CN217434008U

CN217434008U - Wafer polishing equipment

Info

Publication number: CN217434008U
Application number: CN202221345784.8U
Authority: CN
Inventors: 张陈军; 陈福文; 张焜鸣
Original assignee: Jiangsu Jialuo Jingyi Intelligent Technology Co ltd
Current assignee: Jiangsu Jialuo Jingyi Intelligent Technology Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-09-16
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses a wafer polishing device, relating to the technical field of wafer processing; the utility model comprises a processing plate, a cylinder is fixedly arranged on the upper surface of the processing plate, the output end of the cylinder is provided with a top plate, a polishing component is arranged on the top plate, a fixing component is fixedly arranged on the processing plate, supporting legs are fixedly arranged on the lower surface of the processing plate, the number of the supporting legs is four, the fixing component comprises a round block and a round plate, the round plate is fixedly connected on the upper surface of the processing plate, a rectangular groove is arranged on the surface of the round plate, the utility model can place a workpiece on the upper surface of the round plate and is positioned between arc-shaped clamping blocks, and the round block is driven to rotate by rotating a turntable through a rotating rod, thereby make the circular rod move along the arc wall, drive six slide bars through the circular rod and all move to the center of circular slab, finally fix the machined part through the arc clamp splice centre gripping of the tip of slide bar, fix through inserting the screw rod into corresponding threaded hole.

Description

Wafer polishing equipment

Technical Field

The utility model relates to a wafer processing technology field specifically is a wafer polishing equipment.

Background

Generally, after the silicon material is crystallized into a large cylindrical shape over most of its length, the columnar crystalline material is cut into thin disks that become silicon wafers, which may also be referred to as wafers due to their circular shape.

There are also problems in polishing wafers:

1. when the existing polishing equipment is used, wafers with different sizes are not convenient to fix;

2. the polishing wheel is not convenient to replace, the precision of polishing processing is affected, and aiming at the problems, the inventor provides a wafer polishing device for solving the problems.

SUMMERY OF THE UTILITY MODEL

The problem that wafers with different sizes are not convenient to fix when the polishing equipment is used is solved; an object of the utility model is to provide a wafer polishing equipment.

In order to solve the technical problem, the utility model adopts the following technical scheme: a wafer polishing device comprises a processing plate, wherein a cylinder is fixedly arranged on the upper surface of the processing plate in a jacking mode, a top plate is arranged at the output end of the cylinder, a polishing assembly is arranged on the top plate, a fixing assembly is fixedly arranged on the processing plate, supporting legs are fixedly arranged on the lower surface of the processing plate, and the number of the supporting legs is four;

the fixing component comprises a circular block and a circular plate, the circular plate is fixedly connected to the upper surface of the processing plate, a rectangular groove is formed in the surface of the circular plate, a sliding rod is arranged in the rectangular groove in a sliding mode, an arc-shaped clamping block is fixedly arranged at one end of the sliding rod, a circular rod is fixedly arranged on the lower surface of the sliding rod, a rotating rod is arranged on the lower surface of the circular plate in a rotating mode and penetrates through the processing plate, a rotary disc is fixedly arranged at the lower end of the rotating rod, threaded holes are formed in the surface of the rotary disc and the lower surface of the processing plate, the threaded holes are ten in shape, threaded hole annular arrays are distributed on the lower surface of the rotary disc, a screw rod is inserted into each threaded hole, a circular groove is formed in the upper surface of the processing plate, the circular block is sleeved on the outer side surface of the rotating rod, an arc-shaped groove is formed in the surface of the circular block, six arc-shaped grooves are distributed on the circular block in an annular array, the circular rod penetrates through the arc-shaped groove, and the circular rod is in a sliding fit with the arc-shaped groove, six have been seted up to the rectangular channel, and rectangular channel annular array distributes on the surface of circular slab, the accessible is placed the machined part at the upper surface of circular slab, be located between the arc clamp splice, make it drive the circular splice through the bull stick and rotate through rotating the carousel, thereby make the circular rod remove along the arc wall, drive six slide bars through the circular rod and all remove to the center of circular slab, the machined part is fixed to the arc clamp splice centre gripping of the tip through the slide bar finally, fix through inserting the screw rod in corresponding threaded hole.

Preferably, the subassembly of polishing includes motor and connecting block, motor fixed connection is at the upper surface of roof, the output of motor is equipped with the connecting rod, the connecting rod runs through the roof, the fixed hollow block that is equipped with of connecting rod lower extreme, the connecting hole has been seted up to the outside surface of hollow block, the circular slot has been seted up to the outside surface of connecting block, two have been seted up to the circular slot, and the circular slot symmetry sets up the surface at the connecting block, the internal fixed surface of circular slot is equipped with the spring, the fixed ball that is equipped with of one end of spring, the connecting block is mobile to be inserted and to be established in the hollow block, the ball is mobile to be inserted and to be established in the connecting hole.

Compared with the prior art, the beneficial effects of the utility model reside in that:

1. the utility model can place the workpiece on the upper surface of the circular plate and is positioned between the arc-shaped clamping blocks, the turntable is rotated to drive the circular block to rotate through the rotating rod, so that the circular rod moves along the arc-shaped groove, the six sliding rods are driven by the circular rod to move towards the center of the circular plate, and finally the workpiece is clamped and fixed through the arc-shaped clamping blocks at the end parts of the sliding rods and is fixed by inserting the screw rods into the corresponding threaded holes;

2. the utility model discloses an open the motor and make its final drive polishing dish rotate, make polishing dish and machined part contact process through opening the cylinder, the accessible is pressed down the ball and is made it break away from in the connecting hole, makes the connecting block break away from in the hollow block, dismantles the polishing dish, and the accessible is changed the thin round polishing dish, and to the machined part polishing, the machining precision of promotion machined part polished surface.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of the fixing assembly structure of the present invention.

Figure 3 is the utility model discloses polishing subassembly structure schematic diagram.

In the figure: 1. processing a plate; 11. a cylinder; 12. a top plate; 13. supporting legs; 2. polishing the assembly; 21. a motor; 22. a connecting rod; 23. a hollow block; 231. connecting holes; 24. connecting blocks; 25. a circular groove; 26. a spring; 27. a ball bearing; 28. a polishing pad; 3. a fixing assembly; 31. a circular block; 32. an arc-shaped slot; 33. connecting blocks; 34. a rotating rod; 35. a turntable; 351. a threaded hole; 36. a screw; 37. a circular plate; 371. a rectangular groove; 38. a slide bar; 39. an arc-shaped clamping block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The first embodiment is as follows:

as shown in fig. 1-3, the utility model provides a wafer polishing device, which comprises a processing plate 1, wherein a cylinder 11 is fixedly arranged on the upper surface of the processing plate 1, a top plate 12 is arranged at the output end of the cylinder 11, a polishing component 2 is arranged on the top plate 12, and a fixing component 3 is fixedly arranged on the processing plate 1;

the fixing component 3 comprises a circular block 31 and a circular plate 37, the circular plate 37 is fixedly connected to the upper surface of the processing plate 1, a rectangular groove 371 is formed in the surface of the circular plate 37, a sliding rod 38 is slidably arranged in the rectangular groove 371, an arc clamping block 39 is fixedly arranged at one end of the sliding rod 38, a circular rod 33 is fixedly arranged on the lower surface of the sliding rod 38, a rotating rod 34 is rotatably arranged on the lower surface of the circular plate 37, the rotating rod 34 penetrates through the processing plate 1, a rotary disc 35 is fixedly arranged at the lower end of the rotating rod 34, threaded holes 351 are formed in the surface of the rotary disc 35 and the lower surface of the processing plate 1, a screw rod 36 is inserted in the threaded hole 351, a circular groove is formed in the upper surface of the processing plate 1, the circular block 31 is sleeved on the outer side surface of the rotating rod 34, the arc groove 32 is formed in the surface of the circular block 31, the circular rod 33 penetrates through the arc groove 32, the circular rod 33 is in sliding fit with the arc groove 32, a machined part can be placed on the upper surface of the circular plate 37, and the circular block 31 is driven to rotate by the rotating rod 34 by rotating the rotating disc 35 between the arc-shaped clamping blocks 39, so that the circular rod 33 moves along the arc-shaped groove 32, the six sliding rods 38 are driven by the circular rod 33 to move towards the center of the circular plate 37, and finally, the workpiece is clamped and fixed by the arc-shaped clamping blocks 39 at the ends of the sliding rods 38 and the screw rods 36 are inserted into the corresponding threaded holes 351 to be fixed.

The lower fixed surface of processing board 1 is equipped with supporting leg 13, and supporting leg 13 is equipped with four.

Through adopting above-mentioned technical scheme, auxiliary stay.

Threaded holes 351 are ten in number, and threaded holes 351 are distributed in an annular array on the lower surface of turntable 35.

Through adopting above-mentioned technical scheme, be convenient for rotate the after-fixing.

Six arcuate slots 32 are provided and the arcuate slots 32 are distributed in an annular array over the circular block 31.

Through adopting above-mentioned technical scheme, the centre gripping of being convenient for.

Six rectangular grooves 371 are formed, and the rectangular grooves 371 are distributed on the surface of the circular plate 37 in an annular array.

Through adopting above-mentioned technical scheme, be convenient for fix.

Example two:

as shown in fig. 1, the polishing assembly 2 includes a motor 21 and a connecting block 24, the motor 21 is fixedly connected to the upper surface of the top plate 12, a connecting rod 22 is arranged at the output end of the motor 21, the connecting rod 22 penetrates through the top plate 12, a hollow block 23 is fixedly arranged at the lower end of the connecting rod 22, a connecting hole 231 is arranged on the outer side surface of the hollow block 23, a circular groove 25 is arranged on the outer side surface of the connecting block 24, a spring 26 is fixedly arranged on the inner surface of the circular groove 25, a ball 27 is fixedly arranged at one end of the spring 26, the connecting block 24 is movably inserted into the hollow block 23, the ball 27 is movably inserted into the connecting hole 231, two circular grooves 25 are arranged, the circular grooves 25 are symmetrically arranged on the surface of the connecting block 24, the polishing disc 28 is finally driven to rotate by opening the motor 21, the polishing disc 28 is contacted with a workpiece to be processed by opening the cylinder 11, and can be separated from the connecting hole 231 by pressing the ball 27, the connecting block 24 is separated from the hollow block 23, the polishing disk 28 is detached, and the polishing precision of the polishing surface of the workpiece is improved by replacing the fine wheel polishing disk with the fine wheel polishing disk.

The working principle is as follows: when the utility model is used, the workpiece can be placed on the upper surface of the circular plate 37 by the aid of the rotary disc 35 and is positioned between the arc-shaped clamping blocks 39, the circular plate 31 is driven to rotate by the rotary disc 34 by rotating the rotary disc 35, so that the circular rod 33 moves along the arc-shaped groove 32, six sliding rods 38 are driven by the circular rod 33 to move towards the center of the circular plate 37, finally, the workpiece is clamped and fixed by the arc-shaped clamping blocks 39 at the ends of the sliding rods 38, the screw rod 36 is inserted into the corresponding threaded hole 351 for fixing, the polishing disc 28 is driven to rotate by opening the motor 21, the polishing disc 28 is contacted with the workpiece by opening the cylinder 11 for processing, the workpiece can be separated from the connecting hole 231 by pressing the ball 27, the connecting block 24 is separated from the hollow block 23, the polishing disc 28 is detached, the thin wheel polishing disc can be replaced by the thin wheel polishing disc, the workpiece is polished, the processing precision of the polished surface of the workpiece is improved.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A wafer polishing apparatus comprising a processing plate (1), characterized in that: an air cylinder (11) is fixedly supported on the upper surface of the processing plate (1), a top plate (12) is arranged at the output end of the air cylinder (11), a polishing assembly (2) is arranged on the top plate (12), and a fixing assembly (3) is fixedly arranged on the processing plate (1);

the fixing component (3) comprises a circular block (31) and a circular plate (37), the circular plate (37) is fixedly connected to the upper surface of the processing plate (1), a rectangular groove (371) is formed in the surface of the circular plate (37), a sliding rod (38) is arranged in the rectangular groove (371) in a sliding mode, an arc-shaped clamping block (39) is fixedly arranged at one end of the sliding rod (38), a circular rod (33) is fixedly arranged on the lower surface of the sliding rod (38), a rotating rod (34) is arranged on the lower surface of the circular plate (37) in a rotating mode, the rotating rod (34) penetrates through the processing plate (1), a rotating disc (35) is fixedly arranged at the lower end of the rotating rod (34), threaded holes (351) are formed in the surface of the rotating disc (35) and the lower surface of the processing plate (1), a screw rod (36) is inserted into the threaded holes (351), the circular groove is formed in the upper surface of the processing plate (1), the outside surface cover of bull stick (34) is equipped with circular block (31), arc wall (32) have been seted up on the surface of circular block (31), arc wall (32) are run through in circular rod (33), circular rod (33) and arc wall (32) slip laminating.

2. A wafer polishing device according to claim 1, characterized in that said sharpening assembly (2) comprises a motor (21) and a connecting block (24), the motor (21) is fixedly connected with the upper surface of the top plate (12), the output end of the motor (21) is provided with a connecting rod (22), the connecting rod (22) penetrates through the top plate (12), a hollow block (23) is fixedly arranged at the lower end of the connecting rod (22), the outer side surface of the hollow block (23) is provided with a connecting hole (231), the outer side surface of the connecting block (24) is provided with a circular groove (25), a spring (26) is fixedly arranged on the inner surface of the circular groove (25), one end of the spring (26) is fixedly provided with a ball (27), the connecting blocks (24) are movably inserted into the hollow blocks (23), and the balls (27) are movably inserted into the connecting holes (231).

3. A wafer polishing apparatus according to claim 1, wherein said work plate (1) is fixedly provided at a lower surface thereof with support legs (13), and said support legs (13) are provided at four.

4. A wafer polishing apparatus as claimed in claim 1, wherein ten of said threaded holes (351) are provided, and an annular array of threaded holes (351) is provided on the lower surface of the turntable (35).

5. A wafer polishing device as claimed in claim 1, characterized in that there are six of the arc-shaped grooves (32) and that the arc-shaped grooves (32) are distributed in an annular array on the circular block (31).

6. The wafer polishing apparatus as set forth in claim 1, wherein six rectangular grooves (371) are formed, and the rectangular grooves (371) are distributed in an annular array on the surface of the circular plate (37).

7. A wafer polishing device according to claim 2, characterized in that the circular grooves (25) are opened in two, and the circular grooves (25) are symmetrically arranged on the surface of the connecting block (24).