CN111451919A - Clamp for end face polishing and using method thereof - Google Patents
Clamp for end face polishing and using method thereof Download PDFInfo
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- CN111451919A CN111451919A CN202010361380.7A CN202010361380A CN111451919A CN 111451919 A CN111451919 A CN 111451919A CN 202010361380 A CN202010361380 A CN 202010361380A CN 111451919 A CN111451919 A CN 111451919A
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- weight
- polishing
- sample
- protection plate
- plate
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- 238000005498 polishing Methods 0.000 title claims abstract description 130
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims description 16
- 241000425571 Trepanes Species 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 1
- 238000007517 polishing process Methods 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The application discloses anchor clamps for terminal surface polishing and application method thereof, anchor clamps include: the weight-bearing device comprises an accommodating groove body, an upper guard plate, a weight column and a plurality of weights; the accommodating groove body comprises a bottom plate and a side plate, and at least three adjusting screws are arranged on the side plate; the upper protection plate is positioned in the accommodating groove body and is vertical to the adjusting screw; the weight column is fixed on the bottom plate and is vertical to the bottom plate; the center of the weight is provided with a sleeve hole, and the weight is sleeved on the weight column through the sleeve hole. The problem that different pressures can not be applied to a sample at different polishing stages by an existing clamp is solved.
Description
Technical Field
The application relates to a clamp, in particular to a clamp for end face polishing and a using method thereof.
Background
After being cut, crystal material wafers without cleavage planes, such as sapphire wafers, lithium niobate wafers, lithium tantalate wafers and the like, have rough cut end surfaces and can be used only by further processing into mirror planes. The existing processing method generally adopts a polishing process, wherein a clamp is used for clamping a sample in the polishing process, and the cut end face of the sample is placed on a polishing turntable for polishing operation. It is also necessary to apply a certain pressure to the sample during the polishing operation to achieve the desired polishing effect, and the polishing process includes a plurality of stages, with different pressures being applied to the sample at different polishing stages.
However, in the prior art, the sample cannot be pressurized by external means during the polishing operation, and only the weight of the clamp itself is used as the pressure applied to the sample.
Therefore, how to provide a clamp capable of adjusting its own weight as required to meet the requirement of applying different pressures to the sample at different polishing stages has become a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The application provides a clamp for end face polishing and a using method thereof, which are used for solving the problem that the existing clamp cannot apply different pressures to a sample at different polishing stages.
In one aspect, a jig for end face polishing includes: the weight-bearing device comprises an accommodating groove body, an upper guard plate, a weight column and a plurality of weights;
the accommodating groove body comprises a bottom plate and a side plate, and at least three adjusting screws are arranged on the side plate; the upper protection plate is positioned in the accommodating groove body and is vertical to the adjusting screw; the weight column is fixed on the bottom plate and is vertical to the bottom plate;
the center of the weight is provided with a sleeve hole, and the weight is sleeved on the weight column through the sleeve hole.
Optionally, the orthographic projection of the sleeve hole on the bottom plate covers the orthographic projection of the weight column on the bottom plate; the projection of the bottom plate in the extending direction of the weight column is sleeved on the weight column in a covering manner.
Optionally, the fixture for end face polishing further includes a lower protection plate, and the lower protection plate is located in the accommodating groove body and is arranged opposite to the upper protection plate.
Optionally, the opposite surfaces of the upper protection plate and the lower protection plate are provided with buffer layers.
Optionally, the material of the upper guard plate is copper, and the material of the lower guard plate is aluminum.
Optionally, the upper guard plate and the lower guard plate are both made of teflon materials.
Optionally, the buffer layer is of a foam or soft plastic material structure.
In another aspect, a method of using a jig for end face polishing includes:
placing a sample into the accommodating groove body and below the upper protection plate, wherein the end face to be polished of the sample exceeds the accommodating groove body by a preset length; fastening the sample in a clamp by turning an adjusting screw;
placing the clamp with the sample for end face polishing into a carrying disc;
and starting the polishing turntable, and sleeving weights with corresponding weights on the weight columns according to corresponding pressure requirements in different polishing stages.
Optionally, the sample is placed in the accommodating groove body and is positioned below the upper protection plate, and the end face to be polished of the sample exceeds the accommodating groove body by a preset length; by turning the adjusting screw, fasten the sample in the anchor clamps, include:
placing a sample into the accommodating groove body and between the buffer layers arranged on the opposite surfaces of the upper protection plate and the lower protection plate, wherein the end surface to be polished of the sample exceeds the accommodating groove body by a preset length;
by turning the adjusting screw, the upper guard plate is pressed against the sample until the sample is fastened between the two buffer layers.
Optionally, the polishing turntable is started, and at different polishing stages, according to corresponding pressure requirements, a weight sleeve with a corresponding weight is arranged on the weight column, including:
starting a polishing turntable, and sleeving weights with corresponding first weight on a weight column according to required first pressure in a first polishing stage;
in the second polishing stage, according to the required second pressure, the corresponding weight with the second weight is sleeved on the weight column.
According to the above technical solution, the present application provides a jig for end surface polishing and a method for using the same, the jig including: the weight-bearing device comprises an accommodating groove body, an upper guard plate, a weight column and a plurality of weights; the accommodating groove body comprises a bottom plate and a side plate, and at least three adjusting screws are arranged on the side plate; the upper protection plate is positioned in the accommodating groove body and is vertical to the adjusting screw; the weight column is fixed on the bottom plate and is vertical to the bottom plate; the center of the weight is provided with a sleeve hole, and the weight is sleeved on the weight column through the sleeve hole. Through the clamp for end face polishing and the using method thereof provided by the application, the adjusting screws are arranged on the side plates, and the upper protection plate is pushed to move by rotating the adjusting screws so as to fasten a sample. The upper protection plate plays a role in protecting the sample and protecting the sample from being scratched or damaged by the top of the adjusting screw. A weight column is arranged on one side of the bottom plate far away from the accommodating groove body, and the weight can be sleeved on the weight column through a sleeve hole arranged in the center. The weight of the weight pressed on the sample can be flexibly adjusted by adjusting the number of the weights sleeved on the weight column or selecting weights with different weight levels to be sleeved on the weight column, and different pressures can be applied to the sample at different polishing stages in the polishing process.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front view of a fixture for end face polishing provided by an embodiment of the present application;
FIG. 2 is a top view of the fixture for end face polishing shown in FIG. 1;
FIG. 3 is a right side view of the fixture for end face polishing shown in FIG. 1;
FIG. 4 is a left side view of the fixture for end face polishing shown in FIG. 1;
FIG. 5 is a cross-sectional view of the fixture for end face polishing shown in FIG. 1;
FIG. 6 is a structural view of the weight shown in FIG. 1;
FIG. 7 is another structural view of the weight shown in FIG. 1;
FIG. 8 is another top view of the fixture for end face polishing shown in FIG. 1;
FIG. 9 is another cross-sectional view of the fixture for end face polishing shown in FIG. 1;
FIG. 10 is a further cross-sectional view of the fixture for end face polishing shown in FIG. 1;
FIG. 11 is a view showing a state in which the jig for end surface polishing shown in FIG. 5 holds a sample;
FIG. 12 is a diagram showing the positional relationship of the jig with the carrier plate and the polishing turntable during polishing;
FIG. 13 is a view showing a state in which the jig for end surface polishing shown in FIG. 10 holds a sample;
fig. 14 is a left side view of the jig for end surface polishing shown in fig. 13 holding a sample.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
After being cut, crystal material wafers without cleavage planes, such as sapphire wafers, lithium niobate wafers, lithium tantalate wafers and the like, have rough cut end surfaces and can be used only by further processing into mirror planes. The existing processing technology generally adopts a polishing technology, the polishing technology needs to use a clamp to clamp a sample, and the cutting end face of the sample is placed on a polishing turntable for polishing operation. It is also necessary to apply a certain pressure to the sample during the polishing operation to achieve the desired polishing effect, and the polishing process includes a plurality of stages, with different pressures being applied to the sample at different polishing stages.
However, in the prior art, the sample cannot be pressurized by external means during the polishing operation, and only the weight of the clamp itself is used as the pressure applied to the sample.
In view of this, in one aspect, fig. 1 is a front view of a jig for end surface polishing provided by an embodiment of the present application; FIG. 2 is a top view of the fixture for end face polishing shown in FIG. 1; FIG. 3 is a right side view of the fixture for end face polishing shown in FIG. 1; FIG. 4 is a left side view of the fixture for end face polishing shown in FIG. 1; FIG. 5 is a cross-sectional view of the fixture for end face polishing shown in FIG. 1; fig. 6 is a structural view of the weight shown in fig. 1. With reference to fig. 1-5, the present application provides a jig for end face polishing, comprising: the weight-adjustable type steel wire rope pile comprises an accommodating groove body 1, an upper protection plate 2, weight columns 3 and a plurality of weights 4; the accommodating groove body 1 comprises a bottom plate 11 and a side plate 12, and at least three adjusting screws 121 are arranged on the side plate 12; the upper protection plate 2 is positioned in the accommodating groove body 1, and the upper protection plate 2 is vertical to the adjusting screw 121; the weight columns 3 are fixed on the bottom plate 11 and are perpendicular to the bottom plate 11. It will be readily appreciated that a threaded hole (not shown in fig. 5) is provided in the side plate 12 at a position corresponding to the adjustment screw 121, and the adjustment screw 121 is threadedly coupled to the side plate 12 through the threaded hole. The upper protection plate 2 can be freely taken, put or replaced in the accommodating groove body 1. The weight column 3 is fixed on one side of the bottom plate 11 far away from the accommodating groove body 1. Referring to fig. 5 and 6, the center of the weight 4 is provided with a sleeve hole 41, and the weight 4 is sleeved on the weight column 3 through the sleeve hole 41. The weights 4 can be set to different weight levels as required, and the number of the weights 4 is not particularly limited.
It should be noted that, the fixture for end face polishing provided by the present application can set the total weight of the bottom plate 11, the side plate 12, the upper protection plate 2 and the weight column 3 according to the basic pressure required in the polishing process, and then design the specific size of the accommodating tank body 1 according to the size of the sample to be polished. The appearance of the clamp can be designed according to the shape of the limiting through hole of the object carrying disc, and the clamp is not particularly limited in the application.
As shown in fig. 3, the orthographic projection of the trepan 41 on the floor 11 covers the orthographic projection of the weight column 3 on the floor 11; the projection of the base plate 11 in the direction of extension of the weight column 3 covers the weight 4 fitted on the weight column 3.
Fig. 7 is another structural view of the weight shown in fig. 1. As shown in fig. 7, the weight 4 may be circular, and the trepan 41 may also be circular, and fig. 6 and 7 only schematically show the shapes of the weight 4 and the trepan 41, and the present invention is not particularly limited.
The shape of weight 4 can be the same with the shape of bottom plate 11, also can be different, but the overall dimension of weight 4 need be less than the overall dimension of bottom plate 11, is convenient for in polishing process, and anchor clamps can be put into the spacing through-hole of carrying the thing dish smoothly.
The clamp for end face polishing provided by the embodiment is provided with the adjusting screw 121 on the side plate 12, and the upper protection plate 2 is pushed to move by rotating the adjusting screw 121 so as to fasten a sample. The upper protection plate 2 plays a role of protecting the sample from being scratched or damaged by the top of the adjusting screw 121. Through adjusting the length that adjusting screw 121 revolved to holding tank 1 in, can be so that anchor clamps are applicable to the sample of different thickness, increase the kind of anchor clamps processing sample. A weight column 3 is arranged on the side of the bottom plate 11 away from the accommodating trough body 1, and the weight 4 can be sleeved on the weight column 3 through a sleeve hole 41 arranged at the central position. By adjusting the number of the weights 4 sleeved on the weight column 3 or selecting the weights 4 with different weight levels to be sleeved on the weight column 3, the weights pressed on the sample can be flexibly adjusted, different pressures can be applied to the sample at different polishing stages in the polishing process, and meanwhile, the required pressures can be applied to the sample in different sample polishing processes. The application provides a anchor clamps for terminal surface polishing can realize that a anchor clamps is applied to multiple sample.
For example, the polishing process includes two polishing stages, rough polishing and fine polishing. For the same sample, the pressure required for rough polishing is typically greater than the pressure required for fine polishing. When the required polishing rate is high, the required pressure is relatively high, and when the required polishing rate is low, the required pressure is relatively low. In addition, the sample needs to be ground before polishing, and the grinding process can also comprise two grinding stages of coarse grinding and fine grinding. Generally, the pressure required for rough grinding is greater than that required for fine grinding, and the pressure required for rapid grinding is greater than that required for slow grinding. At four stages of coarse grinding, fine grinding, rough polishing and fine polishing, the pressure of applying on the sample all realizes through overlapping on weight post 3 and establishes weight 4, can realize adjusting the pressure of applying on the sample through overlapping the weight 4 of establishing different weight, the weight 4 of establishing the cover is more or overlap and establish heavier weight 4, then the pressure of applying on the sample is big more, consequently, can convert the weight of weight 4 into gravity and correspond the pressure value of applying on the sample, establish the corresponding relation table of weight 4 weight and pressure value. And will not be described in detail herein.
Fig. 8 is another top view of the fixture for end face polishing shown in fig. 1. As shown in fig. 8, the number of the adjusting screws 121 provided on the side plate 12 may be 4. Because the end face to be polished of the sample needs to extend out of the opening end of the accommodating tank 1 by a certain length, at least 2 adjusting screws 121 close to the opening end of the accommodating tank 1 need to be arranged to ensure that the end face to be polished of the sample can be fixed firmly. When only 1 adjusting screw 121 is provided near the open end of the housing tank 1, the sliding of the sample is likely to occur, resulting in the failure to smoothly perform the polishing operation. Therefore, the adjusting screws 121 are respectively arranged at the open end of the accommodating trough body 1 and the end of the accommodating trough body 1 close to the weight column 3, so that the sample can be more firmly fixed.
It should be noted that the number and arrangement of the adjusting screws 121 shown in fig. 2 and 8 are only schematic, and the application is not limited specifically as long as the total number of the adjusting screws 121 is at least 3, and the number of the adjusting screws 121 close to the opening end of the accommodating groove 1 is at least 2.
Fig. 9 is another cross-sectional view of the jig for end surface polishing shown in fig. 1. As shown in fig. 9, the fixture for end surface polishing further includes a lower protection plate 5, the lower protection plate 5 is located in the accommodating tank 1 and is disposed opposite to the upper protection plate 2, and the lower protection plate 5 can be freely taken and placed or replaced in the accommodating tank 1. The lower protection plate 5 can play a role in protecting samples, the upper protection plate 2 can be made of a hard material such as copper, and the lower protection plate 5 can be made of a soft material such as aluminum, so that the samples can be better fastened in the accommodating groove body 1 of the clamp. The material of the upper protection plate 2 and the lower protection plate 5 can also be teflon, and the material of the upper protection plate 2 and the lower protection plate 5 is not particularly limited in the application. Meanwhile, the lower protection plate 5 or the upper protection plate 2 with different thicknesses and the adjusting screws 121 with different lengths are adopted, so that the clamp is suitable for samples with different thicknesses, and the range of the types of the processed samples of the clamp is enlarged.
Fig. 10 is still another sectional view of the jig for end surface polishing shown in fig. 1. As shown in fig. 10, the opposite surfaces of the upper and lower sheathing panels 2 and 5 are each provided with a cushioning layer 6. The buffer layer 6 can be made of foam or soft plastic, and the buffer layer 6 can also be a colloid coating; the buffer layer 6 can be attached to the opposite surfaces of the upper protection plate 2 and the lower protection plate 5 in a sticking mode, and can also be coated on the opposite surfaces of the upper protection plate 2 and the lower protection plate 5 in a coating mode, and the application does not specifically limit the material selection of the buffer layer 6 and the arrangement mode of the buffer layer 6.
On the other hand, fig. 11 is a diagram showing a state where the jig for end surface polishing shown in fig. 5 holds a sample, and fig. 12 is a diagram showing a positional relationship among the jig, the carrier plate and the polishing turntable during polishing. With reference to fig. 11 and 12, the present application provides a method of using a jig for end face polishing, comprising:
s1, placing the sample A into the accommodating groove body 1 and below the upper protection plate 2, enabling the end face B to be polished of the sample A to exceed the accommodating groove body 1 by a preset length L, and fastening the sample A in the clamp by rotating the adjusting screw 121.
As shown in fig. 11, a sample a is placed in the accommodating tank 1 of the fixture, and the sample is placed below the upper protection plate 2, so that the length of the end surface B to be polished of the sample a, which exceeds the accommodating tank 1, is a preset length L, the preset length L can be set according to the actual process capability, and is not specifically limited here.
S2: the jig 01 for end surface polishing with the sample a was placed in the carrier plate 02.
As shown in fig. 12, the object carrying plate 02 is located above the polishing turntable 04, and the object carrying plate 02 is further required to be connected with fixing rods (not shown in fig. 12) for fixing the object carrying plate 02; the object carrying plate 02 is provided with a plurality of limiting through holes 03, and the limiting through holes 03 are used for accommodating the clamp 01 for end face polishing with the sample A so as to limit the position of the clamp 01 for end face polishing with the sample A. The polishing turntable 04 also needs to be connected with a rotating assembly (not shown in fig. 12) for driving the polishing turntable to rotate. The jig 01 for end face polishing with the sample a was placed in the limiting through-hole 03.
S3: and starting the polishing turntable 04, and sleeving the weights 4 with corresponding weights on the weight column 3 according to corresponding pressure requirements at different polishing stages.
S3, starting the polishing turntable 04, and at different polishing stages, according to the corresponding pressure requirements, sleeving the weight 4 with the corresponding weight on the weight column 3, including:
s31: and starting the polishing turntable 04, and sleeving the corresponding weight 4 with the first weight on the weight column 3 according to the required first pressure in the first polishing stage.
S32: in the second polishing stage, according to the required second pressure, the corresponding weight 4 with the second weight is sleeved on the weight column 3.
With reference to fig. 12, for example, the polishing phase may include: rough grinding, fine grinding, rough polishing and fine polishing, the first polishing stage can be rough polishing or rough grinding, and the second polishing stage can be fine polishing or fine grinding, and the application is not particularly limited. The corresponding relation table of the weight and the pressure value can be formulated according to the process experience and aiming at different samples. When polishing is performed, the polishing turntable 04 is started, the polishing turntable 04 rotates according to a set rotating speed, and a polishing pad or grinding sand paper can be attached to the polishing turntable 04 according to different stages of polishing or grinding, which is not described herein again. In the first polishing stage, a first weight corresponding to the first pressure is searched in the corresponding relation table of the weight and the pressure value, and the weight 4 with the first weight is sleeved on the weight column 3 according to the first weight. In the second polishing stage, a second weight corresponding to the second pressure is searched in the corresponding relation table of the weight and the pressure value, and the weight 4 with the second weight is sleeved on the weight column 3 according to the second weight. The first pressure can be greater than, less than or equal to the second pressure, so that the weights 4 on the weight column 3 can be added, removed or not changed in the second polishing stage according to actual conditions. The description is illustrative only and is not intended to limit the present application.
Fig. 13 is a view showing a state where the sample is held by the jig for end surface polishing shown in fig. 10, and fig. 14 is a left side view showing that the sample is held by the jig for end surface polishing shown in fig. 13, in combination with fig. 13 and 14, S1, the sample a is placed in the receiving tank 1 and positioned below the upper protection plate 2, the end surface B to be polished of the sample a exceeds the receiving tank by a preset length L, and the sample a is fastened in the jig by turning the adjusting screw 121, which includes:
and S11, placing the sample A into the accommodating groove body 1 and between the buffer layers 6 arranged on the opposite surfaces of the upper protection plate 2 and the lower protection plate 5, wherein the end surface B to be polished of the sample A exceeds the accommodating groove body by a preset length L.
S12: by turning the adjusting screw 121, the upper guard plate 2 is pressed against the sample a until the sample a is fastened between the two buffer layers 6.
As shown in fig. 13 and 14, the sample a is located between the upper and lower protection plates 2 and 5, both sides of the sample a abut against the buffer layer 6, and the end face B of the sample a is an end face to be polished. When the upper protection plate 2 and the lower protection plate 5 are made of hard materials, the upper protection plate 2 and the lower protection plate 5 are easy to cause damage to the surface of a sample if directly contacting the surfaces of two sides of the sample, and the sample A is easy to slide when being clamped by the hard materials, so that clamping is not firm enough, and polishing operation is influenced. All set up buffer layer 6 at the opposite face of last backplate 2 and backplate 5 down, buffer layer 6 can adopt more elastic material, for example bubble cotton or soft plastics, can play the guard action to the sample, can make simultaneously that go up backplate 2 and backplate 5 are more firm to the centre gripping of sample down, are difficult to take place to slide.
The application provides a clamp for end face polishing and a using method thereof, the clamp is provided with an adjusting screw 121 on a side plate 12, and the upper protection plate 2 is pushed to move by rotating the adjusting screw 121 so as to realize the fastening of a sample. The upper protection plate 2 plays a role of protecting the sample from being scratched or damaged by the top of the adjusting screw 121. Through adjusting the length that adjusting screw 121 revolved to holding tank 1 in, can be so that anchor clamps are applicable to the sample of different thickness, increase the kind of anchor clamps processing sample. A weight column 3 is arranged on the side of the bottom plate 11 away from the accommodating trough body 1, and the weight 4 can be sleeved on the weight column 3 through a sleeve hole 41 arranged at the central position. By adjusting the number of the weights 4 sleeved on the weight column 3 or selecting the weights 4 with different weight levels to be sleeved on the weight column 3, the weights pressed on the sample can be flexibly adjusted, different pressures can be applied to the sample at different polishing stages in the polishing process, and meanwhile, the required pressures can be applied to the sample in different sample polishing processes. The application provides a anchor clamps for terminal surface polishing can realize that a anchor clamps is applied to multiple sample.
The same and similar parts in the various embodiments in this specification may be referred to each other. In particular, for the embodiments, since they are substantially similar to the method embodiments, the description is simple, and the relevant points can be referred to the description in the method embodiments.
Claims (10)
1. A fixture for end face polishing, comprising: the weight scale comprises an accommodating groove body (1), an upper guard plate (2), a weight column (3) and a plurality of weights (4);
the accommodating groove body (1) comprises a bottom plate (11) and a side plate (12), and at least three adjusting screws (121) are arranged on the side plate (12); the upper protection plate (2) is positioned in the accommodating groove body (1), and the upper protection plate (2) is perpendicular to the adjusting screw (121); the weight column (3) is fixed on the bottom plate (11) and is vertical to the bottom plate (11);
the center of the weight (4) is provided with a sleeve hole (41), and the weight (4) is sleeved on the weight column (3) through the sleeve hole (41).
2. The jig for end face polishing according to claim 1, characterized in that the orthographic projection of the trepan (41) on the floor (11) covers the orthographic projection of the weight column (3) on the floor (11); the projection of the bottom plate (11) in the extending direction of the weight column (3) is sleeved on the weight (4) on the weight column (3).
3. The jig for end face polishing according to claim 2, further comprising a lower protection plate (5), wherein the lower protection plate (5) is located in the accommodating tank body (1) and is arranged opposite to the upper protection plate (2).
4. A jig for end face polishing according to claim 3, wherein the opposing faces of the upper protective plate (2) and the lower protective plate (5) are each provided with a cushioning layer (6).
5. The jig for end face polishing as claimed in claim 4, wherein the material of the upper protection plate (2) is copper and the material of the lower protection plate (5) is aluminum.
6. The jig for end face polishing as claimed in claim 4, wherein the upper protection plate (2) and the lower protection plate (5) are each of a Teflon material structure.
7. A jig for end face polishing as claimed in claim 4, wherein the cushioning layer (6) is of foam or soft plastics material construction.
8. A method of using a fixture for end face polishing, comprising:
placing a sample into the accommodating groove body and below the upper protection plate, wherein the end face to be polished of the sample exceeds the accommodating groove body by a preset length; fastening the sample in a clamp by turning an adjusting screw;
placing the clamp with the sample for end face polishing into a carrying disc;
and starting the polishing turntable, and sleeving weights with corresponding weights on the weight columns according to corresponding pressure requirements in different polishing stages.
9. The method as claimed in claim 8, wherein the sample is placed in the containing groove body and is positioned below the upper protection plate, and the end surface to be polished of the sample exceeds the containing groove body by a preset length; by turning the adjusting screw, fasten the sample in the anchor clamps, include:
placing a sample into the accommodating groove body and between the buffer layers arranged on the opposite surfaces of the upper protection plate and the lower protection plate, wherein the end surface to be polished of the sample exceeds the accommodating groove body by a preset length;
by turning the adjusting screw, the upper guard plate is pressed against the sample until the sample is fastened between the two buffer layers.
10. The method according to claim 8, wherein the starting of the polishing turntable for sleeving the weight of the corresponding weight on the weight column according to the corresponding pressure requirement in different polishing stages comprises:
starting a polishing turntable, and sleeving weights with corresponding first weight on a weight column according to required first pressure in a first polishing stage;
in the second polishing stage, according to the required second pressure, the corresponding weight with the second weight is sleeved on the weight column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010361380.7A CN111451919A (en) | 2020-04-30 | 2020-04-30 | Clamp for end face polishing and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010361380.7A CN111451919A (en) | 2020-04-30 | 2020-04-30 | Clamp for end face polishing and using method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111451919A true CN111451919A (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010361380.7A Pending CN111451919A (en) | 2020-04-30 | 2020-04-30 | Clamp for end face polishing and using method thereof |
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| Country | Link |
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| CN (1) | CN111451919A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1006484A (en) * | 1963-04-11 | 1965-10-06 | Commissariat Energie Atomique | A system for mechanically mounting a radioactive sample |
| GB1270910A (en) * | 1971-01-27 | 1972-04-19 | Mullard Ltd | Improvements in or relating to orientation jigs |
| US20080113593A1 (en) * | 2006-06-29 | 2008-05-15 | Kow-Je Ling | Polishing holder for workpiece end surface |
| CN207206151U (en) * | 2017-09-14 | 2018-04-10 | 深圳市金同利光电技术有限公司 | A kind of lock pin lapping device picked and placeed that presses automatically |
| CN108406579A (en) * | 2018-01-31 | 2018-08-17 | 江苏法尔胜光电科技有限公司 | Grinding clamp suitable for fiber optic bundle end face |
| CN212071522U (en) * | 2020-04-30 | 2020-12-04 | 济南晶正电子科技有限公司 | Clamp for end face polishing |
-
2020
- 2020-04-30 CN CN202010361380.7A patent/CN111451919A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1006484A (en) * | 1963-04-11 | 1965-10-06 | Commissariat Energie Atomique | A system for mechanically mounting a radioactive sample |
| GB1270910A (en) * | 1971-01-27 | 1972-04-19 | Mullard Ltd | Improvements in or relating to orientation jigs |
| US20080113593A1 (en) * | 2006-06-29 | 2008-05-15 | Kow-Je Ling | Polishing holder for workpiece end surface |
| CN207206151U (en) * | 2017-09-14 | 2018-04-10 | 深圳市金同利光电技术有限公司 | A kind of lock pin lapping device picked and placeed that presses automatically |
| CN108406579A (en) * | 2018-01-31 | 2018-08-17 | 江苏法尔胜光电科技有限公司 | Grinding clamp suitable for fiber optic bundle end face |
| CN212071522U (en) * | 2020-04-30 | 2020-12-04 | 济南晶正电子科技有限公司 | Clamp for end face polishing |
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