CN111427167B - 3D optical structure, preparation method thereof and electronic equipment - Google Patents

3D optical structure, preparation method thereof and electronic equipment Download PDF

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Publication number
CN111427167B
CN111427167B CN202010355792.XA CN202010355792A CN111427167B CN 111427167 B CN111427167 B CN 111427167B CN 202010355792 A CN202010355792 A CN 202010355792A CN 111427167 B CN111427167 B CN 111427167B
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reflective
film
pattern
light
optical structure
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CN111427167A (en
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王立朋
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Vivo Mobile Communication Chongqing Co Ltd
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Vivo Mobile Communication Chongqing Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279Improving the user comfort or ergonomics
    • H04M1/0283Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

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  • Signal Processing (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

The invention discloses a 3D optical structure, a preparation method thereof and electronic equipment, wherein the 3D optical structure comprises a base part, a first reflecting membrane and a second reflecting membrane which are sequentially stacked, the base part is a transparent structural part, the surface of the second reflecting membrane, which is far away from the first reflecting membrane, is provided with a prefabricated pattern, and light can penetrate through the prefabricated pattern and be projected between the first reflecting membrane and the second reflecting membrane. By the scheme, the problem that the 3D field depth pattern effect is poor due to the fact that the coating film on the outer surface of the product is easy to damage can be solved.

Description

3D optical structure, preparation method thereof and electronic equipment
Technical Field
The embodiment of the invention relates to the technical field of electronic equipment, in particular to a 3D optical structure, a preparation method thereof and electronic equipment.
Background
With the rapid development of science and technology, the appearance expressive force of electronic devices (such as mobile phones, tablet computers and the like) is continuously improved, and the electronic devices are popular with users. The 3D depth of field pattern effect is formed on the shell of the electronic equipment, and the front edge process is a front edge process for improving appearance expressive force.
At present, the 3D depth of field pattern effect is usually realized by adopting a double-sided coating process, taking a mobile phone shell as an example, the double-sided coating process needs to coat the inner surface and the outer surface of the mobile phone shell, and the coating on the outer surface of the mobile phone shell is easily worn and damaged in the use process of the mobile phone, so that the generation quality of the 3D depth of field pattern effect can be influenced.
Disclosure of Invention
The embodiment of the invention provides a 3D optical structure, a preparation method thereof and electronic equipment, and aims to solve the problem that the 3D depth of field pattern effect is poor due to the fact that a coating film on the outer surface of a product is easy to damage.
In order to solve the above problems, the present invention is realized by:
in a first aspect, an embodiment of the present invention provides a 3D optical structure, which includes a base, a first reflective film, and a second reflective film, which are sequentially stacked, where the base is a transparent structural member, a surface of the second reflective film, which faces away from the first reflective film, is provided with a preformed pattern, and light can be projected between the first reflective film and the second reflective film through the preformed pattern.
In a second aspect, an embodiment of the present invention further provides an electronic device, which includes the 3D optical structure.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a 3D optical structure, including:
providing a second reflecting film, and constructing a prefabricated pattern on one side surface of the second reflecting film;
providing a first reflecting membrane, and attaching the other side surface of the second reflecting membrane to one side surface of the first reflecting membrane;
providing a transparent base, and attaching the other side surface of the first reflection film sheet to the base.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the 3D optical structure disclosed by the embodiment of the invention, the first reflecting film sheet and the second reflecting film sheet are arranged on one side of the transparent base in a stacking mode, and the surface, away from the first reflecting film sheet, of the second reflecting film sheet is provided with the prefabricated pattern in a structuring mode. After the light passes through the prefabricated pattern and is projected between the first reflection membrane and the second reflection membrane, the pattern light is separated into a refraction sub-light and a reflection sub-light when being projected to the first reflection membrane, the refraction sub-light passes through the base part and is projected to the eyes of a user, the reflection sub-light is reflected to the second reflection membrane and is then reflected to the first reflection membrane, the reflection sub-light is separated into a refraction sub-light and a reflection sub-light with smaller energy intensity again, and the working process that the pattern light is separated for the first time is repeated. So many times, the refraction sub-ray energy intensity that passes through the basal portion and jets out can constantly attenuate for its luminance also weakens gradually, and the refraction sub-ray that belongs to same pattern light source has the delay on the time dimension, based on 4D formation of image principle, alright see 3D depth of field pattern effect in the outside of basal portion.
Compared with the prior art, the 3D optical structure disclosed in the embodiment of the invention can protect the first reflective film and the second reflective film serving as core members through the base on the basis of realizing the 3D depth-of-field pattern effect, undoubtedly can prevent the first reflective film and the second reflective film from being damaged, and ensure that the stable and high-quality 3D depth-of-field pattern effect is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic cross-sectional structural diagram of a 3D optical structure disclosed in an embodiment of the present invention;
FIG. 2 is a schematic diagram of an optical path of a 3D optical structure according to an embodiment of the present invention when light is reflected once;
FIG. 3 is a schematic diagram of an optical path of a 3D optical structure according to an embodiment of the present invention when light is reflected twice;
FIG. 4 is a schematic diagram of an optical path of a 3D optical structure according to an embodiment of the present invention when light is reflected three times;
description of reference numerals:
100-base part,
200-first reflection film, 210-first carrier film, 220-first reflection coating,
300-second reflection film, 310-second carrier film, 320-second reflection coating, 330-light blocking layer,
400-pre-pattern, 510-first adhesive layer, 520-second adhesive layer, 600-light source module.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a 3D optical structure is disclosed in the present embodiment, and the disclosed 3D optical mechanism includes a base 100, a first reflective film 200 and a second reflective film 300.
The base 100 is a base member of the 3D optical structure, which serves as a load-bearing object of other members. For example, the base 100 may be a rear cover of a smart phone, although the embodiment of the present invention is not limited to the specific type of the base 100, for example, the 3D optical structure may also be other housings of electronic devices, a display component of an optical module, or a cover plate of a building.
In which the base 100, the first reflective film 200, and the second reflective film 300 are sequentially stacked, so as to facilitate control of the optical path of the light, reduce energy loss of the light during propagation, and ensure multiple reflections between the first reflective film 200 and the second reflective film 300.
Meanwhile, the surface of the second reflective film sheet 300 facing away from the first reflective film sheet 200 is configured with a pre-pattern 400, and light rays may pass through the pre-pattern 400 to form a pattern light ray and be projected between the first reflective film sheet 200 and the second reflective film sheet 300. It will be appreciated that the pre-pattern 400 has a higher transmittance with respect to other areas, and that the pre-pattern 400 is visible to the user when light is projected to the user's eye after passing through the pre-pattern.
In the embodiment, the first reflective film 200 and the second reflective film 300 have reflective capability, and the light source module 600 is usually disposed at a position corresponding to the preformed pattern 400, and the light source module 600 emits light, and the light passes through the preformed pattern 400, is refracted into the second reflective film 300, and is reflected between the first reflective film 200 and the second reflective film 300 multiple times.
Specifically, the pattern light is separated into a refracted sub-light and a reflected sub-light when projected to the first reflective film 200, the refracted sub-light passes through the base 100 and is projected to the eye of the user because the base 100 is a transparent structural member, and the refracted sub-lights corresponding to different positions of the preformed pattern 400 are converged to the eye of the user at the same time, so that the preformed pattern 400 can be imaged; meanwhile, the reflected sub-beam is reflected to the second reflective film 300 and then reflected to the first reflective film 200, and at this time, the reflected sub-beam is separated into a refracted sub-beam and a reflected sub-beam having smaller energy intensity again, and the operation process after the first separation of the pattern beam is repeated.
Referring to fig. 2 to 4, the intensity of the energy of the refracted sub-beam emitted through the base 100 is continuously attenuated many times, so that the brightness of the refracted sub-beam is gradually weakened, the intensity of the refracted sub-beam in fig. 2 is greater than that of the refracted sub-beam in fig. 3, and the intensity of the refracted sub-beam in fig. 3 is greater than that of the refracted sub-beam in fig. 4; in addition, the refraction sub-light belonging to the same pattern light source has time-dimension delay, and based on the 4D imaging principle, the 3D depth-of-field pattern effect can be observed on the outer side of the base 100.
It should be noted that the transmittance of the base 100 is usually more than 92%, so that the base can have a good imaging effect. The base 100 can be selected from, but not limited to, ABS resin (acrylonitrile-butadiene-styrene copolymer), AS resin (acrylonitrile-styrene), PC plastic (polycarbonate), PVC plastic (polyvinyl chloride), PS plastic (polystyrene), PP plastic (polypropylene), or plexiglass.
In fig. 1 to 4, only light rays perpendicularly incident to the second reflective film sheet 300 and the first reflective film sheet 200 are shown, and thus the reflection angle and the refraction angle of the light rays are both 0 ° after the light rays are reflected and refracted. Of course, the light emitting angle of the light source module 600 is not limited in this embodiment, and there are also many pattern light rays obliquely incident to the second reflective film 300 and the first reflective film 200, which have the same working principle as the light rays incident perpendicularly, and thus are not shown.
Since the light source module 600 continuously emits new light, the newly formed pattern light supplements the energy of the reflected sub-light between the first reflective film 200 and the second reflective film 300, and even if the reflected sub-light is refracted when reflected at the second reflective film 300 to reduce the energy, the normal operation inside the 3D optical structure can still be ensured.
Meanwhile, the specific connection relationship between the first reflective film 200 and the second reflective film 300 is not limited in this embodiment, a larger reflective gap space may be left between the two, or the two may be disposed adjacently, but it is necessary to realize multiple reflections of light rays between the two.
Compared with the prior art, the 3D optical structure disclosed in the embodiment of the invention can protect the first reflective film 200 and the second reflective film 300 as core members through the base 100 on the basis of realizing the 3D depth of field pattern effect, and can undoubtedly avoid the first reflective film 200 and the second reflective film 300 from being damaged, thereby ensuring that a stable and high-quality 3D depth of field pattern effect is realized.
Referring to fig. 1 again, in the present embodiment, the first reflective film 200 may include a first carrier film 210 and a first reflective coating 220 formed on the first carrier film 210, and the second reflective film 300 includes a second carrier film 310 and a second reflective coating 320 formed on the second carrier film 310. Specifically, the first carrier film 210 is a base for the first reflective plating layer 220, and the second carrier film 310 is a base for the second reflective plating layer 320.
The first reflective coating 220 faces the second carrier film 310, the second reflective coating 320 faces away from the first reflective coating 220, and the preformed pattern 400 is formed on the second reflective coating 320. It should be understood that the first reflective plating layer 220 and the second reflective plating layer 320 have reflective capability, and light can be reflected between the first reflective plating layer 220 and the second reflective plating layer 320 multiple times. Meanwhile, the second carrier film 310 is located between the first reflective plating layer 220 and the second reflective plating layer 320, so that the second carrier film 310 corresponds to a reflective gap space.
In a specific operation process, the light source module 600 emits light, the light passes through the pre-pattern 400 to form a pattern light, and is refracted into the second carrier film 310 and continuously propagates in the second carrier film 310. When projected to the first reflective coating layer 220, the light is split into a refracted sub-light and a reflected sub-light, and the refracted sub-light is projected to the eyes of the user through the base 100; meanwhile, the reflected sub-beam is reflected to the second reflective coating layer 320 and then to the first reflective coating layer 220, and at this time, the reflected sub-beam is separated into a refracted sub-beam and a reflected sub-beam having smaller energy intensity again, and the operation process after the first separation of the pattern beam is repeated.
As mentioned above, the energy intensity of the refracted sub-light rays emitted through the base 100 is attenuated many times, so that the brightness of the refracted sub-light rays is gradually weakened, and the refracted sub-light rays belonging to the same pattern light source have a time-dimension delay, so that the 3D depth-of-field pattern effect can be observed on the outer side of the base 100 based on the 4D imaging principle.
In the prior art, double-sided coating is usually directly performed on a transparent substrate, the transparent substrate is generally made of ABS resin, AS resin, PC plastic, PVC plastic, PS plastic, PP plastic or organic glass, and the like, and the materials are generally low in stretchability and large in brittleness, so that the coating film is easily damaged when the materials are bent, and the imaging quality is further influenced.
Based on this, in an alternative scheme, the first carrier film 210 and the second carrier film 310 can both be made of PET films (phthalic acid and ethylene glycol). It should be understood that the PET film can be thinner, thereby being beneficial to the structural design of the inside of the electronic device, and meanwhile, the PET film is soft, so that the first reflective coating 220 and the second reflective coating 320 cannot be damaged greatly when being bent, and better 3D imaging quality can be ensured.
In the prior art, an aluminum plating process is usually adopted, and an aluminum layer is conductive, so that the problem of electromagnetic interference exists, and the negative effect is large when the aluminum layer is applied to electronic equipment. In this embodiment, the first reflective plating layer 220 and the second reflective plating layer 320 may be both insulating structure layers. With such a configuration, the problem of electromagnetic interference caused by the first reflective plating layer 220 and the second reflective plating layer 320 to the electronic device is avoided. In general, the insulating material can be selected from, but not limited to, SiO2、Sn、In、CrO、TiO2、A12O3、Nb2O5And the like.
The reflectivity of the first reflective plating layer 220 and the second reflective plating layer 320 is determined by their own material, and in an alternative embodiment, the reflectivity of the first reflective plating layer 220 is preferably greater than or equal to 90%, and the reflectivity of the second reflective plating layer 320 is preferably greater than or equal to 80%.
In order to prevent light from passing around the pre-pattern 400 to affect the imaging quality of the pre-pattern 400, in an alternative, the second reflective film 300 may further include a light blocking layer 330, the light blocking layer 330 is disposed on the second reflective plating layer 320, and the pre-pattern 400 is configured on the second reflective plating layer 320 and the light blocking layer 330. It should be understood that the light blocking layer 330 can block light from passing through, thereby preventing light from projecting the periphery of the pre-pattern 400 to the eyes of the user, and improving the imaging effect. The pre-pattern 400 needs to pass through both the light-blocking layer 330 and the second reflective plating layer 320 at the time of construction to ensure that light can be refracted into the second carrier film 310.
In this embodiment, the specific type of the light blocking layer 330 is not limited, and the light blocking layer 330 may be an ink layer, which can effectively shield the periphery of the pre-pattern 400. In the present embodiment, the specific type of the ink is not limited, and it may be various inks commonly used in the art, such as UV ink or thermosetting ink. The ink layer is usually made of dark ink, so that the shielding effect is more excellent.
In order to improve the stability and reliability of the connection between the base 100 and the first reflective membrane 200 and between the first reflective membrane 200 and the second reflective membrane 300, in an alternative, the base 100 may be connected to the first carrier film 210 by a first adhesive layer 510, and the first reflective plating layer 220 may be connected to the second carrier film 310 by a second adhesive layer 520. Through the bonding effect of the first adhesive layer 510 and the second adhesive layer 520, the three can be effectively prevented from falling off accidentally.
In general, the first Adhesive layer 510 and the second Adhesive layer 520 may be OCA optical Clear Adhesive (OCA optical Adhesive); the OCA optical adhesive is a special adhesive for cementing optical elements, can be cured at room temperature, and has the advantages of colorless transparency, light transmittance of over 90 percent, good cementing strength, small curing shrinkage and the like.
The embodiment of the invention also discloses electronic equipment which comprises the 3D optical structure disclosed by the embodiment of the invention. The electronic device in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device, or other devices, and the embodiment does not limit the specific type of the electronic device.
The embodiment of the invention also discloses a preparation method of the 3D optical structure, which comprises the following steps:
step S100: a second reflective film sheet 300 is provided, and a pre-pattern 400 is formed on one side surface of the second reflective film sheet 300.
In this embodiment, the pre-pattern 400 is constructed in various ways, for example, the pre-pattern 400 is formed by burning with a corrosive solution such as hydrofluoric acid. In a specific embodiment, the pre-pattern 400 may be constructed by laser etching on one side surface of the second reflective film sheet 300. It should be understood that, because there is no need to contact the second reflective film 300 during the laser etching process, the second reflective film 300 is not worn, and the advantage of high processing precision is also obtained.
Step S200: a first reflective film 200 is provided, and the other side surface of the second reflective film 300 is attached to one side surface of the first reflective film 200.
In a specific manufacturing process, the first reflective film 200 and the second reflective film 300 are laminated and attached by using an adhesive method, but the specific combination manner of the two is not limited in this embodiment.
Step S300: a transparent base 100 is provided, and the other side surface of the first reflective film 200 is attached to the base 100.
Since the structural features of the 3D optical structure are different in different usage environments, the base 100 is formed to have a predetermined size according to the usage environment, for example, to form a rear cover of a mobile phone as a shell.
Specifically, providing a transparent base 100 may include providing a transparent substrate and shaping the base 100 to a predetermined size. The transparent base material can be selected from ABS resin, AS resin, PC plastic, PVC plastic, PS plastic, PP plastic or organic glass and other materials; these substrates are all lighter, and then make 3D optical structure have the advantage of low weight, be convenient for 3D optical structure's installation and use. In general, the base 100 may be formed by injection molding, die pressing, or cutting.
Similarly, the first reflective film 200 and the base 100 may be laminated by bonding, and the present embodiment is not limited to a specific combination of them.
In this embodiment, step S100 may include:
step S110, providing a second carrier film 310, and forming a second reflective coating 320 on one side surface of the second carrier film 310. It is to be understood that the second reflective plating layer 320 provides the reflective power to the second reflective film sheet 300, and the second carrier film 310 serves as a base for the provision of the second reflective plating layer 320.
Step S120 is to form a light blocking layer 330 on the surface of the second reflective plating layer 320. It should be understood that the light-blocking layer 330 is a structural layer capable of blocking light from passing through, and has a light transmittance close to 0 or completely opaque, so as to improve the imaging quality of the 3D optical structure.
In the present embodiment, the type of the light blocking layer 330 may be various, and the present embodiment does not limit it. Further, this may be achieved by coating an ink layer on the second reflective plating layer 320. The embodiment also does not limit the specific manner of applying the ink layer, and in some specific embodiments, the manner of applying the ink layer is silk-screen printing. The ink layer may be cured by exposure, baking, or the like, depending on the type of ink.
Step S130, constructing a pre-pattern 400 on the second reflective plating layer 320 and the light blocking layer 330. Specifically, when light passes through the pre-pattern 400, a pattern light is formed, and the pattern light can be refracted into the second carrier film 310 and reflected between the first reflective plating layer 220 and the second reflective plating layer 320 multiple times. As described above, a laser etching process may be selected to construct the pre-pattern 400 on the second reflective plating layer 320.
Step S200 may include:
s210, providing a first carrier film 210, and constructing a first reflection plating layer 220 on one side surface of the first carrier film 210. It is to be understood that the first reflective plating layer 220 provides the reflective power to the first reflective film sheet 200, and the first carrier film 210 serves as a base for the provision of the first reflective plating layer 220.
Step S220, the other side surface of the second carrier film 310 is attached to the first reflective coating 220. In this way, the first reflective film 200 and the second reflective film 300 are laminated and bonded.
In step S300, attaching the other side surface of the first reflective film 200 to the base 100 may specifically include attaching the other side surface of the first carrier film 210 to the base 100. In this manner, the base 100 and the first reflective film 200 are laminated and bonded.
At this time, namely, the stacked arrangement of the base 100, the first reflective film sheet 200 and the second reflective film sheet 300 is realized, and at the same time, the pre-pattern 400 is located on the side of the second carrier film 310 facing away from the first reflective plating layer 220, and the pattern light passing through the pre-pattern 400 can be reflected between the first reflective plating layer 220 and the second reflective plating layer 320 multiple times.
In the embodiment, the first carrier film 210 and the second carrier film 310 may be PET films. The PET film is soft, and the thicknesses of the first carrier film 210 and the second carrier film 310 can be made thinner in the process of manufacturing the 3D optical structure, so that the PET film is convenient to be applied to more precise electronic equipment such as a mobile phone, and the light and thin design is realized. The PET film is usually coated with a protective layer on its surface, and the protective layer is peeled off when the first carrier film 210 and the second carrier film 310 are laminated and combined during the manufacturing process, so as to prevent impurities from adhering to their surfaces due to the advance peeling.
The first reflective plating layer 220 and the second reflective plating layer 320 are usually configured by non-conductive plating, but the embodiment is not limited to the plating method, and may be bonding, extrusion molding, or the like. The first reflective coating 220 and the second reflective coating 320 can be insulating structure layers, and the insulating material can be selected from but not limited to SiO2、Sn、In、CrO、TiO2、A12O3、Nb2O5And the like. Thus, the problem of electromagnetic interference generated by the first reflective plating layer 220 and the second reflective plating layer 320 on the electronic device can be avoided. In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (10)

1. A 3D optical structure, comprising:
the light source module comprises a base, a first reflection film and a second reflection film which are sequentially stacked, wherein the first reflection film and the second reflection film are arranged on one side, close to the light source module, of the base;
the base is a transparent structural member, a surface of the second reflective membrane facing away from the first reflective membrane is configured with a preformed pattern, and light can be projected between the first reflective membrane and the second reflective membrane through the preformed pattern.
2. A 3D optical structure according to claim 1, characterized in that the first reflective film sheet comprises a first carrier film and a first reflective coating structured on the first carrier film, the second reflective film sheet comprises a second carrier film and a second reflective coating structured on the second carrier film, the first reflective coating facing the second carrier film, the second reflective coating facing away from the first reflective coating, the preformed pattern being structured on the second reflective coating.
3. A 3D optical structure according to claim 2, characterized in that the first and second carrier films are both PET films.
4. The 3D optical structure of claim 2, wherein the first and second reflective coatings are both insulating structure layers.
5. The 3D optical structure of claim 2, wherein the second reflective film further comprises a light blocking layer disposed on the second reflective plating layer, and the pre-pattern is configured on the second reflective plating layer and the light blocking layer.
6. The 3D optical structure according to claim 5, wherein the light blocking layer is an ink layer.
7. A 3D optical structure according to claim 2, characterized in that the base part is connected to the first carrier film by a first adhesive layer and the first reflective coating is connected to the second carrier film by a second adhesive layer.
8. An electronic device comprising a 3D optical structure according to any of claims 1 to 7.
9. A method of making a 3D optical structure, comprising:
providing a second reflecting film, and constructing a prefabricated pattern on one side surface of the second reflecting film;
providing a first reflecting membrane, and attaching the other side surface of the second reflecting membrane to one side surface of the first reflecting membrane;
providing a transparent base, and attaching the other side surface of the first reflection membrane to the base;
the first reflection film and the second reflection film are arranged on one side, close to the light source module, of the base.
10. The method of claim 9, wherein the providing a second reflective film sheet, and the forming a pre-pattern on a side surface of the second reflective film sheet comprises:
providing a second carrier film, and constructing a second reflection coating on one side surface of the second carrier film through non-conductive electroplating;
a light blocking layer is constructed on the surface of the second reflection coating by coating ink;
and constructing the prefabricated pattern on the second reflection coating and the light-blocking layer through laser etching.
CN202010355792.XA 2020-04-29 2020-04-29 3D optical structure, preparation method thereof and electronic equipment Active CN111427167B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104754081A (en) * 2013-12-30 2015-07-01 比亚迪股份有限公司 Cellphone housing and manufacturing method thereof
CN109788693A (en) * 2019-03-19 2019-05-21 维沃通信科技有限公司 Preparation method, battery cover board and the electronic equipment of cover board for electronic equipment
CN110815983A (en) * 2019-11-28 2020-02-21 Oppo广东移动通信有限公司 Shell of electronic equipment, manufacturing method of shell and electronic equipment
CN111081168A (en) * 2018-10-19 2020-04-28 致伸科技股份有限公司 Display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104754081A (en) * 2013-12-30 2015-07-01 比亚迪股份有限公司 Cellphone housing and manufacturing method thereof
CN111081168A (en) * 2018-10-19 2020-04-28 致伸科技股份有限公司 Display device
CN109788693A (en) * 2019-03-19 2019-05-21 维沃通信科技有限公司 Preparation method, battery cover board and the electronic equipment of cover board for electronic equipment
CN110815983A (en) * 2019-11-28 2020-02-21 Oppo广东移动通信有限公司 Shell of electronic equipment, manufacturing method of shell and electronic equipment

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