | Chemical thinning method for ultrathin glass |
| CN113060940A (en) * | 2021-03-22 | 2021-07-02 | 天津盛诺电子科技有限公司 | Single-face thinning process for rigid OLED display screen |
| CN113466987A (en) * | 2021-07-20 | 2021-10-01 | 拓米(成都)应用技术研究院有限公司 | Light guide plate structure and preparation method thereof |
| CN114394757A (en) * | 2021-11-28 | 2022-04-26 | 凯盛科技股份有限公司蚌埠华益分公司 | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass |
| WO2022088294A1 (en) * | 2020-10-26 | 2022-05-05 | 恩利克(浙江)显示科技有限公司 | Method for manufacturing ultra-thin glass substrates and method for manufacturing display panel |
| CN114804608A (en) * | 2022-04-25 | 2022-07-29 | 江西沃格光电股份有限公司 | Preparation method of ultrathin glass |
| CN115140944A (en) * | 2022-06-30 | 2022-10-04 | 圭垚光电科技(苏州)有限公司 | Etching forming device and etching forming method thereof |
| CN115784625A (en) * | 2022-12-01 | 2023-03-14 | 业泓科技(成都)有限公司 | Thinning method of fingerprint identification module |
| WO2023097651A1 (en) * | 2021-12-03 | 2023-06-08 | Schott Ag | Glass article with improved surface quality |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203696A (en) * | 1995-12-04 | 1998-12-30 | 株式会社日立制作所 | Method for processing semiconductor wafer, method for manufacturing IC card and carrier |
| CN102548758A (en) * | 2011-02-01 | 2012-07-04 | 株式会社微龙技术研究所 | Thin-sheet glass substrate laminate and method of manufacturing the same |
| KR20130022936A (en) * | 2011-08-26 | 2013-03-07 | 주식회사 이지테크놀러지 | Etching apparatus of glass panel |
| CN103086610A (en) * | 2011-11-04 | 2013-05-08 | 三星显示有限公司 | Apparatus and method for processing glass window of display |
| JP5375280B2 (en) * | 2009-04-06 | 2013-12-25 | セイコーエプソン株式会社 | Electro-optical device manufacturing method and manufacturing apparatus |
| CN106746705A (en) * | 2017-02-13 | 2017-05-31 | 京东方科技集团股份有限公司 | Glass single-sided thining method and glass thinning equipment |
| KR20180011952A (en) * | 2016-07-26 | 2018-02-05 | 노바테크인더스트리 주식회사 | Beveling free glass cutting method by etching |
| CN107663030A (en) * | 2016-07-29 | 2018-02-06 | 蓝思科技（长沙）有限公司 | A kind of preparation method and glass plate of the glass plate of the grain pattern containing etching |
-
2020
- 2020-04-14 CN CN202010290299.4A patent/CN111453997A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203696A (en) * | 1995-12-04 | 1998-12-30 | 株式会社日立制作所 | Method for processing semiconductor wafer, method for manufacturing IC card and carrier |
| JP5375280B2 (en) * | 2009-04-06 | 2013-12-25 | セイコーエプソン株式会社 | Electro-optical device manufacturing method and manufacturing apparatus |
| CN102548758A (en) * | 2011-02-01 | 2012-07-04 | 株式会社微龙技术研究所 | Thin-sheet glass substrate laminate and method of manufacturing the same |
| KR20130022936A (en) * | 2011-08-26 | 2013-03-07 | 주식회사 이지테크놀러지 | Etching apparatus of glass panel |
| CN103086610A (en) * | 2011-11-04 | 2013-05-08 | 三星显示有限公司 | Apparatus and method for processing glass window of display |
| KR20180011952A (en) * | 2016-07-26 | 2018-02-05 | 노바테크인더스트리 주식회사 | Beveling free glass cutting method by etching |
| CN107663030A (en) * | 2016-07-29 | 2018-02-06 | 蓝思科技（长沙）有限公司 | A kind of preparation method and glass plate of the glass plate of the grain pattern containing etching |
| CN106746705A (en) * | 2017-02-13 | 2017-05-31 | 京东方科技集团股份有限公司 | Glass single-sided thining method and glass thinning equipment |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021027781A1 (en) * | 2019-08-12 | 2021-02-18 | 重庆鑫景特种玻璃有限公司 | Ultrathin glass cover plate and ultrathin tempered glass cover plate, and preparation methods therefor |
| CN111882991A (en) * | 2020-08-07 | 2020-11-03 | 邹思良 | Flexible display screen and manufacturing method thereof |
| CN111882991B (en) * | 2020-08-07 | 2022-02-15 | 深圳市如新电子有限公司 | Flexible display screen and manufacturing method thereof |
| CN112110652A (en) * | 2020-08-14 | 2020-12-22 | 江西沃格光电股份有限公司 | Method for producing anti-glare glass and anti-glare glass |
| CN112110652B (en) * | 2020-08-14 | 2022-12-02 | 江西沃格光电股份有限公司 | Method for manufacturing anti-glare glass and anti-glare glass |
| WO2022088294A1 (en) * | 2020-10-26 | 2022-05-05 | 恩利克(浙江)显示科技有限公司 | Method for manufacturing ultra-thin glass substrates and method for manufacturing display panel |
| CN112707646A (en) * | 2020-12-30 | 2021-04-27 | 芜湖长信科技股份有限公司 | Production process of ultrathin glass |
| CN113060940A (en) * | 2021-03-22 | 2021-07-02 | 天津盛诺电子科技有限公司 | Single-face thinning process for rigid OLED display screen |
| CN112876090A (en) * | 2021-04-07 | 2021-06-01 | 惠州市清洋实业有限公司 | Chemical thinning method for ultrathin glass |
| CN113466987A (en) * | 2021-07-20 | 2021-10-01 | 拓米(成都)应用技术研究院有限公司 | Light guide plate structure and preparation method thereof |
| CN114394757A (en) * | 2021-11-28 | 2022-04-26 | 凯盛科技股份有限公司蚌埠华益分公司 | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass |
| WO2023097651A1 (en) * | 2021-12-03 | 2023-06-08 | Schott Ag | Glass article with improved surface quality |
| CN114804608A (en) * | 2022-04-25 | 2022-07-29 | 江西沃格光电股份有限公司 | Preparation method of ultrathin glass |
| CN114804608B (en) * | 2022-04-25 | 2024-02-23 | 江西沃格光电股份有限公司 | Preparation method of ultrathin glass |
| CN115140944A (en) * | 2022-06-30 | 2022-10-04 | 圭垚光电科技(苏州)有限公司 | Etching forming device and etching forming method thereof |
| CN115784625A (en) * | 2022-12-01 | 2023-03-14 | 业泓科技(成都)有限公司 | Thinning method of fingerprint identification module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111453997A (en) | Method for manufacturing ultrathin glass by single-side etching and ultrathin glass | |
| KR101620375B1 (en) | Manufacturing Method of Ultra-Thin Type Glass Plate Including Laminating and Cutting Process | |
| CN111253076A (en) | Method for manufacturing high-precision ultrathin glass by rotary single-sided etching and glass manufactured by method | |
| KR101661278B1 (en) | Manufacturing Method of Ultra-Thin Type Glass Plate | |
| JP4447325B2 (en) | Method for dividing semiconductor wafer | |
| KR101441166B1 (en) | A pellicle for lithography and a method for making the same | |
| CN101330800A (en) | Methods for manufacturing circuit substrate | |
| CN110950542A (en) | Preparation method of flexible ultrathin glass substrate for folding mobile phone cover plate | |
| JP6987448B2 (en) | Manufacturing method for small diameter wafers | |
| CN113336447A (en) | Single-side thinning method for ultrathin glass | |
| CN113880450A (en) | Film removing method for coated glass | |
| JPH11226874A (en) | Recessed groove work method | |
| JP3665323B2 (en) | Glass substrate for flat panel display and manufacturing method thereof | |
| KR20040045311A (en) | Glass substrate for flat panel dispaly and manufacturing method for the same | |
| KR20150016738A (en) | Method for reclaiming glasssubstrate for mobile | |
| JPH068145A (en) | Processing method for sheet glass | |
| KR100729653B1 (en) | Method for preparing cover glass for encapsulating organic electroluminescent diode | |
| CN113651544A (en) | Strip-shaped optical glass multi-surface graphical optical coating processing technology | |
| CN114292030A (en) | Glass substrate thinning method, glass panel and electronic equipment | |
| JP2003145426A (en) | Pattern eliminating method for recycle of masked substrate, and pattern eliminating device, and masking- pattern-eliminated substrate | |
| JPH05341502A (en) | Pellicle frame | |
| CN111302612A (en) | Manufacturing method of optical glass part | |
| CN112540509A (en) | Yellow light technology process for 3D curved surface vehicle-mounted screen | |
| JP2000317662A (en) | Method for laser beam machining and device therefor | |
| JP2004063694A (en) | Pattern transfer film, manufacture thereof, functional mask and manufacture of functional mask |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210609 Address after: Building 4, 528 Yuefei Road, Shibantan street, Xindu District, Chengdu, Sichuan 610500 Applicant after: Chengdu tuomi shuangdu photoelectric Co.,Ltd. Address before: 610000 building 7, phase II, maker Park, Deyuan town (Jingrong town), Pidu District, Chengdu City, Sichuan Province Applicant before: TUOMI (CHENGDU) APPLIED TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200728 |